STMICROELECTRONICS TS974IN

TS971-TS972-TS974
Output rail-to-rail very low noise operational amplifier
Features
■
TS971ILT (SOT23-5L)
Rail-to-rail output voltage swing
±2.4V @ VCC = ±2.5V
■
Very low noise level: 4nV/√Hz
■
Ultra low distortion: 0.003%
■
High dynamic features: 12MHz, 4V/µs
■
Operating range: 2.7V to 10V
■
ESD protection (2kV)
■
Latch-up immunity (class A)
Output
1
VDD
2
3
Non-inverting input
N.C.
■
Portable communications (cell phones,
pagers)
■
Instrumentation & sensoring
■
Professional audio circuits
Inverting input
8 N.C.
3
-
7 VCC
+
6 Output 2
5 N.C.
V DD 4
TS972IN (DIP8)
TS972ID-TS972IDT (SO-8)
TS972IPT (TSSOP8)
8 VCC
Output 1
1
Inverting Input 1
2
-
Non-inverting Input 1
3
+
Description
VDD
7 Output 2
4
-
6 Inverting Input 2
+
5 Non-inverting Input 2
TS972IQT (DFN8)
The TS97x family of operational amplifiers
operates with voltages as low as ±1.35V and
features output rail-to-rail signal swing. The
TS97x are particularly well suited for portable and
battery-supplied equipment. Very low noise and
low distortion characteristics make them ideal for
audio pre-amplification.
Output 1
1
8
VCC
Inverting Input 1
2
7
Output 2
Non Inverting Input 1
3
6
Inverting Input 2
4
5
Non Inverting Input 2
VDD
The TS971 is available in a variety of packages to
suit all types of applications. For applications
where space-saving is critical, the SOT23
package (2.8 x 2.9mm) or the DFN package
(3 x 3mm) simplify the board design because they
can be placed everywhere.
TS974IN (DIP14)
TS974ID-TS974IDT (SO-14)
TS974IPT (TSSOP14)
14 Output 4
Output 1 1
Inverting Input 1 2
-
-
13 Inverting Input 4
Non-inverting Input 1 3
+
+
12 Non-inverting Input 4
Non-inverting Input 2 5
+
+
10 Non-inverting Input 3
Inverting Input 2 6
-
-
9
Inverting Input 3
8
Output 3
11 VDD
VCC 4
Output 2 7
December 2007
4
1
Inverting Input 1 2
Applications
Portable equipment (CD players, PDA)
V CC
TS971ID-TS971IDT (SO-8)
Non-inverting Input 1
■
5
Rev 6
1/17
www.st.com
17
Absolute maximum ratings and operating conditions
1
TS971-TS972-TS974
Absolute maximum ratings and operating conditions
Table 1.
Absolute maximum ratings AMR
Symbol
VCC
Vid
Parameter
Unit
12
V
±1
V
VDD -0.3 to VCC +0.3
V
Supply voltage (1)
Differential input voltage
(2)
(3)
Vin
Input voltage
Tstg
Storage temperature range
Tj
Value
-65 to +150
Maximum junction temperature
Rthja
Thermal resistance junction to ambient
SOT23-5
DFN8
SO-8
SO-14
TSSOP8
TSSOP14
DIP8
DIP14
Rthjc
Thermal resistance junction to case(4)
SOT23-5
DFN8
SO-8
SO-14
TSSOP8
TSSOP14
DIP8
DIP14
150
HBM: human body model(5)
ESD
(6)
MM: machine model
CDM: charged device
°C
(4)
model(7)
Lead temperature (soldering, 10sec)
250
40
125
105
120
100
85
80
81
5.2
40
31
37
32
41
33
°C/W
°C/W
2
kV
200
V
1.5
kV
260
°C
1. All voltage values, except differential voltage are with respect to network ground terminal.
2. Differential voltages are the non-inverting input terminal with respect to the inverting input terminal.
3. The magnitude of input and output voltages must never exceed VCC +0.3V.
4. Short-circuits can cause excessive heating and destructive dissipation. Values are typical.
5. Human body model: A 100pF capacitor is charged to the specified voltage, then discharged through a
1.5kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
6. Machine model: A 200pF capacitor is charged to the specified voltage, then discharged directly between
two pins of the device with no external series resistor (internal resistor < 5Ω). This is done for all couples of
connected pin combinations while the other pins are floating.
7. Charged device model: all pins and the package are charged together to the specified voltage and then
discharged directly to the ground through only one pin. This is done for all pins.
No value specified for CDM on SOT23-5 package.
2/17
TS971-TS972-TS974
Table 2.
Absolute maximum ratings and operating conditions
Operating conditions
Symbol
Parameter
VCC
Supply voltage
Vicm
Common mode input voltage range
Toper
Operating free air temperature range
Value
Unit
2.7 to 10
V
VDD +1.15 to VCC -1.15
V
-40 to +125
°C
3/17
Electrical characteristics
TS971-TS972-TS974
2
Electrical characteristics
Table 3.
VCC = +2.5V, VDD = -2.5V, Tamb = 25°C (unless otherwise specified)
Symbol
Vio
Parameter
Conditions
Min.
Typ.
Max.
Unit
1
5
7
mV
Input offset voltage
Tmin ≤ Tamb ≤ Tmax
Input offset voltage drift
Vicm = 0V, Vo = 0V
5
Iio
Input offset current
Vicm = 0V, Vo = 0V
10
150
nA
Iib
Input bias current
Vicm = 0V, Vo = 0V
Tmin ≤ Tamb ≤ Tmax
200
200
750
1000
nA
1.35
V
DVio
µV/°C
Vicm
Common mode input voltage
range
CMR
Common mode rejection ratio
Vicm = ±1.35V
60
85
dB
SVR
Supply voltage rejection ratio
VCC = ±2V to ±3V
60
70
dB
Avd
Large signal voltage gain
RL = 2kΩ
70
80
dB
VOH
High level output voltage
RL = 2kΩ
2
2.4
V
VOL
Low level output voltage
RL = 2kΩ
-1.35
-2.4
-2
V
Output source current
1.5
mA
Isink
Output sink current
100
mA
ICC
Supply current per amplifier
Unity gain - No load
Gain bandwidth product
f = 100kHz, RL = 2kΩ, CL = 100pF
8.5
12
MHz
SR
Slew rate
AV = 1, Vin = ±1V
2.8
4
V/µs
∅m
Phase margin at unit gain
RL = 2kΩ, CL =100pF
60
Degrees
Gm
Gain margin
RL = 2kΩ, CL =100pF
10
dB
Equivalent input noise voltage
f = 100kHz
4
nV/√Hz
Total harmonic distortion
f = 1kHz, AV = -1, RL =10kΩ
0.003
%
Isource
GBP
en
THD
4/17
2
2.8
mA
TS971-TS972-TS974
Electrical characteristics
Figure 1.
Input offset voltage distribution
Figure 2.
Figure 3.
Voltage gain & phase vs. frequency Figure 4.
THS vs. Vout
Figure 5.
THD vs. Vout
THD vs. frequency
Figure 6.
Voltage gain & phase vs. frequency
5/17
Electrical characteristics
TS971-TS972-TS974
Figure 7.
Noise voltage vs. frequency
Figure 8.
Figure 9.
Phase margin vs. Iout
Figure 10. Phase margin vs. VCC
Figure 11. Phase margin vs. VCC
6/17
Gain bandwidth product vs. Iout
Figure 12. Gain margin vs. VCC
TS971-TS972-TS974
3
Package information
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
3.1
SOT23-5 package information
Figure 13. SOT23-5 package mechanical drawing
Table 4.
SOT23-5 package mechanical data
Millimeters
Mils
Ref.
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.90
1.45
35.4
57.1
A1
0.00
0.15
0.00
5.9
A2
0.90
1.30
35.4
51.2
b
0.35
0.50
13.7
19.7
C
0.09
0.20
3.5
7.8
D
2.80
3.00
110.2
118.1
E
2.60
3.00
102.3
118.1
E1
1.50
1.75
59.0
68.8
e
0.95
37.4
e1
1.9
74.8
L
0.35
0.55
13.7
21.6
7/17
Package information
3.2
TS971-TS972-TS974
DIP8 package information
Figure 14. DIP8 package mechanical drawing
Table 5.
DIP8 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
A
Max.
Min.
Typ.
5.33
Max.
0.210
A1
0.38
0.015
A2
2.92
3.30
4.95
0.115
0.130
0.195
b
0.36
0.46
0.56
0.014
0.018
0.022
b2
1.14
1.52
1.78
0.045
0.060
0.070
c
0.20
0.25
0.36
0.008
0.010
0.014
D
9.02
9.27
10.16
0.355
0.365
0.400
E
7.62
7.87
8.26
0.300
0.310
0.325
E1
6.10
6.35
7.11
0.240
0.250
0.280
e
2.54
0.100
eA
7.62
0.300
eB
L
8/17
Inches
10.92
2.92
3.30
3.81
0.430
0.115
0.130
0.150
TS971-TS972-TS974
3.3
Package information
SO-8 package information
Figure 15. SO-8 package mechanical drawing
Table 6.
SO-8 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
A
Inches
Max.
Min.
Typ.
1.75
0.069
A1
0.10
A2
1.25
b
0.28
0.48
0.011
0.019
c
0.17
0.23
0.007
0.010
D
4.80
4.90
5.00
0.189
0.193
0.197
H
5.80
6.00
6.20
0.228
0.236
0.244
E1
3.80
3.90
4.00
0.150
0.154
0.157
e
0.25
Max.
0.004
0.010
0.049
1.27
0.050
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
k
1°
8°
1°
8°
ccc
0.10
0.004
9/17
Package information
3.4
TS971-TS972-TS974
TSSOP8 package information
Figure 16. TSSOP8 package mechanical drawing
Table 7.
TSSOP8 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
A
Max.
Min.
Typ.
1.2
A1
0.05
A2
0.80
b
Max.
0.047
0.15
0.002
1.05
0.031
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.008
D
2.90
3.00
3.10
0.114
0.118
0.122
E
6.20
6.40
6.60
0.244
0.252
0.260
E1
4.30
4.40
4.50
0.169
0.173
0.177
e
10/17
Inches
1.00
0.65
k
0°
L
0.45
0.60
0.006
0.039
0.041
0.0256
8°
0°
0.75
0.018
8°
0.024
L1
1
0.039
aaa
0.1
0.004
0.030
TS971-TS972-TS974
3.5
Package information
DIP14 package information
Figure 17. DIP14 package mechanical drawing
Table 8.
DIP14 package mechanical data
Dimensions
Ref.
Millimeters
Min.
a1
0.51
B
1.39
Typ.
Inches
Max.
Min.
Typ.
Max.
0.020
1.65
0.055
0.065
b
0.5
0.020
b1
0.25
0.010
D
20
0.787
E
8.5
0.335
e
2.54
0.100
e3
15.24
0.600
F
7.1
0.280
I
5.1
0.201
L
Z
3.3
1.27
0.130
2.54
0.050
0.100
11/17
Package information
3.6
TS971-TS972-TS974
SO-14 package information
Figure 18. SO-14 package mechanical drawing
Table 9.
SO-14 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
A
a1
Inches
Max.
Typ.
1.75
0.1
0.2
a2
Max.
0.068
0.003
0.007
1.65
0.064
b
0.35
0.46
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.5
0.019
c1
45° (typ.)
D
8.55
8.75
0.336
0.344
E
5.8
6.2
0.228
0.244
e
1.27
0.050
e3
7.62
0.300
F
3.8
4.0
0.149
0.157
G
4.6
5.3
0.181
0.208
L
0.5
1.27
0.019
0.050
M
S
12/17
Min.
0.68
0.026
8° (max.)
TS971-TS972-TS974
3.7
Package information
TSSOP14 package information
Figure 19. TSSOP14 package mechanical drawing
A
A2
A1
e
b
K
L
c
E
D
E1
PIN 1 IDENTIFICATION
1
Table 10.
TSSOP14 package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
A
Inches
Max.
Min.
Typ.
1.2
A1
0.05
A2
0.8
b
Max.
0.047
0.15
0.002
0.004
0.006
1.05
0.031
0.039
0.041
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.0089
D
4.9
5
5.1
0.193
0.197
0.201
E
6.2
6.4
6.6
0.244
0.252
0.260
E1
4.3
4.4
4.48
0.169
0.173
0.176
e
1
0.65 BSC
K
0°
L
0.45
0.60
0.0256 BSC
8°
0°
0.75
0.018
8°
0.024
0.030
13/17
Package information
3.8
TS971-TS972-TS974
DFN8 exposed pad package information
Figure 20. DFN8 3x3 exposed pad package mechanical drawing
Table 11.
DFN8 3x3 exposed pad package mechanical data
Dimensions
Ref.
Millimeters
Min.
Typ.
Max.
Min.
Typ.
Max.
0.80
0.90
1.00
31.5
35.4
39.4
A1
0.02
0.05
0.8
2.0
A2
0.70
25.6
A3
0.20
7.9
A
b
0.18
0.23
0.30
D
2.875
3.00
3.125
D2
2.23
2.
2.48
E
2.875
3.00
3.125
E2
1.49
1.64
1.74
e
L
14/17
Mils
7.1
0.40
11.8
118.1
87.8
90.7
97.7
118.1
58.7
0.65
0.30
9.1
64.6
68.5
25.6
0.50
11.8
15.7
19.7
TS971-TS972-TS974
Ordering information
4
Ordering information
Table 12.
Order codes
Order code
Temperature
range
TS971ID
TS971IDT
TS971ILT
Package
Packing
Marking
SO-8
Tube or
Tape & reel
971I
SOT23-5L
(1)
TS971IYD
TS971IYDT(1)
SO-8
(Automotive grade level)
TS971IYLT(2)
SOT23-5L
(Automotive grade level)
K120
Tape & reel
971IY
K121
TS972IN
DIP8
Tube
TS972ID
TS972IDT
SO-8
Tube or
Tape & reel
TS972IPT
TSSOP8
(Thin shrink outline package)
TS972IN
972I
Tape & Reel
TS972IQT
-40°C, +125°C
DFN8
(Dual micro lead frame package)
TS972IYD(1)
TS972IYDT(1)
SO-8
(Automotive grade level)
Tube or
Tape & reel
972IY
TS972IYPT(2)
TSSOP8
(Automotive grade level)
Tape & reel
972IY
TS974IN
DIP14
Tube
TS974IN
TS974ID
TS974IDT
SO-14
Tube or
Tape & reel
TS974IPT
TSSOP14
(Thin shrink outline package)
974I
TS974IYD(1)
TS974IYDT(1)
SO-14
(Automotive grade level)
TS974IYPT(2)
TSSOP14
(Automotive grade level)
Tape & reel
974IY
974IY
1. Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001
& Q 002 or equivalent.
2. Qualification and characterization according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC
Q001 & Q 002 or equivalent are on-going.
15/17
Revision history
5
TS971-TS972-TS974
Revision history
Table 13.
16/17
Document revision history
Date
Revision
Changes
15-Nov- 2002
1
First release.
9-May- 2005
2
Modifications on AMR table (explanation of Vid and Vi limits)
31-Aug-2005
3
PPAP references inserted in the datasheet, see Table 1 on page 2.
9-Dec-2005
4
Thermal resistance junction to case data added in Table 1. on page 2
Missing PPAP references inserted in the datasheet, see Table 12:
Order codes.
3-Oct-2007
5
Added Rthja and Rthjc values for DIP8 and DIP14 packages in
Table 1.
ESD footnotes updated in Table 1: Absolute maximum ratings AMR.
Description section updated on cover page.
Markings for automotive grade parts corrected in Table 12: Order
codes.
20-Dec-2007
6
Reformatted package information in Section 3: Package information.
Footnotes for automotive grade parts corrected in Table 12: Order
codes.
TS971-TS972-TS974
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17/17