SAMSUNG CL31B474KBHNNNE

SPECIFICATION
 Supplier : Samsung electro-mechanics
 Samsung P/N : CL31B474KBHNNNE
 Product : Multi-layer Ceramic Capacitor
 Description :
CAP, 470㎋, 50V, ±10%, X7R, 1206
A. Samsung Part Number
① Series
CL
31
B
474
K
B
H
N
N
N
E
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
⑪
Samsung Multi-layer Ceramic Capacitor
② Size
1206 (inch code)
③ Dielectric
X7R
④ Capacitance
⑤ Capacitance
L: 3.2 ± 0.2
⑥ Rated Voltage
50 V
⑦ Thickness
1.6 ± 0.2
mm
1.6
W:
± 0.2
⑧ Inner electrode
Ni
Termination
Cu
Plating
Sn 100%
470 ㎋
±10 %
tolerance
mm
mm
(Pb Free)
⑨ Product
Normal
⑩ Special
Reserved for future use
⑪ Packaging
Embossed Type, 7" reel(2,000ea)
B. Samsung Reliablility Test and Judgement condition
Performance
1.0±0.2Vrms
More than 500Mohm㎌
Rated Voltage
60~120 sec.
Appearance
No abnormal exterior appearance
Withstanding
No dielectric breakdown or
Visual inspection
250% of the rated voltage
Voltage
mechanical breakdown
Temperature
X7R
Characteristics
Adhesive Strength
(From -55℃ to 125℃, Capacitance change should be within ±15%)
No peeling shall be occur on the
500gF, for 10±1 sec.
of Termination
terminal electrode
Bending Strength
Capacitance change :
Tan δ (DF)
Insulation
Within specified tolerance
Test condition
1㎑±10%
Capacitance
0.025 max.
Resistance
within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
Solderability
More than 75% of terminal surface
SnAg3.0Cu0.5 solder
is to be soldered newly
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Capacitance change :
Soldering heat
Tan δ, IR : initial spec.
within ±7.5%
Solder pot : 270±5℃, 10±1sec.
Performance
Vibration Test
Capacitance change :
within ±5%
Tan δ, IR : initial spec.
Moisture
Capacitance change :
Resistance
Tan δ : 0.05 max
IR
Amplitude : 1.5mm
From 10㎐ to 55㎐ (return : 1min.)
2hours  3 direction (x, y, z)
within ±12.5% With rated voltage
40±2℃, 90~95%RH, 500 +12/-0 hour
: More than 25㏁·㎌
High Temperature
Capacitance change :
Resistance
Tan δ : 0.05 max
IR
Test condition
within ±12.5% With 200%
of the rated voltage
Max. operating temperature
: More than 50㏁·㎌
1000+48/-0 hour
Temperature
Capacitance change :
Cycling
Tan δ, IR : initial spec.
within ±7.5%
1 cycle condition
Min. operating temperature
25℃
→
25℃
→
Max. operating temperature →
5 cycles test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.