BYW81HR Aerospace 1 x 15 A and 2 x 15 A - 200 V fast recovery rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ High surge current capability ■ High avalanche energy capability ■ Hermetic packages ■ Target radiation qualification: – 150 krad (Si) low dose rate – 1 Mrad high dose rate ■ ESCC qualified SMD.5 TO-254 Figure 1. Device configurations Variant 03 BYW81-200CFSY1 1 Description Terminal 1: Anode a Terminal 2: Common cathode Terminal 3: Anode b Packaged in hermetic TO-254 or SMD.5, this device is intended for use in medium voltage, high frequency switching mode power supplies, high frequency DC to DC converters, and other aerospace applications. 2 3 The case is not connected to any lead Variant 05 BYW81-200SHRB 1 The complete ESCC specification for this device is available from the European Space Agency web site. ST guarantees full compliance of qualified parts with such ESCC detailed specifications. Terminal 1: Anode Terminal 2: Anode Terminal 3: Cathode 3 2 The lid is not connected to any terminal Table 1. Device summary(1) Order code ESCC part number Quality level EPPL Package IF(AV) - Engineering model - TO-254 2 x 15 A BYW81-200CFSYHRB 5103/029/03 ESCC flight - TO-254 2 x 15 A BYW81-200SHRB 5103/029/05 ESCC flight Y SMD.5 15 A BYW81-200CFSY1 VRRM VF (max) Tj(max) 200 V 1.15 V 150 °C 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. November 2010 Doc ID 17735 Rev 1 1/9 www.st.com 9 Characteristics 1 BYW81HR Characteristics Table 2. Absolute maximum ratings Symbol Characteristic IFSM Forward surge current (1) (2) Variant 05 Variant 03 (per diode) Variant 03 (per device) VRRM Repetitive peak reverse voltage(3) Value 250 250 500 200 Unit A V (2)(4) IO IF(RMS) TOP TJ Average output rectified current (50% duty cycle) Variant 05 Variant 03 (per diode) Variant 03 (per device) 15 15 30 Forward rms current (per diode)(2) Variant 05 Variant 03 (per diode) Variant 03 (per device) 30 30 40 Operating case temperature range(5) Junction temperature TSTG Storage temperature range(5) TSOL Soldering temperature TO-254(6) SMD.5(7) A A -55 to +150 °C +150 °C -55 to +150 °C +260 +245 °C 1. Sinusoidal pulse of 10 ms duration 2. For variant 03 the “per device” ratings apply only when both cathode terminals are tied together. 3. Pulsed, duration 5 ms, F = 50 Hz 4. For Tcase ≥ +110°C, derate linearly to 0 A at +150°C. 5. For devices with hot solder dip lead finish all testing performed at Tamb > +125 °C are carried out in a 100% inert atmosphere. 6. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be resoldered until 3 minutes have elapsed. 7. Duration 5 seconds maximum the same package shall not be resoldered until 3 minutes have elapsed. Table 3. Symbol Rth (j-c) (1) Thermal resistance Parameter Junction to case All variants (per diode) Variant 03 (per device)(2) Value Unit 2.3 1.4 °C/W 1. Package mounted on infinite heatsink. 2. For variant 03 the “per device” ratings apply only when both cathode terminals are tied together. 2/9 Doc ID 17735 Rev 1 BYW81HR Table 4. Symbol IR VF1 Characteristics s Electrical measurements at ambiant temperature (per diode), Tamb = 22 ±3 °C Characteristic MIL-STD-750 test method Reverse current 4016 Forward voltage 4011 (1) VF2(1) VBR Limits Test conditions Units Min. Max. DC method, VR = 200 V - 20 µA Pulse method, IF = 10 A - 1.0 V Pulse method, IF = 20 A - 1.2 V 200 - V Breakdown voltage 4021 IR = 100 µA C Capacitance 4001 VR = 10 V, F = 1 MHz - 220 pF trr Reverse recovery time 4031 IF = 1 A, VR = 30 V, dIF/dt = -50 A/µs - 40 ns Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 µs Zth(j-c)(2) Calculate ΔVF(3) °C/W 1. Pulse width ≤ 300µs, duty cycle ≤ 2% 2. Performed only during screening tests parameter drift values (initial measurements), go-no-go. 3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Symbol IR VF1 (2) Electrical measurements at high and low temperatures (per diode) Characteristic Reverse current Forward voltage MIL-STD-750 test method 4016 4011 Limits Test conditions(1) Units Min. Max. Tcase = +125 (+0, -5) °C DC method, VR = 200 V - 10 mA Tcase = +125 (+0, -5) °C pulse method, IF = 10 A - 0.85 V Tcase = +55 (+0, -5) °C pulse method, IF = 10 A - 1.15 V 1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a 100% inspection may be performed. 2. Pulse width ≤ 300µs, duty cycle ≤ 2% Doc ID 17735 Rev 1 3/9 Package information 2 BYW81HR Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 2. Metal flange mount package (TO-254(a)) 3 lead, dimension definitions B R1 D E H ØF C G A 3 2 1 N ØM R2 L K ØI K J a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections 4/9 Doc ID 17735 Rev 1 BYW81HR Package information Table 6. Metal flange mount package (TO-254) 3-lead, dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 13.59 13.84 0.535 0.545 B 13.59 13.84 0.535 0.545 C 20.07 20.32 0.790 0.800 D 6.3 6.7 0.248 0.264 E 1 3.9 0.039 0.154 ØF 3.5 3.9 0.138 0.154 G 16.89 17.4 0.665 0.685 H ØI (1) 6.86 BSC 0.89 0.270 BSC 1.14 0.035 0.045 J 3.81 BSC 0.150 BSC K 3.81 BSC 0.150 BSC L 12.95 14.5 ØM 0.510 3.05 Typ. 0.571 0.120 Typ. N - 0.71 - 0.028 R1(2) - 1 - 0.039 (3) 1.65 Typ. R2 0.065 1. 3 locations 2. Radius of heatsink flange corner - 4 locations 3. Radius of body corner - 4 locations Doc ID 17735 Rev 1 5/9 Package information Figure 3. BYW81HR Surface mount package (SMD.5) 3-terminal, dimension definitions A e A1 b2 b3 1 2 E D1 D b1 3 b Table 7. Surface mount package (SMD.5) 3-terminal, dimension values Dimension in millimetres Dimlension in inches Reference Min. Max. Min. Max. A 2.84 3.15 0.112 0.124 A1 0.25 0.51 0.010 0.20 b 7.13 7.39 0.281 0.291 b1 5.58 5.84 0.220 0.230 b2(1) 2.28 2.54 0.090 0.100 (1) 2.92 3.18 0.115 0.125 D 10.03 10.28 0.395 0.405 D1(1) 0.76 - 0.030 - E 7.39 7.64 0.291 0.301 b3 e(1) 1.91 BSC 1. 2 locations 6/9 Doc ID 17735 Rev 1 0.075 BYW81HR Ordering information 3 Ordering information Table 8. Ordering information(1) Order code BYW81-200CFSY1 ESCC part number Quality level - Engineering model EPPL Package - TO-254 Lead finish Marking Gold BYW81200CFSY1 + BeO Mass Packing 10 g BYW81200FSYHRB 5103/029/03 ESCC flight - TO-254 BYW81-200SHRB 5103/029/05 ESCC flight Y SMD.5 Solder 510302901 + BeO dip Gold 510302905 Strip pack 2.0 g 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. Doc ID 17735 Rev 1 7/9 Revision history 4 BYW81HR Revision history Table 9. 8/9 Document revision history Date Revision 03-Nov-2010 1 Changes First issue. Doc ID 17735 Rev 1 BYW81HR Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17735 Rev 1 9/9