ULQ200XA/XD1 Seven darlington array Features ■ Seven darlingtons per package ■ Extended temperature range: -40 to 105°C ■ Output current 500mA per driver (600mA peak) ■ Output voltage 50V ■ Integrated suppression diodes for inductive loads ■ Outputs can be paralleled for higher current ■ TTL/CMOS/PMOS/DTL Compatible inputs ■ Inputs pinned opposite outputs to simplify layout DIP-16 ULQ2001 ULQ2003 ULQ2004 Description The ULQ2001, ULQ2003 and ULQ2004 are high voltage, high current darlington arrays each containing seven open collector darlington pairs with common emitters. Each channel rated at 500mA and can withstand peak currents of 600mA. Suppression diodes are included for inductive load driving and the inputs are pinned opposite the outputs to simplify board layout. The versions interface to all common logic families. SO16 (Narrow) General purpose, DTL, TTL, PMOS, CMOS 5V TTL, CMOS 6–15V CMOS, PMOS These versatile devices are useful for driving a wide range of loads including solenoids, relays DC motors, LED displays filament lamps, thermal print-heads and high power buffers. The ULQ2001A/2003A and 2004A are supplied in 16 pin plastic DIP packages with a copper leadframe to reduce thermal resistance. They are available also in small outline package (SO-16) as ULQ2003D1/2004D1. Order codes May 2007 Part numbers Packages ULQ2001A DIP-16 ULQ2003A DIP-16 ULQ2004A DIP-16 ULQ2003D1013TR SO16 in Tape & Reel ULQ2004D1013TR SO16 in Tape & Reel Rev. 3 1/13 www.st.com 13 ULQ200XA/XD1 Contents 1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2/13 ULQ200XA/XD1 1 Diagram Figure 1. Schematic diagram Diagram ULQ2001 (each driver) ULQ2003 (each driver) ULQ2004 (each driver) 3/13 Pin configuration 2 Pin configuration Figure 2. Pin connections (top view) 4/13 ULQ200XA/XD1 ULQ200XA/XD1 Maximum ratings 3 Maximum ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit Vo Output voltage 50 V Vin Input voltage (for ULQ2003A/D1 - 2004A/D1) 30 V Ic Continuous collector current 500 mA Ib Continuous base current 25 mA TA Operating ambient temperature range -40 to 105 °C Storage temperature range -55 to 150 °C 150 °C TSTG TJ Table 2. Symbol RthJA Junction temperature Thermal Data Parameter Thermal resistance junction-ambient, Max. DIP-16 SO-16 Unit 70 120 ° C/W 5/13 Electrical characteristics ULQ200XA/XD1 4 Electrical characteristics Table 3. Electrical characteristics (TA = -40 to 105°C for DIP16 unless otherwise specified) (TJ = 25 to 105°C for SO16 unless otherwise specified). Symbol ICEX Parameter Output leakage current Collector-emitter saturation VCE(SAT) voltage (Figure 5.) II(ON) Input current (Figure 6.) Test conditions Min. VI(ON) 50 TA = 105°C, VCE= 50V (Figure 3.) 100 TJ = 105°C for ULQ2004, VCE= 50V, VI = 1V (Figure 4.) 500 IC = 100mA, IB = 250µA 0.9 1.1 IC = 200mA, IB= 350µA 1.1 1.3 IC = 350mA, IB= 500µA 1.3 1.6 for ULQ2003, VI = 3.85V 0.93 1.35 for ULQ2004, VI = 5V 0.35 0.5 1 1.45 Input current (Figure 7.) TA = 105°C, IC = 500µA Input voltage (Figure 8.) for ULQ2003 IC = 200mA IC = 250mA IC = 300mA for ULQ2004 IC = 125mA IC = 200mA IC = 275mA IC = 350mA hFE DC Forward current gain (Figure 5.) CI Input capacitance Max. VCE = 50V, (Figure 3.) VI = 12V II(OFF) Typ. for ULQ2001, VCE = 2V, IC = 350mA 50 65 mA V 5 6 7 8 1000 25 (1) pF (1) µs µs Turn-on delay time 0.5 VI to 0.5VO 0.25 1 tPHL Turn-off delay time 0.5 VI to 0.5VO 0.25 1 (1) Clamp diode leakage current (Figure 9.) VR = 50V 50 IR TA = 105°C, VR = 50V 100 VF Clamp diode forward voltage (Figure 10.) 6/13 V µA tPLH 1. Guaranteed by design. µA 2.4 2.7 3 15 IF = 350mA Unit µA 1.7 2 V ULQ200XA/XD1 5 Test circuits Test circuits Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. 7/13 Test circuits Figure 9. 8/13 ULQ200XA/XD1 Figure 10. ULQ200XA/XD1 6 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/13 Package mechanical data ULQ200XA/XD1 Plastic DIP-16 (0.25) MECHANICAL DATA mm. inch DIM. MIN. a1 0.51 B 0.77 TYP MAX. MIN. TYP. MAX. 0.020 1.65 0.030 0.065 b 0.5 0.020 b1 0.25 0.010 D 20 0.787 E 8.5 0.335 e 2.54 0.100 e3 17.78 0.700 F 7.1 0.280 I 5.1 0.201 L Z 3.3 0.130 1.27 0.050 P001C 10/13 ULQ200XA/XD1 Package mechanical data mm inch DIM. MIN. TYP. A a1 MAX. MIN. TYP. 1.75 0.1 0.25 a2 MAX. 0.069 0.004 0.009 1.6 0.063 b 0.35 0.46 0.014 0.018 b1 0.19 0.25 0.007 0.010 C 0.5 c1 0.020 45° (typ.) D(1) 9.8 10 0.386 0.394 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 8.89 0.350 F(1) 3.8 4.0 0.150 0.157 G 4.60 5.30 0.181 0.208 L 0.4 1.27 0.150 0.050 M S OUTLINE AND MECHANICAL DATA 0.62 0.024 8 ° (max.) SO16 (Narrow) (1) "D" and "F" do not include mold flash or protrusions - Mold flash or protrusions shall not exceed 0.15mm (.006inc.) 0016020 D 11/13 Revision history ULQ200XA/XD1 7 Revision history Table 4. Revision history Date Revision 05-Dec-2006 2 Order codes has been updated and document has been reformatted. 23-May-2007 3 Order codes has been updated. 12/13 Changes ULQ200XA/XD1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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