LINER LTC3861

LTC3838-2
Dual, Fast, Accurate
Step-Down DC/DC Controller with
External Reference Voltage and
Dual Differential Output Sensing
DESCRIPTION
FEATURES
Wide VIN Range: 4.5V to 38V
n V
OUT1: 0.6V to 5.5V, ±0.67% Output Regulation
Accuracy, with Internal 0.6V VREFERENCE
n V
OUT2: 0.4V to 5.5V, ±4mV Regulation Accuracy, with
Differential External VREFERENCE Sensing
n Differential Remote Output Sensing; Up to ±500mV
(VOUT1) and ±200mV (VOUT2) Ground Deviations
n Fast Load Transient Response Without Clock Delay
n Detect Transient Release (DTR) Reduces V
OUT
Overshoot
n Frequency Programmable from 200kHz to 2MHz,
Synchronizable to External Clock
n t
ON(MIN) = 30ns, tOFF(MIN) = 90ns
n R
SENSE or Inductor DCR Current Sensing
n Overvoltage Protection and Current Limit Foldback
n Power Good Output Voltage Monitor
n Thermally Enhanced 38-Pin (5mm × 7mm) QFN Package
The controlled on-time, valley current mode control architecture allows for not only fast response to transients without
a clock delay, but also constant frequency switching at a
steady-load condition. Its proprietary load-release transient
detection feature (DTR) significantly reduces overshoot at
low output voltages.
APPLICATIONS
See Table 1 for a comparison of LTC3838, LTC3838-1 and
LTC3838-2.
n
Power for ASICs with Dynamic Voltage Scaling
Low Voltage, High Current, High Step-Down Ratio
Converters That Demand Tight Transient Regulation
n
The LTC®3838-2 is a dual-channel, PolyPhase® synchronous step-down DC/DC switching regulator controller. Two
independent channels drive all N-channel power MOSFETs.
The two channels can also be combined into a multiphase
single output configuration with external reference.
The switching frequency can be programmed from 200kHz
to 2MHz with an external resistor, and can be synchronized
to an external clock. Very low tON and tOFF times allow for near
0% and near 100% duty cycles, respectively. Voltage tracking soft start-up and multiple safety features are provided.
L, LT, LTC, LTM, PolyPhase, OPTI-LOOP, Linear Technology and the Linear logo are registered
trademarks and Hot Swap is a trademark of Linear Technology Corporation. All other trademarks
are the property of their respective owners. Protected by U.S. Patents, including 5481178,
5847554, 6580258, 6304066, 6476589, 6774611.
n
TYPICAL APPLICATION
1.2V/15A and 0.8V to 2.5V/15A, 350kHz Step-Down Converter (See Figure 16 for Complete Design)
VIN
4.5V TO 38V
SENSE1–
SENSE2–
SENSE1+
SENSE2+
VIN
0.56µH
LTC3838-2
10k
0.1µF
×2
BG1
BG2
PGND
EXTVREF2
+
VOUTSENSE1
VOUTSENSE1–
20k
0.1µF
DRVCC2
DRVCC1
4.7µF
10k
0.56µH
BOOST2
BOOST1
+
330µF
90
TG2
SW2
0.4V TO
1.25V
+
10k
20k
VOUT2
0.8V TO 2.5V
15A
330µF
×2
+
VDFB2
VDFB2–
115k
ITH1
RT
SGND
EXTVCC
RUN1
ITH2
MODE/PLLIN
CLKOUT
PHASMD
RUN2
2.0
80
1.5
EFFICIENCY
70
POWER
LOSS
60
1.0
0.5
50
40
TRACK/SS1 TRACK/SS2
2.5
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
POWER LOSS (W)
VOUT1
1.2V
15A
SW1
INTVCC
EFFICIENCY (%)
TG1
Efficiency/Power Loss
100
VIN = 12V
VOUT = 1.2V
0.1
1
LOAD CURRENT (A)
10
0
38382 TA01b
38382 TA01a
38382f
For more information www.linear.com/3838-2
1
LTC3838-2
BOOST2
PGOOD2
RUN2
DTR2
SENSE2–
SENSE2+
TOP VIEW
VDFB2–
38 37 36 35 34 33 32
VDFB2+ 1
31 TG2
EXTVREF2 2
30 SW2
ITH2 3
29 BG2
TRACK/SS2 4
28 DRVCC2
27 EXTVCC
MODE/PLLIN 5
CLKOUT 6
26 INTVCC
39
PGND
SGND 7
25 PGND
24 VIN
RT 8
23 DRVCC1
PHASMD 9
ITH1 10
22 BG1
TRACK/SS1 11
21 SW1
VOUTSENSE1+ 12
20 TG1
BOOST1
PGOOD1
DTR1
RUN1
13 14 15 16 17 18 19
SENSE1–
VIN Voltage.................................................. –0.3V to 40V
BOOST1, BOOST2 Voltages........................ –0.3V to 46V
SW1, SW2 Voltages....................................... –5V to 40V
INTVCC, DRVCC1, DRVCC2, EXTVCC, PGOOD1,
PGOOD2, RUN1, RUN2, (BOOST1-SW1),
(BOOST2-SW2), MODE/PLLIN Voltages....... –0.3V to 6V
SENSE1+, SENSE2+,SENSE1–, SENSE2–
Voltages........................................................ –0.6V to 6V
VOUTSENSE1+, Voltage............... –0.6V to (INTVCC + 0.3V)
VOUTSENSE1–, Voltage.....................–0.6V to VOUTSENSE1+
TRACK/SS1, TRACK/SS2 Voltages............... –0.3V to 5V
DTR1, DTR2, PHASMD, RT, EXTVREF2, VDFB2+, VDFB2–,
ITH1, ITH2 Voltages................. –0.3V to (INTVCC + 0.3V)
Operating Junction Temperature Range
(Notes 2, 3, 4)......................................... –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
PIN CONFIGURATION
SENSE1+
(Note 1)
VOUTSENSE1–
ABSOLUTE MAXIMUM RATINGS
UHF PACKAGE
38-LEAD (5mm × 7mm) PLASTIC QFN
TJMAX = 125°C, θJA = 34°C/W
EXPOSED PAD (PIN 39) IS PGND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC3838EUHF-2#PBF
LTC3838EUHF-2#TRPBF
38382
38-Lead (5mm × 7mm) Plastic QFN
–40°C to 125°C
LTC3838IUHF-2#PBF
LTC3838IUHF-2#TRPBF
38382
38-Lead (5mm × 7mm) Plastic QFN
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping
container.Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
Table 1. Comparison of LTC3838 Options
PART NUMBER
DESCRIPTION
LTC3838
±0.67% Differential Output Regulation on Channel 1
±1% Output Regulation on Channel 2
Separate-Per-Channel Continuous 30mV to 100mV Current Sense Range Controls
LTC3838-1
±0.67% on Channel 1 and ±0.75% on Channel 2, Differential Output Regulation on Both Channel 1 and 2
Single-Pin 30mV/60mV Current Sense Range Control
LTC3838-2
±0.67% Differential Output Regulation with Internal Reference on Channel 1
±4mV Differential Output Regulation with External Reference Voltage on Channel 2
Fixed 30mV Current Sense Range
38382f
2
For more information www.linear.com/3838-2
LTC3838-2
ELECTRICAL
CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 15V unless otherwise noted (Note 3).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
Main Control Loops
VIN
Input Voltage Operating Range
VOUT1,2
Regulated Output Voltage Operating Range
IQ
Input DC Supply Current
Both Channels Enabled
Only One Channel Enabled
Shutdown Supply Current
VFB1
Regulated Feedback Voltage on Channel 1
(VOUTSENSE1+ – VOUTSENSE1–)
VFB2
VOUT1 Regulated Differentially with Respect to
VOUTSENSE1–, VOUT2 Regulated Differentially with
Respect to VDFB2–
4.5
38
V
0.6
5.5
V
MODE/PLLIN = 0V, No Load
RUN1 or RUN2 (But Not Both) = 0V
RUN1 = RUN2 = 0V
3
2
15
mA
mA
µA
ITH1 = 1.2V, VOUTSENSE1– = 0V (Note 5)
TA = 25°C
TA = 0°C to 85°C
TA = –40°C to 125°C
l
l
0.5985
0.596
0.594
0.6
0.6
0.6
0.6015
0.604
0.606
V
V
V
Regulated Feedback Voltage on Channel 1
Over Line, Load and Common Mode
VIN = 4.5V to 38V, ITH1 = 0.5V to 1.9V,
TA = –40°C to 125°C (Note 5)
–0.5V < VOUTSENSE1– < 0.5V
l
0.591
0.6
0.609
V
Regulated Feedback Voltage on Channel 2
(2 • VDFB2+ – VDFB2–)
VDFB2– = 0V, ITH2 = 1.2V (Note 5)
EXTVREF2 = 0.6V, TA = 25°C
0.598
0.6
0.602
V
Regulated Feedback Voltage on Channel 2
Over Line, Load and Common Mode
ITH2 = 0.5V to 1.9V, –0.2V < VDFB2– < 0.2V,
TA = –40°C to 125°C (Note 5)
EXTVREF2 = 0.6V, VIN = 4.5V to 38V
EXTVREF2 = 1.5V, VIN = 4.5V to 38V
EXTVREF2 = 2.5V, VIN = 5.5V to 38V
0.596
1.494
2.493
0.6
1.5
2.5
0.604
1.506
2.507
V
V
V
l
l
l
IVOUTSENSE1+
VOUTSENSE1+ Input Bias Current
VOUTSENSE1+ = 0.6V, VOUTSENSE1– = 0V
0
±25
nA
IVOUTSENSE1–
VOUTSENSE1– Input Bias Current
VOUTSENSE1+ = 0.6V, VOUTSENSE1– = 0V
–25
–50
µA
IEXTVREF2
EXTVREF2 Input Bias Current
EXTVREF2 = 0.6V
–5
±50
nA
VEXTVREF2
Maximum EXTVREF2 Input Operating Voltage
VIN ≥ INTVCC ≥ 5V, TRACK/SS2 > 2.5V
VIN ≥ INTVCC ≥ 4V, TRACK/SS2 > 1.5V
0.4
V
IVDFB2+
VDFB2+ Input Bias Current
VDFB2+ = 0.3V, VDFB2– = 0V
0
±25
nA
IVDFB2–
VDFB2– Input Bias Current
VDFB2+ = 0.3V, VDFB2– = 0V
–6
–12
µA
gm(EA)1,2
Error Amplifier Transconductance
(∆ITH1,2 /∆VFB1,2)
ITH = 1.2V (Note 5)
1.7
mS
tON(MIN)1,2
Minimum Top Gate On-Time
VIN = 38V, VOUT = 0.6V, RT = 20k (Note 6)
30
ns
tOFF(MIN)1,2
Minimum Top Gate Off-Time
(Note 6)
90
ns
Minimum EXTVREF2 Input Operating Voltage
l
l
2.5
1.5
V
V
l
Current Sensing
VSENSE(MAX)1,2 Maximum Valley Current Sense Threshold
(VSENSE1,2+ – VSENSE1,2–)
VOUTSENSE1+ = 0.57V, VOUTSENSE1– = 0V,
EXTVREF2 = 0.6V, VDFB2+ = 0.285V, VDFB2– = 0V,
VSENSE1,2– = 2.5V
VSENSE(MIN)1,2 Minimum Valley Current Sense Threshold
(VSENSE1,2+ – VSENSE1,2–)
(Forced Continuous Mode)
VOUTSENSE1+ = 0.63V, VOUTSENSE1– = 0V,
EXTVREF2 = 0.6V, VDFB2+ = 0.315V, VDFB2– = 0V,
VSENSE1,2– = 2.5V
–15
l
24
30
ISENSE1,2+
SENSE1,2+ Pins Input Bias Current
VSENSE+ = 0.6V
VSENSE+ = 5V
±5
1
ISENSE1,2–
SENSE1,2– Pins Input Bias Current (Internal
500k Resistor to SGND)
VSENSE– = 0.6V
VSENSE– = 5V
1.2
10
36
mV
mV
±50
±2
nA
µA
µA
µA
38382f
For more information www.linear.com/3838-2
3
LTC3838-2
ELECTRICAL
CHARACTERISTICS
The l denotes the specifications which apply over the specified operating
junction temperature range, otherwise specifications are at TA = 25°C. VIN = 15V unless otherwise noted (Note 3).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
Start-Up and Shutdown
RUN Pin On Threshold
VRUN1,2 Rising
RUN Pin On Hysteresis
VRUN1,2 Falling from On Threshold
100
RUN Pin Pull-Up Current when Off
RUN1,2 = SGND
1.2
µA
RUN Pin Pull-Up Current Hysteresis
IRUN1,2(HYS) = IRUN1,2(ON) – IRUN1,2(OFF)
5
µA
UVLO
INTVCC Undervoltage Lockout
INTVCC Falling
INTVCC Rising
ITRACK/SS1,2
Soft-Start Pull-Up Current
0V < TRACK/SS1,2 < 0.6V
VRUN1,2
IRUN1,2
l
l
l
1.1
3.3
1.2
3.7
4.2
1.3
V
mV
4.5
1
V
V
µA
Frequency and Clock Synchronization
f
Clock Output Frequency
(Steady-State Switching Frequency)
RT = 205k
RT = 80.6k
RT = 18.2k
Channel 2 Phase (Relative to Channel 1)
PHASMD = SGND
PHASMD = Floating
PHASMD = INTVCC
180
180
240
Deg
Deg
Deg
CLKOUT Phase (Relative to Channel 1)
PHASMD = SGND
PHASMD = Floating
PHASMD = INTVCC
60
90
120
Deg
Deg
Deg
450
200
500
2000
550
kHz
kHz
kHz
VPLLIN(H)
Clock Input High Level Into MODE/PLLIN
VPLLIN(L)
Clock Input Low Level Into MODE/PLLIN
RMODE/PLLIN
MODE/PLLIN Input DC Resistance
With Respect to SGND
600
kΩ
2
V
0.5
V
Gate Drivers
RTG(UP)1,2
TG Driver Pull-Up On Resistance
TG High
2.5
Ω
RTG(DOWN)1,2
TG Driver Pull-Down On Resistance
TG Low
1.2
Ω
RBG(UP)1,2
BG Driver Pull-Up On Resistance
BG High
2.5
Ω
RBG(DOWN)1,2
BG Driver Pull-Down On Resistance
BG Low
0.8
Ω
tD(TG/BG)1,2
Top Gate Off to Bottom Gate On Delay Time
(Note 6)
20
ns
tD(BG/TG)1,2
Bottom Gate Off to Top Gate On Delay Time
(Note 6)
15
ns
Internal VCC Regulator
VDRVCC1
Internally Regulated DRVCC1 Voltage
6V < VIN < 38V
DRVCC1 Load Regulation
IDRVCC1 = 0mA to –100mA
VEXTVCC
EXTVCC Switchover Voltage
EXTVCC Rising
5.0
4.4
EXTVCC Switchover Hysteresis
EXTVCC to DRVCC2 Voltage Drop
VEXTVCC = 5V, IDRVCC2 = –100mA
5.3
5.6
V
–1.5
–3
%
4.6
4.8
V
200
mV
200
mV
PGood Output
OV
PGOOD Overvoltage Threshold
VFB1,2 Rising from Regulated Voltage
5
7.5
10
%
UV
PGOOD Undervoltage Threshold
VFB1,2 Falling from Regulated Voltage
–5
–7.5
–10
%
PGOOD Threshold Hysteresis
VFB1,2 Returning to Regulated Voltage
15
VPGOOD(L)1,2
PGOOD Low Voltage
IPGOOD = 2mA
0.1
tD(PGOOD)1,2
Delay from VFB Fault (OV/UV) to PGOOD Falling
Delay from VFB Good (OV/UV Cleared) to
PGOOD Rising
50
20
mV
0.3
V
µs
µs
38382f
4
For more information www.linear.com/3838-2
LTC3838-2
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The junction temperature (TJ, in °C) is calculated from the ambient
temperature (TA, in °C) and power dissipation (PD, in Watts) according to
the formula:
TJ = TA + (PD • θJA)
where θJA (in °C/W) is the package thermal impedance.
Note 3: The LTC3838-2 is tested under pulsed load conditions such that TJ
≈ TA. The LTC3838E-2 is guaranteed to meet specifications over the 0°C to
85°C operating junction temperature range. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization and correlation with statistical process controls. The
LTC3838I-2 is guaranteed to meet specifications over the –40°C to 125°C
operating junction temperature range . Note that the maximum ambient
temperature consistent with these specifications is determined by specific
operating conditions in conjunction with board layout, the rated package
thermal impedance and other environmental factors.
Note 4: This IC includes overtemperature protection that is intended to
protect the device during momentary overload conditions. The maximum
rated junction temperature will be exceeded when this protection is active.
Continuous operation above the specified absolute maximum operating
junction temperature may impair device reliability or permanently damage
the device.
Note 5: The LTC3838-2 is tested in a feedback loop that adjusts voltages
on VOUTSENSE1+ and VDFB2+ pins to achieve specified error amplifier output
voltages (ITH1,2).
In order to simplify the total system error computation, the regulated
voltage is defined in one combined specification which includes the effects
of line, load and common mode variation. The combined regulated voltage
specification is tested by independently varying line, load, and common
mode, which by design do not significantly affect one another. For any
combination of line, load, and common mode variation, the regulated
voltage should be within the limits specified that are tested in production
to the following conditions:
Line: VIN = 4.5V to 38V, ITH = 1.2V, VOUTSENSE1– = 0V, VDFB2– = 0V
Load: VIN = 15V, ITH = 0.5V to 1.9V, VOUTSENSE1– = 0V, VDFB2– = 0V
Common mode: VIN = 15V, ITH = 1.2V, VOUTSENSE1– = ±0.5V, ±0.2V,
VDFB2– = ±0.2V
Note 6: Delay times are measured with top gate (TG) and bottom gate
(BG) driving minimum load, and using 50% levels.
38382f
For more information www.linear.com/3838-2
5
LTC3838-2
TYPICAL PERFORMANCE CHARACTERISTICS
Transient Response
(Forced Continuous Mode)
Load Step
(Forced Continuous Mode)
Load Release
(Forced Continuous Mode)
ILOAD
10A/DIV
ILOAD
10A/DIV
ILOAD
10A/DIV
VOUT
50mV/DIV
AC-COUPLED
VOUT
50mV/DIV
AC-COUPLED
VOUT
50mV/DIV
AC-COUPLED
IL
10A/DIV
IL
10A/DIV
50µs/DIV
LOAD TRANSIENT = 0A TO 15A TO 0A
VIN = 12V
VOUT = 1.2V
FIGURE 17 CIRCUIT, CHANNEL 1
IL
10A/DIV
5µs/DIV
LOAD STEP = 0A TO 15A
VIN = 12V
VOUT = 1.2V
FIGURE 17 CIRCUIT, CHANNEL 1
38382 G01
Transient Response
(Discontinuous Mode)
5µs/DIV
LOAD RELEASE = 15A TO 0A
VIN = 12V
VOUT = 1.2V
FIGURE 17 CIRCUIT, CHANNEL 1
Load Step
(Discontinuous Mode)
ILOAD
10A/DIV
ILOAD
10A/DIV
VOUT
50mV/DIV
AC-COUPLED
VOUT
50mV/DIV
AC-COUPLED
IL
10A/DIV
IL
10A/DIV
38382 G04
50µs/DIV
LOAD TRANSIENT = 500mA TO 15A TO 500mA
VIN = 12V
VOUT = 1.2V
FIGURE 17 CIRCUIT, CHANNEL 1
38382 G03
Load Release
(Discontinuous Mode)
ILOAD
10A/DIV
VOUT
50mV/DIV
AC-COUPLED
IL
10A/DIV
5µs/DIV
LOAD STEP = 500mA TO 15A
VIN = 12V
VOUT = 1.2V
FIGURE 17 CIRCUIT, CHANNEL 1
Load Release with Detect Transient (DTR)
Feature Enabled
38382 G05
5µs/DIV
LOAD RELEASE = 15A TO 500mA
VIN = 12V
VOUT = 1.2V
FIGURE 17 CIRCUIT, CHANNEL 1
38382 G06
Load Release with Detect Transient (DTR)
Feature Disabled
SW
3V/DIV
SW
3V/DIV
VOUT
50mV/DIV
AC-COUPLED
ITH
1V/DIV
VOUT
50mV/DIV
AC-COUPLED
IL
10A/DIV
IL
10A/DIV
ITH
1V/DIV
5µs/DIV
LOAD RELEASE = 15A TO 5A
VIN = 5V
VOUT = 0.6V
38382 G07
LOAD RELEASE = 15A TO 5A
VIN = 5V
VOUT = 0.6V
FIGURE 17 CIRCUIT, CHANNEL 1 MODIFIED:
RFB2 = 0Ω, CITH1 = 120pF, CITH2 = 0pF,
FROM DTR1 PIN: RITH1 = 46.4k TO SGND, RITH2 = 42.2k TO INTVCC
SHADING OBTAINED WITH INFINITE PERSISTENCE ON
OSCILLOSCOPE WAVEFORMS
6
38382 G02
5µs/DIV
38382 G08
FIGURE 17 CIRCUIT, CHANNEL 1 MODIFIED:
RFB2 = 0Ω, CITH1 = 120pF, CITH2 = 0pF,
RITH1/2 = 46.4k TO SGND//42.2k TO INTVCC,
CONNECTION FROM RITH1/2 AND CITH1 TO DTR1 PIN REMOVED.
DTR1 PIN TIED TO INTVCC
For more information www.linear.com/3838-2
38382f
LTC3838-2
TYPICAL PERFORMANCE CHARACTERISTICS
Soft Start-Up with Internal
Reference
Soft Start-Up Into
Prebiased Output
RUN1
5V/DIV
RUN1
5V/DIV
TRACK/SS1
200mV/DIV
EXTVREF2
500mV/DIV
TRACK/SS2
500mV/DIV
VOUT
500mV/DIV
TRACK/SS1
200mV/DIV
CSS = 10nF
1ms/DIV
VIN = 12V
VOUT = 1.2V
FORCED CONTINUOUS MODE
FIGURE 17 CIRCUIT, CHANNEL 1
38382 G09
CSS = 10nF
1ms/DIV
VIN = 12V
VOUT = 1.2V
VOUT PRE-BIASED TO 0.75V
FIGURE 17 CIRCUIT, CHANNEL 1
Overcurrent Protection
38382 G10
VOUT
1V/DIV
FULL CURRENT LIMIT
WHEN VOUT HIGHER
THAN HALF OF REGULATED
Overvoltage Protection
CURRENT LIMIT STARTS TO FOLD BACK AS
VOUT DROPS BELOW HALF OF REGULATED
COUT
RECHARGE
VIN = 12V
500µs/DIV
VOUT = 1.2V
ILOAD = 0A
FIGURE 17 CIRCUIT, CHANNEL 1
38382 G12
Phase Relationship:
PHASMD = Ground
SW1
10V/DIV
0°
38382 G14
VIN = 12V
20µs/DIV
VOUT = 1.2V
BG STAYS ON UNTIL
FORCED
VOUT IS PULLED
CONTINUOUS MODE BELOW OVERVOLTAGE
THRESHOLD
ILOAD = 0A
FIGURE 17 CIRCUIT, CHANNEL 1
Phase Relationship:
PHASMD = INTVCC
PLLIN
5V/DIV
SW1
10V/DIV
0°
SW2
10V/DIV
180°
60°
38382 G15
500ns/DIV
FIGURE 21 CIRCUIT
VIN = 12V
VOUT1 = 5V, VOUT2 = 3.3V
LOAD = 0A
MODE/PLLIN = 333kHz EXTERNAL CLOCK
CLKOUT
5V/DIV
OVERVOLTAGE CREATED BY APPLYING
A CHARGED CAPACITOR TO VOUT
BG1
5V/DIV
38382 G13
PLLIN
5V/DIV
SW2
10V/DIV
VOUT
100mV/DIV
AC-COUPLED
Phase Relationship:
PHASMD = Float
PLLIN
5V/DIV
38382 G11
IL
10A/DIV
IL
10A/DIV
VOUT
100mV/DIV
AC-COUPLED
VIN = 12V
5ms/DIV
VOUT = 1.2V
FORCED CONTINUOUS MODE
CURRENT LIMIT = 17A
OVERLOAD = 7.5A TO 17.5A
FIGURE 17 CIRCUIT, CHANNEL 1
CSS = 10nF
2ms/DIV
VIN = 12V
EXTVREF2 = 1.2V
VOUT = 1.2V
FORCED CONTINUOUS MODE
FIGURE 17 CIRCUIT, CHANNEL 2
Short-Circuit Protection
SHORTCIRCUIT
TRIGGER
IL
5A/DIV
CLKOUT
5V/DIV
RUN2
5V/DIV
VOUT
500mV/DIV
VOUT
500mV/DIV
SW1
10V/DIV
Soft Start-Up with External
Reference
0°
SW2
10V/DIV
180°
90°
38382 G16
500ns/DIV
FIGURE 21 CIRCUIT
VIN = 12V
VOUT1 = 5V, VOUT2 = 3.3V
LOAD = 0A
MODE/PLLIN = 333kHz EXTERNAL CLOCK
CLKOUT
5V/DIV
240°
120°
38382 G17
500ns/DIV
FIGURE 21 CIRCUIT
VIN = 12V
VOUT1 = 5V, VOUT2 = 3.3V
LOAD = 0A
MODE/PLLIN = 333kHz EXTERNAL CLOCK
38382f
For more information www.linear.com/3838-2
7
LTC3838-2
TYPICAL PERFORMANCE CHARACTERISTICS
Output Regulation
vs Input Voltage
NORMALIZED ∆VOUT (%)
0.1
NORMALIZED ∆VOUT (%)
0.2
VOUT = 0.6V
ILOAD = 5A
VOUT NORMALIZED AT VIN = 15V
0
–0.1
Output Regulation
vs Temperature
0.6
VIN = 15V
VOUT = 0.6V
VOUT NORMALIZED AT ILOAD = 4A
0.1
NORMALIZED ∆VOUT (%)
0.2
Output Regulation
vs Load Current
0
VIN = 15V
VOUT = 0.6V
0.4 ILOAD = 0A
VOUT NORMALIZED AT TA = 25°C
0.2
0
–0.2
–0.1
–0.4
–0.2
0
5
10
15
20 25
VIN (V)
30
35
–0.2
40
2
0
6
4
ILOAD (A)
8
Error Amplifier Transconductance
vs Temperature
1.80
CLKOUT/Switching Frequency
vs Temperature
2
2
1
1
1.60
NORMALIZED ∆f (%)
NORMALIZED ∆f (%)
1.75
1.65
0
–1
VOUT = 0.6V
ILOAD = 5A
f = 500kHz
FREQUENCY NORMALIZED AT VIN = 15V
1.55
1.50
–50 –25
0
–2
25 50 75 100 125 150
TEMPERATURE (°C)
0
5
10
20 25
VIN (V)
15
30
tON(MIN) and tOFF(MIN)
vs VOUT (Voltage on SENSE– Pin)
0
–1
–2
–50 –25
40
100
90
90
tOFF(MIN)
100
90
tOFF(MIN)
80
80
70
60
tON(MIN)
30
tON(MIN)
40
30
20
0
1
2
3
4
VSENSE– (V)
5
6
38382 G24
tON(MIN)
20
VOUT = 0.6V
RT ADJUSTED FOR fCLKOUT = 2MHz
10
0
tOFF(MIN)
50
40
30
20
VIN = 38V
RT ADJUSTED FOR fCLKOUT = 2MHz
10
0
50
TIME (ns)
70
60
TIME (ns)
70
50
25 50 75 100 125 150
TEMPERATURE (°C)
tON(MIN) and tOFF(MIN)
vs Switching Frequency
60
40
0
38382 G23
tON(MIN) and tOFF(MIN)
vs Voltage on VIN Pin
100
TIME (ns)
35
VIN = 15V, VOUT = 0.6V
ILOAD = 0A
f = 500kHz
FREQUENCY NORMALIZED AT TA = 25°C
38382 G21
38382 G27
80
25 50 75 100 125 150
TEMPERATURE (°C)
38382 G20
CLKOUT/Switching Frequency
vs Input Voltage
1.70
0
38382 G19
38382 G18
TRANSCONDUCTANCE (mS)
–0.6
–50 –25
10
0
5
10
15
20 25
VIN (V)
30
VIN = 38V
VOUT = 0.6V
0
500
200
800 1100 1400 1700 2000
CLKOUT/SWITCHING FREQUENCY (kHz)
10
35
40
38382 G25
38382 G26
38382f
8
For more information www.linear.com/3838-2
LTC3838-2
TYPICAL PERFORMANCE CHARACTERISTICS
Current Sense Voltage
vs ITH Voltage
80
60
40
20
0
–20
–40
–60
0
0.8
1.2
1.6
ITH VOLTAGE (V)
0.4
2.4
2
100
80
60
40
20
0
–50 –25
0
25 50 75 100 125 150
TEMPERATURE (°C)
38382 G28
RUN Pin Thresholds
vs Temperature
SWITCHING REGION
STAND-BY REGION
0.8
0.6
SHUTDOWN REGION
3
0.95
0.90
0.85
0
0.80
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
UVLO RELEASE
(INTVCC RISING)
3.5
BOTH CHANNELS ON
30
UVLO LOCK
(INTVCC FALLING)
25
20
15
10
3.5
130°C
25°C
–45°C
5
25 50 75 100 125 150
TEMPERATURE (°C)
38382 G33
25 50 75 100 125 150
TEMPERATURE (°C)
Quiescent Current Into VIN Pin
vs Temperature
35
3.9
0
38382 G32
40
CURRENT (µA)
UVLO THRESHOLDS (V)
1.00
38381 G31
4.5
0
5.5
1.05
Shutdown Current Into VIN Pin
vs Voltage on VIN Pin
4.1
1.5
2.5
3.5
4.5
SENSE – PIN VOLTAGE (V)
38382 G22
RUN PIN BELOW 1.2V
SWITCHING THRESHOLD
0
–50 –25
25 50 75 100 125 150
TEMPERATURE (°C)
INTVCC Undervoltage Lockout
Thresholds vs Temperature
0
0.5
1.10
4
38382 G30
3.3
–50 –25
0
–0.5
TRACK/SS Pull-Up Currents
vs Temperature
RUN PIN ABOVE 1.2V
SWITCHING THRESHOLD
5
1
3.7
20
1.15
0.2
4.3
40
7
2
0
60
1.20
0.4
0
–50 –25
80
8
6
CURRENT (µA)
RUN PIN THRESHOLDS (V)
1.2
1.0
100
RUN Pull-Up Currents
vs Temperature
1.6
1.4
120
38382 G29
CURRENT (µA)
CURRENT SENSE VOLTAGE (mV)
100
120
MAXIMUM CURRENT SENSE VOLTAGE (mV)
MAXIMUM CURRENT SENSE VOLTAGE (mV)
FORCED CONTINUOUS MODE
Maximum Current Sense Voltage
vs Voltage on SENSE– Pin
0
5
10
15
20
25
30
35
40
VIN (V)
38382 G34
QUIESCENT CURRENT (mA)
120
Maximum Current Sense Voltage
vs Temperature
3.0
2.5
CHANNEL 1 ON ONLY OR
CHANNEL 2 ON ONLY
2.0
1.5
1.0
–50 –25
0
25 50
75 100 125 150
TEMPERATURE (°C)
38382 G35
38382f
For more information www.linear.com/3838-2
9
LTC3838-2
PIN FUNCTIONS
VDFB2+ (Pin 1): Differential Feedback Amplifier Positive
(+) Input of Channel 2. As shown in the Functional Diagram, connect this pin to a 3-resistor feedback divider
network, which is composed of RDFB1 and RDFB2 from
this pin to the negative and positive terminals of VOUT2
respectively, and a third resistor from this pin to the remote ground of external reference voltage (VREF2–). The
third resistor must have a value equal to RDFB1//RDFB2
for accurate differential regulation. With the 3-resistor
feedback divider network, the LTC3838-2 will regulate the
differential output (VOUT2+ – VOUT2–) to (VREF2+ – VREF2–)
• (RDFB1 + RDFB2)/RDFB1.
EXTVREF2 (Pin 2): External Reference Voltage for Channel 2.
Connect this pin to the positive (+) terminal of external
reference voltage (VREF2+). The internal feedback voltage
VFB2 (i.e., 2 • VDFB2+ – VDFB2–) will be regulated to the
voltage on this pin, so that the differential VOUT2 equals
(VREF2+ – VREF2–) • (RDFB1 + RDFB2)/RDFB1. When this pin
is less than around 100mV, the TRACK/SS2 pin will be
pulled to ground to keep channel 2 from switching. Channel
2’s overvoltage and undervoltage thresholds are ±7.5% of
this EXTVREF2 pin voltage. For valid PGOOD2 signal upon
startup and to avoid prebiased VOUT2 (if any) being pulled
down, apply EXTVREF2 before RUN2 is enabled. Normal
operations are only guaranteed with an EXTVREF2 of 0.4V
minimum and 1.5V maximum at INTVCC ≥ 4V, or 2.5V
maximum at INTVCC ≥ 5V. Note its small bias current (see
the Electrical Characteristics section) may cause offset if
external R-C filter is connected to this pin for either limiting voltage slew rate or filtering noise.
MODE/PLLIN (Pin 5): Operation Mode Selection or External Clock Synchronization Input. When this pin is tied to
INTVCC, forced continuous mode operation is selected. Tying this pin to SGND allows discontinuous mode operation.
When an external clock is applied at this pin, both channels
operate in forced continuous mode and synchronize to the
external clock. This pin has an internal 600k pull-down
resistor to SGND.
CLKOUT (Pin 6): Clock Output of Internal Clock Generator. Its output level swings between INTVCC and SGND.
If clock input is present at the MODE/PLLIN pin, it will
be synchronized to the input clock, with phase set by the
PHASMD pin. If no clock is present at MODE/PLLIN, its
frequency will be set by the RT pin. To synchronize other
controllers, it can be connected to their MODE/PLLIN pins.
SGND (Pin 7): Signal Ground. All small-signal analog and
compensation components should be connected to this
ground. Connect SGND to the exposed pad and PGND pin
using a single PCB trace.
RT (Pin 8): Clock Generator Frequency Programming Pin.
Connect an external resistor from RT to SGND to program
the switching frequency between 200kHz and 2MHz. An
external clock applied to MODE/PLLIN should be within
±30% of this programmed frequency to ensure frequency
lock. When the RT pin is floating, the frequency is internally
set to be slightly under 200kHz.
PHASMD (Pin 9): Phase Selector Input. This pin
determines the relative phases of channels and the
CLKOUT signal. With zero phase being defined as the
rising edge of TG1: Pulling this pin to SGND locks TG2 to
180°, and CLKOUT to 60°. Connecting this pin to INTVCC
locks TG2 to 240° and CLKOUT to 120°. Floating this pin
locks TG2 to 180° and CLKOUT to 90°.
ITH1, ITH2 (Pin 10, Pin 3): Current Control Threshold. This
pin is the output of the error amplifier and the switching
regulator’s compensation point. The current comparator
threshold increases with this control voltage. The voltage
ranges from 0V to 2.4V, with 0.8V corresponding to zero
sense voltage (zero inductor valley current).
TRACK/SS1, TRACK/SS2 (Pin 11, Pin 4): External Tracking and Soft-Start Input. Channel 1 regulates the feedback
voltage VFB1 = VOUTSENSE1+ – VOUTSENSE1– to the smaller
of 0.6V or the voltage on the TRACK/SS1 pin. Channel 2
regulates the VFB2 = 2 • VDFB2+ – VDFB2– to the smaller
of the voltage on the EXTVREF2 pin or the voltage on the
TRACK/SS2 pin. An internal 1µA temperature-independent
pull-up current source is connected to each TRACK/SS
pin. A capacitor to ground at this pin sets the ramp time
to the final regulated output voltage. Alternatively, another
voltage supply connected to this pin allows the output to
track the other supply during start-up. In applications that
operate simultaneously at both high EXTVREF2 (>1.5V)
and low VIN (<6V) pin voltages, external pull-up (resistor
or fixed current from INTVCC) may be required so that
TRACK/SS2 rises well above EXTVREF2.
38382f
10
For more information www.linear.com/3838-2
LTC3838-2
PIN FUNCTIONS
VOUTSENSE1+ (Pin 12): Differential Output Sense Amplifier
(+) Input of Channel 1. Connect this pin to a feedback
resistor divider between the positive and negative output
capacitor terminals of VOUT1, as shown in the Functional
Diagram. In normal operation, the LTC3838-2 will regulate
the differential output voltage VOUT1 to 0.6V divided by
the feedback resistor divider ratio, i.e., VOUT1+ – VOUT2– =
0.6V • (RFB1 + RFB2)/RFB1.
Shorting the VOUTSENSE1+ pin to INTVCC will disable
channel 1’s error amplifier, and internally connect ITH1
to ITH2. (As a result, TRACK/SS1 is no longer functional
and PGOOD1 is always pulling low.) By doing so, this
part can function as a dual phase, single VOUT step-down
controller, and the two channels use a single channel 2’s
error amplifier for the ITH output and compensation.
VOUTSENSE1– (Pin 13): Differential Output Sense Amplifier
(–) Input of Channel 1. Connect this pin to the negative
terminal of the output load capacitor of VOUT1.
SENSE1+, SENSE2+ (Pin 14, Pin 37): Differential Current
Sense Comparator (+) Inputs. The ITH pin voltage and
controlled offsets between the SENSE+ and SENSE– pins
set the current trip threshold. The comparator can be used
for RSENSE sensing or inductor DCR sensing. For RSENSE
sensing, Kelvin (4-wire) connect the SENSE+ pin to the
(+) terminal of RSENSE. For DCR sensing, tie the SENSE+
pins to the connection between the DCR sense capacitor
and sense resistor tied across the inductor.
SENSE1–, SENSE2– (Pin 15, Pin 36): Differential Current
Sense Comparator (–) Input. The comparator can be used
for RSENSE sensing or inductor DCR sensing. For RSENSE
sensing, Kelvin (4-wire) connect the SENSE– pin to the (–)
terminal of RSENSE. For DCR sensing, tie the SENSE– pin
to the DCR sense capacitor tied to the inductor VOUT node
connection. These pins also function as output voltage
sense pins for the top MOSFET on-time adjustment. The
impedance looking into these pins is different from the
SENSE+ pins because there is an additional 500k internal
resistor from each of the SENSE– pins to SGND.
DTR1, DTR2 (Pin 16, Pin 35): Detect Load-Release Transient for Overshoot Reduction. When load current suddenly drops, if voltage on this DTR pin drops below half
of INTVCC, the bottom gate (BG) could turn off, allowing
the inductor current to drop to zero faster, thus reducing
the VOUT overshoot. (Refer to Load-Release Transient
Detection in the Applications Information section for more
details.) An internal 2.5μA current source pulls this pin
toward INTVCC. To disable the DTR feature, simply tie the
DTR pin to INTVCC.
RUN1, RUN2 (Pin 17, Pin 34): Run Control Inputs. An
internal proportional-to-absolute-temperature (PTAT)
pull-up current source (~1.2µA at 25°C) is constantly
connected to this pin. Taking both RUN1 and RUN2 pins
below a threshold voltage (~0.8V at 25°C) shuts down all
bias of INTVCC and DRVCC and places the LTC3838-2 into
micropower shutdown mode. Allowing either RUN pin to
rise above this threshold would turn on the internal bias
supply and the circuitry for the particular channel. When
a RUN pin rises above 1.2V, its corresponding channel’s
TG and BG drivers are turned on and an additional 5µA
temperature-independent pull-up current is connected
internally to the RUN pin. Either RUN pin can sink up to
50µA, or be forced no higher than 6V.
PGOOD1, PGOOD2 (Pin 18, Pin 33): Power Good Indicator
Outputs. This open-drain logic output is pulled to ground
when the output voltage goes out of a ±7.5% window around
the regulation point, after a 50µs power-bad-masking
delay. Returning to the regulation point, there is a delay
of around 20µs to power good, and a hysteresis of around
15mV (on the same scale as each channel’s reference
and internal feedback voltages VFB1,2) on both sides of
the voltage window. Channel 2’s ±7.5% window is based
on the EXTVREF2 pin voltage, and only guaranteed with a
minimum EXTVREF2 of 0.4V. To ensure valid PGOOD2 upon
start-up, apply stable EXTVREF2 before RUN2 is enabled.
BOOST1, BOOST2 (Pin 19, Pin 32): Boosted Floating
Supplies for Top MOSFET Drivers. The (+) terminal of the
bootstrap capacitor, CB, connects to this pin. The BOOST
pins swing by a VIN between a diode drop below DRVCC,
or (VDRVCC – VD) and (VIN + VDRVCC – VD).
38382f
For more information www.linear.com/3838-2
11
LTC3838-2
PIN FUNCTIONS
TG1, TG2 (Pin 20, Pin 31): Top Gate Driver Outputs. The
TG pins drive the gates of the top N-channel power MOSFET
with a voltage swing of VDRVCC between SW and BOOST.
SW1, SW2 (Pin 21, Pin 30): Switch Node Connection to
Inductors. Voltage swings are from a diode voltage below
ground to VIN. The (–) terminal of the bootstrap capacitor,
CB, connects to this node.
BG1, BG2 (Pin 22, Pin 29): Bottom Gate Driver Outputs.
The BG pins drive the gates of the bottom N‑channel power
MOSFET between PGND and DRVCC.
DRVCC1, DRVCC2 (Pin 23, Pin 28): Supplies of Bottom
Gate Drivers. DRVCC1 is also the output of an internal 5.3V
regulator. DRVCC2 is also the output of the EXTVCC switch.
Normally the two DRVCC pins are shorted together on the
PCB, and decoupled to PGND with a minimum of 4.7µF
ceramic capacitor, CDRVCC.
VIN (Pin 24): Input Voltage Supply. The supply voltage
can range from 4.5V to 38V. For increased noise immunity
decouple this pin to SGND with an RC filter. Voltage at
this pin is also used to adjust top gate on-time, therefore
it is recommended to tie this pin to the main power input
supply through an RC filter.
PGND (Pin 25, Exposed Pad Pin 39): Power Ground.
Connect this pin as close as practical to the source of the
bottom N-channel power MOSFET, the (–) terminal of
CDRVCC and the (–) terminal of CIN. Connect the exposed
pad and PGND pin to SGND pin using a single PCB trace
under the IC. The exposed pad must be soldered to the
circuit board for electrical and rated thermal performance.
INTVCC (Pin 26): Supply Input for Internal Circuitry (Not
Including Gate Drivers). Normally powered from the DRVCC
pins through a decoupling RC filter to SGND (typically
2Ω and 1µF).
EXTVCC (Pin 27): External Power Input. When EXTVCC
exceeds the switchover voltage (typically 4.6V), an internal
switch connects this pin to DRVCC2 and shuts down the
internal regulator so that INTVCC and gate drivers draw
power from EXTVCC. The VIN pin still needs to be powered
up but draws minimum current.
VDFB2­– (Pin 38): Differential Feedback Amplifier Negative
(–) Input of Channel 2. Connect this pin to the negative
terminal of the output load capacitor of VOUT2.
38382f
12
For more information www.linear.com/3838-2
LTC3838-2
FUNCTIONAL DIAGRAM
VIN
VIN
IN
EN LDO
OUT SD
1-2µA
PTAT
5µA
+
UVLO
RUN
BOOST
TG
DRV
–
+
1.2V
4.2V
MT
L
SW
EN_DRV
–
CB
DB
TG
RSENSE
VOUT+
DRVCC
~0.8V
–
–
LOGIC
CONTROL
SENSE–
ONE-SHOT
TIMER
250k
STOP
CDRVCC
BG DRV
BG
MB
PGND
+
VOUT–
IREV
CLK1
CLK2
+
–
–
SENSE+
SENSE–
TO CHANNEL 2
CLKOUT
EA
gm
INTVCC
+
RPGD
COUT
DRVCC1
ICMP
RT
CINTVCC
DRVCC2
PHASE
DETECTOR
MODE/CLK
DETECT
CLOCK PLL/
GENERATOR
INTVCC
ON-TIME
ADJUST
MODE/PLLIN
RT
~4.6V
START
VIN
250k
FORCED
CONTINUOUS
MODE
EXTVCC
+
+
+7.5%
1µA
+
+
–
TRACK/SS
VREFERENCE
CSS
0.6V INTERNAL (CHANNEL 1)
0.4V TO 2.5V EXTERNAL (CHANNEL 2) EXTVREF2
VREF2+
UV
PGOOD
–
+
VFB1 (CHANNEL 1)
DELAY
DIFFAMP
(A = 1)
–
+
VOUTSENSE1+
VOUTSENSE1–
RFB1 (1)
RFB2 (1)
–
–7.5%
VOUT1+
–
–
VDFB2
50k
INTVCC
1/2 INTVCC
ITH
DTR
+
RDFB1
50k
LOAD
RELEASE
DETECTION
–
RDFB1//RDFB2
VDFB2+
+
VFB2 (CHANNEL 2)
DUPLICATE DASHED
LINE BOX FOR
CHANNEL 2
REMOTE OUTPUT
SENSING
(CHANNEL 1)
VOUT1–
OV
RDFB2
DIFFERENTIAL
EXTERNAL
REFERENCE
SENSING
(CHANNEL 2)
+
–
VREF2
VREF2–
REMOTE OUTPUT
SENSING
(CHANNEL 2)
VOUT2+
VOUT2–
TO LOGIC
CONTROL
38382 FD
INTVCC
CITH1
CITH2
OPT
RITH2
RITH1
38382f
For more information www.linear.com/3838-2
13
LTC3838-2
OPERATION (Refer to Functional Diagram)
Main Control Loop
The LTC3838-2 is a controlled on-time, valley current
mode step-down DC/DC dual controller with two channels
operating out of phase. Each channel drives both main
and synchronous N-channel MOSFETs. The two channels
can be either configured to two independently regulated
outputs, or combined into a single output.
The top MOSFET is turned on for a time interval determined
by a one-shot timer. The duration of the one-shot timer is
controlled to maintain a fixed switching frequency. As the
top MOSFET is turned off, the bottom MOSFET is turned
on after a small delay. The delay, or dead time, is to avoid
both top and bottom MOSFETs being on at the same time,
causing shoot-through current from VIN directly to power
ground. The next switching cycle is initiated when the current comparator, ICMP, senses that inductor current falls
below the trip level set by voltages at the ITH and VRNG
pins. The bottom MOSFET is turned off immediately and
the top MOSFET on again, restarting the one-shot timer
and repeating the cycle. In order to avoid shoot-through
current, there is also a small dead-time delay before the
top MOSFET turns on. At this moment, the inductor current hits its “valley” and starts to rise again.
Inductor current is determined by sensing the voltage
between SENSE+ and SENSE–, either by using an explicit
resistor connected in series with the inductor or by implicitly
sensing the inductor’s DC resistive (DCR) voltage drop
through an RC filter connected across the inductor. The
trip level of the current comparator, ICMP , is proportional
to the voltage at the ITH pin, with a zero-current threshold
corresponding to an ITH voltage of around 0.8V.
The error amplifier (EA) adjusts this ITH voltage by comparing the feedback signal (VFB) derived from the difference
amplifier (DIFFAMP) to an internal or external reference
voltage. The ITH voltage controls the output by adjusting
the current in the inductor. Output voltage is regulated so
that the feedback voltage is equal to the reference. If the
load current increases/decreases, it causes a momentary
drop/rise in the differential feedback voltage relative to
the reference. The EA then moves ITH voltage, or inductor valley current setpoint, higher/lower until the average
inductor current again matches the load current, so that
the output voltage comes back to the regulated voltage.
The LTC3838-2 features a detect transient (DTR) pin to
detect “load-release”, or a transient where the load current
suddenly drops, by monitoring the first derivative of the
ITH voltage. When detected, the bottom gate (BG) is turned
off and inductor current flows through the body diode in
the bottom MOSFET, allowing the SW node voltage to
drop below PGND by the body diode’s forward-conduction
voltage. This creates a more negative differential voltage
(VSW – VOUT) across the inductor, allowing the inductor
current to drop faster to zero, thus creating less overshoot
on VOUT. See Load-Release Transient Detection in Applications Information for details.
Differential Output Sensing and External Reference
Both channels of this dual controller have differential
output voltage sensing. The output voltage is resistively
divided externally to create a feedback voltage for the
controller. As shown in the Functional Diagram, channel 1
uses an external 2-resistor voltage divider, and an internal
unity-gain difference amplifier (DIFFAMP) that converts
the differential feedback signal to a single-ended internal
feedback voltage VFB1 = VOUTSENSE1+ – VOUTSENSE1–
with respect to SGND. With the external resistor divider, VOUT1+– VOUT1– = VFB1 • (RFB1 + RFB2)/RFB1.
Channel 2 has a unique feedback amplifier that produces
VFB2 = 2 • VDFB2+ – VDFB2–. Its external feedback network
requires a third resistor tied to the external reference
remote ground (VREF2–). The third resistor must have a
value equal to the parallel value of the two voltage divider
resistors RDFB1 and RDFB2 so that VOUT2+ – VOUT2– =
(VFB2 – VREF2– ) • (RDFB1 + RDFB2)/RDFB1.
38382f
14
For more information www.linear.com/3838-2
LTC3838-2
OPERATION (Refer to Functional Diagram)
Both channels adjust outputs through system feedback
loops so that the internally-generated single-ended feedback voltages (VFB1,2 in the Functional Diagram) equal
either the internal 0.6V reference (for channel 1) or the
EXTVREF2 = VREF2+ (for channel 2) when in regulation.
Therefore, the differential VOUT1 is regulated to 0.6V • (RFB1
+ RFB2)/RFB1, and the differential VOUT2 is regulated to
(VREF2+ – VREF2–) • (RDFB1 + RDFB2)/RDFB1. Such schemes
eliminate any ground offsets between local ground and
remote output ground, resulting in a more accurate output
voltage. Channel 1 allows remote output ground to deviate
as much as ±500mV, and channel 2 allows as much as
±200mV, with respect to local ground (SGND).
Channel 2 senses the external reference voltage VREF2 differentially. The positive terminal of the external reference
VREF2+ is fed into the EXTVREF2 pin. The remote ground
of the external reference VREF2– is connected to the third
resistor in the external output voltage feedback network.
The IC itself does not see the VREF2– directly, but to keep
the regulation accuracy, the common mode voltage of the
external reference is practically limited by the voltages on
EXTVREF2 pin as specified in the Electrical Characteristic
table, and the VDFB2+ pin (≥ –0.2V), etc.
If the EXTVCC pin is below the EXTVCC switchover voltage
(typically 4.6V with 200mV hysteresis, see the Electrical Characteristics Table), then the internal 5.3V LDO is
enabled. If the EXTVCC pin is tied to an external voltage
source greater than this EXTVCC switchover voltage, then
the LDO is shut down and the internal EXTVCC switch
shorts the EXTVCC pin to the DRVCC2 pin. In this case,
DRVCC and INTVCC draw power from the external voltage
source which helps to increase overall efficiency and decrease internal self heating from power dissipated in the
LDO. If the output voltage of the converter itself is above
the upper switchover voltage limit (4.8V), it can provide
power for EXTVCC. The VIN pin still needs to be powered
up but now draws minimum current.
Power for most internal control circuitry other than gate
drivers is derived from the INTVCC pin. INTVCC can be powered from the combined DRVCC pins through an external
RC filter to SGND to filter out noises due to switching.
Shutdown and Start-Up
DRVCC1,2 are the power for the bottom MOSFET drivers.
Normally the two DRVCC pins are shorted together on
the PCB, and decoupled to PGND with a minimum 4.7µF
ceramic capacitor, CDRVCC. The top MOSFET drivers are
biased from the floating bootstrap capacitors (CB1,2)
which are recharged during each cycle through an external
Schottky diode when the top MOSFET turns off and the
SW pin swings down.
Each of the RUN1 and RUN2 pins has an internal proportional-to-absolute-temperature (PTAT) current source (around
1.2µA at 25°C) to pull up the pins. Taking both RUN1 and
RUN2 pins below a certain threshold voltage (around 0.8V
at 25°C) shuts down all bias of INTVCC and DRVCC and
places the LTC3838-2 into micropower shutdown mode
with a minimum IQ at the VIN pin. The LTC3838-2’s DRVCC
(through the internal 5.3V LDO regulator or EXTVCC) and
the corresponding channel’s internal circuitry off INTVCC
will be biased up when either or both RUN pins are pulled
up above the 0.8V threshold, either by the internal pull-up
current or driven directly by an external voltage source
such as a logic gate output.
The DRVCC can be powered two ways: an internal lowdropout (LDO) linear voltage regulator that is powered
from VIN and can output 5.3V to DRVCC1. Alternatively,
an internal EXTVCC switch (with on-resistance of around
2Ω) can short the EXTVCC pin to DRVCC2.
A channel of the LTC3838-2 will not start switching until
the RUN pin of the respective channel is pulled up to 1.2V.
When a RUN pin rises above 1.2V, the corresponding
channel’s TG and BG drivers are enabled, and TRACK/
SS released. An additional 5µA temperature-independent
DRVCC/EXTVCC/INTVCC Power
38382f
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15
LTC3838-2
OPERATION (Refer to Functional Diagram)
pull-up current is connected internally to the channel’s
respective RUN pin. To turn off TG, BG and the additional
5µA pull-up current, RUN needs to be pulled down below 1.2V by about 100mV. These built-in current and
voltage hystereses prevent false jittery turn-on and turnoff due to noise. These features on the RUN pins allow
input undervoltage lockout (UVLO) to be set up using
external voltage dividers from VIN.
The start-up of a channel’s output voltage (VOUT) is
controlled by the voltage on its TRACK/SS pin. When the
voltage on the TRACK/SS pin is less than the 0.6V internal
reference (channel 1) or the external reference voltage on
EXTVREF2 pin (channel 2), the feedback voltage (VFB) is
regulated to the TRACK/SS voltage instead of the reference.
The TRACK/SS pin can be used to program the output
voltage soft-start ramp-up time by connecting an external
capacitor from a TRACK/SS pin to signal ground. An internal temperature-independent 1µA pull-up current charges
this capacitor, creating a voltage ramp on the TRACK/SS
pin. As the TRACK/SS voltage rises from ground to the
reference voltage, the switching starts, and VOUT ramps
up smoothly to its final regulated value. TRACK/SS will
keep rising until the pull-up current stops at well above
3V when the VIN pin is greater than 6V.
Note, when the VIN pin voltage is close to its low end, the
pull-up current may stop at a lower voltage. In applications that require both low VIN pin voltage (< 6V, down to
4.5V) and high EXTVREF2 (>1.5V, up to 2.5V) at the same
time, an external pull-up (current or resistor from INTVCC)
could be added to the TRACK/SS2 pin so that TRACK/SS2
settles well above EXTVREF2. This prevents VFB2 from being
regulated to an insufficient TRACK/SS2 voltage instead of
the desired EXTVREF2 after soft-start.
Upon enabling the RUN pin, if VOUT is prebiased at a
level above zero, the top gate (TG) will remain off and
VOUT stays prebiased. Once TRACK/SS rises above the
prebiased feedback level, and TG starts switching, VOUT
will be regulated according to TRACK/SS or the reference,
whichever is lower.
Alternatively, the TRACK/SS pin can be used to track an
external supply like in a master slave configuration. Typically, this requires connecting a resistor divider from the
master supply to the TRACK/SS pin (see the Applications
Information section).
TRACK/SS is pulled low internally when the corresponding channel’s RUN pin is pulled below the 1.2V threshold
(hysteresis applies), or when INTVCC or either of the
DRVCC1,2 pins drop below their respective undervoltage
lockout (UVLO) thresholds. TRACK/SS2 is also pulled low
internally when voltage on the EXTVREF2 pin is less than
0.1V, which prevents channel 2 from starting to switch until
a valid EXTVREF2 is present and TRACK/SS2 is released.
When EXTVREF2 rises from below 0.1V, a fast voltage step
up can be applied on EXTVREF2, as TRACK/SS2 allows
VOUT2 to soft-start. However, once the soft-start ends and
TRACK/SS2 rises above EXTVREF2, it is recommended that
dynamic voltage change on EXTVREF2 be rate-limited. If
EXTVREF2 jumps up, inductor current may reach its full
limit. If EXTVREF2 steps down, overvoltage (OV) may be
triggered, which turns on BG2 and discharges VOUT2
without any limit on inductor current. If any external R-C
filter is connected in series to control the slew rate of
EXTVREF2 voltage, be careful about the offset caused by
the pin’s bias current (see the Electrical Characteristics
section) through the resistor.
38382f
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LTC3838-2
OPERATION (Refer to Functional Diagram)
Light Load Current Operation
If the MODE/PLLIN pin is tied to INTVCC or an external
clock is applied to MODE/PLLIN, the LTC3838-2 will be
forced to operate in continuous mode. With load current
less than one-half of the full load peak-to-peak ripple, the
inductor current valley can drop to zero or become negative. This allows constant-frequency operation but at the
cost of low efficiency at light loads.
If the MODE/PLLIN pin is left open or connected to signal
ground, the channel will transition into discontinuous mode
operation, where a current reversal comparator (IREV)
shuts off the bottom MOSFET (MB) as the inductor current
approaches zero, thus preventing negative inductor current
and improving light-load efficiency. In this mode, both
switches can remain off for extended periods of time. As
the output capacitor discharges by load current and the
output voltage droops lower, EA will eventually move the
ITH voltage above the zero current level (0.8V) to initiate
another switching cycle.
Power Good and Fault Protection
Each PGOOD pin is connected to an internal open-drain
N‑channel MOSFET. An external resistor or current source
can be used to pull this pin up to 6V (e.g., VOUT1,2 or
DRVCC). Overvoltage or undervoltage comparators (OV,
UV) turn on the MOSFET and pull the PGOOD pin low
when the feedback voltage is outside the ±7.5% window
of the channel’s reference voltage. The PGOOD pin is
also pulled low when the channel’s RUN pin is below the
1.2V threshold (hysteresis applies), or in undervoltage
lockout (UVLO).
When the feedback voltage is within the ±7.5% window,
the open-drain NMOS is turned off and the pin is pulled
up by the external source. The PGOOD pin will indicate
power good immediately after the feedback is within the
window. But when a feedback voltage of a channel goes
out of the window, there is an internal 50µs delay before
its PGOOD is pulled low.
In an overvoltage (OV) condition, MT is turned off and MB
is turned on immediately without delay and held on until
the overvoltage condition clears. Upon enabling the RUN1
pin, if VOUT1 is prebiased so that the VFB1 is at more than
7.5% above the regulated voltage, OV stays triggered and
bottom gate (BG) forced to pull VOUT1 low until VFB1 is
~15mV (or ~2.5% of 0.6V internal reference) hysteresis
below the OV threshold. For channel 2, the OV threshold
is set at 7.5% above the voltage on EXTVREF2 pin, but the
~15mV hysteresis remains the same regardless of the OV
threshold. To ensure that OV and UV thresholds are not
determined by extremely low reference voltages, apply a
stable EXTVREF2 before enabling RUN2, which also prevents
BG from being turned on, and any prebiased VOUT2 from
being pulled low upon start-up.
Foldback current limiting is provided if the output is below
one-half of the regulated voltage, such as being shorted
to ground. As the feedback approaches 0V, the internal
clamp voltage for the ITH pin drops from 2.4V to around
1.3V, which reduces the inductor valley current level to
about 30% of its maximum value. Foldback current limiting
is disabled at start-up.
38382f
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LTC3838-2
OPERATION (Refer to Functional Diagram)
Frequency Selection and External Clock
Synchronization
Multichip Operations
An internal oscillator (clock generator) provides phaseinterleaved internal clock signals for individual channels
to lock up to. The switching frequency and phase of each
switching channel is independently controlled by adjusting the top MOSFET turn-on time (on-time) through the
one-shot timer. This is achieved by sensing the phase
relationship between a top MOSFET turn-on signal and
its internal reference clock through a phase detector,
and the time interval of the one-shot timer is adjusted on
a cycle-by-cycle basis, so that the rising edge of the top
MOSFET turn-on is always trying to synchronize to the
internal reference clock signal for the respective channel.
The frequency of the internal oscillator can be programmed
from 200kHz to 2MHz by connecting a resistor, RT , from
the RT pin to signal ground (SGND). The RT pin is regulated
to 1.2V internally.
For applications with stringent frequency or interference
requirements, an external clock source connected to the
MODE/PLLIN pin can be used to synchronize the internal
clock signals through a clock phase-locked loop (Clock
PLL). The LTC3838-2 operates in forced continuous mode
of operation when it is synchronized to the external clock.
The external clock frequency has to be within ±30% of the
internal oscillator frequency for successful synchronization. The clock input levels should be no less than 2V for
“high” and no greater than 0.5V for “low”. The MODE/
PLLIN pin has an internal 600k pull-down resistor.
The PHASMD pin determines the relative phases between
the internal reference clock signals for the two channels as
well as the CLKOUT signal, as shown in Table 2. The phases
tabulated are relative to zero degree (0°) being defined as the
rising edge of the internal reference clock signal of channel
1. The CLKOUT signal can be used to synchronize additional
power stages in a multiphase power supply solution feeding
either a single high current output, or separate outputs.
The system can be configured for up to 12-phase operation with a multichip solution. Typical configurations are
shown in Table 3 to interleave the phases of the channels.
Table 2
PHASMD
SGND
FLOAT
INTVCC
Channel 1
0°
0°
0°
Channel 2
180°
180°
240°
CLKOUT
60°
90°
120°
Table 3
NUMBER OF
PHASES
NUMBER OF
LTC3838-2
PIN CONNECTIONS
[PIN NAME (CHIP NUMBER)]
2
1
PHASMD(1) = FLOAT or SGND
3
2
PHASMD(1) = INTVCC
MODE/PLLIN(2) = CLKOUT(1)
4
2
PHASMD(1) = FLOAT
PHASMD(2) = FLOAT or SGND
MODE/PLLIN(2) = CLKOUT(1)
6
3
PHASMD(1) = SGND
PHASMD(2) = SGND
MODE/PLLIN(2) = CLKOUT(1)
PHASMD(3) = FLOAT or SGND
MODE/PLLIN(3) = CLKOUT(2)
12
6
PHASMD(1) = SGND
PHASMD(2) = SGND
MODE/PLLIN(2) = CLKOUT(1)
PHASMD(3) = FLOAT
MODE/PLLIN(3) = CLKOUT(2)
PHASMD(4) = SGND
MODE/PLLIN(4) = CLKOUT(3)
PHASMD(5) = SGND
MODE/PLLIN(5) = CLKOUT(4)
PHASMD(6) = FLOAT or SGND
MODE/PLLIN(6) = CLKOUT(5)
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LTC3838-2
OPERATION (Refer to Functional Diagram)
Single-Output External-Reference PolyPhase
Configurations
To use LTC3838-2 for a 2-phase single output externalreferenced step-down controller: Tie the VOUTSENSE1+ pin
to INTVCC, which will disable channel 1’s error amplifier
and internally connect ITH2 to ITH1. Tie the compensation R-C components to the ITH2 pin. The ITH1 pin can
be either left open or shorted to ITH2 externally. The
TRACK/SS1 and PGOOD1 pins become defunct and
can be left open. Note that the RUN1 and RUN2, as
well as DTR1 and DTR2 pins still function for the two
channels individually, therefore should be shorted externally for single-output applications. Set PHASMD
to SGND or FLOAT so that the two channels are 180°
out-of-phase. Efficiency losses may be substantially
reduced because the peak current drawn from the input
capacitor is effectively divided by the number of phases
used and power loss is proportional to the RMS current
squared. A 2-phase implementation can reduce the input
path power loss by up to 75%.
To make a single-output converter of three or more phases,
additional LTC3838-2 ICs can be used. The first chip should
be tied the same way as the 2-phase above. If only one
more channel of an additional LTC3838-2 is needed, use
channel 2 for the additional phase:
• Tie the ITH2 pin to the ITH2 pin of the first chip
• Tie the RUN2 pin to the RUN pins of the first chip
• Tie the VDFB2+ pin to the VDFB2+ pin of the first chip
• Tie the VDFB2– pin to the VDFB2– pin of the first chip
• Tie the TRACK/SS2 pin to the TRACK/SS2 pin of the
first chip
If both channels are needed, the additional LTC3838-2
chip should be tied the same way as the first LTC3838-2
chip to disable channel 1’s EA:
• Tie the VOUTSENSE1+ pin to the chip’s own INTVCC
• Tie the ITH2 pin to the ITH2 pin of the first chip
• Tie the RUN pins to the RUN pins of the first chip
• Tie the VDFB2+ pin to the VDFB2+ pin of the first chip
• Tie the VDFB2– pin to the VDFB2– pin of the first chip
• Tie the TRACK/SS2 pin to the TRACK/SS2 pin of the
first chip
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19
LTC3838-2
APPLICATIONS INFORMATION
Once the required output voltage and operating frequency
have been determined, external component selection is
driven by load requirement, and begins with the selection of inductors and current sense method (either sense
resistors RSENSE or inductor DCR sensing). Next, power
MOSFETs are selected. Finally, input and output capacitors are selected.
Output Voltage Programming
As shown in Figure 1, external resistor dividers are used
from the regulated outputs to their respective ground
references to program the output voltages. On Channel 1, the resistive divider is tapped by the VOUTSENSE1+
pin, and the ground reference is remotely sensed by the
VOUTSENSE1– pin; this voltage is sensed differentially. By
regulating the tapped (differential) feedback voltages to the
internal reference 0.6V, the resulting output voltages are:
VOUT1+ – VOUT1– = 0.6V • (1 + RFB2/RFB1)
The minimum (differential) VOUT1 is limited to the internal reference 0.6V, when RFB1 is removed (effectively
RFB1 = ∞), and/or RFB2 is shorted (effectively RFB2 = 0).
On channel 2, add a 3rd resistor with value equal to the
two voltage-divider resistors in parallel (or simply add two
parallel resistors equal to each of the two voltage divider
resistors). Note the external reference VREF2 is sensed differentially through the EXTVREF2 pin and the 3rd resistor:
VOUT2+ – VOUT2– = (VREF2+ – VREF2–) • (1 + RDFB2/RDFB1)
The minimum (differential) VOUT2 is limited to the (differential) external reference VREF2. To program VOUT2 =
VREF2, RDFB1 can be removed and the RDFB3 = RDFB1//RDFB2
uses the same value as RDFB2, as effectively RDFB1 = ∞.
The maximum output voltages on both channels can be
set up to 5.5V, as limited by the maximum voltage that
can be applied on the SENSE pins.
VOUTSENSE1+ and VDFB2+ are high impedance pins with
no input bias current other than leakage in the nA range.
The VOUTSENSE1– pin has about 25µA of current flowing
out of the pin. The VDFB2– pin has a current of around
(VDFB2+ – VDFB2–)/50k flowing out of the pin.
Differential output sensing allows for more accurate output
regulation in high power distributed systems having large
line losses. Figure 2 illustrates the potential variations in
the power and ground lines due to parasitic elements.
The variations may be exacerbated in multi-application
systems with shared ground planes. Without differential
output sensing, these variations directly reflect as an
error in the regulated output voltage. The LTC3838-2’s
differential output sensing can correct for up to ±500mV
of common-mode deviation in the output’s power and
ground lines on channel 1, and ±200mV on channel 2.
The LTC3838-2’s differential output sensing schemes are
distinct from conventional schemes where the regulated
output and its ground reference are directly sensed with
a difference amplifier whose output is then divided down
with an external resistor divider and fed into the error
amplifier input. This conventional scheme is limited by
the common mode input range of the difference amplifier
and typically limits differential sensing to the lower range
of output voltages.
VOUT2+
VOUT1+
RFB2
COUT1
LTC3838-2
RDFB2
VOUTSENSE1+ VDFB2+
RDFB1
RFB1
VOUT1–
REMOTELY-SENSED
POWER GROUND 1,
±500mV MAX vs SGND
VOUTSENSE1– VDFB2–
EXTVREF2
VREF2+
+
–
VREF2–
RDFB3 =
RDFB1//RDFB2
TO PROGRAM VOUT2 = VREF2,
COUT2 REMOVE RDFB1AND USE
RDFB3 = RDFB2
VOUT2–
REMOTELY-SENSED
POWER GROUND 2,
±200mV MAX vs SGND
REMOTELY-SENSED
EXTERNAL REFERENCE GROUND
38382 F01
Figure 1. Setting Output Voltage
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LTC3838-2
APPLICATIONS INFORMATION
CIN
MT
LTC3838-2
VOUTSENSE1+ VOUTSENSE1–
RFB2
+
–
VIN
POWER TRACE
PARASITICS
L
±VDROP(PWR)
MB
COUT
RFB1
ILOAD
ILOAD
GROUND TRACE
PARASITICS
±VDROP(GND)
OTHER CURRENTS
FLOWING IN
SHARED GROUND
PLANE
38382 F02
Figure 2. Differential Output Sensing Used to Correct Line Loss Variations
in a High Power Distributed System with a Shared Ground Plane
The LTC3838-2 allows for seamless differential output
sensing by sensing the resistively divided feedback voltage
differentially. This allows for differential sensing in the full
output ranges. Channel 1’s difference amplifier (DIFFAMP)
has a bandwidth of around 8MHz, and channel 2’s feedback
amplifier has a bandwidth of around 4MHz, both high
enough so as not to affect main loop compensation and
transient behavior.
The switching frequency of the LTC3838-2 can be programmed from 200kHz to 2MHz by connecting a resistor
from the RT pin to signal ground. The value of this resistor
can be chosen according to the following formula:
RT [kΩ] =
41550
– 2.2
f [kHz ]
To avoid noise coupling into the feedback voltages, the
resistor dividers should be placed close to the VOUTSENSE1+
and VOUTSENSE1–, or VDFB2+ and VDFB2– pins. Remote
output and ground traces should be routed together
as a differential pair to the remote output. For best accuracy, these traces to the remote output and ground
should be connected as close as possible to the desired
regulation point.
The overall controller system, including the clock PLL
and switching channels, has a synchronization range of
no less than ±30% around this programmed frequency.
Therefore, during external clock synchronization be sure
that the external clock frequency is within this ±30% range
of the RT programmed frequency. It is advisable that the
RT programmed frequency be equal the external clock for
maximum synchronization margin. Refer to the “Phase
and Frequency Synchronization” section for more details.
Switching Frequency Programming
Inductor Value Calculation
The choice of operating frequency is a trade-off between
efficiency and component size. Lowering the operating frequency improves efficiency by reducing MOSFET switching
losses but requires larger inductance and/or capacitance
to maintain low output ripple voltage. Conversely, raising
the operating frequency degrades efficiency but reduces
component size.
The operating frequency and inductor selection are interrelated in that higher operating frequencies allow the use of
smaller inductor and capacitor values. A higher frequency
generally results in lower efficiency because of MOSFET
gate charge losses. In addition to this basic trade-off, the
effect of inductor value on ripple current and low current
operation must also be considered.
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21
LTC3838-2
APPLICATIONS INFORMATION
The inductor value has a direct effect on ripple current.
The inductor ripple current ∆IL decreases with higher
inductance or frequency and increases with higher VIN:
frequency, especially in the MHz range, core loss can be
very significant. Be sure to check with the manufacturer
on the frequency characteristics of the core material.
 V  V 
∆IL =  OUT 1– OUT 
 f • L 
VIN 
Current Sense Pins
Accepting larger values of ∆IL allows the use of low inductances, but results in higher output voltage ripple, higher
ESR losses in the output capacitor, and greater core losses.
A reasonable starting point for setting ripple current is ∆IL
= 0.4 • IMAX. The maximum ∆IL occurs at the maximum
input voltage. To guarantee that ripple current does not
exceed a specified maximum, the inductance should be
chosen according to:


 V
V
OUT
1– OUT 
L = 
 f • ∆IL(MAX)  VIN(MAX) 
Inductor Core Selection
Once the value for L is known, the type of inductor must
be selected. The two basic types are iron powder and ferrite. The iron powder types have a soft saturation curve
which means they do not saturate hard like ferrites do.
However, iron powder type inductors have higher core
losses. Ferrite designs have very low core loss and are
preferred at high switching frequencies, so design goals
can concentrate on copper loss and preventing saturation.
Core loss is independent of core size for a fixed inductor
value, but it is very dependent on inductance selected. As
inductance increases, core losses go down. Unfortunately,
increased inductance requires more turns of wire and
therefore copper losses will increase.
Ferrite core material saturates hard, which means that inductance collapses abruptly when the peak design current
is exceeded. This results an abrupt increase in inductor
ripple current and consequent output voltage ripple. Do
not allow the core to saturate!
A variety of inductors designed for high current, low
voltage applications are available from manufacturers
such as Sumida, Panasonic, Coiltronics, Coilcraft, Toko,
Vishay, Pulse and Würth. In designs of higher switching
Inductor current is sensed through voltage between
SENSE+ and SENSE– pins, the inputs of the internal current
comparators. Care must be taken not to float these pins
during normal operation. The SENSE+ pins are quasi-high
impedance inputs. There is no bias current into a SENSE+
pin when its corresponding channel’s SENSE– pin ramps
up from below 1.1V and stays below 1.4V. But there is a
small (~1μA) current flowing into a SENSE+ pin when its
corresponding SENSE– pin ramps down from 1.4V and
stays above 1.1V. Such currents also exist on SENSE– pins.
But in addition, each SENSE– pin has an internal 500k
resistor to SGND. The resulted current (VOUT/500k) will
dominate the total current flowing into the SENSE– pins.
SENSE+ and SENSE– pin currents have to be taken into
account when designing either RSENSE or DCR inductor
current sensing.
Current Limit Programming
The current sense comparators’ maximum trip voltage
between SENSE+ and SENSE– (or VSENSE(MAX)), when ITH
is clamped at its maximum 2.4V, is 30mV typical.
The valley current mode control loop does not allow the
inductor current valley to exceed VSENSE(MAX). But note
that the peak inductor current is higher than this valley
current limit by the amount of the inductor ripple current.
Also when calculating the peak current limit, allow sufficient
margin to account for the tolerance of VSENSE(MAX) as given
in the Electrical Characteristics table, and variations in
values of external components (such as the inductor), as
well as the range of the input voltage(since ripple current
is a function of input voltage).
Either low value series current sensing resistor (RSENSE)
or the DC resistance of the inductor (DCR) can be used
to monitor the inductor current. The choice between the
two current sensing schemes is largely a design tradeoff among accuracy, power consumption, and cost. The
RSENSE method offers more precise control of the current
38382f
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LTC3838-2
APPLICATIONS INFORMATION
limit but the resistor will dissipate loss. The DCR method
saves the cost of the sense resistors and may offer better efficiency, especially in high current applications, but
tolerance and the variation over temperature in the DCR
value usually requires larger design margins.
RSENSE is chosen based on the required maximum output
current. Given the maximum current, IOUT(MAX), maximum
sense voltage, VSENSE(MAX), and maximum inductor ripple
current ∆IL(MAX), the value of RSENSE can be chosen as:
RSENSE =
RSENSE Inductor Current Sensing
The LTC3838-2 can be configured to sense the inductor
currents through either current sensing resistors (RSENSE)
or inductor DC resistance (DCR). The current sensing
resistors provide the most accurate current limits for the
controller.
A typical RSENSE inductor current sensing scheme is shown
in Figure 3a. The filter components (RF , CF) need to be
placed close to the IC. The positive and negative sense
traces need to be routed as a differential pair close together and Kelvin (4-wire) connected underneath the sense
resistor, as shown in Figure 3b. Sensing current elsewhere
can effectively add parasitic inductance to the current sense
element, degrading the information at the sense terminals
and making the programmed current limit unpredictable.
RSENSE RESISTOR
AND
PARASITIC INDUCTANCE
R
LTC3838-2
SENSE–
CF
VOUT
CF • 2RF ≤ ESL/RS
POLE-ZERO
CANCELLATION
RF
SENSE+
ESL
RF
38382 F03a
FILTER COMPONENTS
PLACED NEAR SENSE PINS
Figure 3a. RSENSE Current Sensing
TO SENSE FILTER,
NEXT TO THE CONTROLLER
COUT
RSENSE
38382 F03b
Figure 3b. Sense Lines Placement with Sense Resistor
VSENSE(MAX)
∆IL(MAX)
IOUT(MAX) –
2
Conversely, given RSENSE and IOUT(MAX), VSENSE(MAX)
can be determined from the above equation. To ensure
the maximum output current, sufficient margin should be
built in the calculations to account for variations of the
ICs under different operating conditions and tolerances
of external components.
Because of possible PCB noise in the current sensing
loop, the current sensing voltage ripple ∆VSENSE = ∆IL •
RSENSE also needs to be checked in the design to get a
good signal-to-noise ratio. In general, for a reasonably
good PCB layout, 10mV of ∆VSENSE is recommended as
a conservative number to start with, either for RSENSE or
Inductor DCR sensing applications.
For today’s highest current density solutions the value
of the sense resistor can be less than 1mΩ and the
peak sense voltage can be as low as 20mV. In addition,
inductor ripple currents greater than 50% with operation
up to 2MHz are becoming more common. Under these
conditions, the voltage drop across the sense resistor’s
parasitic inductance becomes more relevant. A small RC
filter placed near the IC has been traditionally used to reduce the effects of capacitive and inductive noise coupled
in the sense traces on the PCB. A typical filter consists of
two series 10Ω resistors connected to a parallel 1000pF
capacitor, resulting in a time constant of 20ns.
This same RC filter, with minor modifications, can be
used to extract the resistive component of the current
sense signal in the presence of parasitic inductance.
For example, Figure 4a illustrates the voltage waveform
across a 2mΩ sense resistor with a 2010 footprint for a
1.2V/15A converter operating at 100% load. The waveform
is the superposition of a purely resistive component and a
purely inductive component. It was measured using two
scope probes and waveform math to obtain a differential
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LTC3838-2
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measurement. Based on additional measurements of the
inductor ripple current and the on-time and off-time of
the top switch, the value of the parasitic inductance was
determined to be 0.5nH using the equation:
ESL =
VESL(STEP) tON • tOFF
•
∆IL
tON + tOFF
where VESL(STEP) is the voltage step caused by the ESL
and shown in Figure 4a, and tON and tOFF are top MOSFET
on-time and off-time respectively. If the RC time constant
is chosen to be close to the parasitic inductance divided by
the sense resistor (L/R), the resulting waveform looks resistive again, as shown in Figure 4b. For applications using
low VSENSE(MAX), check the sense resistor manufacturer’s
data sheet for information about parasitic inductance.
In the absence of data, measure the voltage drop directly
across the sense resistor to extract the magnitude of the
ESL step and use the equation above to determine the ESL.
However, do not over filter. Keep the RC time constant less
than or equal to the inductor time constant to maintain a
high enough ripple voltage on VRSENSE.
Note that the SENSE1– and SENSE2– pins are also used
for sensing the output voltage for the adjustment of top
gate on time, tON. For this purpose, there is an additional
internal 500k resistor from each SENSE– pin to SGND,
VSENSE
20mV/DIV
VESL(STEP)
500ns/DIV
therefore there is an impedance mismatch with their corresponding SENSE+ pins. The voltage drop across the
RF causes an offset in sense voltage. For example, with
RF = 100Ω, at VOUT = VSENSE– = 5V, the sense-voltage
offset VSENSE(OFFSET) = VSENSE– • RF/500k = 1mV. Such
small offset may seem harmless for current limit, but
could be significant for current reversal detection (IREV),
causing excess negative inductor current at discontinuous
mode. Also, at VSENSE(MAX) = 30mV, a mere 1mV offset
will cause a significant shift of zero-current ITH voltage
by (2.4V – 0.8V) • 1mV/30mV = 53mV. Too much shift
may not allow the output voltage to return to its regulated
value after the output is shorted due to ITH foldback.
Therefore, when a larger filter resistor RF value is used,
it is recommended to use an external 500k resistor from
each SENSE+ pin to SGND, to balance the internal 500k
resistor at its corresponding SENSE– pin.
The previous discussion generally applies to high density/
high current applications where IOUT(MAX) > 10A and low
inductor values are used. For applications where IOUT(MAX)
< 10A, set RF to 10Ω and CF to 1000pF. This will provide
a good starting point.
The filter components need to be placed close to the IC.
The positive and negative sense traces need to be routed
as a differential pair and Kelvin (4-wire) connected to the
sense resistor.
VSENSE
20mV/DIV
38382 F04a
500ns/DIV
Figure 4a. Voltage Waveform Measured
Directly Across the Sense Resistor
38382 F04b
Figure 4b. Voltage Waveform Measured After the
Sense Resistor Filter. CF = 1000pF, RF = 100Ω
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DCR Inductor Current Sensing
For applications requiring higher efficiency at high load
currents, the LTC3838-2 is capable of sensing the voltage drop across the inductor DCR, as shown in Figure 5.
The DCR of the inductor represents the small amount of
DC winding resistance, which can be less than 1mΩ for
today’s low value, high current inductors.
In a high current application requiring such an inductor,
conduction loss through a sense resistor would cost several
points of efficiency compared to DCR sensing.
The inductor DCR is sensed by connecting an RC filter
across the inductor. This filter typically consists of one or
two resistors (R1 and R2) and one capacitor (C1) as shown
in Figure 5. If the external (R1||R2) • C1 time constant is
chosen to be exactly equal to the L/DCR time constant, the
voltage drop across the external capacitor is equal to the
voltage drop across the inductor DCR multiplied by R2/
(R1 + R2). Therefore, R2 may be used to scale the voltage
across the sense terminals when the DCR is greater than
the target sense resistance. C1 is usually selected in the
range of 0.01µF to 0.47µF. This forces R1||R2 to around
2k to 4k, reducing error that might have been caused by
the SENSE pins’ input bias currents.
INDUCTOR
L
DCR
VOUT
COUT
L/DCR = (R1||R2) C1
LTC3838-2
Resistor R1 should be placed close to the switching node,
to prevent noise from coupling into sensitive small-signal
nodes. Capacitor C1 should be placed close to the IC pins.
The first step in designing DCR current sensing is to
determine the DCR of the inductor. Where provided, use
the manufacturer’s maximum value, usually given at 25°C.
Increase this value to account for the temperature coefficient of resistance, which is approximately 0.4%/°C. A
conservative value for inductor temperature TL is 100°C.
The DCR of the inductor can also be measured using a good
RLC meter, but the DCR tolerance is not always the same
and varies with temperature; consult the manufacturers’
data sheets for detailed information.
From the DCR value, VSENSE(MAX) is easily calculated as:
VSENSE(MAX) = DCRMAX(25°C)
• 1+ 0.4% ( TL(MAX) – 25°C)

∆I 
• IOUT(MAX) – L 

2 
If VSENSE(MAX) is within the maximum sense voltage
(30mV typical) of the LTC3838-2, then the RC filter only
needs R1. If VSENSE(MAX) is higher, then R2 may be used
to scale down the maximum sense voltage so that it falls
within range.
The maximum power loss in R1 is related to duty cycle,
and will occur in continuous mode at the maximum input
voltage:
R1
SENSE+
C1
SENSE–
R2
(OPT)
C1 NEAR SENSE PINS
Figure 5. DCR Current Sensing
38382 F05
PLOSS (R1) =
( VIN(MAX) – VOUT ) • VOUT
R1
Ensure that R1 has a power rating higher than this value.
If high efficiency is necessary at light loads, consider this
power loss when deciding whether to use DCR sensing or
RSENSE sensing. Light load power loss can be modestly
higher with a DCR network than with a sense resistor due
to the extra switching losses incurred through R1. However, DCR sensing eliminates a sense resistor, reduces
conduction losses and provides higher efficiency at heavy
loads. Peak efficiency is about the same with either method.
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To maintain a good signal-to-noise ratio for the current
sense signal, start with a ∆VSENSE of 10mV. For a DCR
sensing application, the actual ripple voltage will be determined by:
V –V
V
∆VSENSE = IN OUT • OUT
R1• C1
VIN • f
Two external N-channel power MOSFETs must be selected
for each channel of the LTC3838-2 controller: one for the
top (main) switch and one for the bottom (synchronous)
switch. The gate drive levels are set by the DRVCC voltage.
This voltage is typically 5.3V. Pay close attention to the
BVDSS specification for the MOSFETs as well; most of the
logic-level MOSFETs are limited to 30V or less.
Selection criteria for the power MOSFETs include the onresistance, RDS(ON), Miller capacitance, CMILLER, input
voltage and maximum output current. Miller capacitance,
CMILLER, can be approximated from the gate charge curve
usually provided on the MOSFET manufacturers’ data sheet.
CMILLER is equal to the increase in gate charge along the
horizontal axis while the curve is approximately flat (or
the parameter QGD if specified on a manufacturer’s data
sheet), divided by the specified VDS test voltage:
QGD
VDS(TEST)
When the IC is operating in continuous mode, the duty
cycles for the top and bottom MOSFETs are given by:
DTOP =
VOUT
VIN
DBOT = 1–
PTOP = DTOP •IOUT(MAX)2 • RDS(ON)(MAX) (1+ δ) + VIN 2

 IOUT(MAX) 
RTG(DOWN) 
RTG(UP)
•
+
 • CMILLER 
• f
2
VMILLER 


 VDRVCC – VMILLER
PBOT = DBOT • IOUT(MAX)2 • RDS(ON)(MAX) • (1 + δ )
Power MOSFET Selection
CMILLER ≅
The MOSFET power dissipations at maximum output
current are given by:
where δ is the temperature dependency of RDS(ON), RTG(UP)
is the TG pull-up resistance, and RTG(DOWN) is the TG pulldown resistance. VMILLER is the Miller effect VGS voltage
and is taken graphically from the MOSFET ’s data sheet.
Both MOSFETs have I2R losses while the topside N-channel
equation includes an additional term for transition losses,
which are highest at high input voltages. For VIN < 20V,
the high current efficiency generally improves with larger
MOSFETs, while for VIN > 20V, the transition losses rapidly
increase to the point that the use of a higher RDS(ON) device
with lower CMILLER actually provides higher efficiency. The
synchronous MOSFET losses are greatest at high input
voltage when the top switch duty factor is low or during
short-circuit when the synchronous switch is on close to
100% of the period.
The term (1 + δ) is generally given for a MOSFET in the
form of a normalized RDS(ON) vs temperature curve in the
power MOSFET data sheet. For low voltage MOSFETs,
0.5% per degree (°C) can be used to estimate δ as an
approximation of percentage change of RDS(ON):
δ = 0.005/°C • (TJ – TA)
where TJ is estimated junction temperature of the MOSFET
and TA is ambient temperature.
VOUT
VIN
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CIN Selection
In continuous mode, the source current of the top Nchannel MOSFET is a square wave of duty cycle VOUT/
VIN. To prevent large voltage transients, a low ESR input
capacitor sized for the maximum RMS current must be
used. The worst-case RMS current occurs by assuming
a single‑phase application. The maximum RMS capacitor
current is given by:
IRMS ≅ IOUT(MAX) •
VIN
VOUT
•
–1
VIN
VOUT
This formula has a maximum at VIN = 2VOUT , where
IRMS = IOUT(MAX)/2. This simple worst-case condition
is commonly used for design because even significant
deviations do not offer much relief. Note that capacitor
manufacturers’ ripple current ratings are often based on
only 2000 hours of life. This makes it advisable to further
derate the capacitor or to choose a capacitor rated at a
higher temperature than required. Several capacitors may
also be paralleled to meet size or height requirements in
the design. Due to the high operating frequency of the
LTC3838-2, additional ceramic capacitors should also be
used in parallel for CIN close to the IC and power switches
to bypass the high frequency switching noises. Typically
multiple X5R or X7R ceramic capacitors are put in parallel
with either conductive-polymer or aluminum-electrolytic
types of bulk capacitors. Because of its low ESR, the
ceramic capacitors will take most of the RMS ripple current. Vendors do not consistently specify the ripple current
rating for ceramics, but ceramics could also fail due to
excessive ripple current. Always consult the manufacturer
if there is any question.
Figure 6 represents a simplified circuit model for calculating the ripple currents in each of these capacitors. The
input inductance (LIN) between the input source and the
input of the converter will affect the ripple current through
the capacitors. A lower input inductance will result in less
ripple current through the input capacitors since more
ripple current will now be flowing out of the input source.
For simulations with this model, look at the ripple current
during steady-state for the case where one phase is fully
loaded and the other was not loaded. This will in general
LIN
1µH
+
–
VIN
+
ESR(BULK)
ESR(CERAMIC)
ESL(BULK)
ESL(CERAMIC)
CIN(BULK)
IPULSE(PHASE1)
IPULSE(PHASE2)
CIN(CERAMIC)
38382 F06
Figure 6. Circuit Model for Input Capacitor
Ripple Current Simulation
be the worst case for ripple current since the ripple current from one phase will not be cancelled by ripple current
from the other phase.
Note that the bulk capacitor also has to be chosen for
RMS rating with ample margin beyond its RMS current
per simulation with the circuit model provided. For a lower
VIN range, a conductive-polymer type (such as Sanyo
OS‑CON) can be used for its higher ripple current rating
and lower ESR. For a wide VIN range that also require
higher voltage rating, aluminum-electrolytic capacitors are
more attractive since it can provide a larger capacitance
for more damping. An aluminum-electrolytic capacitor
with a ripple current rating that is high enough to handle
all of the ripple current by itself will be very large. But
when in parallel with ceramics, an aluminum-electrolytic
capacitor will take a much smaller portion of the RMS
ripple current due to its high ESR. However, it is crucial
that the ripple current through the aluminum-electrolytic
capacitor should not exceed its rating since this will
produce significant heat, which will cause the electrolyte
inside the capacitor to dry over time and its capacitance
to go down and ESR to go up.
The benefit of PolyPhase operation is reduced RMS currents and therefore less power loss on the input capacitors. Also, the input protection fuse resistance, battery
resistance, and PC board trace resistance losses are also
reduced due to the reduced peak currents in a PolyPhase
system. The details of a close form equation can be found
in Application Note 77 High Efficiency, High Density, PolyPhase Converters for High Current Applications. Figure 7
shows the input capacitor RMS ripple currents normalized
against the DC output currents with respect to the duty
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LTC3838-2
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cycle. This graph can be used to estimate the maximum
RMS capacitor current for a multiple-phase application,
assuming the channels are identical and their phases are
fully interleaved.
Figure 7 shows that the use of more phases will reduce the
ripple current through the input capacitors due to ripple
current cancellation. However, since LTC3838-2 is only
truly phase-interleaved at steady state, transient RMS currents could be higher than the curves for the designated
number of phase. Therefore, it is advisable to choose
capacitors by taking account the specific load situations
of the applications. It is always the safest to choose input
capacitors’ RMS current rating closer to the worst case of
a single-phase application discussed above, calculated by
assuming the loss that would have resulted if controller
channels switched on at the same time.
0.5
DC LOAD CURRENT
RMS INPUT RIPPLE CURRNET
0.6
0.3
0.2
0.1
0
0.1
0.2
0.3 0.4 0.5 0.6 0.7
DUTY FACTOR (VO/VIN)
The VIN sources of the top MOSFETs should be placed
close to each other and share common CIN(s). Separating
the sources and CIN may produce undesirable voltage and
current resonances at VIN.
A small (0.1µF to 1µF) bypass capacitor between the IC’s
VIN pin and ground, placed close to the IC, is suggested.
A 2.2Ω to 10Ω resistor placed between CIN and the VIN
pin is also recommended as it provides further isolation
from switching noise of the two channels.
COUT Selection
The selection of output capacitance COUT is primarily
determined by the effective series resistance, ESR, to
minimize voltage ripple. The output voltage ripple ∆VOUT ,
in continuous mode is determined by:


1
∆VOUT ≤ ∆IL RESR +

8 • f • COUT 

1-PHASE
2-PHASE
3-PHASE
4-PHASE
6-PHASE
0.4
rarely be at 100% of IOUT(MAX). Using the worst-case load
current should already have margin built in for transient
conditions.
0.8
0.9
38382 F07
Figure 7. Normalized RMS Input Ripple Current
However, it is generally not needed to size the input capacitor for such worst-case conditions where on-times of the
phases coincide all the time. During a load step event, the
overlap of on-time will only occur for a small percentage
of time, especially when duty cycles are low. A transient
event where the switch nodes align for several cycles at
a time should not damage the capacitor. In most applications, sizing the input capacitors for 100% steady-state
load should be adequate. For example, a microprocessor
load may cause frequent overlap of the on-times, which
makes the ripple current higher, but the load current may
where f is operating frequency, and ∆IL is ripple current
in the inductor. The output ripple is highest at maximum
input voltage since ∆IL increases with input voltage. Typically, once the ESR requirement for COUT has been met,
the RMS current rating generally far exceeds that required
from ripple current.
In multiphase single-output applications, it is advisable to
consider ripple requirements at specific load conditions. At
steady state, the LTC3838-2’s individual phases are interleaved, and their ripples cancel each other at the output,
so ripple on COUT is reduced. During transient, when the
phases are not fully interleaved, the ripple cancellation
may not be as effective. While the worst-case ∆IL is the
sum of the ∆ILs of individual phases aligned during a
fast transient, such ripple tends to counteract the effect
of load transient itself and lasts for only a short time. For
example, during sudden load current increase, the phases
align to ramp up the total inductor current to quickly pull
the VOUT up from the droop.
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The choice of using smaller output capacitance increases
the ripple voltage due to the discharging term but can be
compensated for by using capacitors of very low ESR to
maintain the ripple voltage.
Multiple capacitors placed in parallel may be needed to
meet the ESR and RMS current handling requirements.
Dry tantalum, special polymer, aluminum electrolytic and
ceramic capacitors are all available in surface mount packages. Special polymer capacitors offer very low ESR but
have lower capacitance density than other types. Tantalum
capacitors have the highest capacitance density but it is
important to only use types that have been surge tested
for use in switching power supplies. Aluminum electrolytic
capacitors have significantly higher ESR, but can be used
in cost-sensitive applications provided that consideration
is given to ripple current ratings and long-term reliability.
Ceramic capacitors have excellent low ESR characteristics
but can have a high voltage coefficient and audible piezoelectric effects. The high Q of ceramic capacitors with trace
inductance can also lead to significant ringing. When used
as input capacitors, care must be taken to ensure that ringing from inrush currents and switching does not pose an
overvoltage hazard to the power switches and controller.
For high switching frequencies, reducing output ripple and
better EMI filtering may require small value capacitors that
have low ESL (and correspondingly higher self-resonant
frequencies) to be placed in parallel with larger value
capacitors that have higher ESL. This will ensure good
noise and EMI filtering in the entire frequency spectrum
of interest. Even though ceramic capacitors generally
have good high frequency performance, small ceramic
capacitors may still have to be parallel connected with
large ones to optimize performance.
High performance through-hole capacitors may also be
used, but an additional ceramic capacitor in parallel is
recommended to reduce the effect of their lead inductance.
Remember also to place high frequency decoupling capacitors as close as possible to the power pins of the load.
Top MOSFET Driver Supply (CB, DB)
An external bootstrap capacitor, CB, connected to the
BOOST pin supplies the gate drive voltage for the topside
MOSFET. This capacitor is charged through diode DB from
DRVCC when the switch node is low. When the top MOSFET
turns on, the switch node rises to VIN and the BOOST pin
rises to approximately VIN + INTVCC. The boost capacitor
needs to store approximately 100 times the gate charge
required by the top MOSFET. In most applications a 0.1µF
to 0.47µF, X5R or X7R dielectric capacitor is adequate. It
is recommended that the BOOST capacitor be no larger
than 10% of the DRVCC capacitor, CDRVCC, to ensure that
the CDRVCC can supply the upper MOSFET gate charge
and BOOST capacitor under all operating conditions. Variable frequency in response to load steps offers superior
transient performance but requires higher instantaneous
gate drive. Gate charge demands are greatest in high
frequency low duty factor applications under high load
steps and at start-up.
DRVCC Regulator and EXTVCC Power
The LTC3838-2 features a PMOS low dropout (LDO) linear
regulator that supplies power to DRVCC from the VIN supply.
The LDO regulates its output at the DRVCC1 pin to 5.3V.
The LDO can supply a maximum current of 100mA and
must be bypassed to ground with a minimum of 4.7µF
ceramic capacitor. Good bypassing is needed to supply
the high transient currents required by the MOSFET gate
drivers and to minimize interaction between the channels.
High input voltage applications in which large MOSFETs
are being driven at high frequencies may cause the maximum junction temperature rating for the LTC3838-2 to
be exceeded, especially if the LDO is active and provides
DRVCC. Power dissipation for the IC in this case is highest
and is approximately equal to VIN • IDRVCC. The gate charge
current is dependent on operating frequency as discussed
in the Efficiency Considerations section. The junction temperature can be estimated by using the equation given in
Note 2 of the Electrical Characteristics. For example, when
using the LDO, LTC3838-2’s DRVCC current is limited to
less than 42mA from a 38V supply at TA = 70°C:
TJ = 70°C + (42mA)(38V)(34°C/W) = 125°C
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To prevent the maximum junction temperature from being
exceeded, the input supply current must be checked while
operating in continuous conduction mode at maximum VIN.
When the voltage applied to the EXTVCC pin rises above
the switchover voltage (typically 4.6V), the VIN LDO is
turned off and the EXTVCC is connected to DRVCC2 pin with
an internal switch. This switch remains on as long as the
voltage applied to EXTVCC remains above the hysteresis
(around 200mV) below the switchover voltage. Using
EXTVCC allows the MOSFET driver and control power
to be derived from the LTC3838-2’s switching regulator
output VOUT during normal operation and from the LDO
when the output is out of regulation (e.g., start up, short
circuit). If more current is required through the EXTVCC
than is specified, an external Schottky diode can be added
between the EXTVCC and DRVCC pins. Do not apply more
than 6V to the EXTVCC pin and make sure that EXTVCC is
less than VIN.
Significant efficiency and thermal gains can be realized
by powering DRVCC from the switching converter output,
since the VIN current resulting from the driver and control
currents will be scaled by a factor of (Duty Cycle)/(Switcher
Efficiency).
3. EXTVCC connected to an external supply. If a 4.8V or
greater external supply is available, it may be used to
power EXTVCC providing that the external supply is
sufficient for MOSFET gate drive requirements.
4. EXTVCC connected to an output-derived boost network.
For 3.3V and other low voltage converters, efficiency
gains can still be realized by connecting EXTVCC to an
output-derived voltage that has been boosted to greater
than 4.8V.
For applications where the main input power never exceeds
5.3V, tie the DRVCC1 and DRVCC2 pins to the VIN input
through a small resistor, (such as 1Ω to 2Ω) as shown
in Figure 8 to minimize the voltage drop caused by the
gate charge current. This will override the LDO and will
prevent DRVCC from dropping too low due to the dropout
voltage. Make sure the DRVCC voltage exceeds the RDS(ON)
test voltage for the external MOSFET which is typically at
4.5V for logic-level devices.
LTC3838-2
DRVCC2
DRVCC1
RDRVCC
VIN
CDRVCC
CIN
Tying the EXTVCC pin to a 5V supply reduces the junction
temperature in the previous example from 125°C to:
TJ = 70°C + (42mA)(5V)(34°C/W) = 77°C
However, for 3.3V and other low voltage outputs, additional circuitry is required to derive DRVCC power from
the converter output.
The following list summarizes the four possible connections for EXTVCC:
1. EXTVCC left open (or grounded). This will cause INTVCC
to be powered from the internal 5.3V LDO resulting in an
efficiency penalty of up to 10% at high input voltages.
2. EXTVCC connected directly to switching converter output
VOUT is higher than the switchover voltage’s higher limit
(4.8V). This provides the highest efficiency.
38382 F08
Figure 8. Setup for VIN ≤ 5.3V
Input Undervoltage Lockout (UVLO)
The LTC3838-2 has two functions that help protect the
controller in case of input undervoltage conditions. An
internal UVLO comparator constantly monitors the INTVCC
and DRVCC voltages to ensure that adequate voltages are
present. The comparator enables internal UVLO signal,
which locks out the switching action of both channels, until
the INTVCC and DRVCC1,2 pins are all above their respective
UVLO thresholds. The rising threshold (to release UVLO)
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of the INTVCC is typically 4.2V, with 0.5V falling hysteresis
(to re-enable UVLO). The UVLO thresholds for DRVCC1,2 are
lower than that of INTVCC but higher than typical threshold
voltages of power MOSFETs, to prevent them from turning
on without sufficient gate drive voltages.
Generally for VIN > 6V, a UVLO can be set through monitoring the VIN supply by using external voltage dividers
at the RUN pins from VIN to SGND. To design the voltage divider, note that both RUN pins have two levels
of threshold voltages. The precision gate-drive-enable
threshold voltage of 1.2V can be used to set a VIN to turn
on a channel’s switching. If resistor dividers are used on
both RUN pins, when VIN is low enough and both RUN
pins are pulled below the ~0.8V threshold, the part will
shut down all bias of INTVCC and DRVCC and be put in
micropower shutdown mode.
The RUN pins’ bias currents depend on the RUN voltages.
The bias current changes should be taken into account
when designing the external voltage divider UVLO circuit.
An internal proportional-to-absolute-temperature (PTAT)
pull-up current source (~1.2µA at 25°C) is constantly connected to this pin. When a RUN pin rises above 1.2V, the
corresponding channel’s TG and BG drives are turned on
and an additional 5µA temperature-independent pull-up
current is connected internally to the RUN pin. Pulling the
RUN pin to fall below 1.2V by more than an 80mV hysteresis turns off TG and BG of the corresponding channel,
and the additional 5µA pull-up current is disconnected.
As voltage on a RUN pin increases, typically beyond 3V,
its bias current will start to reverse direction and flow into
the RUN pin. Keep in mind that neither of the RUN pins
can sink more than 50µA; Even if a RUN pin may slightly
exceed 6V when sinking 50µA, a RUN pin should never
be forced to higher than 6V by a low impedance voltage
source to prevent faulty conditions.
Soft-Start and Tracking
The LTC3838-2 has the ability to either soft-start by itself
with a capacitor or track the output of another channel or
an external supply. Note that the soft-start and tracking
features are achieved not by limiting the maximum output
current of the controller, but by controlling the output ramp
voltage according to the ramp rate on the TRACK/SS pin.
When a channel is configured to soft-start by itself, a capacitor should be connected to its TRACK/SS pin. TRACK/
SS is pulled low until the RUN pin voltage exceeds 1.2V
and UVLO is cleared (also for channel 2, a valid external
reference voltage greater than 0.1V is present at the
EXTVREF2 pin). After the pull-down of TRACK/SS is released, an internal current of 1µA charges the soft-start
capacitor, CSS, connected to the TRACK/SS pin. Currentlimit foldback is disabled during this phase to ensure
smooth soft-start or tracking. The soft-start or tracking
range is defined to be the voltage range from 0V to the
reference VREF (internal 0.6V for channel 1, or EXTVREF2
pin voltage for channel 2) on the TRACK/SS pin. The total
soft-start time can be calculated as:
tSS (SEC) = VREF (V) •
CSS (µF)
1(µA)
Care should be taken for channel 2 to assure that TRACK/
SS2 settles well above the EXTVREF2 voltage after softstart is complete under all operating conditions. Typically
TRACK/SS will be pulled up by the internal current source
to well above 3V when the VIN pin is greater than 6V. However, when the VIN pin voltage is close to its low end, the
internal pull-up current may stop at a voltage less than 3V.
An external pull-up circuit to TRACK/SS2 may be required
in applications that operate with low VIN pin voltages
and high EXTVREF2 voltages simultaneously, especially
when both the VIN pin is less than 6V (down to 4.5V) and
EXTVREF2 is greater than 1.5V (up to 2.5V). The external
pull-up circuit to the TRACK/SS2 pin can be a fixed current source, or simply a resistor from INTVCC. Note that
the soft-start time will change according to the external
pull-up used. The external pull-up is to prevent VFB2 from
being regulated to a low TRACK/SS2 voltage instead of
the intended EXTVREF2.
When one particular channel is configured to track an
external supply, a voltage divider can be used from the
external supply to the TRACK/SS pin to scale the ramp
rate appropriately. Two common implementations are coincidental tracking and ratiometric tracking. For coincident
tracking, make the divider ratio from the external supply
the same as the divider ratio for the differential feedback
voltage. Ratiometric tracking could be achieved by using
a different ratio than the differential feedback.
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Note that the 1µA soft-start capacitor charging current is
still flowing, producing a small offset error. To minimize
this error, select the tracking resistive divider values to be
small enough to make this offset error negligible.
The LTC3838-2 allows the user to program how its two
channels’ outputs track each other ramping up or down.
Since channel 2 uses EXTVREF2 as reference, by tying
EXTVREF2 to VOUT1, either directly or through a voltage
divider of a certain ratio, VOUT2 can be set to track VOUT1.
Note the EXTVREF2 pin has a small bias current (see
Electrical Characteristics). If any series external resistor
is connected to this pin, make sure the offset caused by
the bias current through its resistance is within the tolerance of VOUT2 regulation. Place a 100k resistor from the
EXTVREF2 pin to ground in case this pin is disconnected
from the external reference. Do not let this pin float.
In addition, TRACK/SS pins can be utilized for either channel
to track each other. In the following discussions, VOUT1 refers
to the LTC3838‑2’s output 1 as a master channel and VOUT2
refers to the LTC3838-2’s output 2 as a slave channel. In
practice though, either channel can be used as the master.
By selecting different resistors, the LTC3838-2 can
achieve different modes of tracking including the two in
Figure 9. To implement the coincident tracking, connect
an additional resistive divider to VOUT1 and connect its
midpoint to the TRACK/SS pin of the slave channel. The
ratio of this divider should be the same as that of the slave
channel’s feedback divider shown in Figure 9b. In this
tracking mode, VOUT1 must be set higher than VOUT2. To
implement the ratiometric tracking as shown in Figure 9,
the additional divider should be of the same ratio as the
master channel’s feedback divider.
Under the ratiometric mode, when the master channel’s
output experiences dynamic excursion (under load transient, for example), the slave channel output will be affected
as well. For better output regulation, use the coincident
tracking mode instead of ratiometric, or use the additional
divider with a ratio of somewhere between coincident and
ratiometric tracking modes.
VOUT2
VOUT1
OUTPUT VOLTAGE
OUTPUT VOLTAGE
VOUT1
VOUT2
TIME
TIME
Coincident Tracking
38382 F09a
Ratiometric Tracking
Figure 9a. Two Different Modes of Output Tracking
VOUT1+
TO
TRACK/SS2
PIN
VOUT2+
RDFB2
RDFB1
SGND
RFB2(1)
TO
VOUTSENSE1+
PIN
RFB1(1)
TO
VOUTSENSE1–
PIN
VOUT1–
RDFB2
TO
VDFB2+
PIN
TO
VDFB2–
PIN
RDFB1
VOUT2–
Coincident Tracking Setup
RDFB1//RDFB2
SGND
VOUT1+
TO
TRACK/SS2
PIN
VOUT2+
RFB2(1)
RFB2(1)
RFB1(1)
RFB1(1)
SGND
TO
VOUTSENSE1+
PIN
TO
VOUTSENSE1–
PIN
VOUT1–
Ratiometric Tracking Setup
TO
VDFB2+
PIN
TO
VDFB2–
PIN
RDFB2
RDFB1
VOUT2–
RDFB1//RDFB2
SGND
38382 F09b
Figure 9b. Setup for Coincident and Ratiometric Tracking
38382f
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Phase and Frequency Synchronization
For applications that require better control of EMI and
switching noise or have special synchronization needs,
the LTC3838-2 can synchronize the turn-on of the top
MOSFET to an external clock signal applied to the MODE/
PLLIN pin. The applied clock signal needs to be within
±30% of the RT programmed frequency to ensure proper
frequency and phase lock. The clock signal levels should
generally comply to VPLLIN(H) > 2V and VPLLIN(L) < 0.5V.
The MODE/PLLIN pin has an internal 600k pull-down
resistor to ensure discontinuous current mode operation
if the pin is left open.
The LTC3838-2 uses the voltages on VIN and VOUT as well
as RT to adjust the top gate on-time in order to maintain
phase and frequency lock for wide ranges of VIN, VOUT
and RT-programmed switching frequency f:
tON ≈
VOUT
VIN • f
As the on-time is a function of the switching regulator’s
output voltage, this output is measured by the SENSE– pin
to set the required on-time. The SENSE– pin is tied to the
regulator’s local output point to the IC for most applications, as the remotely regulated output point could be
significantly different from the local output point due to
line losses, and local output versus local ground is typically
the VOUT required for the calculation of tON.
However, there could be circumstances where this VOUT
programmed on-time differs significantly different from
the on-time required in order to maintain frequency
and phase lock. For example, lower efficiencies in the
switching regulator can cause the required on-time to be
substantially higher than the internally set on-time (see
Efficiency Considerations). If a regulated VOUT is relatively
low, proportionally there could be significant error caused
by the difference between the local ground and remote
ground, due to other currents flowing through the shared
ground plane.
If necessary, the RT resistor value, voltage on the VIN pin,
or even the common mode voltage of the SENSE pins may
be programmed externally to correct for such systematic
errors. The goal is to set the on-time programmed by VIN,
VOUT and RT close to the steady-state on-time so that the
system will have sufficient range to correct for component
and operating condition variations, or to synchronize to the
external clock. Note that there is an internal 500k resistor
on each SENSE– pin to SGND, but not on the SENSE+ pin.
During dynamic transient conditions either in the line
voltage or load current (e.g., load step or release), the top
switch will turn on more or less frequently in response to
achieve faster transient response. This is the benefit of
the LTC3838-2’s controlled on-time, valley current mode
architecture. However, this process may understandably
lose phase and even frequency lock momentarily. For
relatively slow changes, phase and frequency lock can
ILOAD
CLOCK
INPUT
PHASE AND
FREQUENCY
LOCKED
PHASE AND
FREQUENCY
LOCK LOST
DUE TO FAST
LOAD STEP
FREQUENCY
RESTORED
QUICKLY
PHASE LOCK
RESUMED
PHASE AND
FREQUENCY
LOCK LOST
DUE TO FAST
LOAD STEP
FREQUENCY
RESTORED
QUICKLY
SW
VOUT
38382 F10
Figure 10. Phase and Frequency Locking Behavior During Transient Conditions
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LTC3838-2
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still be maintained. For large load current steps with fast
slew rates, phase lock will be lost until the system returns
back to a steady-state condition (see Figure 10). It may
take up to several hundred microseconds to fully resume
the phase lock, but the frequency lock generally recovers
quickly, long before phase lock does.
For light load conditions, the phase and frequency synchronization depends on the MODE/PLLIN pin setting. If
the external clock is applied, synchronization will be active
and switching in continuous mode. If MODE/PLLIN is tied
to INTVCC, it will operate in forced continuous mode at
the RT-programmed frequency. If the MODE/PLLIN pin is
tied to SGND, the LTC3838-2 will operate in discontinuous
mode at light load and switch into continuous conduction
at the RT programmed frequency as load increases. The TG
on-time during discontinuous conduction is intentionally
slightly extended (approximately 1.2 times the continuous
conduction on-time as calculated from VIN, VOUT and f) to
create hysteresis at the load-current boundary of continuous/discontinuous conduction.
If an application requires very low (approaching minimum)
on-time, the system may not be able to maintain its full
frequency synchronization range. Getting closer to minimum on-time, it may even lose phase/frequency lock at no
load or light load conditions, under which the SW on-time
is effectively longer than TG on-time due to TG/BG dead
times. This is discussed further under Minimum On-Time,
Minimum Off-Time and Dropout Operation.
architecture allows low on-time, making the LTC3838-2
suitable for high step-down ratio applications.
The effective on-time, as determined by the SW node
pulse width, can be different from this TG on-time, as it
also depends on external components, as well as loading
conditions of the switching regulator. One of the factors that
contributes to this discrepancy is the characteristics of the
power MOSFETs. For example, if the top power MOSFET’s
turn-on delay is much smaller than the turn-off delay,
the effective on-time will be longer than the TG on-time,
limiting the effective minimum on-time to a larger value.
Light-load operation, in forced continuous mode, will
further elongate the effective on-time due to the dead
times between the “on” states of TG and BG, as shown in
Figure 11. During the dead time from BG turn-off to TG
turn-on, the inductor current flows in the reverse direction,
charging the SW node high before the TG actually turns
on. The reverse current is typically small, causing a slow
rising edge. On the falling edge, after the top FET turns off
and before the bottom FET turns on, the SW node lingers
high for a longer duration due to a smaller peak inductor
current available in light load to pull the SW node low. As
a result of the sluggish SW node rising and falling edges,
the effective on-time is extended and not fully controlled
by the TG on-time. Closer to minimum on-time, this may
cause some phase jitter to appear at light load. As load
current increase, the edges become sharper, and the phase
locking behavior improves.
In continuous mode operation, the minimum on-time limit
imposes a minimum duty cycle of:
Minimum On-Time, Minimum Off-Time
and Dropout Operation
The minimum on-time is the smallest duration that
LTC3838-2’s TG (top gate) pin can be in high or “on”
state. It has dependency on the operating conditions of the
switching regulator, and is a function of voltages on the
VIN and VOUT pins, as well as the value of external resistor
RT. As shown by the tON(MIN) curves in the Typical Performance Characteristics section, a minimum on-time of 30ns
can be achieved when VOUT, sensed by the SENSE­– pin,
is at 0.6V or lower, while the VIN is tied to its maximum
value of 38V. For larger values of VOUT, smaller values of
VIN and/or larger values of RT (i.e. lower f), the minimum
achievable on-time will be longer. The valley mode control
DMIN = f • tON(MIN)
where tON(MIN) is the effective minimum on-time for the
switching regulator. As the equation shows, reducing the
operating frequency will alleviate the minimum duty cycle
constraint. If the minimum on-time that LTC3838-2 can
provide is longer than the on-time required by the duty
cycle to maintain the switching frequency, the switching
frequency will have to decrease to maintain the duty cycle,
but the output voltage will still remain in regulation. This is
generally more preferable to skipping cycles and causing
larger ripple at the output, which is typically seen in fixed
frequency switching regulators.
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TG-SW
(VGS OF TOP
MOSFET)
The minimum off-time is the smallest duration of time
that the TG pin can be turned low and then immediately
turned back high. This minimum off-time includes the time
to turn on the BG (bottom gate) and turn it back off, plus
the dead-time delays from TG off to BG on and from BG
off to TG on. The minimum off-time that the LTC3838-2
can achieve is 90ns.
DEAD-TIME
DELAYS
BG
(VGS OF
BOTTOM
MOSFET)
IL 0
NEGATIVE
INDUCTOR
CURRENT
IN FCM
VIN
SW
DURING BG-TG DEAD TIME,
NEGATIVE INDUCTOR CURRENT
WILL FLOW THROUGH TOP MOSFET’S
BODY DIODE TO PRECHARGE SW NODE
IL
SW
+
–
DURING TG-BG DEAD TIME,
THE RATE OF SW NODE DISCHARGE
WILL DEPEND ON THE CAPACITANCE
ON THE SW NODE AND INDUCTOR
CURRENT MAGNITUDE
VIN
L
L
The effective minimum off-time of the switching regulator,
or the shortest period of time that the SW node can stay
low, can be different from this minimum off-time. The main
factor impacting the effective minimum off-time is the top
and bottom power MOSFETs’ electrical characteristics,
such as Qg and turn-on/off delays. These characteristics
can either extend or shorten the SW nodes’ effective
minimum off-time. Large size (high Qg) power MOSFETs
generally tend to increase the effective minimum off-time
due to longer gate charging and discharging times. On
the other hand, imbalances in turn-on and turn-off delays
could reduce the effective minimum off-time.
The minimum off-time limit imposes a maximum duty
cycle of:
IL
TOTAL CAPACITANCE
ON THE SW NODE
38382 F11
Figure 11. Light Loading On-Time Extension for Forced
Continuous Mode Operation
The tON(MIN) curves in the Typical Performance Characteristics are measured with minimum load on TG and
BG, at extreme cases of VIN = 38V, and/or VOUT = 0.6V,
and/or programmed f = 2MHz (i.e., RT = 18k). In applications with different VIN, VOUT and/or f, the tON(MIN) that
can be achieved will generally be larger. Also, to guarantee
frequency and phase locking at light load, sufficient margin
needs to be added to account for the dead times (tD(TG/BG)
+ tD(TG/BG) in the Electrical Characteristics).
For applications that require relatively low on-time, proper
caution has to be taken when choosing the power MOSFET.
If the gate of the MOSFET is not able to fully turn on due
to insufficient on-time, there could be significant heat dissipation and efficiency loss as a result of larger RDS(ON).
This may even cause early failure of the power MOSFET.
DMAX = 1 – f • tOFF(MIN)
where tOFF(MIN) is the effective minimum off-time of the
switching regulator. Reducing the operating frequency can
alleviate the maximum duty cycle constraint.
If the maximum duty cycle is reached, due to a drooping
input voltage for example, the output will drop out of
regulation. The minimum input voltage to avoid dropout is:
VIN(MIN) =
VOUT
DMAX
At the onset of drop-out, there is a region of VIN of about
500mV that generates two discrete off-times, one being
the minimum off time and the other being an off-time that
is about 40ns to 60ns longer than the minimum off-time.
This secondary off-time is due to the extra delay in tripping the internal current comparator. The two off-times
average out to the required duty cycle to keep the output in
regulation. There may be higher SW node jitter, apparent
especially when synchronized to an external clock, but the
output voltage ripple remains relatively small.
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Fault Conditions: Current Limiting and Overvoltage
OPTI-LOOP® Compensation
The maximum inductor current is inherently limited in a
current mode controller by the maximum sense voltage. In
the LTC3838-2, the maximum sense voltage is controlled
by the voltage on the VRNG pin. With valley current mode
control, the maximum sense voltage and the sense resistance determine the maximum allowed inductor valley
current. The corresponding output current limit is:
OPTI-LOOP compensation, through the availability of the
ITH pin, allows the transient response to be optimized for
a wide range of loads and output capacitors. The ITH pin
not only allows optimization of the control-loop behavior
but also provides a DC-coupled and AC-filtered closed-loop
response test point. The DC step, rise time and settling
at this test point truly reflects the closed-loop response.
Assuming a predominantly 2nd order system, phase
margin and/or damping factor can be estimated using the
percentage of overshoot seen at this pin.
ILIMIT =
VSENSE(MAX)
RSENSE
1
+ • ∆IL
2
The current limit value should be checked to ensure that
ILIMIT(MIN) > IOUT(MAX). The current limit value should
be greater than the inductor current required to produce
maximum output power at the worst-case efficiency.
Worst-case efficiency typically occurs at the highest VIN
and highest ambient temperature. It is important to check
for consistency between the assumed MOSFET junction
temperatures and the resulting value of ILIMIT which heats
the MOSFET switches.
To further limit current in the event of a short circuit to
ground, the LTC3838-2 includes foldback current limiting.
If the output falls by more than 50%, the maximum sense
voltage is progressively lowered, to about one-fourth of
its full value as the feedback voltage reaches 0V.
A feedback voltage exceeding 7.5% of the regulated target
of 0.6V is considered as overvoltage (OV). In such an OV
condition, the top MOSFET is immediately turned off and
the bottom MOSFET is turned on indefinitely until the OV
condition is removed, i.e., the feedback voltage falling
back below the 7.5% threshold by more than a hysteresis
of around 15mV (on the same scale as each channel’s
reference and internal feedback voltages VFB1,2). Current
limiting is not active during an OV. If the OV persists, and
the BG turns on for a longer time, the current through the
inductor and the bottom MOSFET may exceed their maximum ratings, sacrificing themselves to protect the load.
The external series RITH-CITH1 filter at the ITH pin sets the
dominant pole-zero loop compensation. The values can
be adjusted to optimize transient response once the final
PCB layout is done and the particular output capacitor type
and value have been determined. The output capacitors
need to be selected first because their various types and
values determine the loop feedback factor gain and phase.
An additional small capacitor, CITH2, can be placed from
the ITH pin to SGND to attenuate high frequency noise.
Note this CITH2 contributes an additional pole in the loop
gain therefore can affect system stability if too large. It
should be chosen so that the added pole is higher than
the loop bandwidth by a significant margin.
The regulator loop response can also be checked by
looking at the load transient response. An output current
pulse of 20% to 100% of full-load current having a rise
time of 1µs to 10µs will produce VOUT and ITH voltage
transient-response waveforms that can give a sense of the
overall loop stability without breaking the feedback loop.
For a detailed explanation of OPTI-LOOP compensation,
refer to Application Note 76.
Switching regulators take several cycles to respond to
a step in load current. When a load step occurs, VOUT
immediately shifts by an amount equal to ∆ILOAD • ESR,
where ESR is the effective series resistance of COUT . ∆ILOAD
also begins to charge or discharge COUT , generating a
feedback error signal used by the regulator to return VOUT
to its steady-state value. During this recovery time, VOUT
can be monitored for overshoot or ringing that would
indicate a stability problem.
38382f
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Connecting a resistive load in series with a power MOSFET,
then placing the two directly across the output capacitor
and driving the gate with an appropriate signal generator
is a practical way to produce a realistic load step condition. The initial output voltage step resulting from the step
change in load current may not be within the bandwidth
of the feedback loop, so it cannot be used to determine
phase margin. The output voltage settling behavior is more
related to the stability of the closed-loop system. However,
it is better to look at the filtered and compensated feedback
loop response at the ITH pin.
The gain of the loop increases with the RITH and the bandwidth of the loop increases with decreasing CITH1. If RITH
is increased by the same factor that CITH1 is decreased, the
zero frequency will be kept the same, thereby keeping the
phase the same in the most critical frequency range of the
feedback loop. In addition, a feedforward capacitor, CFF ,
can be added to improve the high frequency response, as
used in the typical application at the last page of this data
sheet. Feedforward capacitor CFF provides phase lead by
creating a high frequency zero with RFB2 which improves
the phase margin.
A more severe transient can be caused by switching in
loads with large supply bypass capacitors. The discharged
bypass capacitors of the load are effectively put in parallel
with the converter’s COUT , causing a rapid drop in VOUT .
No regulator can deliver current quick enough to prevent
this sudden step change in output voltage, if the switch
connecting the COUT to the load has low resistance and is
driven quickly. The solution is to limit the turn-on speed
of the load switch driver. Hot Swap™ controllers are designed specifically for this purpose and usually incorporate
current limiting, short-circuit protection and soft starting.
Load-Release Transient Detection
As the output voltage requirement of step-down switching
regulators becomes lower, VIN to VOUT step-down ratio
increases, and load transients become faster, a major
challenge is to limit the overshoot in VOUT during a fast
load current drop, or “load-release” transient.
Inductor current slew rate diL/dt = VL/L is proportional
to voltage across the inductor VL = VSW – VOUT. When
the top MOSFET is turned on, VL = VIN – VOUT, inductor
current ramps up. When bottom MOSFET turns on, VL =
VSW – VOUT = –VOUT, inductor current ramps down. At
very low VOUT, the low differential voltage, VL, across the
inductor during the ramp down makes the slew rate of the
inductor current much slower than needed to follow the
load current change. The excess inductor current charges
up the output capacitor, which causes overshoot at VOUT.
If the bottom MOSFET could be turned off during the loadrelease transient, the inductor current would flow through
the body diode of the bottom MOSFET, and the equation
can be modified to include the bottom MOSFET body
diode drop to become VL = –(VOUT + VBD). Obviously the
benefit increases as the output voltage gets lower, since
VBD would increase the sum significantly, compared to a
single VOUT only.
The load-release overshoot at VOUT causes the error amplifier output, ITH, to drop quickly. ITH voltage is proportional
to the inductor current setpoint. A load transient will
result in a quick change of this load current setpoint, i.e.,
a negative spike of the first derivative of the ITH voltage.
The LTC3838-2 uses a detect transient (DTR) pin to
monitor the first derivative of the ITH voltage, and detect
the load-release transient. Referring to the Functional
Diagram, the DTR pin is the input of a DTR comparator,
and the internal reference voltage for the DTR comparator
is half of INTVCC. To use this pin for transient detection,
ITH compensation needs an additional RITH resistor tied
to INTVCC, and connects the junction point of ITH compensation components CITH1, RITH1 and RITH2 to the DTR
pin as shown in the Functional Diagram. The DTR pin is
now proportional to the first derivative of the inductor
current setpoint, through the highpass filter of CITH1 and
(RITH1//RITH2).
The two RITH resistors establish a voltage divider from
INTVCC to SGND, and bias the DC voltage on DTR pin (at
steady-state load or ITH voltage) slightly above half of
INTVCC. Compensation performance will be identical by
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APPLICATIONS INFORMATION
using the same CITH1 and make RITH1//RITH2 equal the
RITH as used in conventional single resistor OPTI-LOOP
compensation. This will also provide the R-C time constant
needed for the DTR duration. The DTR sensitivity can be
adjusted by the DC bias voltage difference between DTR
and half INTVCC. This difference could be set as low as
200mV, as long as the ITH ripple voltage with DC load
current does not trigger the DTR.
Note the internal 2.5µA pull-up current from the DTR pin
will generate an additional offset on top of the resistor
divider itself, making the total difference between the DC
bias voltage on the DTR pin and half INTVCC:


RITH1
VDTR – 0.5VINTVCC = 
– 0.5 • 5.3V
(RITH1+RITH2)

+ 2.5µA • (RITH1// RITH2)
As illustrated in Figure 12, when load current suddenly
drops, VOUT overshoots, and ITH drops quickly. The voltage
on the DTR pin will also drop quickly, since it is coupled
to the ITH pin through a capacitor. If the load transient
is fast enough that the DTR voltage drops below half of
INTVCC, a load release event is detected. The bottom gate
(BG) will be turned off, so that the inductor current flows
through the body diode in the bottom MOSFET. This allows the SW node to drop below PGND by a voltage of
a forward-conducted silicon diode. This creates a more
negative differential voltage (VSW – VOUT) across the
inductor, allowing the inductor current to drop at a faster
rate to zero, therefore creating less overshoot on VOUT.
The DTR comparator output is overridden by reverse
inductor current detection (IREV) and overvoltage (OV)
condition. This means BG will be turned off when SENSE+
is higher than SENSE– (i.e., inductor current is positive),
as long as the OV condition is not present. When inductor
current drops to zero and starts to reverse, BG will turn
back on in forced continuous mode (e.g., the MODE/
PLLIN pin tied to INTVCC, or an input clock is present),
even if DTR is still below half INTVCC. This is to allow the
inductor current to go negative to quickly pull down the
VOUT overshoot. Of course, if the MODE/PLLIN pin is set
to discontinuous mode (i.e., tied to SGND), BG will stay
off as inductor current reverse, as it would with the DTR
feature disabled.
Also, if VOUT gets higher than the OV window (7.5%
typical), the DTR function is defeated and BG will turn
on regardless. Therefore, in order for the DTR feature
to reduce VOUT overshoot effectively,sufficient output
capacitance needs to be used in the application so that
OV is not triggered with the amount of load step desired
to have its overshoot suppressed.
Experimenting with a 0.6V output application (modified
from the design example circuit by setting VOUT to 0.6V
and ITH compensation adjusted accordingly) shows this
detect transient feature significantly reduces the overshoot
peak voltage, as well as time to resume regulation during
load release steps (see application examples in Typical
Performance Characteristics).
SW
5V/DIV
SW
5V/DIV
BG
5V/DIV
BG
5V/DIV
DTR
1V/DIV
BG TURNS BACK ON, INDUCTOR
CURRENT (IL) GOES NEGATIVE
IL
10A/DIV
DTR DETECTS LOAD
RELEASE, TURNS OFF BG
FOR FASTER INDUCTOR
CURRENT (IL) DECAY
5µs/DIV
LOAD RELEASE = 15A TO 0A
VIN = 5V
VOUT = 0.6V
BG REMAINS ON
DURING THE LOAD
RELEASE EVENT
ITH
1V/DIV
IL
10A/DIV
LOAD RELEASE = 15A TO 0A
VIN = 5V
VOUT = 0.6V
(12a) DTR Enabled
5µs/DIV
38382 F12
(12b) DTR Disabled
Figure 12. Comparison of VOUT Overshoot with Detect Transient (DTR) Feature Enabled and Disabled
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Note that it is expected that this DTR feature will cause
additional loss on the bottom MOSFET, due to its body
diode conduction. The bottom MOSFET temperature may
be higher with a load of frequent and large load steps. This
is an important design consideration. Experiments on the
demo board show a 20°C increase when a continuous
100% to 50% load step pulse train with 50% duty cycle
and 100kHz frequency is applied to the output.
If not needed, this DTR feature can be disabled by tying
the DTR pin to INTVCC, or simply leave the DTR pin open
so that an internal 2.5µA current source will pull itself up
to INTVCC.
Efficiency Considerations
The percent efficiency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the efficiency and which change would
produce the most improvement. Percentage efficiency
can be expressed as:
%Efficiency = 100% – (L1% + L2% + L3% + ...)
where L1%, L2%, etc. are the individual losses as a percentage of input power. Although all dissipative elements
in the circuit produce power losses, several main sources
usually account for most of the losses:
1. I2R loss. These arise from the DC resistances of the
MOSFETs, inductor, current sense resistor and is the majority of power loss at high output currents. In continuous mode the average output current flows though the
inductor L, but is chopped between the top and bottom
MOSFETs. If the two MOSFETs have approximately the
same RDS(ON), then the resistance of one MOSFET can
simply be summed with the inductor’s DC resistances
(DCR) and the board traces to obtain the I2R loss. For
example, if each RDS(ON) = 8mΩ, RL = 5mΩ, and RSENSE
= 2mΩ the loss will range from 15mW to 1.5W as the
output current varies from 1A to 10A. This results in loss
from 0.3% to 3% a 5V output, or 1% to 10% for a 1.5V
output. Efficiency varies as the inverse square of VOUT
for the same external components and output power
level. The combined effects of lower output voltages
and higher currents load demands greater importance
of this loss term in the switching regulator system.
2. Transition loss. This loss mostly arises from the brief
amount of time the top MOSFET spends in the saturation (Miller) region during switch node transitions. It
depends upon the input voltage, load current, driver
strength and MOSFET capacitance, among other factors, and can be significant at higher input voltages or
higher switching frequencies.
3. DRVCC current. This is the sum of the MOSFET driver
and INTVCC control currents. The MOSFET driver currents result from switching the gate capacitance of the
power MOSFETs. Each time a MOSFET gate is switched
from low to high to low again, a packet of charge dQ
moves from DRVCC to ground. The resulting dQ/dt is a
current out of DRVCC that is typically much larger than
the controller IQ current. In continuous mode,
IGATECHG = f • (Qg(TOP) + Qg(BOT)),
where Qg(TOP) and Qg(BOT) are the gate charges of the
top and bottom MOSFETs, respectively.
Supplying DRVCC power through EXTVCC could increase
efficiency by several percent, especially for high VIN
applications. Connecting EXTVCC to an output-derived
source will scale the VIN current required for the driver
and controller circuits by a factor of (Duty Cycle)/(Efficiency). For example, in a 20V to 5V application, 10mA
of DRVCC current results in approximately 2.5mA of VIN
current. This reduces the mid-current loss from 10%
or more (if the driver was powered directly from VIN)
to only a few percent.
4. CIN loss. The input capacitor filters large square-wave
input current drawn by the regulator into an averaged
DC current from the supply. The capacitor itself has
a zero average DC current, but square-wave-like AC
current flows through it. Therefore the input capacitor
must have a very low ESR to minimize the RMS current
loss on ESR. It must also have sufficient capacitance
to filter out the AC component of the input current to
prevent additional RMS losses in upstream cabling,
fuses or batteries. The LTC3838-2’s 2-phase architecture
improves the ESR loss.
For more information www.linear.com/3838-2
38382f
39
LTC3838-2
APPLICATIONS INFORMATION
“Hidden” copper trace, fuse and battery resistance, even
at DC current, can cause a significant amount of efficiency
degradation, so it is important to consider them during
the design phase. Other losses, which include the COUT
ESR loss, bottom MOSFET ’s body diode reverse-recovery
loss, and inductor core loss generally account for less
than 2% additional loss.
Power losses in the switching regulator will reflect as
a higher than ideal duty cycle, or a longer on-time for a
constant frequency. This efficiency accounted on-time
can be calculated as:
tON ≈ tON(IDEAL)/Efficiency
When making adjustments to improve efficiency, the input
current is the best indicator of changes in efficiency. If
you make a change and the input current decreases, then
the efficiency has increased.
Design Example
Consider a channel of step-down converter from VIN =
4.5V to 26V to VOUT = 1.2V, with IOUT(MAX) = 15A, and
f = 350kHz (see Figure 13, channel 1).
The regulated output voltage of channel 1 is determined by:
 R 
VOUT1 = 0.6V • 1+ FB2 
 RFB1 
Using a 10k resistor for RFB1, RFB2 is also 10k.
Channel 2 uses an external reference and requires an
additional resistor to the remote ground of the external
reference (See Output Voltage Programming section).
The value of the additional resistor is equal to the parallel
of the two feedback resistors. If such an exact resistor
value is not available, simply use two additional resistors
in parallel for the best accuracy.
The frequency is programmed by:
RT [kΩ] =
41550
41550
– 2.2 =
– 2.2 ≈ 116.5
f [kHz ]
350
The minimum on-time occurs for maximum VIN. Using the
tON(MIN) curves in the Typical Performance Characteristics
as references, make sure that the tON(MIN) at maximum VIN
is greater than that the LTC3838-2 can achieve, and allow
sufficient margin to account for the extension of effective
on-time at light load due to the dead times (tD(TG/BG) +
tD(TG/BG) in the Electrical Characteristics). The minimum
on-time for this application is:
tON(MIN) =
VOUT
VIN(MAX) • f
=
1.2V
= 143ns
24V • 350kHz
Set the inductor value to give 40% ripple current at maximum VIN using the adjusted operating frequency:

 1.2V 
1.2V
L =
1–
 = 0.54µH




350kHz
•
40%
•
15A
24V
Select 0.56µH which is the nearest standard value.
The resulting maximum ripple current is:

 1.2V 
1.2V
∆IL = 
 = 5.8A
1–
 350kHz • 0.56µH  24V 
Often in a high current application, DCR current sensing is
preferred over RSENSE in order to maximize efficiency. In
order to determine the DCR filter values, first the inductor
manufacturer has to be chosen. For this design, the Vishay
IHLP-4040DZ-01 model is chosen with a value of 0.56µH
and a DCRMAX =1.8mΩ. This implies that:
VSENSE(MAX) = 1.8mΩ • [1 + (100°C – 25°C) • 0.4%/°C]
• (15A – 5.8A/2) = 28mV
The maximum sense voltage, VSENSE(MAX), is within the
range that LTC3838-2 can handle without any additional
scaling. Therefore, the DCR filter can use a simple RC filter
across the inductor. If the C is chosen to be 0.1µF, then
the R can be calculated as:
RDCR =
L
0.56µH
=
= 3.1kΩ
DCR • CDCR 1.8mΩ • 0.1µF
Use the nearest 1% resistor standard value of 115k.
38382f
40
For more information www.linear.com/3838-2
LTC3838-2
APPLICATIONS INFORMATION
+
CIN1
220µF
CIN2
10µF
×3
2.2Ω
1µF
VIN
0.1µF
3.57k
VOUT1
1.2V
15A
+
COUT2
330µF
×2
SENSE2–
SENSE1+
SENSE2+
BOOST1
BOOST2
0.1µF
TG1
MT1
4.7µF
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG1
MB1
BG2
PGND
EXTVREF2
VOUTSENSE1+
100k
PGOOD1
0.01µF
PGOOD1
220pF
82.5k
115k
ITH1
DTR1
RT
SGND
RUN1
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
40
EFFICIENCY (%)
1.0
VIN = 12V
VOUT = 1.2V
0.1
1
LOAD CURRENT (A)
10
DTR2
CIN1: PANASONIC EEEFK1V221P
CIN2: TAIYO YUDEN GMK325BJ106MN-T
COUT2, COUT4: SANYO 2R5TPE330M9
COUT1, COUT3: MURATA GRM31CR60J107ME39L
DB1, DB2: CENTRAL SEMI CMDSH-4ETR
L1, L2: VISHAY IHLP4040DZERR56M01
MT1, MT2: RENESAS RJK0305DPB
MB1, MB2: RENESAS RJK0330DPB
22pF
220pF
90.9k
82.5k
38382 F13a
PHASMD
MODE/PLLIN
CLKOUT
RUN2
2.5
2.0
80
EFFICIENCY
70
50
0
40
1.5
POWER
LOSS
60
0.5
38382 F13b
3.0
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
1.0
VIN = 12V
VOUT = 1.5V
0.1
1
LOAD CURRENT (A)
10
POWER LOSS (W)
50
ITH2
100k
0.01µF
90
POWER LOSS (W)
60
PGOOD2
2.5
1.5
POWER
LOSS
PGOOD2
VREF2–
100
EFFICIENCY
70
VDFB2–
COUT3
100µF
×2
10k
3.0
2.0
80
VOUT2
0.8V TO 2.5V
15A
20k
VDFB2+
20k
VOUTSENSE1–
COUT4 +
330µF
×2
MB2
VREF2+
0.4V TO 1.25V
TRACK/SS1 TRACK/SS2
22pF
90.9k
L2
0.56µH
SW2
10k
90
MT2
DB2
10k
100
3.57k
TG2
SW1
1µF
15k
0.1µF
DB1
2.2Ω
COUT1
100µF
×2
SENSE1–
0.1µF
15k
L1
0.56µH
LTC3838-2
EFFICIENCY (%)
VIN
4.5V TO 26V
0.5
0
38382 F13c
Figure 13. Design Example: 4.5V to 26V Input, 1.2V/15A and 0.8V to 2.5V/15A
(VOUT2: EXTVREF2 = 2:1) Dual Outputs, 350kHz, DCR Sense, DTR Enabled, Step-Down Converter
38382f
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41
LTC3838-2
APPLICATIONS INFORMATION
Use an additional resistor in the DCR filter, as discussed
in DCR Inductor Current Sensing, to scale the VSENSE(MAX)
down by a comfortable margin below the lower limit of
the LTC3838-2’s own VSENSE(MAX) specification, so that
the maximum output current can be guaranteed.
The resulted junction temperatures at an ambient temperature TA = 75°C are:
In this design example, a 3.57k and 15k resistor divider
is used. The previously calculated VSENSE(MAX) is scaled
down from 28mV to 22.6mV, which is close to the lower
limit of LTC3838-2’s VSENSE(MAX) specification. Note the
equivalent RDCR = 3.57k//15k = 2.9k, slightly lower than
the 3.1k calculated above for a matched RDCR-CDCR and
L-DCR network. The resulted mismatch allows for a slightly
higher ripple in VSENSE.
These numbers show that careful attention should be paid
to proper heat sinking when operating at higher ambient
temperatures.
Remember to check the maximum possible peak inductor
current, considering the upper spec limit of VSENSE(MAX)
and the DCR(MIN) at lowest operating temperature, as well
as the maximum ∆IL, is not going to saturate the inductor
or exceed the rating of power MOSFETs:
IL(PEAK) =
VSENSE(MAX)(UpperSpecLimit)
+ ∆IL(MAX)
DCRMIN 1+ ( TMIN – 25°C) • 0.4% / °C
For the external N-channel MOSFETs, Renesas
RJK0305DBP (R DS(ON) = 13mΩ max, C MILLER =
150pF, VGS = 4.5V, θJA = 40°C/W, TJ(MAX) = 150°C)
is chosen for the top MOSFET (main switch). RJK0330DBP (RDS(ON) = 3.9mΩ max, VGS = 4.5V, θJA =
40°C/W, TJ(MAX) = 150°C) is chosen for the bottom
MOSFET (synchronous switch). The power dissipation
for each MOSFET can be calculated for VIN = 24V and
typical TJ = 125°C:
 1.2V 
2
PTOP = 
 (15A ) (13mΩ) 1+ 0.4% (125°C – 25°C)
 24V 
 2.5Ω
1.2Ω 
2  15A 
+ (24V ) 
+
 (150pF ) 
(350kHz )
 5.3V – 3V 3V 
 2 
= 0.54W
 24V – 1.2V 
2
PBOT = 
 (15A ) (3.9mΩ) 1+ 0.4% (125°C – 25°C)
 24V 
= 1.2W
TJ(TOP) = 75°C + (0.54W)(40°C/W) = 97°C
TJ(BOT) = 75°C + (1.2W)(40°C/W) = 123°C
Select the CIN capacitors to give ample capacitance and
RMS ripple current rating. Consider worst-case duty
cycles per Figure 6: If operated at steady-state with SW
nodes fully interleaved, the two channels would generate not more than 7.5A RMS at full load. In this design
example, 3 × 10µF 35V X5R ceramic capacitors are put
in parallel to take the RMS ripple current, with a 220µF
aluminum-electrolytic bulk capacitor for stability. For
10µF 1210 X5R ceramic capacitors, try to keep the ripple
current less than 3A RMS through each device. The bulk
capacitor is chosen for RMS rating per simulation with
the circuit model provided.
The output capacitor COUT is chosen for a low ESR of
4.5mΩ to minimize output voltage changes due to inductor
ripple current and load steps. The output voltage ripple
is given as:
∆VOUT(RIPPLE) = ∆IL(MAX) • ESR = 5.85A • 4.5mΩ = 26mV
However, a 10A load step will cause an output change
of up to:
∆VOUT(STEP) = ∆ILOAD • ESR = 10A • 4.5mΩ = 45mV
Optional 2 × 100µF ceramic output capacitors are included
to minimize the effect of ESR and ESL in the output ripple
and to improve load step response.
The ITH compensation resistor RITH of 40k and a CITH of
220pF are chosen empirically for fast transient response,
and an additional CITH2 = 22pF is added directly from ITH pin
to SGND, to roll off the system gain at switching frequency
and attenuate high frequency noise. For less aggressive
transient response but more stability, lower-valued RITH
and higher-valued CITH and CITH2 can be used (such as
the various combinations used in Figures 16, 17, 18, 19,
20), which typically results in lower bandwidth but more
phase margin.
38382f
42
For more information www.linear.com/3838-2
LTC3838-2
APPLICATIONS INFORMATION
To set up the detect transient (DTR) feature, pick resistors for an equivalent RITH = RITH1//RITH2 close to 40k.
Here, 1% resistors RITH1 = 90.9k (low side) and RITH2 =
82.5k (high side) are used, which yields an equivalent
RITH of 43.2k, and a DC-bias threshold of 236mV typical
above one-half of INTVCC (including the 2.5µA pull-up
current from the DTR pin, see the Load-Release Transient
Detection section). Note that even though the accuracy
of the equivalent compensation resistance RITH is not as
important, always use 1% or better resistors for the resistor divider from INTVCC to SGND to guarantee the relative
accuracy of this DC-bias threshold. To disable the DTR
feature, simply use a single RITH resistor to SGND, and
tie the DTR pin to INTVCC.
If channel 2 uses an external reference voltage with a ratio
of VOUT2: VEXTVREF2 = 2:1, as in this design example, it
would have the same ratio and overall system gain as
channel 1 (VOUT1: VINTVREF = 1.2V: 0.6V = 2:1), therefore the same values (as channel 1) of compensation
components can be used on ITH2 pin. If another ratio is
needed, the ITH compensation may need to be adjusted.
Figure 17 shows an RSENSE and DTR-disabled version of
this design with a channel 2 that has VOUT2: VEXTVREF2 =
1:1. Note that as EXTVREF2 is getting closer to its higher
limit , the lower end of the VIN range may require a higher
value to guarantee the INTVCC required at the EXTVREF2
applied (see the Electrical Characteristics section) and
assure TRACK/SS2 settles well above EXTVREF2 when no
external pull-up is used.
PCB Layout Checklist
The printed circuit board layout is illustrated graphically
in Figure 14. Figure 15 illustrates the current waveforms
present in the various branches of 2-phase synchronous
regulators operating in continuous mode. Use the following checklist to ensure proper operation:
• A multilayer printed circuit board with dedicated ground
planes is generally preferred to reduce noise coupling
and improve heat sinking. The ground plane layer
should be immediately next to the routing layer for the
power components, e.g., MOSFETs, inductors, sense
resistors, input and output capacitors etc.
• Keep SGND and PGND separate. Upon finishing the
layout, connect SGND and PGND together with a single
PCB trace underneath the IC from the SGND pin through
the exposed PGND pad to the PGND pin.
• All power train components should be referenced to
PGND; all components connected to noise-sensitive
pins, e.g., ITH, RT, TRACK/SS, etc., should return to the
SGND pin. Keep PGND ample, but SGND area compact.
Use a modified “star ground” technique: a low impedance, large copper area central PCB point on the same
side of the as the input and output capacitors.
• Place power components, such as CIN, COUT , MOSFETs,
DB and inductors, in one compact area. Use wide but
shortest possible traces for high current paths (e.g., VIN,
VOUT , PGND etc.) to this area to minimize copper loss.
• Keep the switch nodes (SW1,2), top gates (TG1,2) and
boost nodes (BOOST1,2) away from noise-sensitive
small-signal nodes, especially from the opposite channel’s voltage and current sensing feedback pins. These
nodes have very large and fast moving signals and
therefore should be kept on the “output side” of the
LTC3838-2 (power-related pins are toward the right
hand side of the IC), and occupy minimum PC trace
area. Use compact switch node (SW) planes to improve
cooling of the MOSFETs and to keep EMI down. If DCR
sensing is used, place the top filter resistor (R1 only in
Figure 5) close to the switch node.
38382f
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43
LTC3838-2
APPLICATIONS INFORMATION
• The top N-channel MOSFETs of the two channels have
to be located within a short distance from (preferably
<1cm) each other with a common drain connection at
CIN. Do not attempt to split the input decoupling for the
two channels as it can result in a large resonant loop.
• Connect the input capacitor(s), CIN, close to the power
MOSFETs. This capacitor provides the MOSFET transient
spike current. Connect the drain of the top MOSFET as
close as possible to the (+) plate of the ceramic portion
of input capacitors CIN. Connect the source of the bottom MOSFET as close as possible to the (–) terminal
of the same ceramic CIN capacitor(s). These ceramic
capacitor(s) bypass the high di/dt current locally, and
both top and bottom MOSFET should have short PCB
trace lengths to minimize high frequency EMI and
prevent MOSFET voltage stress from inductive ringing.
• The path formed by the top and bottom N-channel
MOSFETs, and the CIN capacitors should have short
leads and PCB trace. The (–) terminal of output capacitors should be connected close to the (–) terminal of
CIN, but away from the loop described above. This is to
achieve an effect of Kelvin (4-wire) connection to the
input ground so that the “chopped” switching current
will not flow through the path between the input ground
and the output ground, and cause common mode output
voltage ripple.
• Several smaller sized ceramic output capacitors, COUT ,
can be placed close to the sense resistors and before
the rest bulk output capacitors.
• The filter capacitor between the SENSE+ and SENSE– pins
should always be as close as possible to these pins.
Ensure accurate current sensing with Kelvin (4-wire)
connections to the soldering pads from underneath
the sense resistors or inductor. A pair of sense traces
should be routed together with minimum spacing.
RSENSE, if used, should be connected to the inductor
on the noiseless output side, and its filter resistors
close to the SENSE+/SENSE– pins. For DCR sensing,
however, filter resistor should be placed close to the
inductor, and away from the SENSE+/SENSE– pins, as
its terminal is the SW node.
• Keep small-signal components connected noise-sensitive pins (give priority to SENSE+/SENSE–, VOUTSENSE1+/
VOUTSENSE1–, VDFB2+/VDFB2–, RT, ITH, etc.) on the left
hand side of the IC as close to their respective pins as
possible. This minimizes the possibility of noise coupling
into these pins. If the LTC3838-2 can be placed on the
bottom side of a multilayer board, use ground planes
to isolate from the major power components on the top
side of the board, and prevent noise coupling to noise
sensitive components on the bottom side.
• Place the resistor feedback dividers close to the
VOUTSENSE1+ and VOUTSENSE1– pins for channel 1, or
the VDFB2+ and VDFB2– pins for channel 2, so that the
feedback voltage tapped from the resistor divider will
not be disturbed by noise sources. Route remote sense
PCB traces (use a pair of wires closely together for
differential sensing) directly to the terminals of output
capacitors for best output regulation.
• Place decoupling capacitors CITH2 next to the ITH and
SGND pins with short, direct trace connections.
• Use sufficient isolation when routing a clock signal into
the MODE/PLLIN pin or out of the CLKOUT pin, so that
the clock does not couple into sensitive pins.
• Place the ceramic decoupling capacitor CINTVCC between
the INTVCC pin and SGND and as close as possible to
the IC.
• Place the ceramic decoupling capacitor CDRVCC close
to the IC, between the combined DRVCC1,2 pins and
PGND.
• Filter the VIN input to the LTC3838-2 with an RC filter.
Place the filter capacitor close to the VIN pin.
• If vias have to be used, use immediate vias to connect components to the SGND and PGND planes of
LTC3838‑2. Use multiple large vias for power components.
• Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
components. Connect the copper areas to DC rails only,
e.g., PGND.
38382f
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LTC3838-2
APPLICATIONS INFORMATION
PCB Layout Debugging
Only after each controller is checked for its individual
performance should both controllers be turned on at the
same time. It is helpful to use a current probe to monitor
the current in the inductor while testing the circuit. Monitor
the output switching node (SW pin) to synchronize the
oscilloscope to the internal oscillator output CLKOUT, or
external clock if used. Probe the actual output voltage as
well. Check for proper performance over the operating
voltage and current range expected in the application.
Investigate whether any problems exist only at higher output currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG,
and possibly BG connections and the sensitive voltage
and current pins.
The capacitor placed across the current sensing pins needs
to be placed immediately adjacent to the pins of the IC.
This capacitor helps to minimize the effects of differential
noise injection due to high frequency capacitive coupling.
The frequency of operation should be maintained over
the input voltage range. The phase should be maintained
from cycle to cycle in a well designed, low noise PCB
implementation. Variation in the phase of SW node pulse
can suggest noise pickup at the current or voltage sensing
inputs or inadequate loop compensation. Overcompensation of the loop can be used to tame a poor PCB layout if
regulator bandwidth optimization is not required.
If problems are encountered with high current output
loading at lower input voltages, look for inductive coupling
between CIN, top and bottom MOSFET components to the
sensitive current and voltage sensing traces.
Pay special attention to the region of operation when one
controller channel is turning on (right after its current
comparator trip point) while the other channel is turning
off its top MOSFET at the end of its on-time. This may
cause minor phase-lock jitter at either channel due to
noise coupling.
At high switching frequencies there may be an increased
sensitivity to noise. Special care may need to be taken to
prevent cycle-by-cycle instability and/or phase-lock jitter.
First, carefully follow the recommended layout techniques
to reduce coupling from the high switching voltage/current
traces. Additionally, use low ESR and low impedance X5R
or X7R ceramic input capacitors: up to 5μF per Ampere
of load current may be needed.
Reduce VIN from its nominal level to verify operation of
the regulator in dropout. Check the operation of the undervoltage lockout circuit by further lowering VIN while
monitoring the outputs to verify operation.
In addition, investigate common ground path voltage pickup
between these components and the SGND pin of the IC.
High Switching Frequency Operation
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LTC3838-2
APPLICATIONS INFORMATION
RDFB1
RDFB2
RDFB1//RDFB2
–
VREF2
+
RITH2(2)
CITH1(2)
RITH1(2)
VDFB2– SENSE2+ SENSE2– DTR2 RUN2 PGOOD2 BOOST2
VDFB2+
LTC3838-2
CERAMIC
COUT2
PGND
CVIN VIN
VIN
PHASMD
CDRVCC
RVIN
+
PGND
CIN
CERAMIC
COUT1
DRVCC1
RITH1(1)
RITH2(1)
MB2
RINTVCC
+
RT
CITH2(1)
RT
VOUT2
+
LOCALIZED
SGND TRACE
MT2
RSENSE2
CINTVCC
TRACK/SS2
MODE/PLLIN
CLKOUT
SGND
L2
DB2
DRVCC2
EXTVCC
INTVCC
CSS2
CB2
EXTVREF2
ITH2
CITH2(2)
TG2
SW2
BG2
DB1
ITH1
CITH1(1)
TRACK/SS1
RFB2(1) CSS1
RFB1(1)
MT1
MB1
BG1
SW1
TG1
VOUTSENSE1+
VOUTSENSE1– SENSE1+ SENSE1– DTR1 RUN1 PGOOD1 BOOST1
RSENSE1
CB1
VOUT1
L1
38382 F14
BOLD LINES INDICATE HIGH SWITCHING CURRENT. KEEP LINES TO A MINIMUM LENGTH
Figure 14. Recommended PCB Layout Diagram
38382f
46
For more information www.linear.com/3838-2
LTC3838-2
APPLICATIONS INFORMATION
SW2
L2
RSENSE2
VOUT2
COUT2
RL2
VIN
RIN
CIN
SW1
BOLD LINES INDICATE
HIGH SWITCHING
CURRENT. KEEP LINES
TO A MINIMUM LENGTH.
L1
RSENSE1 VOUT1
COUT1
RL1
38382 F15
Figure 15. Branch Current Waveforms
38382f
For more information www.linear.com/3838-2
47
LTC3838-2
TYPICAL APPLICATIONS
VIN
4.5V TO 38V
+
CIN2
10µF
×3
CIN1
100µF
2.2Ω
1µF
VIN
3.57k
+
SENSE1+
SENSE2+
BOOST1
BOOST2
TG1
MT1
COUT2
330µF
×2
3.57k
TG2
MT2
DB2
SW1
4.7µF
1µF
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG2
EXTVREF2
PGND
10k
VOUTSENSE1+
VDFB2+
VOUTSENSE1–
0.01µF
PGOOD1
ITH1
220pF
DTR1
115k
RT
SGND
RUN1
100
DTR2
38382 F16a
PHASMD
MODE/PLLIN
CLKOUT
RUN2
POWER
LOSS
60
1.0
0.5
50
VIN = 12V
VOUT = 1.2V
0.1
1
LOAD CURRENT (A)
10
0
3.0
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
90
EFFICIENCY (%)
70
20k
2.5
2.0
80
EFFICIENCY
POWER
LOSS
70
1.5
1.0
60
50
40
VIN = 12V
VOUT = 1.5V
0.1
38382 F16b
1
LOAD CURRENT (A)
10
POWER LOSS (W)
1.5
EFFICIENCY
40
220pF
2.0
80
CIN1: NICHICON UCJ1H101MCL1GS
CIN2: MURATA GRM32ER71H106K
COUT2, COUT4: SANYO 2R5TPE330M9
COUT1, COUT3: MURATA GRM31CR60J107ME39L
DB1, DB2: DIODES INC. SDM10K45
L1, L2: TOKO FDA1055-R56M
MT1, MT2: INFINEON BSC093N04LSG
MB1, MB2: INFINEON BSC035N04LSG
22pF
100
POWER LOSS (W)
EFFICIENCY (%)
90
ITH2
100k
0.01µF
2.5
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
VREF2–
PGOOD2
TRACK/SS1 TRACK/SS2
22pF
COUT3
100µF
×2
10k
VDFB2–
PGOOD2
COUT4 +
330µF
×2
MB2
20k
PGOOD1
VOUT2
0.8V TO 2.5V
15A
VREF2+
0.4V TO 1.25V 20k
10k
100k
L2
0.56µH
SW2
BG1
MB1
20k
15k
0.1µF
DB1
2.2Ω
COUT1
100µF
×2
SENSE2–
0.1µF
0.1µF
VOUT1
1.2V
15A
SENSE1–
0.1µF
15k
L1
0.56µH
LTC3838-2
0.5
0
38382 F16c
Figure 16. 4.5V to 38V Input, 1.2V/15A and 0.8V to 2.5V/15A (VOUT2: EXTVREF2 = 2:1)
Dual Output, 350kHz, DCR Sense, Step-Down Converter
38382f
48
For more information www.linear.com/3838-2
LTC3838-2
TYPICAL APPLICATIONS
+
CIN1
220µF
CIN2
10µF
×3
2.2Ω
1µF
VIN
100Ω
L1
0.47µH
MT1
+
COUT2
330µF
×2
SENSE1+
SENSE2+
BOOST1
BOOST2
TG1
100Ω
MT2
TG2
MB1
4.7µF
SW2
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG1
10k
VREF2+
0.8V TO 2.5V
EXTVREF2
VOUTSENSE1+
0.01µF
39.2k
220pF
115k
VREF2–
VOUTSENSE1–
PGOOD1
ITH1
DTR1
RT
SGND
RUN1
Channel 1 Loop Gain
PGOOD2
100k
PGOOD2
0.01µF
ITH2
470pF
13k
DTR2
38382 F17
PHASMD
MODE/PLLIN
CLKOUT
RUN2
60
40
45
30
PHASE
15
GAIN
0
60
PHASE
45
30
20
10
15
GAIN
0
–15
–10
–15
–20
–30
–20
–30
–45
1000
–30
10
100
FREQUENCY (kHz)
38382 F17b
10
60
0
0
PHASE
GAIN
–5
–60
–10
–120
0
–10
–30
5
PHASE (deg)
30
20
GAIN (dB)
75
PHASE (deg)
90
50
PHASE (deg)
60
75
0
Channel 2 Closed-Loop
(VOUT2 /EXTVREF2)
Channel 2 Loop Gain
90
10
CIN1: PANASONIC EEEFK1V221P
CIN2: TAIYO YUDEN GMK325BJ106MN-T
COUT1, COUT4: MURATA GRM31CR60J107ME39L
COUT2, COUT3: SANYO 2R5TPE330M9
DB1, DB2: CENTRAL SEMI CMDSH-4ETR
L1, L2: WÜRTH 7443330047
MT1, MT2: RENESAS RJK0305DPB
MB1, MB2: RENESAS RJK0330DPB
47pF
50
30
GAIN (dB)
VDFB2–
60
40
COUT4
100µF
×2
10k
TRACK/SS1 TRACK/SS2
22pF
+
VOUT2
0.8V TO 2.5V
12A
10k
VDFB2+
10k
PGOOD1
RS2
0.002Ω
COUT3
330µF
×2
MB2
BG2
PGND
100k
L2
0.47µH
DB2
SW1
1µF
100Ω
0.1µF
DB1
2.2Ω
COUT1
100µF
×2
SENSE2–
1nF
0.1µF
RS1
0.002Ω
SENSE1–
1nF
100Ω
VOUT1
1.2V
12A
LTC3838-2
GAIN (dB)
VIN
6V TO 26V
100
FREQUENCY (kHz)
–45
1000
–15
1
10
100
FREQUENCY (kHz)
38382 F17c
–180
1000
38382 F17d
Bode plots taken with OMICRON Lab Bode 100 Vector Network Analyzer.
Figure 17. 6V to 26V Input, 1.2V/15A and 0.8V to 2.5V/15A (VOUT2: EXTVREF2 = 1:1)
Dual Output, 350kHz, RSENSE, Step-Down Converter
38382f
For more information www.linear.com/3838-2
49
LTC3838-2
TYPICAL APPLICATIONS
VIN
5V TO 14V
+
CIN2
22µF
×4
CIN1
180µF
2.2Ω
1µF
VIN
100Ω
L1
0.47µH
M1
+
SENSE1+
SENSE2+
BOOST1
BOOST2
TG1
COUT2
330µF
×2
M2
TG2
4.7µF
SW2
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG1
VDFB2+
10k
10k
PGOOD1
0.01µF
470pF
23.2k
137k
VOUTSENSE1–
PGOOD1
ITH1
DTR1
RT
SGND
RUN1
VDFB2–
PGOOD2
100k
PGOOD2
0.01µF
ITH2
47pF
470pF
12.7k
DTR2
38382 F18
CIN1: SANYO 16SVP180MX
CIN2: MURATA GRM32ER61C226KE20L
COUT1, COUT4: MURATA GRM31CR60J107ME39L
COUT2, COUT3: SANYO 2R5TPE330M9
DB1, DB2: CENTRAL SEMI CMDSH-4ETR
L1, L2: WÜRTH 7443330047
M1, M2: INFINEON BSC0911ND
PHASMD
MODE/PLLIN
CLKOUT
RUN2
90
3
90
3
80
2
80
2
1
70
0
100
60
70
60
0.1
1
10
VIN = 12V LOAD CURRENT (A)
VOUT = 1.2V
38382 F18b
4
VIN = 5V FCM
VIN = 5V DCM
1
LOSS
0.1
1
10
LOAD CURRENT (A)
VIN = 5V
VOUT = 1.2V
POWER LOSS (W)
LOSS
EFFICIENCY (%)
100
VIN = 12V FCM
VIN = 12V DCM
POWER LOSS (W)
EFFICIENCY (%)
10k
4
100
COUT4
100µF
×2
VREF2–
TRACK/SS1 TRACK/SS2
47pF
+
VOUT2
0.8V TO 1.5V
20A
VREF2+
0.8V TO 1.5V
EXTVREF2
VOUTSENSE1+
10k
COUT3
330µF
×2
BG2
PGND
100k
RS2
L2
0.47µH 0.0015Ω
DB2
SW1
1µF
100Ω
0.1µF
DB1
2.2Ω
COUT1
100µF
×2
SENSE2–
1nF
0.1µF
RS1
0.0015Ω
100Ω
SENSE1–
1nF
100Ω
VOUT1
1.2V
20A
LTC3838-2
0
100
38382 F18c
Figure 18. 5V to 14V Input, 1.2V/20A and 0.8V to 1.5V/20A (VOUT2: EXTVREF2 = 1:1)
Dual Output, 300kHz, RSENSE, Step-Down Converter
38382f
50
For more information www.linear.com/3838-2
LTC3838-2
TYPICAL APPLICATIONS
5V TO 5.5V EXTERNAL
VIN
3.3V TO 14V
+
CIN1
180µF
CIN2
22µF
×4
2.2Ω
1µF
VIN
100Ω
L1
0.47µH
M1
+
SENSE1+
SENSE2+
BOOST1
BOOST2
100Ω
TG1
COUT2
330µF
×2
M2
TG2
DB2
SW1
1µF
4.7µF
DRVCC1
INTVCC
DRVCC2
EXTVCC
COUT3
330µF
×2
BG2
EXTVREF2
PGND
VOUTSENSE1+
10k
0.01µF
VDFB2+
10k
23.2k
470pF
137k
+
COUT4
100µF
×2
10k
VREF2–
VOUTSENSE1–
PGOOD1
VDFB2–
PGOOD2
TRACK/SS1 TRACK/SS2
47pF
VOUT2
0.8V TO 1.2V
20A
VREF2+
0.8V TO 1.2V
10k
PGOOD1
RS2
L2
0.47µH 0.0015Ω
SW2
BG1
100k
100Ω
0.1µF
DB1
2.2Ω
COUT1
100µF
×2
SENSE2–
1nF
0.1µF
RS1
0.0015Ω
SENSE1–
1nF
100Ω
VOUT1
1.2V
20A
LTC3838-2
ITH1
DTR1
RT
SGND
RUN1
ITH2
100k
PGOOD2
0.01µF
CIN1: SANYO 16SVP180MX
CIN2: MURATA GRM32ER61C226KE20L
COUT1, COUT4: MURATA GRM31CR60J107ME39L
COUT2, COUT3: SANYO 2R5TPE330M9
DB1, DB2: CENTRAL SEMI CMDSH-4ETR
L1, L2: WÜRTH 7443330047
M1, M2: INFINEON BSC0911ND
47pF
470pF
DTR2
PHASMD
MODE/PLLIN
CLKOUT
RUN2
12.7k
38382 F19
Note: When operating with the power VIN supply below 5.5V, this application requires the 5V to 5.5V external supply
to be present at EXTVCC in order to maintain DRVCC, INTVCC and VIN pin voltages needed for the IC to function
properly. The EXTVCC supply is optional when the power VIN supply is at or above 5.5V.
Power input voltage range of this application cannot be generalized for other frequency and/or output voltage. Each
application that needs a power input voltage different from the VIN pin voltage shall be tested individually for margin
of range in which the switching nodes (SW1, SW2) phase-lock to the clock output (CLKOUT)
Figure 19. 3.3V to 14V Power Input, 1.2V/20A and 0.8V to 1.2V/20A (VOUT2: EXTVREF2 = 1:1)
Dual Output, 300kHz, RSENSE, Step-Down Converter (with Externally-Available 5V to 5.5V Supply)
38382f
For more information www.linear.com/3838-2
51
LTC3838-2
TYPICAL APPLICATIONS
VIN
4.5V TO 14V
+
CIN2
22µF
×4
CIN1
180µF
2.2Ω
1µF
VIN
SENSE1+
SENSE2+
BOOST1
BOOST2
0.1µF
0.1µF
4.02k
MT1
L1
0.4µH
TG1
COUT2
330µF
×2
4.02k
MT2
TG2
L2
0.4µH
DB2
SW1
4.7µF
1µF
16.2k
0.1µF
DB1
2.2Ω
+
SENSE2–
0.1µF
16.2k
COUT1
100µF
×2
LTC3838-2
SENSE1–
MB1
VOUT
0.4V TO 2.5V
50A
SW2
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG1
BG2
PGND
EXTVREF2
VOUTSENSE1+
VDFB2+
VREF2+
0.4V TO 2.5V 10k
COUT3 +
330µF
×2
MB2
COUT4
100µF
×2
10k
VREF2–
VOUTSENSE1–
PGOOD1
VDFB2–
PGOOD2
0.01µF
TRACK/SS1 TRACK/SS2
ITH1
137k
CIN1: SANYO 16SVP180MX
CIN2: MURATA GRM32ER61C226KE20L
COUT1, COUT4: MURATA GRM31CR60J107ME39L
COUT2, COUT3: SANYO 2R5TPE330M9
DB1, DB2: CENTRAL SEMI CMDSH-4ETR
L1, L2: VISHAY IHLP5050FDERR40M01
MT1, MT2: INFINEON BSC050NE2LS
MB1, MB2: INFINEON BSC010NE2LS
DTR1
RT
SGND
RUN1
ITH2
100k
PGOOD
100pF
1000pF
7.5k
DTR2
PHASMD
MODE/PLLIN
CLKOUT
RUN2
38382 F20a
EFFICIENCY
POWER
LOSS
8
90
6
70
4
60
50
0.1
1
10
VIN = 12V LOAD CURRENT (A)
VOUT = 1.2V
38382 F20b
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
80
EFFICIENCY
POWER
LOSS
10
2.5
8
2.0
6
POWER LOSS (W)
80
100
POWER LOSS (W)
EFFICIENCY (%)
90
10
VOUT (V)
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
EFFICIENCY (%)
100
1.5
EXTVREF2 = VOUT
70
4
2
60
2
0.5
0
50
0
0
0.1
1
10
LOAD CURRENT (A)
VIN = 5V
VOUT = 1.2V
DO
NOT
USE
1.0
4
5
6
38382 F20c
7
8
9 10 11 12 13 14
VIN (V)
38382 F20d
LIMITED BY VOLTAGE DROP FROM VIN TO INTVCC AND
TRACK/SS2 (INTVCC ≥ 4V REQUIRED AT EXTVREF = 1.5V,
AND INTVCC ≥ 5V REQUIRED AT EXTVREF2 = 2.5V, AND
TRACK/SS2 > EXTVREF2 AFTER SOFT-START)
Figure 20. 4.5V to 14V Input, 0.4V to 2.5V/50A (VOUT: EXTVREF2 = 1:1)
2-Phase Single Output, 300kHz, DCR Sense, Step-Down Converter
38382f
52
For more information www.linear.com/3838-2
LTC3838-2
TYPICAL APPLICATIONS
+
CIN2
10µF
×3
CIN1
220µF
2.2Ω
1µF
VIN
20Ω
L1
2.2µH
MT1
+
COUT2
150µF
×2
SENSE1+
SENSE2+
BOOST1
BOOST2
TG1
MT2
TG2
SW1
4.7µF
1µF
MB1
DRVCC1
INTVCC
DRVCC2
EXTVCC
EXTVREF2
VOUTSENSE1+
VDFB2+
PGOOD1
0.01µF
PGOOD1
VDFB2–
PGOOD2
TRACK/SS1 TRACK/SS2
22pF
220pF
137k
MB2
ITH1
DTR1
RT
SGND
RUN1
ITH2
+
VOUT2
2.5V TO 5V
12A
COUT4
100µF
VREF2+
1.25V TO 2.5V 20k
10k
20k
VOUTSENSE1–
RS2
0.002Ω
COUT3
150µF
×2
VOUT1
BG2
PGND
10k
53.6k
L2
1.3µH
SW2
BG1
100k
20Ω
0.1µF
DB2
73.2k
VREF2–
100k
PGOOD2
0.01µF
CIN1: PANASONIC EEEFK1V221P
CIN2: TAIYO YUDEN GMK325BJ106MN-T
COUT1, COUT4: MURATA GRM31CR60J107ME39L
COUT2, COUT3:SANYO 6TPE150MIC2
DB1, DB2: DIODES INC. SDM10K45
L1: WÜRTH 7443320220
L2: WÜRTH 7443551130
MT1, MT2: INFINEON BSC093N04LSG
MB1, MB2: INFINEON BSC035N04LSG
47pF
470pF
15k
DTR2
38382 F21a
PHASMD
MODE/PLLIN
CLKOUT
RUN2
100
3.0
100
3.0
90
2.5
90
2.5
EFFICIENCY
70
60
50
40
1.5
POWER
LOSS
1.0
VIN = 12V
VOUT = 5V
0.1
1
LOAD CURRENT (A)
10
2.0
80
EFFICIENCY
70
60
0.5
50
0
40
38382 F21b
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
1.5
POWER
LOSS
1.0
VIN = 12V
VOUT = 3.3V
0.1
1
LOAD CURRENT (A)
10
POWER LOSS (W)
2.0
80
POWER LOSS (W)
EFFICIENCY (%)
20Ω
DB1
2.2Ω
COUT1
100µF
SENSE2–
1nF
0.1µF
RS1
0.002Ω
SENSE1–
1nF
20Ω
VOUT1
5V
12A
LTC3838-2
EFFICIENCY (%)
VIN
6.5V TO 34V
0.5
0
38382 F21c
FORCED CONTINUOUS MODE
DISCONTINUOUS MODE
Figure 21. 6.5V to 34V Input, 5V/12A and 2.5V to 5V/12A (VOUT2: EXTVREF2 = 2:1)/12A Dual Output,
300kHz, RSENSE, 5V Output Tied to EXTVCC, Step-Down Converter
38382f
For more information www.linear.com/3838-2
53
LTC3838-2
TYPICAL APPLICATIONS
VIN
4.5V TO 14V
CIN1
180µF
+
CIN2
22µF
×4
2.2Ω
1µF
VIN
10Ω
SENSE2–
SENSE1+
SENSE2+
BOOST1
BOOST2
10Ω
1nF
0.1µF
MT1
L1
0.3µH
TG1
MT2
TG2
MB1
L2
0.3µH
DB2
SW1
4.7µF
1µF
10Ω
0.1µF
DB1
2.2Ω
COUT1
100µF
×3
SENSE1–
1nF
10Ω
RS1
0.002Ω
LTC3838-2
SW2
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG1
EXTVREF2
VOUTSENSE1+
VREF2+
1V TO 2.5V
PGOOD1
VDFB2–
PGOOD2
10k
PGOOD
VREF2–
100k
0.01µF
TRACK/SS1 TRACK/SS2
ITH1
220pF
ITH2
DTR1
20k
VDFB2+
20k
VOUTSENSE1–
16.2k
DTR2
PHASMD
MODE/PLLIN
CLKOUT
RUN2
RT
SGND
RUN1
38382 F22a
CIN1: SANYO 16SVP180MX
CIN2: MURATA GRM32ER61C226KE20L
COUT1, COUT2: MURATA GRM31CR60J107ME39L
DB1, DB2: CENTRAL CMDSH-3
MT1, MT1: INFINEON BSC050NE2LS
MB1, MB2: INFINEON BSC032NE2LS
L1, L2: WÜRTH 7443340030/WÜRTH 7443340047
8
FORCED
CONTINUOUS
MODE
70
60
50
LOSS
FORCED
CM
0.1
LOSS
DCM
1
10
LOAD CURRENT (A)
4
6
4
70
60
0
100
50
10
LOSS
FORCED CM
0.1
1
10
LOAD CURRENT (A)
5
DO NOT
USE
L1, L2: WÜRTH
7443340047 (0.47µH)
8
FORCED
CONTINUOUS
MODE
80
2
38382 F22b
VIN = 5V
VOUT 3.3V
POWER LOSS (W)
6
80
90
DISCONTINUOUS
MODE
4
VOUT (V)
DISCONTINUOUS
MODE
100
POWER LOSS (W)
EFFICIENCY (%)
90
10
VIN = 12V
VOUT = 3.3V
EFFICIENCY (%)
100
VOUT
2V TO 5V
25A
COUT2
100µF
×3
MB2
BG2
PGND
18.7k
RS2
0.002Ω
3
L1, L2: WÜRTH 7443340030 (0.3µH)
2
LOSS
DCM
0
100
2
4
5
6
7
8
9 10 11 12 13 14
VIN (V)
38382 F22c
38382 F22d
Figure 22. 4.5V to 14V Input, 2V to 5V/25A (VOUT2: EXTVREF2 = 2:1) Output, 2MHz, RSENSE, Step-Down Converter
38382f
54
For more information www.linear.com/3838-2
LTC3838-2
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701 Rev C)
0.70 ± 0.05
5.50 ± 0.05
5.15 ± 0.05
4.10 ± 0.05
3.00 REF
3.15 ± 0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
5.5 REF
6.10 ± 0.05
7.50 ± 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ± 0.10
0.75 ± 0.05
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
3.00 REF
37
0.00 – 0.05
38
0.40 ±0.10
PIN 1
TOP MARK
(SEE NOTE 6)
1
2
5.15 ± 0.10
5.50 REF
7.00 ± 0.10
3.15 ± 0.10
(UH) QFN REF C 1107
0.200 REF 0.25 ± 0.05
0.50 BSC
R = 0.125
TYP
R = 0.10
TYP
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representaFor more
information
www.linear.com/3838-2
tion that the interconnection
of its circuits
as described
herein will not infringe on existing patent rights.
38382f
55
LTC3838-2
TYPICAL APPLICATION
7V to 14V Input, 5V/5A and 2.5V to 5V/5A (VOUT2: EXTVREF2 = 2:1)/5A Dual Output, 2MHz, RSENSE,
Step-Down Converter with EXTVCC Tied to 5V Output
VIN
7V TO 14V
+
CIN2
10µF
×3
CIN1
39µF
2.2Ω
1µF
VIN
10Ω
VOUT1
5V
7A
MT1
SENSE1+
SENSE2+
BOOST1
BOOST2
TG1
10Ω
1µF
MT2
TG2
DB2
SW1
4.7µF
MB1
SW2
DRVCC1
INTVCC
DRVCC2
EXTVCC
BG1
EXTVREF2
VOUTSENSE1+
PGOOD1
0.01µF
VREF2+
1.25V TO 2.5V
20k
VOUTSENSE1–
PGOOD1
VDFB2–
PGOOD2
330pF
18.7k
ITH1
DTR1
RT
SGND
RUN1
ITH2
L2
0.8µH
RS2
0.004Ω
VOUT2
2.5V TO 5V
7A
COUT2
47µF
×2
20k
10k
VREF2–
CFF2
150pF
100k
PGOOD2
0.01µF
TRACK/SS1 TRACK/SS2
22pF
24.9k
MB2
VDFB2+
10k
100k
VOUT1
BG2
PGND
73.2k
CFF1
47pF
10Ω
0.1µF
DB1
2.2Ω
COUT1
47µF
×2
SENSE2–
1nF
0.1µF
L1
0.8µH
SENSE1–
1nF
10Ω
RS1
0.004Ω
LTC3838-2
68pF
900pF
CIN1: SANYO 16SVP180MX
CIN2: MURATA GRM32ER61C226KE20L
COUT1, COUT2: MURATA GRM43ER60J476ME01L
DB1, DB2: CENTRAL CMDSH-3
L1, L2: COILCRAFT XAL5030-801MEB
MT1, MB1, MT2, MB2: VISHAY SI7114ADN
13k
DTR2
38382 TA02
PHASMD
MODE/PLLIN
CLKOUT
RUN2
RELATED PARTS
PART NUMBER
LTC3833
LTC3838/LTC3838-1
LTC3839
LTC3880/LTC3880-1
LTC3869/LTC3869-2
LTC3855
LTC3856
LTC3861/LTC3861-1
LTC3850/LTC3850-1
LTC3850-2
DESCRIPTION
Fast Controlled On-Time, High Frequency Synchronous
Step-Down Controller with Diff Amp
Dual or Single Output, 2-Channel Fast Controlled On-Time
Synchronous Step-Down DC/DC Controller with Diff Amp(s)
Single-Output 2-Channel Fast Controlled On-Time
Synchronous Step-Down Controller with Diff Amp
Dual Output PolyPhase Step-Down DC/DC Controller with
Digital Power System Management
Dual Output, 2-Phase Synchronous Step-Down DC/DC
Controller, with Accurate Current Sharing
Dual Output, 2-phase, Synchronous Step-Down DC/DC
Controller with Diff Amp and DCR Temperature Compensation
Single Output 2-Channel Synchronous Step-Down DC/DC
Controller with Diff Amp and Up to 12-Phase Operation
Dual, Multiphase, Synchronous Step-Down DC/DC Controller
with Diff Amp and Three-State Output Drive
Dual Output, 2-Phase Synchronous Step-Down DC/DC
Controller, RSENSE or DCR Current Sensing
COMMENTS
200kHz to 2MHz Operating Frequency, 4.5V ≤ VIN ≤ 38V,
0.6V ≤ VOUT ≤ 5.5V, 3mm × 4mm QFN-20, TSSOP-20
200kHz to 2MHz Operating Frequency, 4.5V ≤ VIN ≤ 38V,
0.6V ≤ VOUT ≤ 5.5V, 5mm × 7mm QFN-38, TSSOP-38
200kHz to 2MHz Operating Frequency, 4.5V ≤ VIN ≤ 38V,
0.6V ≤ VOUT ≤ 5.5V, 5mm × 5mm QFN-32
I2C/PMBus Interface with EEPROM and 16-Bit ADC, VIN Up to 24V,
0.5V ≤ VOUT ≤ 5.5V, Analog Control Loop
PLL Fixed 250kHz to 750kHz Frequency, 4V ≤ VIN ≤ 38V,
VOUT3 Up to 12.5V
PLL Fixed Frequency 250kHz to 770kHz, 4.5V ≤ VIN ≤ 38V,
0.8V ≤ VOUT ≤ 12V
PLL Fixed 250kHz to 770kHz Frequency, 4.5V ≤ VIN ≤ 38V,
0.8V ≤ VOUT ≤ 5V
Operates with Power Blocks, DRMOS Devices or External Drivers/
MOSFETs, 3V ≤ VIN ≤ 24V, tON(MIN) = 20ns
PLL Fixed 250kHz to 780kHz Frequency, 4V ≤ VIN ≤ 30V,
0.8V ≤ VOUT ≤ 5.25V
38382f
56 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/3838-2
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com/3838-2
LT 0213 • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 2013