STMICROELECTRONICS STPS10L60C

STPS10L60C
Power Schottky rectifier
Main product characteristics
A1
IF(AV)
2x5A
VRRM
60 V
Tj (max)
150° C
VF (max)
0.52 V
K
A2
K
Features and benefits
A2
●
Low forward voltage drop
●
Negligible switching losses
●
Insulated package: TO-220FPAB
Insulating voltage = 2000 V DC
Capacitance = 12 pF
●
Avalanche capability specified
K
A1
TO-220FPAB
STPS10L60CFP
A2
A1
D2PAK
STPS10L60CG
Description
Dual center tap Schottky rectifier suited for switch
mode power supplies and high frequency DC to
DC converters.
Packaged in TO-220FPAB and D2PAK, this device
is intended for use in high frequency inverters.
March 2007
Rev 4
1/8
www.st.com
8
Characteristics
1
STPS10L60C
Characteristics
Symbol
Parameter
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
RMS forward current
30
A
5
10
A
180
A
1
A
4000
W
-65 to +
175
°C
150
°C
10000
V/µs
TO220FPAB
TC = 130° C
δ = 0.5
Per diode
Per device
IF(AV)
Average forward
current
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
IRRM
Repetitive peak reverse current
tp = 2 µs square F=1 kHz
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25° C
Tstg
Storage temperature range
Maximum operating junction temperature(1)
Tj
dV/dt
1.
Value
dPtot
--------------dTj
Critical rate of rise reverse voltage
<
1
-------------------------Rth ( j – a )
Table 1.
thermal runaway condition for a diode on its own heatsink
Thermal resistance
Symbol
Rth (j-c)
Parameter
Junction to case
TO-220FPAB
Rth (c)
Value
Unit
Per diode
Total
4.5
3.5
° C/W
Coupling
2.5
° C/W
When the diodes 1 and 2 are used simultaneously :
ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 2.
Symbol
IR (1)
Static electrical characteristics (per diode)
Parameter
Reverse leakage current
Tests Conditions
Tj = 25° C
VR = VRRM
Tj = 125° C
VF (1)
Forward voltage drop
Tj = 25° C
IF = 5 A
Tj = 125° C
IF = 5 A
Tj = 25° C
IF = 10 A
Tj = 125° C
IF = 10 A
1. Pulse test : tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.44 x IF(AV) + 0.0091x IF2(RMS)
2/8
Min.
Typ.
45
Max.
Unit
220
µA
60
mA
0.55
0.43
0.52
V
0.67
0.55
0.64
STPS10L60C
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
(per diode)
PF(AV)(W)
Average forward current versus
ambient temperature (δ = 0.5)
(per diode)
IF(AV)(A)
3.5
δ = 0.05
3.0
δ = 0.1
6
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-c)
5
2.5
4
δ=1
Rth(j-a)=15°C/W
2.0
3
1.5
2
1.0
T
T
1
0.5
δ=tp/T
IF(AV)(A)
δ=tp/T
tp
Tamb(°C)
tp
0
0.0
0.0
0.5
1.0
1.5
Figure 3.
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(1µs)
50
75
100
125
150
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1
1.2
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
Figure 5.
1
0
10
100
25
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values, per diode)
(TO-220FPAB)
Figure 6.
50
75
100
125
150
Relative variation of thermal
transient impedance junction to
case versus pulse duration
(TO-220FPAB)
Zth(j-c)/Rth(j-c)
IM(A)
1.0
90
80
0.8
70
60
0.6
50
TC=25°C
40
TC=75°C
0.4
30
20
10
0
1E-3
δ = 0.5
δ = 0.2
TC=125°C
IM
t
0.2
t(s)
δ=0.5
0.0
1E-2
1E-1
1E+0
1E-3
T
δ = 0.1
tp(s)
Single pulse
1E-2
1E-1
δ=tp/T
1E+0
tp
1E+1
3/8
Characteristics
Figure 7.
STPS10L60C
Figure 8.
Relative variation of thermal
transient impedance junction to
case versus pulse duration
(D2PAK)
Zth(j-c)/Rth(j-c)
Reverse leakage current versus
reverse voltage applied (typical
values, per diode)
IR(mA)
1.0
3E+2
0.9
1E+2
Tj=150°C
Tj=125°C
0.8
1E+1
0.7
Tj=100°C
0.6
Tj=75°C
1E+0
0.5
Tj=50°C
0.4
1E-1
0.3
Single pulse
Tj=25°C
0.2
1E-2
0.1
VR(V)
tp(s)
1E-3
0.0
1.E-03
1.E-02
Figure 9.
1.E-01
0
1.E+00
Junction capacitance versus
reverse voltage applied (typical
values, per diode)
5
10
15
20
25
30
40
45
50
55
60
Figure 10. Forward voltage drop versus
forward current (maximum values,
per diode)
C(pF)
IFM(A)
1000
100.0
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj=150°C
(typical values)
Tj=25°C
Tj=125°C
500
10.0
1.0
200
VFM(V)
VR(V)
100
1
10
100
Figure 11. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, copper thickness:
35 µm) ( D2PAK)
Rth(j-a)(°C/W)
80
70
60
50
40
30
20
10
S(Cu)(cm²)
0
0
4/8
35
5
10
15
20
25
30
35
40
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
STPS10L60C
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.55 Nm
●
Maximum torque value: 0.70 Nm
Table 3.
TO-220FPAB dimensions
Dimensions
REF.
A
H2
Dia
C
L5
L7
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
B
2.50
2.70
0.098
0.106
D
2.50
2.75
0.098
0.108
E
0.45
0.70
0.018
0.027
F
0.75
1.00
0.030
0.039
F1
1.15
1.70
0.045
0.067
F2
1.15
1.70
0.045
0.067
G
4.95
5.20
0.195
0.205
G1
2.40
2.70
0.094
0.106
H
10.00
10.40
0.393
0.409
L6
L2
F2
F1
D
L9
L4
F
L2
M
G1
E
G
16.00 Typ.
0.630 Typ.
L3
28.60
30.60
1.126
1.205
L4
9.80
10.60
0.386
0.417
L5
2.9
3.6
0.114
0.142
L6
15.90
16.40
0.626
0.646
L7
9.00
9.30
0.354
0.366
Diam
3.00
3.20
0.118
0.126
5/8
Package information
Table 4.
STPS10L60C
D2PAK dimensions
Dimensions
Ref
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A
E
C2
L2
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
V2
0.40 typ.
0°
8°
0.016 typ.
0°
8°
Figure 12. Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
8.90
3.70
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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STPS10L60C
3
Ordering information
Ordering information
Type
Marking
Package
Weight
Base qty
Delivery
mode
STPS10L60CFP
STPS10L60CFP
TO-220FPAB
STPS10L60CG
STPS10L60CG-TR
4
STPS10L60CG
STPS10L60CG
2g
50
Tube
2
1.48 g
50
Tube
2
1.48 g
1000
Tape and reel
D PAK
D PAK
Revision history
Date
Revision
Jul-2003
3C
26-Mar-2007
4
Description of Changes
Last release.
Removed ISOWATT package.
Added D2PAK package.
7/8
STPS10L60C
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