STGP30NC60W STGW30NC60W N-channel 30A - 600V - TO-247 - TO-220 Ultra fast switching PowerMESH™ IGBT General features Type VCES VCE(sat)Max @25°C IC @100°C STGW30NC60W STGP30NC60W 600V 600V < 2.5V < 2.5V 30A 30A 3 ■ High frequency operation ■ Lower CRES / CIES ratio (no cross-conduction susceptibility) 1 ■ Very soft ultra fast recovery antiparallel diode ■ Short circuit withstand time 10µs TO-247 2 TO-220 Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “W” identifies a family optimized for very high frequency application. Internal schematic diagram Applications ■ High frequency motor controls, inverters, ups ■ HF, SMPS and PFC in both hard switch and resonant topologies Order codes Part number Marking Package Packaging STGW30NC60W GW30NC60W TO-247 Tube STGP30NC60W GP30NC60W TO-220 Tube December 2006 Rev 3 1/14 www.st.com 14 Contents STGW30NC60W - STGP30NC60W Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 5 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2/14 ................................................ 8 STGW30NC60W - STGP30NC60W 1 Electrical ratings Electrical ratings Table 1. Absolute maximum ratings Symbol Value Unit Collector-emitter voltage (VGS = 0) 600 V IC Collector current (continuous) at 25°C 60 A IC Collector current (continuous) at 100°C 30 A Collector current (pulsed) 200 A VGE Gate-emitter voltage ± 20 V PTOT Total dissipation at TC = 25°C 200 W Tstg Storage temperature – 55 to 150 °C 300 °C VCES ICM(1) Parameter Tj Operating junction temperature TL Maximum lead temperature for soldering purpose (1.6mm from case, for 10 sec.) 1. Pulse width limited by max junction temperature Table 2. Thermal resistance Min. Rthj-case Thermal resistance junction-case Rthj-amb Thermal resistance junction-ambient Typ. Max. Unit 0.625 °C/W TO-220 TO-247 62.5 50 °C/W °C/W 3/14 Electrical characteristics 2 STGW30NC60W - STGP30NC60W Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol Parameter VBR(CES) Collector-emitter breakdown voltage VCE(SAT) Collector-emitter saturation VGE=15V, IC= 20A, Tj= 25°C voltage VGE=15V, IC= 20A,Tj= 125°C Test conditions IC = 1mA, VGE = 0 Gate threshold voltage VCE= VGE, IC= 250µA ICES Collector-emitter leakage current (VCE = 0) VCE = Max rating,Tc=25°C IGES Gate-emitter leakage current (VCE = 0) VGE = ±20V , VCE = 0 Forward transconductance VCE = 15V, IC= 20A VGE(th) gfs Table 4. Symbol Cies Coes Cres Qg Min. Typ. Max. 600 Unit V 2.1 1.8 3.75 VCE = Max rating, Tc=125°C 2.5 V V 5.75 V 10 1 µA mA ± 100 nA 15 S Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Qgc Total gate charge Gate-emitter charge Gate-collector charge ICL Turn-Off SOA minimum current Qge 4/14 Static Test conditions Min. VCE = 390V, IC = 20A, 102 17.5 47 VGE = 15V, (see Figure 16) RG = 10Ω, VGE= 15V Max. 2080 175 52 VCE = 25V, f = 1MHz, VGE=0 Vclamp = 480V , Tj = 150°C Typ. 200 Unit pF pF pF 140 nC nC nC A STGW30NC60W - STGP30NC60W Table 5. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf Table 6. Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets Electrical characteristics Switching on/off (inductive load) Parameter Test Conditions Turn-on delay time Current rise time Turn-on current slope VCC = 390V, IC = 20A Turn-on delay time Current rise time Turn-on current slope VCC = 390V, IC = 20A Off voltage rise time Turn-off delay time Current fall time Vcc = 390V, IC = 20A, Off voltage rise time Turn-off delay time Current fall time Vcc = 390V, IC = 20A, Min. RG= 10Ω, VGE= 15V, TJ= 25°C (see Figure 15) RG= 10Ω, VGE= 15V, TJ= 125°C (see Figure 15) RGE = 10Ω , VGE = 15V TJ=25°C (see Figure 17) RGE=10Ω , VGE =15V, TJ=125°C (see Figure 17) Typ. Max. Unit 29.5 12 1640 ns ns A/µs 29 13.5 1600 ns ns A/µs 19.5 118 27 ns ns ns 46 151 38 ns ns ns Switching energy (inductive load) Parameter Test conditions Turn-on switching losses Turn-off switching losses Total switching losses VCC = 390V, IC = 20A Turn-on switching losses Turn-off switching losses Total switching losses VCC = 390V, IC = 20A RG= 10Ω, VGE= 15V, Tj= 25°C (see Figure 17) RG= 10Ω, VGE= 15V, Tj= 125°C (see Figure 17) Min. Typ. Max. Unit 116 181 297 µJ µJ µJ 239 355 594 µJ µJ µJ 1. Eon is the tun-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25°C and 125°C) 2. Turn-off losses include also the tail of the collector current 5/14 Electrical characteristics STGW30NC60W - STGP30NC60W 2.1 Electrical characteristics (curves) Figure 1. Output characterisics Figure 2. Transfer characteristics Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs temperature Figure 5. Gate charge vs gate-source voltage Figure 6. 6/14 Capacitance variations STGW30NC60W - STGP30NC60W Electrical characteristics Figure 7. Normalized gate threshold voltage vs temperature Figure 8. Collector-emitter on voltage vs collector current Figure 9. Normalized breakdown voltage vs temperature Figure 10. Switching losses vs temperature Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector current 7/14 Electrical characteristics Figure 13. Thermal impedance 8/14 STGW30NC60W - STGP30NC60W Figure 14. Turn-off SOA STGW30NC60W - STGP30NC60W 3 Test circuit Test circuit Figure 15. Test circuit for inductive load switching Figure 16. Gate charge test circuit Figure 17. Switching waveform Figure 18. Diode recovery time waveform 9/14 Package mechanical data 4 STGW30NC60W - STGP30NC60W Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/14 STGW30NC60W - STGP30NC60W Package mechanical data TO-247 MECHANICAL DATA DIM. mm. MIN. TYP inch MAX. MIN. TYP. MAX. A 4.85 5.15 0.19 0.20 A1 2.20 2.60 0.086 0.102 b 1.0 1.40 0.039 0.055 b1 2.0 2.40 0.079 0.094 0.134 b2 3.0 3.40 0.118 c 0.40 0.80 0.015 0.03 D 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 e 5.45 L 14.20 14.80 0.560 L1 3.70 4.30 0.14 L2 0.620 0.214 18.50 0.582 0.17 0.728 øP 3.55 3.65 0.140 0.143 øR 4.50 5.50 0.177 0.216 S 5.50 0.216 11/14 Package mechanical data STGW30NC60W - STGP30NC60W TO-220 MECHANICAL DATA DIM. mm. MIN. inch MAX. MIN. TYP. MAX. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107 0.551 L 13 14 0.511 L1 3.50 3.93 0.137 L20 16.40 L30 12/14 TYP 0.154 0.645 28.90 1.137 øP 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 STGW30NC60W - STGP30NC60W 5 Revision history Revision history Table 7. Revision history Date Revision Changes 15-Sep-2005 1 Initial release. 04-Jan-2006 2 Inserted TO-220. Complete version 18-Dec-2006 3 The document has been reformatted 13/14 STGW30NC60W - STGP30NC60W Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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