Features and Benefits n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications n n n n n n Solid state switch Brushless DC motor commutation Speed sensing Linear position sensing Angular position sensing Current sensing Ordering Information Part No. Temperature Suffix Package US1881 E ( -40oC to 85oC ) SO (SOT-23) or UA (TO-92 flat) US1881 L ( -40oC to 150oC ) SO (SOT-23) or UA (TO-92 flat) *Contact factory or sales representative for legacy temperature options Functional Diagram VDD Description The US1881 is the industry’s first Hall integrated circuit in a SOT-23 package. The US1881 is a bipolar Hall effect sensor IC fabricated from mixed signal CMOS technology. It incorporates advanced chopper stabilization techniques to provide accurate and stable magnetic switch points. There are many applications for this HED in addition to those listed above. The design, specifications and performance have been optimized for commutation applications in 5V and 12V brushless DC motors. Output Voltage Regulator Chopper The output transistor will be latched on (BOP) in the presence of a sufficiently strong South pole magnetic field facing the marked side of the package. Similarly, the output will be latched off (BRP) in the presence of a North field. GND UA Package Pin 1 - VDD Pin 2 - GND Pin 3 - Output SO Package Pin 1 - VDD Pin 2 - Output Pin 3 - GND The SOT-23 device is reversed from the UA package. The SOT-23 output transistor will be latched on in the presence of a sufficiently strong North pole magnetic field applied to the marked face. Note: Static sensitive device; please observe ESD precautions. Reverse VDD protection is not included. For reverse voltage protection, a 100W resistor in series with VDD is recommended. 3901001881 Rev. 012 Page 1 Aug/02 US1881 Electrical Specifications DC Operating Parameters: TA = 25, VDD = 12VDC (unless otherwise specified). Parameter Symbol Test Conditions Min Supply Voltage VDD Operating 3.5 Supply Current IDD B<BOP 1.1 Saturation Voltage VDS(on) Output Leakage Max Units 24 V 2.5 5.0 mA IOUT = 20 mA, B>BOP 0.4 0.5 V IOFF B<BRP, VOUT = 24V 0.01 10.0 A Output Rise Time tr VDD = 12V, RL = 1.1K , CL = 20pf 0.04 s Output Fall Time tf VDD = 12V, RL = 1.1K , CL = 20pf 0.18 s Typ US1881 Magnetic Specifications Parameter Symbol Test Conditions Min Typ Max Units Operating Point BOP EUA,ESO,LUA,LSO 25°C, Vdd=3.5 & 24 volts DC 1.0 5.0 9.0 mT Release Point BRP EUA,ESO,LUA,LSO 25°C, Vdd=3.5 & 24 volts DC -9.0 -5.0 -1.0 mT Hysteresis Bhys EUA,ESO,LUA,LSO 25°C, Vdd=3.5 & 24 volts DC 7.0 10.0 12.0 mT Operating Point BOP EUA, ESO 85°C, Vdd=3.5 & 24 volts DC 0.5 5.0 9.5 mT Release Point BRP EUA, ESO 85°C, Vdd=3.5 & 24 volts DC -9.5 -5.0 -0.5 mT Hysteresis Bhys EUA, ESO 85°C, Vdd=3.5 & 24 volts DC 7.0 10.0 12.0 mT Operating Point BOP LUA, LSO 150°C, Vdd=3.5 & 24 volts DC 0.5 5.0 9.5 mT Release Point BRP LUA, LSO 150°C, Vdd=3.5 & 24 volts DC -9.5 -5.0 -0.5 mT Hysteresis Bhys LUA, LSO 150°C, Vdd=3.5 & 24 volts DC 6.0 10.0 12.5 mT 3901001881 Rev. 012 Page 2 Aug/02 Performance Graphs Typical Magnetic Switch Points vs. Vdd Typical Magnetic Switch Points versus Temperature 1881 12.5 10.0 1881 12 BHYS 7.5 5.0 2.5 Flux Density (mT) Field Strength (mT) 7.5 0.0 -2.5 -5.0 BOP 2.5 -2.5 BRP -7.5 -7.5 -10.0 -12.5 0 10 20 30 -12.5 -40 40 0 40 80 12 0 16 0 20 0 Temperature (o C) Vdd (V) Min/Max Magnetic Switch Range versus Temperature Output Voltage versus Flux Density 1881 12.5 1881 30 B OP Max 7.5 VDD 2.5 B OPMin -2.5 Output Voltage (V) Flux Density (mT) 24 BRP Max 18 B OP 12 B RP -7.5 BRP Min 6 Vout -12.5 -40 0 40 80 12 0 16 0 20 0 0 Temperature (o C) -30 -20 -10 0 10 20 30 Flux Density (mT) 3901001881 Rev. 012 Page 3 Aug/02 Power Dissipation versus Temperature All Devices 500 All Devices 280 400 260 Solder Temperature (o C) Package Power Dissipation (mW) Wave Soldering Parameters UA Package RθJA =206oC/W 300 200 100 240 220 200 SO Package RθJA =575oC/W 0 -40 0 40 80 12 0 16 0 20 0 0 Temperature (o C) 5 1 0 1 5 2 0 2 5 3 0 Time in Wave Solder (Seconds) Absolute Maximum Ratings Supply Voltage (Operating), VDD Supply Current (Fault), IDD Output Voltage, VOUT Output Current (Fault), IOUT Power Dissipation, PD Operating Temperature Range, TA Storage Temperature Range, TS Maximum Junction Temp,TJ 3901001881 Rev. 012 3.5V to 24V 50mA 3.5V to 24V 50mA 100mW -40 to 150°C -65°C to 150°C 175°C Page 4 Aug/02 Performance Graphs Typical Saturation Voltage versus Temperature V DD = 12 V, I OUT = 20mA Typical Supply Current versus Supply Voltage 1881 5 4 400 VDS( ON) TA = -40o C VDS(ON) (mV) Supply Curre nt (mA) 1881 500 3 T A = 25oC 2 300 200 TA = 125o C 1 100 0 0 0 5 10 15 20 25 30 -40 0 40 80 120 160 200 Temperature (oC) Supply Voltage (V) Unique Features CMOS Hall IC Technology The chopper stabilized amplifier uses switched capacitor techniques to eliminate the amplifier offset voltage, which, in bipolar devices, is a major source of temperature-sensitive drift. CMOS makes this advanced technique possible. The CMOS chip is also much smaller than a bipolar chip, allowing very sophisticated circuitry to be placed in less space. The small chip size also contributes to lower physical stress and less power consumption. EMC conditions, use the application circuit on the following page. Installation Consider Temperature Coefficients of Hall IC and magnetics, as well as air gap and life time variations. Observe ESD control procedures. Observe temperature limits during wave soldering. Applications If reverse supply protection is desired, use a resistor in series with the VDD pin that will limit the Supply Current (Fault), IDD, to 50 mA. For severe 3901001881 Rev. 012 Page 5 Aug/02 Applications Examples Automotive and Severe Environment Protection Circuit Two Wire Optional Current Biasing Circuit R1 100 Ω D1 Z1 C1 Supply Voltage V DD OUT Hall IC RL I IN Iout RL 1.2K IDD V DD 4.7nF C2 4.7nF Rb VSS Hall IC The resistors Rb and RL can be used to bias the input current, Iin. Refer to the part specification for limiting values. This circuit will help in getting the precise ON and OFF currents desired. B RP = Ioff = (VDD / Rb + IDD ) B OP = Ion = (Ioff + VDD / RL ) 3901001881 Rev. 012 Page 6 Aug/02 Physical Characteristics UA Package Dimensions 45 o Typical 1.60 1.40 2.13 1.87 4.30 3.90 0.84 0.63 UA Hall Plate / Chip Location 0.45 0.41 5o Typical 2.64 2.34 1.53 1.27 U18 * 805 3.20 2.80 Marked Surface 0.48 0.43 1.75 1.55 All Dimensions in millimeters 0.38 Typical (see note 3) 0.20 0.00 0.41 0.35 1 2 3 NOTES: 1.) Controlling dimension: mm 2.) Leads must be free of flash and plating voids 3.) Do not bend leads within 1mm of the lead to package interface. 4.) Package dimensions exclude molding flash 5.) Tolerance is 0.254mm unless otherwise specified Line 2: 1st digit (8) 2nd and 3rd digits(05) = Year (1998) = Week of Year 0.50 0.35 0.20 MIN 3 * 1651 1 V DD GND Output 0.41 0.35 2.57 2.51 SOT-23 Package Dimensions (Top View) 1.80 1.50 chip 0.66 0.56 2 2.10 1.70 0.25 0.10 Pin # 3.10 2.70 0.10 0.00 3901001881 Rev. 012 = Supplier (Melexis) = Series (1880) PINOUT: Pin 1 Pin 2 Pin 3 1.30 1.24 3.00 2.60 15.0 14.0 * MARKING: Line 1: 1st digit (U) 2nd and 3rd digits (18) 0.90 0.70 NOTES: 1. MARKING: 1st Digit (1) = Series (1880) 2nd Digit(6) = Year - 1996 Last Digits (51) = Week of Year 2. PINOUT (See Top View at left): Pin 1 VDD Pin 2 Output Pin 3 GND 3. Controlling dimension: mm. 4. Lead thickness after solder plating will be 0.254 mm maximum. 5. Package dimensions exclude molding flash. 6. The end flash shall not exceed 0.127 mm on each side of package. 7. Tolerance is +/- 0.254 mm unless otherwise specified. SOT-23 Hall Plate / Chip Location (Bottom View) 0.95 0.85 1.55 1.45 1.30 1.00 Page 7 Aug/02 Reliability Information Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave soldering with usual (63/37 SnPb-) solder (melting point at 183degC). The following test methods are applied: IPC/JEDEC J-STD-020A (issue April 1999) Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices CECC00802 (issue 1994) Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed Quality MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. For more information on manufacturability/solderability see quality page at our website: http://www.melexis.com/ ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 3901001881 Rev. 012 Page 8 Aug/02 Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2002 Melexis NV. All rights reserved. For the latest version of this document, go to our website at: www.melexis.com Or for additional information contact Melexis Direct: Europe and Japan: All other locations: Phone: +32 13 67 04 95 E-mail: [email protected] Phone: +1 603 223 2362 E-mail: [email protected] QS9000, VDA6.1 and ISO14001 Certified 3901001881 Rev. 012 Page 9 Aug/02