1N5822U Aerospace 40 V power Schottky rectifier Features Aerospace applications ■ Surface mount hermetic package ■ High thermal conductivity materials ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low forward voltage drop ■ Package weight: 0.18 g ■ Target radiation qualification – 150 krad (Si) low dose rate – 3 Mrad (Si) high dose rate ■ K A ■ K A LCC2B ESCC qualified Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. It is housed in a surface mount hermetically sealed LCC2B package whose footprint is 100% compatible with industry standard solutions in D5B. The 1N5822U is suitable for switching mode power supplies and high frequency DC to DC converters such as low voltage high frequency inverter, free wheeling or polarity protection. Table 1. Device summary(1) Order code ESCC detailed specification Quality level Lead finish EPPL 1N5822UB1 - Engineering model Gold plated - 1N5822U02B 5106/020/02 Flight part Solder dip Y IF(AV) VRRM Tj(max) VF (max) 3A 40 V 150 °C 0.47 V 1. Contact ST sales office for information about the specific conditions for products in die form and gold plated versions. September 2011 Doc ID 16007 Rev 2 1/7 www.st.com 7 Characteristics 1 1N5822U Characteristics Table 2. Absolute ratings (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) Forward rms current 10 A IF(AV) Average forward rectified current Tc = 135 °C, δ = 0.5 3 A IFSM Forward surge current tp = 10 ms sinusoidal 80 A Tstg Storage temperature range -65 to + 150 °C 150 °C 245 °C Maximum operating junction temperature Tj Maximum soldering temperature Tsol 1. Parameter dPtot --------------dTj (1) (2) 1 - condition to avoid thermal runaway for a diode on its own heatsink < ------------------------Rth ( j – a ) 2. Maximum duration 5 s. The same package must not be resoldered until 3 minutes have elapsed. Table 3. Thermal resistance Symbol Rth (j-c) Table 4. Symbol Parameter IR Parameter Tests conditions Reverse current Tj = 25 °C Tj = 25 °C °C/W Min. Typ. Max. - - 40 - - 80 - - 12 - - 0.4 - - 0.56 - - 0.485 - - 0.455 - - 0.70 VR = 40 V IF = 1A Tj = -55 °C VF 7 Static electrical characteristics Tj = 100 °C (2) Unit Junction to case Tj = -55 °C (1) Value Forward voltage Tj = 25 °C IF = 3 A Tj = 100 °C Tj = 25 °C IF = 9.4 A Unit µA mA V 1. Pulse test : tp = 5 ms, δ < 2% 2. Pulse test : tp = 680 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.32 x IF(AV) + 0.050 IF2(RMS ) Table 5. Symbol Cj 2/7 Dynamic characteristics Parameter Diode capacitance Test conditions VR = 5 V, F = 1 MHz Doc ID 16007 Rev 2 Min. Typ. Max. Unit - - 240 pF 1N5822U Characteristics Figure 1. 2.4 Average forward power dissipation Figure 2. versus average forward current PF(av)(W) 3.5 δ=0.05 2.2 δ=0.1 IF(av)(A) δ=1 δ=0.5 d=0.2 Average forward current versus ambient temperature (δ = 0.5) Rth(j-a)=Rth(j-c) 3.0 2.0 1.8 2.5 1.6 1.4 2.0 1.2 1.5 1.0 0.8 T T 0.4 0.5 IF(av) (A) 0.2 δ=tp/T δ=tp/T tp Tamb(°C) tp 0.0 0.0 0.0 0.5 Figure 3. 50 Rth(j-a)=120 °C/W 1.0 0.6 1.0 1.5 2.0 2.5 3.0 3.5 0 4.0 Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) Figure 4. 1.0 45 0.9 40 0.8 35 0.7 Tc=25 °C 25 20 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 0.5 0.4 Tc=75 °C 0.3 15 Tc=125 °C 0.2 IM 5 1.E-03 tp(s) 0.0 1.E-02 Figure 5. Single pulse 0.1 t(s) t δ =0.5 0 1.E+02 50 0.6 30 10 25 1.E-01 1.E+00 Reverse leakage current versus reverse voltage applied (typical values) 1.E-04 1.E-03 Figure 6. IR(mA) 10.00 Tj=150°C 1.E-02 1.E-01 1.E+00 Forward voltage drop versus forward current (typical values) IFM(A) Tj=125°C 1.E+01 Tj=100°C Tj=125°C 1.00 1.E+00 Tj=75°C Tj=25°C Tj=100°C Tj=50°C 1.E-01 0.10 Tj=25°C 1.E-02 VR(V) VFM(V) 0.01 1.E-03 0 5 10 15 20 25 30 35 40 0.0 Doc ID 16007 Rev 2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 3/7 Characteristics Figure 7. 1N5822U Non repetitive surge peak forward current versus number of cycles 100 IFSM(A) F=50 Hz Tj initial=25°C 80 60 40 20 Number of cycles 0 1 4/7 10 Doc ID 16007 Rev 2 100 1000 1N5822U 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. Leadless chip carrier 2 (LCC2B) package dimensions Dimensions Ref. A D B 2 C Pin 2 Cathode Inches Min. Typ. Max. Min. Typ. Max. A(1) 2.04 2.23 2.42 0.080 0.088 0.095 B 5.27 5.4 5.6 0.207 0.213 0.220 C 3.49 3.62 3.82 0.137 0.143 0.150 D 1.71 1.90 2.09 0.067 0.075 0.082 E 0.48 - 0.71 0.019 - 0.028 F - 1.4 - - 0.055 - G - 3.32 - - 0.131 - H - 1.82 - - 0.072 - I - 0.15 - - 0.006 - r1 - 0.15 - - 0.006 - r2 - 0.20 - - 0.008 - Note 1 1 F Millimeters Note 1 Pin 1 Anode E H I 1 Note 1 E 2 r1 G r2 Note 1: The anode is identified by metallization in two top internal angles and the index mark. 1. Measurement prior to solder coating the mounting pads on bottom of package Doc ID 16007 Rev 2 5/7 Ordering information 3 1N5822U Ordering information Table 7. Ordering information(1) Order code ESCC detailed specification Package Lead finish Marking 1N5822UB1 - LCC2B Gold plated 22UB1 EPPL Weight 0.18 g 1N5822U02B 5106/020/02 Solder dip 22U02B Y Packing Waffle pack 1. Contact ST sales office for information about the specific conditions for products in die form and gold plated versions. 4 Revision history Table 8. 6/7 Document revision history Date Revision Changes 10-Aug-2009 1 First issue. 23-Sep-2011 2 Updated Table 1 and Table 7 for ESCC qualification. Doc ID 16007 Rev 2 1N5822U Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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