STMICROELECTRONICS STPS41L60C

STPS41L60C
Power Schottky rectifier
Main product characteristics
IF(AV)
2 x 20 A
VRRM
60 V
Tj (max)
150° C
VF (max)
0.58 V
A1
K
A2
K
K
Features and benefits
■
Low forward voltage drop
■
Negligible switching losses
■
Low thermal resistance
■
Avalanche capability specified
A2
A1
K
A1
I2PAK
TO-220AB
STPS41L60CR
STPS41L60CT
Description
A2
Packaged in D2PAK, I2PAK and TO-220AB, this
device is intended for use in low voltage, high
A1
D2PAK
frequency inverters, free-wheeling and polarity
protection applications.
STPS41L60CG
Absolute ratings (limiting values, per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
RMS forward current
30
A
20
40
A
IF(AV)
Average forward current
TC = 125° C
δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
220
A
PARM
Repetitive peak avalanche power
tp = 1 µs Tj = 25° C
9500
W
-65 to + 175
°C
150
°C
Tstg
dPtot
--------------dTj
Per diode
Per device
Storage temperature range
Maximum operating junction temperature
Tj
1.
A2
K
Dual center tap Schottky rectifiers suited for
switch mode power supplies and high frequency
DC to DC converters.
Table 1.
K
<
May 2007
1
-------------------------Rth ( j – a )
(1)
condition to avoid thermal runaway for a diode on its own heatsink
Rev 5
1/8
www.st.com
8
Characteristics
STPS41L60C
1
Characteristics
Table 2.
Thermal resistances
Symbol
Parameter
Rth (j-c)
Junction to case
Rth (c)
Coupling
Value
Unit
1.5
0.8
° C/W
Per diode
Total
0.1
When the diodes 1 and 2 are used simultaneously :
ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 3.
Static electrical characteristics (per diode)
Symbol
IR (1)
Parameter
Tests Conditions
Reverse leakage current
Tj = 25° C
Min.
Typ.
VR = VRRM
VF (1)
Forward voltage drop
IF = 20 A
Tj = 125° C
IF = 20 A
Tj = 25° C
IF = 40A
Tj = 125° C
IF = 40A
Unit
600
µA
175
mA
100
Tj = 125° C
Tj = 25° C
Max.
0.60
0.50
0.58
V
0.77
0.67
0.71
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.42 x IF(AV) + 0.007 x IF2(RMS)
Figure 1.
Conduction losses versus
average current
Figure 2.
PF(av)(W)
16
IF(av)(A)
22
δ=0.5
δ=1
18
δ=0.2
16
δ=0.1
10
Rth(j-a)=Rth(j-c)
20
14
12
Average forward current versus
ambient temperature (δ = 0.5)
14
δ=0.05
12
8
10
T
6
8
Rth(j-a)=50 °C/W
6
T
4
δ=tp/T
tp
4
2
IF(av)(A)
δ=tp/T
2
tp
0
0
2/8
Tamb(°C)
0
5
10
15
20
25
0
25
50
75
100
125
150
STPS41L60C
Figure 3.
Characteristics
Normalized avalanche power
derating versus pulse duration
Figure 4.
PARM(tp)
PARM(1µs)
1.2
1
Normalized avalanche power
derating versus junction
temperature
PARM(tp)
PARM(25°C)
1
0.8
0.1
0.6
0.4
0.01
0.2
0.001
0.01
0.1
Figure 5.
250
Tj(°C)
tp(µs)
1
0
10
100
0
1000
Non repetitive surge peak forward
current versus overload duration
(maximum values)
IM(A)
25
Figure 6.
1.0
50
75
100
125
150
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
Single pulse
225
0.9
200
0.8
175
0.7
150
0.6
Tc=25 °C
125
0.5
Tc=75 °C
100
0.4
75
0.3
0.2
IM
25
0.1
t
t(s)
δ =0.5
0
1.E-03
δ=tp/T
tp(s)
tp
0.0
1.E-02
Figure 7.
1.E+03
T
Tc=125 °C
50
1.E-01
1.E+00
Reverse leakage current versus
reverse voltage applied
(typical values)
1.E-03
Figure 8.
IR(mA)
1.E-02
1.E-01
1.E+00
Junction capacitance versus
reverse voltage applied
(typical values)
C(nF)
10.0
Tj=150°C
1.E+02
F=1 MHz
VOSC= 30 mV
Tj=25 °C
Tj=125°C
Tj=100°C
1.E+01
Tj=75°C
1.E+00
1.0
Tj=50°C
Tj=25°C
1.E-01
VR(V)
VR(V)
1.E-02
0.1
0
5
10
15
20
25
30
35
40
45
50
55
60
1
10
100
3/8
Package information
Figure 9.
100
STPS41L60C
Forward voltage drop versus
forward current
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (epoxy printed board
FR4, Cu = 35 µm)
(STPS41L60CG only)
IFM(A)
80
Rth(j-a)(°C/W)
70
Tj=125 °C
(Maximum values)
60
Tj=125 °C
(Typical values)
50
10
40
Tj=25 °C
(Maximum values)
30
20
10
S(cm²)
VFM(V)
0
1
0.0
0.2
2
0.4
0.6
0.8
1.0
1.2
0
5
10
15
20
25
30
35
40
Package information
●
Epoxy meets UL94,V0
●
Cooling method: by conduction (C)
●
Recommended torque value: 0.8 Nm
●
Maximum torque value: 1.0 Nm
Figure 11. Package dimensions I2PAK
DIMENSIONS
REF.
A
E
c2
L2
D
L1
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
b
0.70
0.93
0.028
0.037
b1
1.14
1.17
0.044
0.046
b2
1.14
1.17
0.044
0.046
c
0.45
0.60
0.018
0.024
c2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
e
2.40
2.70
0.094
0.106
b1
E
10.0
10.4
0.394
0.409
L
13.1
13.6
0.516
0.535
L1
3.48
3.78
0.137
0.149
L2
1.27
1.40
0.050
0.055
L
b
4/8
Inches
b2
A1
e
Millimeters
c
STPS41L60C
Package information
Figure 12. Package dimensions D2PAK
DIMENSIONS
REF.
A
E
C2
L2
D
L
L3
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
V2
0.40 typ.
0°
0.016 typ.
8°
0°
8°
Figure 13. Footprint
16.90
10.30
5.08
1.30
3.70
8.90
5/8
Package information
STPS41L60C
Figure 14. Package dimensions TO-220AB
DIMENSIONS
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
F
M
G1
E
G
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
L2
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam.
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6/8
STPS41L60C
3
Ordering information
Ordering information
Type
Marking
Package
Weight
Base qty
Delivery
mode
STPS41L60CG
STPS41L60CG
D2PAK
1.48 g
50
Tube
D2
1.48 g
1000
Tape and reel
STPS41L60CG-TR STPS41L60CG
4
PAK
STPS41L60CT
STPS41L60CT
TO-220AB
2.20 g
50
Tube
STPS41L60CR
STPS41L60CR
I2PAK
1.49 g
50
Tube
Revision history
Date
Revision
Description of Changes
July 2003
3A
10-Jan-2007
4
Reformated to current standards. Added ECOPACK statement
Removed IRRM and dV/dT from the Absolute ratings table on page 1.
Updated reverse leakage current values in Table 3 and Figure 7.
28-May-2007
5
Updated figures 1, 2, and 5 to 10.
Previous issue
7/8
STPS41L60C
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
8/8