STEVAL-TDR010V1
RF power amplifier demonstration board using: 2 x SD2942
N-channel enhancement-mode lateral MOSFETs
Features
■
Excellent thermal stability
■
Frequency: 87.5 - 108 MHz
■
Supply voltage: 48 V
■
Output power: 700 W min.
■
Gain: 19.5 dB min.
■
Efficiency: 73 % min.
■
Harmonics < - 36 dBc
■
Gain flatness: ± 0.5 dB max
AM01227v1
Table 1.
Description
The STEVAL-TDR010V1 is a RF broadband
power amplifier intended for FM broadcast radio
transmitters over the band 87.5 to 108 MHz using
2 x SD2942 gold metallized N-channel MOS fieldeffect transistors.
Device summary
Order code
STEVAL-TDR010V1
STEVAL-TDR010V1 is designed in cooperation
with InnovAction s.r.l in italy.
April 2010
Doc ID 17348 Rev 1
1/13
www.st.com
13
Contents
STEVAL-TDR010V1
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
Circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Circuit layout and connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5
Features include . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6
SD2942 mounting recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.1
Mounting recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6.2
Mounting sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
7
Package mechanical data: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
Doc ID 17348 Rev 1
STEVAL-TDR010V1
Electrical data
1
Electrical data
1.1
Maximum ratings
Table 2.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
Input power
15
W
POUT
Output power
800
W
TSTG
Storage temperature range
-20 to +70
°C
0 to +70
°C
PIN
TC
Operating base plate temperature
IDD
Drain current
22
A
Power dissipation
400
W
PDISS
2
Electrical characteristics
TA = +25 oC, VDD = 48 V, Idq = 2 x 200 mA
Table 3.
Electrical specification
Symbol
Test conditions
Frequency Frequency range
POUT
Min
Typ
Max
Unit
87.5
108
MHz
700
750
W
Gain
POUT = 700 W
20 ± 1.0
dB
ND
POUT = 700 W
80
%
H2
2
nd
harmonic @ POUT = 700 W
-40
dBc
H3
3rd
harmonic @ POUT = 700 W
-45
dBc
FL
Gain flatness @ POUT = 700 W
Doc ID 17348 Rev 1
± 0.5
dB
3/13
4/13
Doc ID 17348 Rev 1
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STEVAL-TDR010V1
Circuit schematic
Input and protection board
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STEVAL-TDR010V1
Output directional coupler
!-V
STEVAL-TDR010V1
4
Circuit layout and connections
Circuit layout and connections
Figure 4.
Circuit layout and connections
!-V
Doc ID 17348 Rev 1
7/13
Features include
5
STEVAL-TDR010V1
Features include
●
30 W input dummy load with automatic change-over case of alarm
●
Input directional coupler
●
Output directional coupler
●
Input forward power measurement 2.5 V @ 10 W
●
Input reflected power measurement 2.5 V @ 5 W
●
Output forward power measurement 2.5 V @ 700 W
●
Output reflected power measurement 2.5 V @ 250 W
●
Latching protection
●
Latch reset pin for manual restart (momentary to GND)
●
Over reflected power ultrafast alarm (700 nS)
●
Input pin for RF power inhibit
●
Acknowledge pin alarm + 5 V
Figure 5.
IDC connector piuout
!-V
8/13
Doc ID 17348 Rev 1
STEVAL-TDR010V1
SD2942 mounting recommendations
6
SD2942 mounting recommendations
6.1
Mounting recommendations
6.2
Table 4.
●
Ensure holes in heatsinks are free from burrs;
●
Minimum depth of tapped holes in heatsinks is 6 mm;
●
Use 4-40 UNC-2A cheese-head screws with a flat washer to spread the joint pressure;
●
The minimum flatness of the mounting area is 0.02 mm;
●
Mounting area roughness should be less than 0.5 µm (micro);
●
Avoid, as much as possible, use of flux or flux solutions because flux can penetrate
even when hermetically sealed ceramic-capped transistors. Tin and wash the printedcircuit board BEFORE mounting the power transistors, then solder the transistor leads
without using flux;
●
Transistor leads may be tinned by dipping them full-length into a solder bath at a
temperature of about 230 °C. No flux should be used during tinning;
●
Recommended heatsink compounds: WPSII (silicon free) from Austerlitz Electronics,
340 from dow corning etc.
Mounting sequence
●
Apply a thin layer of evenly distributed heatsink compound to the flange;
●
Position the device with flat washers in place;
●
Tighten the screws until finger tight (0.05 Nm);
●
Further tighten the screws until the specified torque is reached;
●
For M174, M177 and M244 type of packages, torque should be minimum 0.6 Nm and
0.75 Nm max.
DMOS packages - list of materials
Package
Type
Description
M174
0.500 dia 4l non
herm w/flange
Cu
Alloy 42
(Fe58 /
Ni42)
M174
(Moly
disk)
0.500 dia 4l non
herm w/flange
(moly disk)
Cu-MoCu
M177
0.550 dia 4l non
herm w/flange
M244
Flange
Leadframe
Plating
Ceramic
insulator
Torque (Nm)
Leads
Flange
Min
Max
BeO
(99.5%
min)
Au (100 µ min)
over Ni (100 µ
min / 350 µ max)
Ni(100 µ min) +
Pd (10 µ min)
0.6
0.75
Alloy 42
(Fe58 /
Ni42)
BeO
(99.5%
min)
Au (100 µ min)
over Ni (100 µ
min / 350 µ max)
Ni(100 µ min) +
Pd (10 µ min)
0.6
0.75
Cu-MoCu
Alloy 42
(Fe58 /
Ni42)
BeO
(99.5%
min)
Au (60 µ min)
Au (100 µ min)
over Ni (100 µ
over Ni (100 µ
min / 350 µ max) min / 350µ max)
0.6
0.75
2 x 0.400x0.425 W (85%)
wide 2l lap n/h
- Cu
flange
(15%)
Alloy 42
(Fe58 /
Ni42)
BeO(99.5
% min)
Au (60 µ min)
Au (60 µ min)
over Ni (100 µ
over Ni (100 µ
min / 350µ max) min / 350µ max)
0.6
0.75
Doc ID 17348 Rev 1
9/13
Package mechanical data:
7
STEVAL-TDR010V1
Package mechanical data:
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com. ECOPACK
is an ST trademark.
Table 5.
M244 (.400 x .860 4/L BAL N/HERM W/FLG)
mm.
inch
Dim.
Min.
A
5.59
B
Max.
Min.
5.84
0.220
5.08
Typ
Max.
0.230
0.200
C
3.02
3.28
0.119
0.129
D
9.65
9.91
0.380
0.390
E
19.81
20.82
0.780
0.820
F
10.92
11.18
0.430
0.440
G
10/13
Typ
27.94
1.100
H
33.91
34.16
1.335
1.345
I
0.10
0.15
0.004
0.006
J
1.52
1.78
0.060
0.070
K
2.59
2.84
0.102
0.112
L
4.83
5.84
0.190
0.230
M
10.03
10.34
0.395
0.407
N
21.59
22.10
0.850
0.870
Doc ID 17348 Rev 1
STEVAL-TDR010V1
Figure 6.
Package mechanical data:
M244 package dimensions
Controlling Dimension: Inches
Doc ID 17348 Rev 1
11/13
Revision history
8
STEVAL-TDR010V1
Revision history
Table 6.
12/13
Document revision history
Date
Revision
02-Apr-2010
1
Changes
Initial release.
Doc ID 17348 Rev 1
STEVAL-TDR010V1
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