TPS63030
TPS63031
www.ti.com .............................................................................................................................................................................................. SLVS696 – OCTOBER 2008
HIGH EFFICIENCY SINGLE INDUCTOR BUCK-BOOST CONVERTER WITH 1-A SWITCHES
FEATURES
APPLICATIONS
• Up to 96% Efficiency
• 800-mA Output Current at 3.3V in Step Down
Mode (VIN = 3.6V to 5.5V)
• Up to 500-mA Output Current at 3.3V in Boost
Mode (VIN > 2.4V)
• Automatic Transition Between Step Down and
Boost Mode
• Device Quiescent Current less than 50µA
• Input Voltage Range: 1.8V to 5.5V
• Fixed and Adjustable Output Voltage Options
from 1.2V to 5.5V
• Power Save Mode for Improved Efficiency at
Low Output Power
• Forced Fixed Frequency Operation and
Synchronization Possible
• Load Disconnect During Shutdown
• Over-Temperature Protection
• Available in Small 2,5-mm × 2,5-mm, QFN-10
Package
•
1
2
•
•
•
•
•
All Two-Cell and Three-Cell Alkaline, NiCd or
NiMH or Single-Cell Li Battery Powered
Products
Portable Audio Players
PDAs
Cellular Phones
Personal Medical Products
White LEDs
DESCRIPTION
The TPS6303x devices provide a power supply
solution for products powered by either a two-cell or
three-cell alkaline, NiCd or NiMH battery, or a
one-cell Li-Ion or Li-polymer battery. Output currents
can go as high as 600 mA while using a single-cell
Li-Ion or Li-Polymer Battery, and discharge it down to
2.5V or lower. The buck-boost converter is based on
a fixed frequency, pulse-width-modulation (PWM)
controller using synchronous rectification to obtain
maximum efficiency. At low load currents, the
converter enters Power Save mode to maintain high
efficiency over a wide load current range. The Power
Save mode can be disabled, forcing the converter to
operate at a fixed switching frequency. The maximum
average current in the switches is limited to a typical
value of 1000 mA. The output voltage is
programmable using an external resistor divider, or is
fixed internally on the chip. The converter can be
disabled to minimize battery drain. During shutdown,
the load is disconnected from the battery. The device
is packaged in a 10-pin QFN PowerPAD™ package
measuring 2.5 mm × 2.5 mm (DSK).
L1
1.5 µH
L1
VIN
1.8 V to
5.5 V
L2
VIN
C1
4.7 µF
VOUT
VINA
EN
FB
C2
10 µF
VOUT
3.3 V up to
800 mA
PS/SYNC
GND
PGND
TPS63031
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPS63030
TPS63031
SLVS696 – OCTOBER 2008 .............................................................................................................................................................................................. www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OUTPUT VOLTAGE OPTIONS (1)
TA
OUTPUT VOLTAGE
DC/DC
PACKAGE MARKING
Adjustable
CEE
3.3 V
CEF
–40°C to 85°C
(1)
(2)
PART NUMBER (2)
PACKAGE
TPS63030DSK
10-Pin QFN
TPS63031DSK
Contact the factory to check availability of other fixed output voltage versions.
The DSK package is available taped and reeled. Add R suffix to device type (e.g., TPS63030DSKR) to order quantities of 3000 devices
per reel. Add T suffix to device type (e.g., TPS63030DSKT) to order quantities of 250 devices per reel.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
TPS6300x
Input voltage range on VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB
–0.3 V to 7 V
Operating virtual junction temperature range, TJ
–40°C to 150°C
Storage temperature range Tstg
–65°C to 150°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
DISSIPATION RATINGS TABLE
PACKAGE
THERMAL
RESISTANCE
ΘJA (1)
THERMAL
RESISTANCE
ΘJP
THERMAL
RESISTANCE
ΘJC
POWER RATING
TA≤ 25°C (1)
DERATING FACTOR
ABOVE
TA = 25°C (1)
DSK
60.6°C/W
6.3°C/W
40°C/W
1650 mW
17 mW/°C
(1)
Thermal ratings are determined assuming a high K PCB design according to JEDEC standard JESD51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX UNIT
Supply voltage at VIN, VINA
1.8
5.5
V
Operating free air temperature range, TA
–40
85
°C
Operating virtual junction temperature range, TJ
–40
125
°C
2
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ELECTRICAL CHARACTERISTICS
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
DC/DC STAGE
PARAMETER
VI
Input voltage range
VI
Minimum input voltage for startup
VI
VO
TEST CONDITIONS
MIN
0°C ≤ TA ≤ 85°C
Iq
IS
V
1.9
V
Minimum input voltage for startup
1.6
1.8
2.0
V
TPS63030 output voltage range
1.2
5.5
V
30%
TPS63030 feedback voltage
PS/SYNC = VIN
Oscillator frequency
Frequency range for synchronization
ISW
UNIT
5.5
1.8
TPS63031 output voltage
f
MAX
1.6
Minimum duty cycle in step down conversion
VFB
TYP
1.8
40%
495
500
505
3.267
3.3
3.333
mV
V
2200
2400
2600
kHz
2200
2400
2600
kHz
900
1000
1100
Average switch current limit
VIN = VINA = 3.6 V, TA = 25°C
High side switch on resistance
VIN = VINA = 3.6 V
200
mΩ
Low side switch on resistance
VIN = VINA = 3.6 V
200
mΩ
Maximum line regulation
0.5%
Maximum load regulation
0.5%
Quiescent
current
VIN and VINA
VOUT
IO = 0 mA, VEN = VIN = VINA = 3.6 V,
VOUT = 3.3 V
TPS63031 FB input impedance
VEN = HIGH
Shutdown current
VEN = 0 V, VIN = VINA = 3.6 V
25
35
4
6
1
mA
µA
µA
MΩ
0.1
0.9
µA
1.5
1.6
V
0.4
V
CONTROL STAGE
VUVLO
Under voltage lockout threshold
VIL
EN, PS/SYNC input low voltage
VIH
EN, PS/SYNC input high voltage
EN, PS/SYNC input current
VINA voltage decreasing
1.4
1.2
Clamped on GND or VINA
V
0.01
0.1
µA
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
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TPS63031
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PIN ASSIGNMENTS
DSK PACKAGE
(TOP VIEW)
VOUT
L2
PGND
L1
VIN
FB
GND
VINA
PS/SYNC
EN
Terminal Functions
TERMINAL
NAME
NO.
I/O
DESCRIPTION
EN
6
I
Enable input. (1 enabled, 0 disabled)
FB
10
I
Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions
GND
9
PS/SYNC
7
I
Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization)
L1
4
I
Connection for Inductor
L2
2
I
Connection for Inductor
PGND
3
VIN
5
I
Supply voltage for power stage
VOUT
1
O
Buck-boost converter output
VINA
8
I
Supply voltage for control stage
PowerPAD™
4
Control / logic ground
Power ground
Must be soldered to achieve appropriate power dissipation. Should be connected to PGND.
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TPS63031
www.ti.com .............................................................................................................................................................................................. SLVS696 – OCTOBER 2008
FUNCTIONAL BLOCK DIAGRAM (TPS63030)
L1
L2
VIN
VOUT
Current
Sensor
VINA
VBAT
VOUT
PGND PGND
Gate
Control
_
VINA
Modulator
+
_
+
FB
VREF
Oscillator
PS/SYNC
+
-
Device
Control
EN
Temperature
Control
PGND
PGND
GND
FUNCTIONAL BLOCK DIAGRAM (TPS63031)
L1
L2
VIN
VOUT
Current
Sensor
VINA
VBAT
VOUT
VINA
PGND PGND
Gate
Control
FB
_
Modulator
+
+
_
Oscillator
PS/SYNC
VREF
Device
Control
EN
+
-
Temperature
Control
PGND
PGND
GND
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TYPICAL CHARACTERISTICS
TABLE OF GRAPHS
DESCRIPTION
FIGURE
Maximum output current
Efficiency
Output voltage
Waveforms
vs Input voltage (TPS63030, VOUT = 2.5 V / VOUT = 4.5 V)
1
vs Input voltage (TPS63031, VOUT = 3.3V)
2
vs Output current (TPS63030, Power Save Enabled, VOUT = 2.5 V / VOUT = 4.5 V)
3
vs Output current (TPS63030, Power Save Disabled, VOUT = 2.5V / VOUT = 4.5V)
4
vs Output current (TPS63031, Power Save Enabled, VOUT = 3.3V)
5
vs Output current (TPS63031, Power Save Disabled, VOUT = 3.3V)
6
vs Input voltage (TPS63030, Power Save Enabled, VOUT = 2.5V, IOUT = {10; 100;
500 mA})
7
vs Input voltage (TPS63030, Power Save Enabled, VOUT = 4.5V, IOUT = {10; 100;
500 mA})
8
vs Input voltage (TPS63030, Power Save Disabled, VOUT = 2.5V, IOUT = {10; 100;
500 mA})
9
vs Input voltage (TPS63030, Power Save Disabled, VOUT = 4.5V, IOUT = {10; 100;
500 mA})
10
vs Input voltage (TPS63031, Power Save Enabled, VOUT = 3.3V, IOUT = {10; 100;
500 mA})
11
vs Input voltage (TPS63031, Power Save Disabled, VOUT = 3.3V, IOUT = {10; 100;
500 mA})
12
vs Output current (TPS63030, VOUT = 2.5 V)
13
vs Output current (TPS63030, VOUT = 4.5 V)
14
vs Output current (TPS63031, VOUT = 3.3V)
15
Load transient response (TPS63031, VIN < VOUT, Load change from 40% to 60% of
max)
16
Load transient response (TPS63031, VIN > VOUT, Load change from 40% to 60% of
max)
17
Line transient response (TPS63031, VOUT = 3.3V, Iout = 300 mA)
18
Startup after enable (TPS63031, VOUT = 3.3V, VIN = 2.4V, Iout = 300mA)
19
Startup after enable (TPS63031, VOUT = 3.3V, VIN = 4.2V, Iout = 300mA)
20
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
MAXIMUM OUTPUT CURRENT
vs
INPUT VOLTAGE
1200
1100
TPS63030
1000
TPS63031
VO = 2.5 V
1000
Maximum Output Current - mA
Maximum Output Current - mA
900
800
700
VO = 4.5 V
600
500
400
300
200
VO = 3.3 V
800
600
400
200
100
0
1.8
2.2
2.6
3
3.4 3.8 4.2 4.6
VI - Input Voltage - V
5
5.4
0
1.8 2.2
Figure 1.
6
2.6
3
3.4 3.8 4.2 4.6
VI - Input Voltage - V
5
5.4
Figure 2.
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www.ti.com .............................................................................................................................................................................................. SLVS696 – OCTOBER 2008
EFFICIENCY
vs
OUTPUT CURRENT
EFFICIENCY
vs
OUTPUT CURRENT
100
100
80
80
70
70
60
VI = 2.4 V, VO = 4.5 V
VI = 3.6 V, VO = 4.5 V
50
VI = 2.4 V, VO = 2.5 V
40
60
40
30
20
20
TPS63030
Power Save Enabled
100
1
10
100
IO - Output Current - mA
0
0.1
1000
1000
10
100
IO - Output Current - mA
Figure 4.
EFFICIENCY
vs
OUTPUT CURRENT
EFFICIENCY
vs
OUTPUT CURRENT
100
VI = 3.6 V, VO = 3.3 V
80
80
Efficiency - %
50
40
60
40
30
20
20
TPS63031
Power Save Enabled
VI = 2.4 V, VO = 3.3 V
50
30
100
1
10
IO - Output Current - mA
VI = 3.6 V, VO = 3.3 V
70
VI = 2.4 V, VO = 3.3 V
60
0
0.1
1
Figure 3.
90
10
TPS63030
Power Save Disabled
10
90
70
VI = 2.4 V, VO = 4.5 V
50
30
0
0.1
VI = 3.6 V, VO = 2.5 V
VI = 2.4 V, VO = 2.5 V
VI = 3.6 V, VO = 4.5 V
10
Efficiency - %
90
Efficiency - %
Efficiency - %
90
VI = 3.6 V, VO = 2.5 V
TPS63031
Power Save Disabled
10
1000
0
0.1
Figure 5.
1
10
100
IO - Output Current - mA
1000
Figure 6.
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TPS63031
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EFFICIENCY
vs
INPUT VOLTAGE
100
100
IO = 100 mA
VO = 2.5 V
VO = 4.5 V
90
90
80
80
IO = 10 mA
70
IO = 500 mA
60
50
40
20
100
2.2
2.6
3
3.4 3.8 4.2 4.6
VI - Input Voltage - V
5
0
1.8
5.4
2.2
2.6
Figure 8.
EFFICIENCY
vs
INPUT VOLTAGE
EFFICIENCY
vs
INPUT VOLTAGE
VO = 2.5 V
100
IO = 100 mA
VO = 4.5 V
5
5.4
IO = 100 mA
90
80
IO = 500 mA
70
Efficiency - %
70
60
50
IO = 10 mA
40
60
IO = 10 mA
40
30
20
20
TPS63030
Power Save Disabled
2.2
2.6
3 3.4 3.8 4.2 4.6
VI - Input Voltage - V
5
IO = 500 mA
50
30
10
TPS63030
Power Save Disabled
10
5.4
0
1.8
2.2
2.6
Figure 9.
8
3 3.4 3.8 4.2 4.6
VI - Input Voltage - V
Figure 7.
80
0
1.8
TPS63030
Power Save Enabled
10
90
Efficiency - %
40
20
TPS63030
Power Save Enabled
IO = 500 mA
50
30
0
1.8
IO = 10 mA
60
30
10
IO = 100 mA
70
Efficiency - %
Efficiency - %
EFFICIENCY
vs
INPUT VOLTAGE
3 3.4 3.8 4.2 4.6
VI - Input Voltage - V
5
5.4
Figure 10.
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EFFICIENCY
vs
INPUT VOLTAGE
100
100
IO = 100 mA
VO = 3.3 V
90
90
80
80
IO = 500 mA
70
IO = 10 mA
60
50
40
40
20
TPS63031
Power Save Enabled
2.575
2.6
3 3.4 3.8 4.2 4.6
VI - Input Voltage - V
5
TPS63031
Power Save Disabled
10
0
1.8
5.4
2.2
2.6
3 3.4 3.8 4.2 4.6
VI - Input Voltage - V
Figure 11.
Figure 12.
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
5
5.4
4.635
VO = 2.5 V
VO = 4.5 V
4.59
VO - Output Voltage - V
2.55
VO - Output Voltage - V
IO = 10 mA
20
2.2
IO = 500 mA
50
30
0
1.8
IO = 100 mA
60
30
10
VO = 3.3 V
70
Efficiency - %
Efficiency - %
EFFICIENCY
vs
INPUT VOLTAGE
2.525
VI = 3.6 V
2.5
2.475
2.45
4.545
VI = 3.6 V
4.5
4.455
4.41
TPS63031
Power Save Disabled
TPS63031
Power Save Disabled
4.365
2.425
1
10
100
IO - Output Current - mA
1000
1
Figure 13.
10
100
IO - Output Current - mA
1000
Figure 14.
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OUTPUT VOLTAGE
vs
OUTPUT CURRENT
LOAD TRANSIENT RESPONSE
3.399
VI = 2.4 V, IL = 175 mA to 265 mA
VO = 3.3 V
Output Voltage
50 mV/div, AC
VO - Output Voltage - V
3.366
VI = 3.6 V
3.333
3.3
Output Current
50 mA/div
3.267
3.234
TPS63031, VO = 3.3 V
TPS63031
Power Save Disabled
3.201
1
10
100
IO - Output Current - mA
Time - 1 ms/div
1000
Figure 15.
Figure 16.
LOAD TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
VI = 4.2 V, IL = 340 mA to 500 mA
VI = 3 V to 3.6 V, IL = 300 mA
Output Voltage
50 mV/div, AC
Input Voltage
500 mV/div, AC
Output Current
100 mA/div
Output Voltage
20 mV/div, AC
TPS63031, VO = 3.3 V
TPS63031, VO = 3.3 V
Time 1 ms/div
Time 2 ms/Div
Figure 18.
Figure 17.
10
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STARTUP AFTER ENABLE
Enable
5 V/div, DC
STARTUP AFTER ENABLE
Enable
5 V/div, DC
Output Voltage
1 V/div, DC
Output Voltage
1 V/div, DC
Inductor Current
200 mA/div, DC
Inductor Current
Voltage at L1 200 mA/div, DC
5 V/div, DC
Voltage at L2
5 V/div, DC
TPS63031, VO = 3.3 V
TPS63031, VO = 3.3 V
VI = 2.4 V, RL = 11 W
VI = 4.2 V, RL = 11 W
Time 100 ms/div
Time 200ms/div
Figure 19.
Figure 20.
PARAMETER MEASUREMENT INFORMATION
L1
L1
VIN
L2
VIN
VINA
C1
C3
R1
EN
C2
FB
PS/SYNC
GND
VOUT
VOUT
R2
PGND
TPS6303X
List of Components
REFERENCE
DESCRIPTION
MANUFACTURER
TPS6303 0 / 1
Texas Instruments
L1
1.5 µH, 3 mm x 3 mm x 1.5 mm
LPS3015-1R5, Coilcraft
C1
10 µF 6.3V, 0603, X7R ceramic
GRM188R60J106KME84D, Murata
C2
2 × 10 µF 6.3V, 0603, X7R ceramic
GRM188R60J106KME84D, Murata
C3
0.1 µF, X7R ceramic
R1, R2
Depending on the output voltage at TPS63030, not used at TPS63031
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DETAILED DESCRIPTION
CONTROLLER CIRCUIT
The controlling circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses
input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can
change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier
gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be
connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the
voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be
compared with the internal reference voltage to generate a stable and accurate output voltage.
The controller circuit also senses the average input current as well as the peak input current. With this, maximum
input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under
all possible conditions. To finally protect the device from overheating, an internal temperature sensor is
implemented.
Synchronous Operation
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range.
To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and
PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter.
Buck-Boost Operation
To be able to regulate the output voltage properly at all possible input voltage conditions, the device
automatically switches from step down operation to boost operation and back as required by the configuration. It
always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off.
Therefore, it operates as a step down converter (buck) when the input voltage is higher than the output voltage,
and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation
in which all 4 switches are permanently switching. Controlling the switches this way allows the converter to
maintain high efficiency at the most important point of operation; when input voltage is close to the output
voltage. The RMS current through the switches and the inductor is kept at a minimum, to minimize switching and
conduction losses. Switching losses are also kept low by using only one active and one passive switch.
Regarding the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus
causing no switching losses.
Power Save Mode and Synchronization
The PS/SYNC pin can be used to select different operation modes. To enable power save, PS/SYNC must be
set low. Power save mode is used to improve efficiency at light load. If power save mode is enabled, the
converter stops operating if the average inductor current gets lower than about 100 mA and the output voltage is
at or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up the
output voltage again by starting operation using a programmed average inductor current higher than required by
the current load condition. Operation can last for one or several pulses. The converter again stops operating
once the conditions for stopping operation are met again.
The power save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at
PS/SYNC forces the device to synchronize to the connected clock frequency. Synchronization is done by a PLL,
so synchronizing to lower and higher frequencies compared to the internal clock works without any issues. The
PLL can also tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports
standard logic thresholds.
12
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Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This also means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high
peak currents flowing from the input.
Softstart and Short Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus the output voltage overshoot at startup, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output.
When the output voltage does not increase above 1.2 V, the device assumes a short circuit at the output and
keeps the current limit low to protect itself and the application. At a short at the output during operation the
current limit also will be decreased accordingly. At 0 V at the output, for example, the output current will not
exceed about 400 mA.
Undervoltage Lockout
An undervoltage lockout function prevents device start-up if the supply voltage on VINA is lower than
approximately its threshold (see electrical characteristics table). When in operation, the device automatically
enters the shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device
automatically restarts if the input voltage recovers to the minimum operating input voltage.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see electrical characteristics table) the device stops operating. As soon as
the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
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APPLICATION INFORMATION
DESIGN PROCEDURE
The TPS6303x dc/dc converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with a
typical voltage between 2.3 V and 4.5 V. They can also be used in systems powered by a double or triple cell
Alkaline, NiCd, or NiMH battery with a typical terminal voltage between 1.8 V and 5.5 V . Additionally, any other
voltage source with a typical output voltage between 1.8 V and 5.5 V can power systems where the TPS6303x is
used.
PROGRAMMING THE OUTPUT VOLTAGE
Within the TPS6303X family there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider is
used to adjust the output voltage. The resistor divider must be connected between VOUT, FB and GND. When
the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500mV. The maximum
recommended value for the output voltage is 5.5V. The current through the resistive divider should be about 100
times greater than the current into the FB pin. The typical current into the FB pin is 0.01 µA, and the voltage
across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended
value for R2 should be lower than 500kΩ, in order to set the divider current at 1µA or higher. It is recommended
to keep the value for this resistor in the range of 200kΩ. From that, the value of the resistor connected between
VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 1:
R 1 + R2
ǒ
VOUT
V FB
Ǔ
*1
(1)
L1
L1
VIN
L2
VIN
VINA
C1
C3
R1
EN
C2
FB
PS/SYNC
GND
VOUT
VOUT
R2
PGND
TPS6303X
Figure 21. Typical Application Circuit for Adjustable Output Voltage Option
INDUCTOR SELECTION
To properly configure the TPS6303X devices, an inductor must be connected between pin L1 and pin L2. To
estimate the inductance value Equation 2 and Equation 3 can be used.
μs
L1 = (VIN1 - VOUT ) × 0.5 ×
A
(2)
μs
L2 = VOUT × 0.5 ×
A
(3)
In Equation 2 the minimum inductance value, L1 for step down mode operation is calculated. VIN1 is the
maximum input voltage. In Equation 3 the minimum inductance, L2, for boost mode operation is calculated. The
recommended minimum inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor
for generating 3.3V from a Li-Ion battery with a battery voltage range from 2.5V up to 4.2V is 2.2 µH. The
recommended inductor value range is between 1.5 µH and 4.7 µH. In general, this means that at high voltage
conversion rates, higher inductor values offer better performance.
14
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With the chosen inductance value, the peak current for the inductor in steady state operation can be calculated.
Equation 4 shows how to calculate the peak current I1 in step down mode operation and Equation 5 shows how
to calculate the peak current I2 in boost mode operation.
VOUTǒV IN1 * V OUTǓ
I
I 1 + OUT )
0.8
2 V IN1 f L
V
I OUT VIN2
I 2 + OUT
)
2
0.8 V IN2
(4)
ǒV OUT * V IN2Ǔ
VOUT
f
L
(5)
In both equations f is the minimum switching frequency. VIN2 is the minimum input voltage. The critical current
value for selecting the right inductor is the higher value of I1 and I2. It also needs to be taken into account that
load transients and error conditions may cause higher inductor currents. This also needs to be taken into account
when selecting an appropriate inductor. The following inductor series from different suppliers have been used
with TPS6303x converters:
Table 1. List of Inductors
VENDOR
Coilcraft
INDUCTOR SERIES
LPS3015
EPL3010
Murata
LQH3NP
Tajo Yuden
NR3015
CAPACITOR SELECTION
Input Capacitor
At least a 4.7 µF input capacitor is recommended to improve transient behavior of the regulator and EMI
behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND
pins of the IC is recommended.
Bypass Capacitor
To make sure that the internal control circuits are supplied with a stable low noise supply voltage, a capacitor can
be connected between VINA and GND. Using a ceramic capacitor with a value of 0.1µF is recommended. The
value of this capacitor should not be higher than 0.22µF.
Output Capacitor
For the output capacitor, it is recommended to use small ceramic capacitors placed as close as possible to the
VOUT and PGND pins of the IC. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended.
This small capacitor should be placed as close as possible to the VOUT and PGND pins of the IC.
To get an estimate of the recommended minimum output capacitance, Equation 6 can be used.
mF
C OUT + 5 L
mH
(6)
A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain
control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit
for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output
voltage drop during load transients.
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SLVS696 – OCTOBER 2008 .............................................................................................................................................................................................. www.ti.com
LAYOUT CONSIDERATIONS
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces as well, separated from the power ground traces. This
avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the PowerPAD
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
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PACKAGE OPTION ADDENDUM
www.ti.com
20-Nov-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS63030DSKR
ACTIVE
SON
DSK
10
3000 Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63030DSKRG4
ACTIVE
SON
DSK
10
3000 Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63030DSKT
ACTIVE
SON
DSK
10
250
Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63030DSKTG4
ACTIVE
SON
DSK
10
250
Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63031DSKR
ACTIVE
SON
DSK
10
3000 Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63031DSKRG4
ACTIVE
SON
DSK
10
3000 Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63031DSKT
ACTIVE
SON
DSK
10
250
Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
TPS63031DSKTG4
ACTIVE
SON
DSK
10
250
Green (RoHS &
no Sb/Br)
Cu NiPdAu
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS63030DSKT
SON
DSK
10
250
179.0
8.4
2.73
2.73
0.8
4.0
8.0
Q2
TPS63031DSKR
SON
DSK
10
3000
179.0
8.4
2.73
2.73
0.8
4.0
8.0
Q2
TPS63031DSKT
SON
DSK
10
250
179.0
8.4
2.73
2.73
0.8
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Nov-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS63030DSKT
SON
DSK
10
250
195.0
200.0
45.0
TPS63031DSKR
SON
DSK
10
3000
195.0
200.0
45.0
TPS63031DSKT
SON
DSK
10
250
195.0
200.0
45.0
Pack Materials-Page 2
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