STMICROELECTRONICS PD54008L-E

PD54008L-E
RF power transistors
The LdmoST Plastic family
Features
■
Excellent thermal stability
■
Common source configuration
■
Broadband performances POUT = 8W with 15
dB gain @ 500MHz
■
New leadless plastic package
■
EDS protection
■
Supplied in tape & reel of 3K units
■
In compliance with the 2002/93/EC european
directive
PowerFLAT™ (5x5)
Description
Pin connection
The PD54008L-E is a common source
N-Channel, enhancement-mode lateral FieldEffect RF power transistor. It is designed for high
gain, broad band commercial and industrial
applications. It operates at 7 V in common source
mode at frequencies of up to 1 GHz. PD54008L-E
boasts the excellent gain, linearity and reliability
of STH1LV latest LDMOS technology mounted in
the innovative leadless SMD plastic package,
PowerFLAT™.
PD54008L-E’s superior linearity performance
makes it an ideal solution for portable radio.
Top view
Order codes
Part Number
Marking
Package
Packaging
PD54008L-E
54008
PowerFLAT (5x5)
Tape & Reel
January 2007
Rev 2
1/15
www.st.com
15
PD54008L-E
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2
Impedances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1
Typical performance (Broadband) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Test circuit schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/15
PD54008L-E
Electrical data
1
Electrical data
1.1
Maximum ratings
Table 1.
Absolute maximum ratings (TCASE = 25°C)
Symbol
Value
Unit
V(BR)DSS
Drain source voltage
25
V
VGS
Gate-source voltage
-0.5 to +15
V
5
A
Power dissipation (tCASE = 70°C)
26.7
W
Maximum operating junction temperature
150
°C
-65 to +150
°C
Value
Unit
3
°C/W
ID
PDISS
TJ
TSTG
1.2
Parameter
Drain current
Storage temperature
Thermal data
Table 2.
Symbol
RthJC
Thermal data
Parameter
Junction to case thermal resistance
3/15
PD54008L-E
Electrical data
1.3
Electrical characteristics
Table 3.
Static (TCASE = 25°C)
Symbol
Test conditions
IDSS
VGS = 0V
IGSS
VGS = 5V
VGS(Q)
VDS = 10V
ID = 50mA
VDS(ON)
VGS = 10V
ID = 0.5A
CISS
VGS = 0V
VDS = 7.5V
COSS
VGS = 0V
CRSS
VGS = 0V
Table 4.
Typ
Max
Unit
1
µA
1
µA
5.0
V
VDS = 25V
VDS = 0V
2.0
0.09
V
f = 1MHz
80
pF
VDS = 7.5V
f = 1MHz
60
pF
VDS = 7.5V
f = 1MHz
6.6
pF
Dynamic
Symbol
Test conditions
Min.
Typ.
Max.
Unit
P1dB
VDD = 7.5 V
IDQ = 200 mA
f = 500MHz
8
W
GPS
VDD = 7.5 V
IDQ = 200 mA POUT = 8 W
f = 500MHz
15
dB
ηD
VDD = 7.5 V
IDQ = 200 mA POUT = 8 W
f = 500MHz
50
%
VDD = 7.5 V
IDQ = 200 mA POUT = 8W
f = 500MHz
20:1
VSW
R
Load
Mismatch
Table 5.
Table 6.
4/15
Min
All Phase Angles
ESD protection characteristics
Test conditions
Class
Human body model
2
Machine model
M3
Moisture sensitivity level
Test methodology
Rating
J-STD-020B
MSL 3
PD54008L-E
2
Impedances
Impedances
Impedance data schematic
Figure 1.
D
ZDL
Typical Input
Impedance
Typical Drain
Load Impedance
G
Zin
S
SC13140
Impedance data (1)
Table 7.
f
ZIN (Ω)
ZDL (Ω)
480MHz
1.12 - j 2.02
2.01 + j 0.13
500MHz
1.3 - j 2.01
1.84 + j 0.7
520MHz
1.66 - j 2.55
1.66 + j 1.51
1. In Broadband amplifier
5/15
PD54008L-E
Typical performance
3
Typical performance
Figure 2.
Power gain vs output power
Figure 3.
20
Efficiency vs output power
80
Idq = 200 mA
19
70
18
60
17
Idq = 150 mA
50
Idq = 100 mA
Nd (%)
Gp (dB)
16
15
40
14
30
13
20
12
f = 500 MHz
Vds = 7.5 V
11
Idq = 200 mA
f = 500 MHz
Vds = 7.5 V
10
10
0
0
1
Figure 4.
2
3
4
5
Pout (W)
6
7
8
9
10
Return loss vs output power
0
1
Figure 5.
0
2
3
4
5
Pout (W)
6
7
8
9
10
Capacitance vs supply voltage
1000
f = 1 MHz
-5
-15
-20
Coss
10
Crss
Idq = 200 mA
f = 500 MHz
Vds = 7.5 V
-25
-30
0
1
2
3
4
5
Pout (W)
6/15
Ciss
100
C (pF)
RL (dB)
-10
6
7
8
9
10
1
0
1
2
3
4
5
Vds (V)
6
7
8
9
PD54008L-E
3.1
Typical performance (Broadband)
Figure 6.
Power gain vs frequency
Figure 7.
14
70
12
60
10
50
8
40
Nd (%)
Gp (dB)
Typical performance
6
Efficiency vs frequency
30
20
4
10
2
Idq = 150 mA
Pin = 26 dBm
Idq = 150 mA
Pin = 26 dBm
0
470
480
490
500
510
520
530
480
490
500
510
520
530
f (MHz)
f (MHz)
Figure 8.
0
470
Return loss vs frequency
0
-4
RL (dB)
-8
-12
-16
Idq = 150 mA
Pin = 26 dBm
-20
470
480
490
500
510
520
530
f (MHz)
7/15
PD54008L-E
Test circuit schematic
4
Test circuit schematic
Figure 9.
Internal schematic
Table 8.
Test circuit component part list
Component
B1, B2
C1, C16
C2, C3, C4, C13,C14
Ferrite bead
300 pF, 100 mil ATC
1 -:- 20 pF Trimmer cap - JOHANSON
C15
0.8 -:- 10 pF Trimmer cap - JOHANSON
C5
36 pF, 100 mil ATC
C6
51 pF, 100 mil ATC
C7
62 pF, 100 mil ATC
C8, C17
C9
150 pF, 100 mil CHIP CAP
1 nF, 100 mil CHIP CAP
C10, C18
1000 pF, 100 mil CHIP CAP
C11, C19
0.1 nF, 100 mil CHIP CAP
C12, C20
10 µF 50 V Electrolytic Capacitor
C21
L
8/15
Description
15 pF, 100 mil ATC
43nH, Coilcraft
R1
33 KΩ, 1W CHIP Resistor
R3
1 KΩ, 1W CHIP Resistor
R4
15 Ω, 1W CHIP Resistor
Z1
0.49" X 0.080" MICROSTRIP
Z2
1.024" X 0.080" MICROSTRIP
Z3
0.079" X 0.080" MICROSTRIP
Z4
0.24" X 0.223"
Z5
0.079" X 0.223" MICROSTRIP
MICROSTRIP
PD54008L-E
Table 8.
Test circuit schematic
Test circuit component part list
Z6
0.138" X 0.223" MICROSTRIP
Z7
0.259" X 0.223" MICROSTRIP
Z8
0.079" X 0.080" MICROSTRIP
Z9
0.413" X 0.080" MICROSTRIP
Z10
0.756" X 0.080" MICROSTRIP
Z11
0.61" X 0.080" MICROSTRIP
N1, N2
Type N Flange Mount
Board
ROGER, ULTRA LAM 2000 THK 0.030", εr = 2.55 2oz. ED cu SIDES
9/15
Package mechanical data
5
PD54008L-E
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
10/15
PD54008L-E
Table 9.
Package mechanical data
PowerFLAT™ mechanical data
mm
inch
Dim.
Min.
Typ.
Max.
A
0.90
A1
0.02
A3
0.24
Min.
Typ.
Max.
1.00
0.035
0.039
0.05
0.001
0.002
0.009
AA
0.15
0.25
0.35
0.006
0.01
0.014
b
0.43
0.51
0.58
0.017
0.020
0.023
c
0.64
0.71
0.79
0.025
0.028
0.031
D
5.00
0.197
d
0.30
0.011
E
5.00
0.197
E2
2.49
2.57
2.64
0.098
0.101
e
1.27
0.050
f
3.37
0.132
g
0.74
0.03
h
0.21
0.008
0.104
Figure 10. PowerFLAT™ package dimensions
11/15
PD54008L-E
Package mechanical data
Table 10.
PowerFLAT™ tape & reel dimensions
mm.
DIM.
Min.
Typ
Max.
Ao
5.15
5.25
5.35
Bo
5.15
5.25
5.35
Ko
1.0
1.1
1.2
Figure 11. PowerFLAT™ tape & reel
12/15
PD54008L-E
Table 11.
Package mechanical data
Recommended footprint
13/15
PD54008L-E
Revision history
6
Revision history
Table 12.
14/15
Revision history
Date
Revision
Changes
19-Jan-2006
1
First Issue
23-Jan-2007
2
Document has been reformatted
PD54008L-E
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