SMS05T1 Series SC−74 Quad Transient Voltage Suppressor for ESD Protection This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems and other applications. This quad device provides superior surge protection over current quad Zener MMQA series by providing up to 350 watts peak power. http://onsemi.com SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR 350 WATTS PEAK POWER 5 VOLTS Features • SC-74 Package Allows Four Separate Unidirectional Configurations • Peak Power − 350 W, 8 x 20 mS • ESD Rating of Class N (Exceeding 25 kV) per • • • SC−74 CASE 318F STYLE 1 6 1 the Human Body Model ESD Rating: IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 23 A (8/20 ms) UL Flammability Rating of 94 V−0 Pb−Free Packages are Available MARKING DIAGRAM xxx M G G Typical Applications 1 • Hand Held Portable Applications such as Cell Phones, Pagers, Notebooks and Notebook Computers MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation 8 x 20 mS @ TA = 25°C (Note 1) Ppk 350 W Total Power Dissipation on FR−5 Board @ TA = 25°C (Note 2) Derate Above 25°C PD 225 mW 1.8 mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C TL 260 °C Lead Solder Temperature Maximum 10 Seconds Duration Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform 2. FR−5 = 1.0 x 0.75 x 0.62 in. xxx = Specific Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT 1 6 2 5 3 4 PIN 1. 2. 3. 4. 5. 6. CATHODE ANODE CATHODE CATHODE ANODE CATHODE DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 7 1 Publication Order Number: SMS05T1/D SMS05T1 Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IT QVBR I IF Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT VC VBR VRWM V IR VF IT Test Current Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK IPP Uni−Directional ELECTRICAL CHARACTERISTICS − UNIDIRECTIONAL Max Reverse Leakage Current Breakdown Voltage VBR(V) Max Reverse Voltage (Clamping Voltage) At Specified Reverse Surge Current (IRSM) Max Reverse Voltage (Clamping Voltage) At Specified Reverse Surge Current (IRSM) IT IR VR IRSM (8x20 ms) VRSM (8x20 ms) IRSM (8x20 ms) VRSM (8x20 ms) Capacitance @ 0 Volt Bias, 1 MHz (pF) Device Device Marking Min Nom Max (mA) (mA) (V) (A) (V) (A) (V) Min Max SMS05T1 5V0 6.0 − 7.2 1.0 20 5.0 5.0 9.8 23 15.5 250 400 SMS12T1 12V 13.3 − 15 1.0 1.0 12 5.0 19.0 15 23.0 80 150 SMS15T1 15V 16.7 − 18.5 1.0 1.0 15 5.0 24.0 12 29.0 60 125 SMS24T1 24V 26.7 − 32 1.0 1.0 24 5.0 40.0 8 44.0 40 75 ORDERING INFORMATION Device SMS05T1 SMS05T1G SMS12T1 SMS12T1G SMS15T1 SMS15T1G SMS24T1 SMS24T1G Package Shipping † SC−74 SC−74 (Pb−Free) 3000 / Tape & Reel SC−74 SC−74 (Pb−Free) 3000 / Tape & Reel SC−74 SC−74 (Pb−Free) 3000 / Tape & Reel SC−74 SC−74 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 SMS05T1 Series 110 100 % OF RATED POWER OR IPP PPP, PEAK PULSE POWER (kW) 10 1 0.1 90 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 1000 75 100 125 Figure 2. Power Derating Curve 150 50 80 70 VC, CLAMPING VOLTAGE (V) WAVEFORM PARAMETERS tr = 8 ms td = 20 ms 90 PERCENT OF IPP 50 Figure 1. Non−Repetitive Peak Pulse Power versus Pulse Time 110 c−t 60 td = IPP/2 50 40 30 20 45 WAVEFORM PARAMETERS tr = 8 ms td = 20 ms SMS24 40 35 30 SMS15 25 SMS12 20 15 SMS05 10 5 0 5 10 15 20 25 0 30 0 5 10 15 25 20 t, TIME (ms) IPP, PEAK PULSE CURRENT (A) Figure 3. Pulse Waveform Figure 4. Clamping Voltage versus Peak Pulse Current 300 5 PULSE WAVEFORM tr = 8 ms td = 20 ms 4 250 C, CAPACITANCE (pF) VF, FORWARD VOLTAGE (V) 25 TA, AMBIENT TEMPERATURE (°C) 100 10 0 0 tp, PULSE DURATION (ms) 8 X 20 ms SURGE 3 2 1 TJ = 25°C 200 SMS05 150 100 SMS12 50 SMS15 SMS24 0 0 0 5 10 15 20 0 5 10 15 20 25 IF, FORWARD CURRENT (A) VR, REVERSE VOLTAGE (V) Figure 5. 8 x 20 ms VF Figure 6. Typical Capacitance (SMS05 Series) http://onsemi.com 3 SMS05T1 Series PACKAGE DIMENSIONS SC−74 (SC−59ML) CASE 318F−05 ISSUE M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05. D 6 5 4 2 3 E HE 1 DIM A A1 b c D E e L HE q b e C A 0.05 (0.002) q L A1 MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° STYLE 1: PIN 1. 2. 3. 4. 5. 6. MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° CATHODE ANODE CATHODE CATHODE ANODE CATHODE SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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