ABS2 THRU ABS10 Single Phase 1.0 AMP. Glass Passivated Bridge Rectifiers Voltage Range 200 to 1000 Volts Current 1.0 Ampere 0.012(0.3) 0~10 O 0.010(0.25) 0.028(0.7) 0.024(0.6) 0.006(0.15) 0.002(0.05) 0.252(6.4) 0.236(6.0) 0.006(0.15) 0.177(4.5) 0.028(0.7) 0.128(3.25) 0.193(4.9) 0.055(1.40) MAX. 0.20(5.1) 0.056(1.42) 0.154(3.9) 0.048(1.22) 0.136(3.45) 0.161(4.1) 0.006(0.15) Glass passivated junction Ideal for printed circuit board Reliable low cost construction utilizing molded plastic technique High temperature soldering guaranteed: 260℃ / 10 seconds / 0.375” ( 9.5mm ) lead length at 5 lbs., ( 2.3 kg ) tension Small size, simple installation Leads solderable per MIL-STD-202, Method 208 High surge current capability 0.002(0.05) 0.169(4.3) Thin Mini-Dip Features DETAIL "A", SCALE=20/1 A 0.033(0.85) 0.026(0.65) Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25℃ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol ABS2 ABS4 Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current On glass-epoxy P.C.B. On aluminum substrate Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage @ 0.4A Maximum DC Reverse Current @ TA=25℃ at Rated DC Blocking Voltage Typical Thermal resistance Junction to Lead On aluminum substrate On Glass-Epoxy substrate Operating Temperature Range Storage Temperature Range VRRM VRMS VDC 200 140 200 400 280 400 ABS6 ABS8 ABS10 Units 600 420 600 800 560 800 1000 700 1000 V V V I(AV) 0.8 1.0 A IFSM 30 A VF 095 V IR 10 uA RθJL RθJA 25 62.5 80 -55 to +150 -55 to +150 TJ TSTG - 694 - ℃/W ℃ ℃ RATINGS AND CHARACTERISTIC CURVES (ABS2 THRU ABS10) FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE FIG.2- TYPICAL FORWARD CHARACTERISTICS 50 INSTANTANEOUS FORWARD CURRENT. (A) 1.6 AVERAGE FORWARD CURRENT. (A) 1.4 1.2 SIN 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 140 10 Tj=150 0C 1 0.1 0.0 160 O Tj=25 0C 0.2 LEAD TEMPERATURE. ( C) 0.6 0.8 1.0 FORWARD VOLTAGE. (V) 1.2 1.4 1.6 FIG.4- FORWARD POWER DISSIPATION FIG.3- MAXIMUM FORWARD CURRENT DERATING CURVE 2.5 1.6 1.2 FORWARD POWER DISSIPATION (pF) 1.4 ALUMINA SUBSTRATE 50.8mm X 50.8mm SOLDERING LAND 1mm X 1mm CONDUCTOR LAYER 20 mm SUBSTRATE THICKNESS 0.64mm SIN 1.0 0.8 0.6 0.4 SIN 2.0 Tj=150 0C 1.5 1.0 0.5 0.2 0 0 20 40 60 80 100 120 140 0 0.0 160 0.2 0.4 0.6 0.8 1.0 AVERAGE RECTIFIED FORWARD CURRENT. (A) O AMBIENT TEMPERATURE. ( C) 1.2 FIG.5- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 35 PEAK FORWARD SURGE CURRENT. (A) AVERAGE FORWARD CURRENT. (A) 0.4 - 695 - 30 25 20 IFSM 15 10ms 10ms 1 Cycle Ta=40 C NON-REPETITIVE, Single Half Sine-Wave SINE(JEDEC WAVE, Method) O Tj = 25 C BEFORE SURGE CURRENT IS APPLIED 10 5 0 1 10 NUMBER OF CYCLES (CYCLE) 100