SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 D 8-Bit Serial-In, Parallel-Out Shift D Wide Operating Voltage Range of 2 V to 6 V D High-Current 3-State Outputs Can Drive Up D D D D D SN54HC595 . . . J OR W PACKAGE SN74HC595 . . . D, DB, DW, N, OR NS PACKAGE (TOP VIEW) QB QC QD QE QF QG QH GND To 15 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 13 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max Shift Register Has Direct Clear 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC QA SER OE RCLK SRCLK SRCLR QH′ description/ordering information The ’HC595 devices contain an 8-bit serial-in, parallel-out shift register that feeds an 8-bit D-type storage register. The storage register has parallel 3-state outputs. Separate clocks are provided for both the shift and storage register. The shift register has a direct overriding clear (SRCLR) input, serial (SER) input, and serial outputs for cascading. When the output-enable (OE) input is high, the outputs are in the high-impedance state. QC QB NC VCC QA SN54HC595 . . . FK PACKAGE (TOP VIEW) 5 17 6 16 7 15 8 14 9 10 11 12 13 SER OE NC RCLK SRCLK SRCLR 3 2 1 20 19 18 QH Both the shift register clock (SRCLK) and storage register clock (RCLK) are positive-edge triggered. If both clocks are connected together, the shift register always is one clock pulse ahead of the storage register. 4 GND NC Q H′ QD QE NC QF QG NC − No internal connection ORDERING INFORMATION PDIP − N TOP-SIDE MARKING Tube of 25 SN74HC595N Tube of 40 SN74HC595D Reel of 2500 SN74HC595DR Reel of 250 SN74HC595DT Tube of 40 SN74HC595DW Reel of 2000 SN74HC595DWR SOP − NS Reel of 2000 SN74HC595NSR HC595 SSOP − DB Reel of 2000 SN74HC595DBR HC595 CDIP − J Tube of 25 SNJ54HC595J SNJ54HC595J CFP − W Tube of 150 SNJ54HC595W SNJ54HC595W LCCC − FK Tube of 55 SNJ54HC595FK SOIC − D −40°C to 85°C SOIC − DW −55°C −55 C to 125 125°C C ORDERABLE PART NUMBER PACKAGE† TA SN74HC595N HC595 HC595 SNJ54HC595FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ '*%$"# $')!" " 12 !)) '!!&"&# !& "&#"&* %)&## ",&.#& "&*+ !)) ",& '*%$"# '*%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 FUNCTION TABLE INPUTS 2 SER SRCLK X X X X X X L SRCLR FUNCTION RCLK OE X X H X X L Outputs QA−QH are disabled. Outputs QA−QH are enabled. L X X Shift register is cleared. ↑ H X X First stage of the shift register goes low. Other stages store the data of previous stage, respectively. H ↑ H X X First stage of the shift register goes high. Other stages store the data of previous stage, respectively. X X X ↑ X Shift-register data is stored in the storage register. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 logic diagram (positive logic) OE RCLK SRCLR SRCLK SER 13 12 10 11 14 1D C1 R 3R C3 3S 15 2S 2R C2 R 3R C3 3S 1 2S 2R C2 R 3R C3 3S 2 2S 2R C2 R 3R C3 3S 3 2S 2R C2 R 3R C3 3S 4 2S 2R C2 R 3R C3 3S 5 2S 2R C2 R 3R C3 3S 6 2S 2R C2 R 3R C3 3S 7 9 QA QB QC QD QE QF QG QH QH′ Pin numbers shown are for the D, DB, DW, J, N, NS, and W packages. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 timing diagram SRCLK SER RCLK SRCLR OE ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ QA QB QC QD QE QF QG QH QH’ NOTE: 4 ÎÎÎÎ ÎÎÎÎ implies that the output is in 3-State mode. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC595 VCC VIH Supply voltage High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V VCC = 2 V VIL VI VO ∆t/∆v‡ Low-level input voltage NOM MAX 2 5 6 MIN NOM MAX 2 5 6 1.5 1.5 3.15 3.15 4.2 4.2 0 Output voltage Input transition rise/fall time MIN VCC = 4.5 V VCC = 6 V Input voltage SN74HC595 0 VCC = 2 V VCC = 4.5 V VCC = 6 V 0.5 1.35 1.35 1.8 1.8 0 0 V V 0.5 VCC VCC UNIT VCC VCC 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. ‡ If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH SN74HC595 MIN 2V 1.9 1.998 1.9 1.9 IOH = −20 µA 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 3.98 4.3 3.7 3.84 3.98 4.3 3.7 3.84 5.48 5.8 5.2 5.34 VI = VIH or VIL QH′, IOH = −4 mA QH′, IOH = −5.2 mA QA−QH, IOH = −7.8 mA IOL = 20 µA VI = VIH or VIL QH′, IOL = 4 mA QA−QH, IOL = 6 mA QH′, IOL = 5.2 mA QA−QH, IOL = 7.8 mA 4.5 V 6V 5.48 5.8 MIN MAX 5.2 MIN MAX V 5.34 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 0.17 0.26 0.4 0.33 0.15 0.26 0.4 0.33 0.15 0.26 0.4 0.33 4.5 V 6V UNIT V II IOZ VI = VCC or 0 VO = VCC or 0, 6V ±0.1 ±100 ±1000 ±1000 nA QA−QH 6V ±0.01 ±0.5 ±10 ±5 µA ICC VI = VCC or 0, IO = 0 6V 8 160 80 µA 10 10 10 pF Ci 6 SN54HC595 VCC QA−QH, IOH = −6 mA VOL TA = 25°C TYP MAX TEST CONDITIONS 2V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC fclock Clock frequency SRCLK or RCLK high or low tw Pulse duration SRCLR low SER before SRCLK↑ SRCLK↑ before RCLK↑† tsu Setup time SRCLR low before RCLK↑ SRCLR high (inactive) before SRCLK↑ th Hold time, SER after SRCLK SRCLK↑ TA = 25°C MIN MAX SN54HC595 MIN MAX SN74HC595 MIN MAX 2V 6 4.2 5 4.5 V 31 21 25 6V 36 25 29 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 80 120 100 4.5 V 16 24 20 6V 14 20 17 2V 100 150 125 4.5 V 20 30 25 6V 17 25 21 2V 75 113 94 4.5 V 15 23 19 6V 13 19 16 2V 50 75 65 4.5 V 10 15 13 6V 9 13 11 2V 50 75 60 4.5 V 10 15 12 6V 9 13 11 2V 0 0 0 4.5 V 0 0 0 6V 0 0 0 UNIT MHz ns ns ns † This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case the shift register is one clock pulse ahead of the storage register. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) fmax SRCLK QH H′ tpd RCLK tPHL ten tdis SRCLR OE OE QA−QH QH H′ QA−QH QA−QH QA−QH tt QH H′ VCC MIN TA = 25°C TYP MAX SN54HC595 MIN MAX SN74HC595 MIN 2V 6 26 4.2 5 4.5 V 31 38 21 25 6V 36 42 25 29 MAX UNIT MHz 2V 50 160 240 200 4.5 V 17 32 48 40 6V 14 27 41 34 2V 50 150 225 187 4.5 V 17 30 45 37 6V 14 26 38 32 2V 51 175 261 219 4.5 V 18 35 52 44 6V 15 30 44 37 2V 40 150 225 187 4.5 V 15 30 45 37 6V 13 26 38 32 2V 42 200 300 250 4.5 V 23 40 60 50 6V 20 34 51 43 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 2V 28 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 ns ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd ten FROM (INPUT) RCLK OE tt TO (OUTPUT) QA−QH QA−QH QA−QH VCC MIN TA = 25°C TYP MAX SN54HC595 MIN MAX SN74HC595 MIN MAX 2V 60 200 300 250 4.5 V 22 40 60 50 6V 19 34 51 43 2V 70 200 298 250 4.5 V 23 40 60 50 6V 19 34 51 43 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 UNIT ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd 8 Power dissipation capacitance POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TEST CONDITIONS TYP UNIT No load 400 pF SCLS041G − DECEMBER 1982 − REVISED FEBRUARY 2004 PARAMETER MEASUREMENT INFORMATION VCC S1 Test Point From Output Under Test PARAMETER RL CL (see Note A) tPZH ten 1 kΩ tPZL tPHZ tdis S2 RL tPLZ tpd or tt 1 kΩ Data Input VCC 50% 10% 50% VCC 0V In-Phase Output 50% 10% tPHL 90% 90% tr tPHL Out-ofPhase Output 90% tf Open Closed Closed Open Open Open VCC th 90% 90% VCC 50% 10% 0 V tf 50% 10% Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL VOH 50% 10% V OL tf Output Waveform 1 (See Note B) tPLZ 90% VOH VOL Output Waveform 2 (See Note B) ≈VCC ≈VCC 50% 10% tPZH tPLH 50% 10% Open VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES 50% tPLH Closed tr VOLTAGE WAVEFORMS PULSE DURATIONS 50% Closed 0V 0V Input Open tsu 0V 50% 50 pF or 150 pF 50% 50% tw Low-Level Pulse S2 50 pF or 150 pF −− Reference Input VCC 50% S1 50 pF LOAD CIRCUIT High-Level Pulse CL VOL tPHZ 50% 90% VOH ≈0 V tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. For clock inputs, fmax is measured when the input duty cycle is 50%. E. The outputs are measured one at a time, with one input transition per measurement. F. tPLZ and tPHZ are the same as tdis. G. tPZL and tPZH are the same as ten. H. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-86816012A ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC 5962-8681601EA ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC 5962-8681601VEA ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC 5962-8681601VFA ACTIVE CFP W 16 1 None Call TI Level-NC-NC-NC SN54HC595J ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC SN74HC595D ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR SN74HC595DBR ACTIVE SSOP DB 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SN74HC595DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC595DT ACTIVE SOIC D 16 250 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR SN74HC595DW ACTIVE SOIC DW 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74HC595DWR ACTIVE SOIC DW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-250C-1 YEAR/ Level-1-235C-UNLIM SN74HC595N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC SN74HC595NSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM SNJ54HC595FK ACTIVE LCCC FK 20 1 None Call TI Level-NC-NC-NC SNJ54HC595J ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC SNJ54HC595W OBSOLETE None Call TI Call TI 16 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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