MAX232E www.ti.com SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION Check for Samples: MAX232E FEATURES 1 • • • • • • • Meets or Exceeds TIA/RS-232-F and ITU Recommendation V.28 Operates From a Single 5-V Power Supply With 1.0-μF Charge-Pump Capacitors Operates up to 250 kbit/s Two Drivers and Two Receivers ±30-V Input Levels Low Supply Current . . . 8 mA Typical ESD Protection for RS-232 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC61000-4-2, Contact Discharge – ±15-kV IEC61000-4-2, Air-Gap Discharge D, DW, N, NS, OR PW PACKAGE (TOP VIEW) C1+ VS+ C1− C2+ C2− VS− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 7 11 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 APPLICATIONS • • • • • TIA/RS-232-F Battery-Powered Systems Terminals Modems Computers DESCRIPTION/ORDERING INFORMATION The MAX232E is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels. This receiver has a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each driver converts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC™ library. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2009, Texas Instruments Incorporated MAX232E SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 www.ti.com Table 1. ORDERING INFORMATION (1) PACKAGE (2) TA PDIP – N SOIC – D 0°C to 70°C SOIC – DW TSSOP – PW PDIP – N SOIC – D –40°C to 85°C SOIC – DW TSSOP – PW (1) (2) ORDERABLE PART NUMBER Tube of 25 MAX232ECN Tube of 40 MAX232ECD Reel of 2500 MAX232ECDR Tube of 40 MAX232ECDW Reel of 2000 MAX232ECDWR Tube of 25 MAX232ECPW Reel of 2000 MAX232ECPWR Tube of 25 MAX232EIN Tube of 40 MAX232EID Reel of 2500 MAX232EIDR Tube of 40 MAX232EIDW Reel of 2000 MAX232EIDWR Tube of 25 MAX232EIPW Reel of 2000 MAX232EIPWR TOP-SIDE MARKING MAX232ECN MAX232EC MAX232EC MA232EC MAX232EIN MAX232EI MAX232EI MB232EI For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. Table 2. FUNCTION TABLES ABC Each Driver (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level Table 3. Each Receiver (1) (1) INPUT RIN OUTPUT ROUT L H H L H = high level, L = low level LOGIC DIAGRAM (POSITIVE LOGIC) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 2 RIN2 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E MAX232E www.ti.com SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Input supply voltage range (2) VS+ Positive output supply voltage range VS– Negative output supply voltage range VI Input voltage range VO Output voltage range Driver MIN MAX –0.3 6 V VCC – 0.3 15 V –0.3 –15 V –0.3 VCC + 0.3 Receiver Short-circuit duration Package thermal impedance (3) (4) TJ Operating virtual junction temperature Tstg Storage temperature range DOUT VS– – 0.3 VS+ + 0.3 ROUT –0.3 VCC + 0.3 (2) (3) (4) V Unlimited D package 73 DW package 57 N package 67 PW package (1) V ±30 DOUT θJA UNIT °C/W 108 –65 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions VCC Supply voltage VIH High-level input voltage (DIN1, DIN2) VIL Low-level input voltage (DIN1, DIN2) MIN NOM MAX 4.5 5 5.5 V 2 V Receiver input voltage (RIN1, RIN2) TA UNIT MAX232EC Operating free-air temperature MAX232EI 0.8 V ±30 V 0 70 –40 85 °C Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER ICC (1) (2) TEST CONDITIONS Supply current VCC = 5.5 V, MIN All outputs open, TA = 25°C TYP (2) MAX 8 10 UNIT mA Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V and TA = 25°C. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E 3 MAX232E SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 www.ti.com DRIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature range PARAMETER TEST CONDITIONS VOH High-level output voltage DOUT RL = 3 kΩ to GND VOL Low-level output voltage (3) DOUT RL = 3 kΩ to GND ro Output resistance DOUT VS+ = VS– = 0, VO = ±2 V IOS (4) Short-circuit output current DOUT VCC = 5.5 V, VO = 0 IIS Short-circuit input current DIN VI = 0 (1) (2) (3) (4) MIN 5 TYP (2) MAX 7 –7 UNIT V –5 V Ω 300 ±10 mA 200 μA Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V and TA = 25°C. The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only. Not more than one output should be shorted at a time. Switching Characteristics (1) VCC = 5 V, TA = 25°C (see Note 4) PARAMETER TEST CONDITIONS SR Driver slew rate RL = 3 kΩ to 7 kΩ, See Figure 2 SR(t) Driver transition region slew rate See Figure 3 Data rate One DOUT switching (1) MIN TYP MAX UNIT 30 V/μs 3 V/μs 250 kbit/s Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. ESD protection PARAMETER DOUT, RIN 4 TYP UNIT HBM TEST CONDITIONS ±15 kV IEC61000-4-2, Air-Gap Discharge ±15 kV IEC61000-4-2, Contact Discharge ±8 kV Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E MAX232E www.ti.com SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 RECEIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature range PARAMETER MIN TYP (2) TEST CONDITIONS VOH High-level output voltage ROUT IOH = –1 mA VOL Low-level output voltage (3) ROUT IOL = 3.2 mA VIT+ Receiver positive-going input threshold voltage RIN VCC = 5 V, TA = 25°C VIT– Receiver negative-going input threshold voltage RIN VCC = 5 V, TA = 25°C Vhys Input hysteresis voltage RIN VCC = 5 V ri Receiver input resistance RIN VCC = 5 V, (1) (2) (3) MAX 3.5 TA = 25°C UNIT V 1.7 0.4 V 2.4 V 0.8 1.2 0.2 0.5 1 V V 3 5 7 kΩ Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V and TA = 25°C. The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only. Switching Characteristics (1) VCC = 5 V, TA = 25°C (see Figure 1) PARAMETER TYP UNIT tPLH(R) Receiver propagation delay time, low- to high-level output 500 ns tPHL(R) Receiver propagation delay time, high- to low-level output 500 ns (1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E 5 MAX232E SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC RL = 1.3 kΩ Pulse Generator (see Note A) See Note C ROUT RIN CL = 50 pF (see Note B) TEST CIRCUIT ≤10 ns Input 10% ≤10 ns 90% 50% 90% 50% 3V 10% 0V 500 ns tPLH tPHL VOH Output 1.5 V 1.5 V VOL WAVEFORMS A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance. C. All diodes are 1N3064 or equivalent. Figure 1. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements 6 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E MAX232E www.ti.com SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) Pulse Generator (see Note A) DIN DOUT RS-232 Output CL = 10 pF (see Note B) RL TEST CIRCUIT ≤10 ns ≤10 ns 10% 3V 90% 50% 90% 50% Input 10% 0V 5 µs tPLH tPHL 90% Output 90% 10% 10% VOH VOL tTLH tTHL 0.8 (V SR + –V ) 0.8 (V –V ) OH OL OL OH or t t TLH THL WAVEFORMS A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance. Figure 2. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-μs Input) Pulse Generator (see Note A) DIN DOUT RS-232 Output 3 kΩ CL = 2.5 nF TEST CIRCUIT ≤10 ns ≤10 ns Input 90% 1.5 V 90% 1.5 V 10% 10% 20 µs tTLH tTHL Output 3V 3V −3 V −3 V SR + VOH VOL 6V tTHL or t TLH WAVEFORMS A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. Figure 3. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-μs Input) Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E 7 MAX232E SLLS723B – APRIL 2006 – REVISED NOVEMBER 2009 www.ti.com APPLICATION INFORMATION 5V CBYPASS = 1 µF + − 16 1 C1 C1+ 1 µF 3 1 µF 5 From CMOS or TTL To CMOS or TTL 8.5 V VS+ 6 VS− C2+ 1 µF 2 C1− 4 C2 C3† VCC −8.5 V C4 + C2− 11 14 10 7 12 13 9 8 0V 1 µF RS-232 Output RS-232 Output RS-232 Input RS-232 Input 15 GND † C3 can be connected to VCC or GND. A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. In addition to the 1-μF capacitors shown, the MAX202E can operate with 0.1-μF capacitors. Figure 4. Typical Operating Circuit 8 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX232E PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX232ECD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type MAX232ECNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type MAX232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232ECPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX232EIN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type MAX232EINE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type MAX232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 17-Nov-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty MAX232EIPWG4 ACTIVE TSSOP PW 16 MAX232EIPWR ACTIVE TSSOP PW MAX232EIPWRG4 ACTIVE TSSOP PW 90 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 17-Nov-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX232ECDR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232ECDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232ECPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 MAX232EIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232EIDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232EIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Nov-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX232ECDR SOIC D 16 2500 346.0 346.0 33.0 MAX232ECDWR SOIC DW 16 2000 346.0 346.0 33.0 MAX232ECPWR TSSOP PW 16 2000 346.0 346.0 29.0 MAX232EIDR SOIC D 16 2500 346.0 346.0 33.0 MAX232EIDWR SOIC DW 16 2000 346.0 346.0 33.0 MAX232EIPWR TSSOP PW 16 2000 346.0 346.0 29.0 Pack Materials-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. 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