SAMSUNG CL31B475KOHNNNE

SPECIFICATION
• Supplier : Samsung electro-mechanics
• Samsung P/N : CL31B475KOHNNNE
• Product : Multi-layer Ceramic Capacitor
• Description :
CAP, 4.7㎌, 16V, ±10%, X7R, 1206
A. Samsung Part Number
① Series
CL
31
B
475
K
O
H
N
N
N
E
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
⑪
Samsung Multi-layer Ceramic Capacitor
② Size
1206 (inch code)
③ Dielectric
X7R
④ Capacitance
⑤ Capacitance
L: 3.2 ± 0.15
⑥ Rated Voltage
16 V
⑦ Thickness
1.6 ± 0.2
mm
1.6
W:
± 0.15 mm
⑧ Inner electrode
Ni
Termination
Cu
Plating
Sn 100%
4.7 ㎌
±10 %
tolerance
mm
(Pb Free)
⑨ Product
Normal
⑩ Special
Reserved for future use
⑪ Packaging
Embossed Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Performance
1.0±0.2Vrms
Rated Voltage
60~120 sec.
Resistance
10,000Mohm or 100Mohm⋅㎌
Whichever is Smaller
Appearance
No abnormal exterior appearance
Withstanding
No dielectric breakdown or
Microscope (×10)
250% of the rated voltage
Voltage
mechanical breakdown
Temperature
X7R
Characterisitcs
Adhesive Strength
(From -55℃ to 125℃, Capacitance change shoud be within ±15%)
No peeling shall be occur on the
500g⋅F, for 10±1 sec.
of Termination
terminal electrode
Bending Strength
Capacitance change :
Tan δ (DF)
Insulation
Within specified tolerance
Test condition
1㎑±10%
Capacitance
0.1 max.
within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
Solderability
More than 75% of terminal surface
1) Sn63Pb37 solder
is to be soldered newly
235±5℃, 5±0.5sec.
2) SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Capacitance change :
Soldering heat
Tan δ, IR : initial spec.
within ±7.5%
Solder pot : 270±5℃, 10±1sec.
Performance
Vibration Test
Capacitance change :
within ±5%
Tan δ, IR : initial spec.
Test condition
Amplitude : 1.5mm
From 10㎐ to 55㎐ (return : 1min.)
2hours × 3 direction (x, y, z)
Humidity
Capacitance change :
within ±12.5% 40±2℃, 90~95%RH, 500+12/-0hrs
Tan δ : 0.125 max
IR :
25㏁·㎌ or Over
Moisture
Resistance
Capacitance change :
Tan δ :
IR :
0.125 max
40±2℃, 90~95%RH, 500+12/-0hrs
12.5㏁·㎌ or Over
High Temperature
Capacitance change :
Resistance
Tan δ :
IR :
within ±12.5% With rated voltage
within ±12.5% With 150%
0.125 max
of the rated voltage
Max. operating temperature
25㏁·㎌ or Over
1000+48/-0hrs
Temperature
Capacitance change :
Cycling
Tan δ, IR : initial spec.
within ±7.5%
1 cycle condition
Min. operating temperature→
→
25℃
Max. operating temperature → 25℃
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.