TI SN74LV4046APWR

SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656A – FEBRUARY 2006 – REVISED FEBRUARY 2006
FEATURES
•
•
•
•
•
•
•
Choice of Three Phase Comparators
– Exclusive OR
– Edge-Triggered J-K Flip-Flop
– Edge-Triggered RS Flip-Flop
Excellent VCO Frequency Linearity
VCO-Inhibit Control for ON/OFF Keying and
for Low Standby Power Consumption
Optimized Power-Supply Voltage Range From
3 V to 5.5 V
Wide Operating Temperature Range . . . –40°C
to 125°C
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
D, DGV, NS, OR PW PACKAGE
(TOP VIEW)
PCPOUT
PC1OUT
COMPIN
VCOOUT
INH
C1A
C1B
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
PC3OUT
SIGIN
PC2OUT
R2
R1
DEMOUT
VCOIN
DESCRIPTION
The SN74LV4046A is a high-speed silicon-gate CMOS device that is pin compatible with the CD4046B and the
CD74HC4046. The device is specified in compliance with JEDEC Std 7.
The SN74LV4046A is a phase-locked-loop circuit that contains a linear voltage-controlled oscillator (VCO) and
three different phase comparators (PC1, PC2, and PC3). A signal input and a comparator input are common to
each comparator.
The signal input can be directly coupled to large voltage signals, or indirectly coupled (with a series capacitor) to
small voltage signals. A self-bias input circuit keeps small voltage signals within the linear region of the input
amplifiers. With a passive low-pass filter, the SN74LV4046A forms a second-order loop PLL. The excellent VCO
linearity is achieved by the use of linear operational amplifier techniques.
ORDERING INFORMATION
TA
PACKAGE
SOP – NS
–40°C to 125°C
SOIC – D
TSSOP – PW
TVSOP – DGV
ORDERABLE PART NUMBER
SN74LV4040ANS
SN74LV4040ANSR
SN74LV4040AD
SN74LV4040ADR
SN74LV4040APW
SN74LV4040APWR
SN74LV4040ADGVR
TOP-SIDE MARKING
74LV4046A
LV4046A
LW046A
LW046A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656A – FEBRUARY 2006 – REVISED FEBRUARY 2006
PIN DESCRIPTION
PIN NO.
SYMBOL
NAME AND FUNCTION
1
PCPOUT
Phase comparator pulse output
2
PC1OUT
Phase comparator 1 output
3
COMPIN
Comparator input
4
VCOOUT
VCO output
5
INH
Inhibit input
6
C1A
Capacitor C1 connection A
7
C1B
Capacitor C1 connection B
8
GND
Ground (0 V)
9
VCOIN
10
DEMOUT
11
R1
Resistor R1 connection
12
R2
Resistor R2 connection
13
PC2OUT
14
SIGIN
15
PC3OUT
16
VCC
VCO input
Demodulator output
Phase comparator 2 output
Signal input
Phase comparator 3 output
Positive supply voltage
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
DC supply voltage range
–0.5
7
V
VI
Input voltage range
–0.5
VCC + 0.5
V
VO
Output voltage range
–0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output curent
VO = 0 to VCC
±35
mA
ICC
DC VCC or ground current
±70
mA
D package
θJA
Package thermal impedance (2)
Tstg
(1)
(2)
V
73
DGV package
120
NS package
64
PW package
108
Storage temperature range
UNIT
–65
°C/W
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
PARAMETER
TA
Operating free-air temperature
VCC
Supply voltage
VI, VO
DC input or output voltage
2
Submit Documentation Feedback
MIN
MAX
UNIT
–40
125
°C
3
5.5
V
0
VCC
V
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656A – FEBRUARY 2006 – REVISED FEBRUARY 2006
Electrical Specifications
TEST CONDITIONS
PARAMETER
VI (V)
IO (mA)
VCC (V)
MIN
3 to 3.6
VCC × 0.7
4.5 to 5.5
VCC × 0.7
TYP
MAX
UNIT
VCO
VIH
High-level input voltage
INH
VIL
Low-level input voltage
INH
VOH
High-level
output voltage
VCOOUT
Low-level
output voltage
VOL
VCOOUT
CMOS
VIL or VIH
TTL
–12
CMOS
0.05
VIL or VIH
TTL
C1A, C1B
(test purposes only)
II
Input leakage current
–0.05
INH, VCOIN
3 to 5.5
VCC × 0.3
4.5 to 5.5
VCC × 0.3
3 to 3.6
VCC – 0.1
4.5 to 5.5
VCC – 0.1
4.5 to 5.5
3.8
4.5 to 5.5
0.1
4.5 to 5.5
0.55
12
4.5 to 5.5
0.65
±1
µA
50
kΩ
3 to 4.5
3
50
kΩ
3 to 3.6
40
4.5 to 5.5
40
No Limit
pF
3 to 3.6
1.1
1.9
4.5 to 5.5
1.1
3.2
R2 range (1)
C1 capacitance range
Over the range specified
for R1 for linearity (2)
V
3
5.5
3 to 5.5
VCOIN
0.1
12
VCC or GND
V
V
3 to 3.6
R1 range (1)
Operating voltage
range
V
V
Phase Comparator
DC-coupled high-level
input voltage
SIGIN,
COMPIN
VIL
DC-coupled low-level input voltage
SIGIN,
COMPIN
VOH
High-level
output voltage
VIH
Low-level
output voltage
VOL
4.5 to 5.5
VCC × 0.7
3 to 3.6
VCC × 0.3
4.5 to 5.5
VCC × 0.3
3 to 5.5
VCC – 0.1
–6
3 to 3.6
2.48
TTL
–12
4.5 to 5.5
3.8
CMOS
0.02
CMOS
PCPOUT,
PCNOUT
VIL or VIH
VIL or VIH
4
II
Input leakage current
SIGIN,
COMPIN
VCC or GND
IOZ
3-state off-state current
PC2OUT
VIL or VIH
Input resistance
VCC × 0.7
–0.05
PCPOUT,
PCNOUT
TTL
RI
3 to 3.6
SIGIN,
COMPIN
VI at self-bias operating
point, VI = 0.5 V
V
V
3 to 3.6
0.1
4.5 to 5.5
0.1
4.5 to 5.5
0.4
3 to 3.6
±11
4.5 to 5.5
±29
±5
3 to 5.5
3
800
4.5
250
V
µA
µA
kΩ
Demodulator
RS
Resistor range
RS > 300 kΩ, Leakage
current can influence
VDEMOUT
VOFF
Offset voltage VCOIN to VDEM
VI = VVCOIN = VCC/2,
Values taken over RS
range
ICC
Quiescent device current
(1)
(2)
Pins 3, 5, and 14 at VCC,
Pin 9 at GND, II at pins 3
and 14 to be excluded
3 to 3.6
50
300
4.5 to 5.5
50
300
3 to 3.6
±30
4.5 to 5.5
±20
5.5
kΩ
mV
50
µA
The value for R1 and R2 in parallel should exceed 2.7 kΩ.
The maximum operating voltage can be as high as VCC – 0.9 V; however, this may result in an increased offset voltage.
Submit Documentation Feedback
3
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656A – FEBRUARY 2006 – REVISED FEBRUARY 2006
Switching Specifications
CL = 50 pF, Input tr, tf = 6 ns
PARAMETER
TEST CONDITIONS
VCC
(V)
MIN
TYP
MAX
UNIT
Phase Comparator
3 to 3.6
135
4.5 to 5.5
50
3 to 3.6
300
4.5 to 5.5
60
3 to 3.6
200
4.5 to 5.5
50
tPLH, tPHL
Propagation delay
SIGIN, COMPIN to
PC1OUT
tPLH, tPHL
Propagation delay
SIGIN, COMPIN to
PCPOUT
tPLH, tPHL
Propagation delay
SIGIN, COMPIN to
PC3OUT
tTHL, tTLH
Output transition time
3 to 3.6
75
4.5 to 5.5
15
tPZH, tPZL
3-state output enable time
SIGIN, COMPIN to
PC2OUT
3 to 3.6
270
4.5 to 5.5
54
tPHZ, tPLZ
3-state output disable time
SIGIN, COMPIN to
PC2OUT
3 to 3.6
320
4.5 to 5.5
65
AC-coupled input sensitivity
(P-P) at SIGIN or
COMPIN
VI(P-P)
3 to 3.6
11
4.5 to 5.5
15
ns
ns
ns
ns
ns
ns
mV
VCO
∆f/∆T
fMAX
Frequency stability with temperature change
Maximum frequency
Center frequency (duty 50%)
∆fVCO
VI = VCOIN = 1/2 VCC,
R1 = 100 kΩ,
R2 = ∞,
C1 = 100 pF
C1 = 50 pF,
R1 = 3.5 kΩ,
R2 = ∞
C1 = 0 pF,
R1 = 9.1 kΩ,
R2 = ∞
C1 = 40 pF,
R1 = 3 kΩ,
R2 = ∞,
VCOIN = VCC/2
3 to 3.6
0.11
4.5 to 5.5
0.11
3 to 3.6
24
4.5 to 5.5
24
3 to 3.6
38
4.5 to 5.5
38
3 to 3.6
7
10
4.5 to 5.5
12
17
C1 = 100 pF,
R1 = 100 kΩ,
R2 = ∞
3 to 3.6
0.4
Frequency linearity
4.5 to 5.5
0.4
Offset frequency
C1 = 1 nF,
R2 = 220 kΩ
3 to 3.6
400
4.5 to 5.5
400
%/°C
MHz
MHz
%
kHz
Demodulator
VOUT vs fIN
4
C1 = 100 pF,
C2 = 100 pF,
R1 = 100 kΩ,
R2 = ∞,
R3 = 100 kΩ
Submit Documentation Feedback
3
4.5
8
330
mV/kHz
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656A – FEBRUARY 2006 – REVISED FEBRUARY 2006
APPLICATION INFORMATION
AVERAGE OUTPUT VOLTAGE
vs
INPUT PHASE DIFFERENCE
AVERAGE OUTPUT VOLTAGE
vs
INPUT PHASE DIFFERENCE
V CC
VCC
V DEMOUT (AV)
VDEMOUT (AV)
1/2 V CC
1/2 V CC
0
–360
0
0
90
φDEMOUT
180
Figure 1. Phase Comparator 1:
VDEMOUT = VPC1OUT = (VCC/π) (SIGIN – COMPIN);
DEMOUT = (SIGIN – COMPIN)
φ DEMOUT
360
Figure 2. Phase Comparator 2:
VDEMOUT = VPC2OUT = (VCC/4) (SIGIN – COMPIN);
DEMOUT = (SIGIN – COMPIN)
SIGIN
SIGIN
COMPIN
COMPIN
VCOOUT
VCOOUT
0
VCC
GND
PC2 OUT
PC1OUT
High-Impedance Off State
VCC
VCO IN
VCOIN
GND
PCPOUT
Figure 3. Typical Waveforms for PLL Using
Phase Comparator 1, Loop Locked at fo
Figure 4. Typical Waveforms for PLL Using
Phase Comparator 2, Loop Locked at fo
AVERAGE OUTPUT VOLTAGE
vs
INPUT PHASE DIFFERENCE
VCC
SIGIN
VDEMOUT(AV)
COMPIN
VCOOUT
1/2 VCC
PC3OUT
VCC
VCOIN
GND
0
0
180
DEMOUT
360
Figure 5. Phase Comparator 3:
VDEMOUT = VPC3OUT = (VCC/2π) (SIGIN – COMPIN);
DEMOUT = (SIGIN – COMPIN)
Figure 6. Typical Waveforms for PLL Using
Phase Comparator 3, Loop Locked at fo
Submit Documentation Feedback
5
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656A – FEBRUARY 2006 – REVISED FEBRUARY 2006
APPLICATION INFORMATION (continued)
SIGIN, COMPIN
Inputs
SIGIN
Inputs
VS
tPHL
tPLH
PCPOUT, PC1OUT,
PC3OUT
Outputs
VS
COMPIN
Inputs
VS
tPHZ
VS
tPZL
tPZH
tTHL
PC2OUT
Output
tTLH
tPLZ
90%
VS
10%
Figure 7. Input-to-Output Propagation Delays and
Output Transition Times
Figure 8. 3-State Enable and Disable Times for PC2OUT
CPD (1)
CHIP SECTION
120
VCO
120
(1)
6
CPD
Comparator 1
R1 between 3 kΩ and 50 kΩ
R2 between 3 kΩ and 50 kΩ
R1 + R2 parallel value > 2.7 kΩ
C1 > 40 pF
Submit Documentation Feedback
UNIT
pF
PACKAGE OPTION ADDENDUM
www.ti.com
13-Feb-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV4046AD
ACTIVE
SOIC
D
16
SN74LV4046ADGVR
ACTIVE
TVSOP
DGV
SN74LV4046ADR
ACTIVE
SOIC
SN74LV4046ANS
ACTIVE
SN74LV4046ANSR
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SO
NS
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046APW
ACTIVE
TSSOP
PW
16
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
50
90
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Mailing Address:
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated