FREESCALE MPVZ4006GW7U

深圳市南天星电子科技有限公司
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Pressure
Freescale Semiconductor
+
MPXV4006
Rev 3, 1/2009
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV4006 series piezoresistive transducers are state-of-the-art
monolithic silicon pressure sensors designed for the appliance, consumer,
health care and industrial market. The analog output can be read directly into
the A/D input of Freescale microcontrollers. This transducer combines
advanced micromachining techniques, thin-film metallization, and bipolar
processing to provide an accurate, high level analog output signal that is
proportional to the applied pressure. The axial port has been modified to
accommodate industrial grade tubing.
Features
•
•
•
•
•
MPXV4006
Series
Integrated
Pressure Sensor
0 to 6 kPa (0 to 0.87 psi)
0.2 to 4.8 V Output
Application Examples
•
•
•
2.5% Maximum Error over +10°C to +60°C with Auto Zero
5% Maximum Error over +10°C to +60°C without Auto Zero
Durable Thermoplastic (PPS) Package
Available in Surface Mount (SMT) or Through-Hole (DIP) Configurations
Available with Standard Fluorosilicone Gel or Media Resistant Gel
•
Washing Machine Water Level
Measurement (Reference AN1950)
Ideally Suited for Microprocessor or
Microcontroller-Based Systems
Appliance Liquid Level and Pressure
Measurement
Respiratory Equipment
ORDERING INFORMATION
Option
Surface ThroughNone Single Dual Gauge Differential Absolute
Mount
Hole
Small Outline Package (Media Resistant Gel) (MPVZ4006 Series)
MPVZ4006GW6U
Rail
1735
•
•
•
MPVZ4006GW7U
Rail
1560
•
•
•
Device Name
MPVZ4006G6U
Package
Options
Rail
Case
No.
482
MPVZ4006G6T1
Tape and
482
Reel
MPVZ4006G7U
Rail
482B
Small Outline Package (MPXV4006 Series)
MPXV4006GC6U
Rail
482A
MPXV4006GC6T1 Tape and
482A
Reel
MPXV4006GC7U
Rail
482C
MPXV4006GP
Tray
1369
MPXV4006DP
Tray
# of Ports
1351
Pressure Type
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.
MZ4006GW
MPVZ4006G
•
MPVZ4006G
MPXV4006G
•
•
MPXV4006G
•
•
MZ4006GW
MPVZ4006G
•
•
•
•
Device
Marking
MPXV4006G
MPXV4006GP
MPXV4006DP
Pressure
SMALL OUTLINE PACKAGE SURFACE MOUNT
MPVZ4006G6U/T1
CASE 482-01
MPVZ4006GW6U
CASE 1735-01
MPXV4006GC6U/C6T1
CASE 482A-01
MPXV4006DP
CASE 1351-01
MPXV4006GP
CASE 1369-01
SMALL OUTLINE PACKAGE THROUGH-HOLE
J
MPVZ4006GW7U
CASE 1560-02
MPVZ4006G7U
CASE 482B-03
MPXV4006GC7U
CASE 482C-03
MPXV4006
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
0
—
6.0
612
kPa
mm H2O
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
IS
—
—
10
mAdc
Full Scale
Span(2)
VFSS
—
4.6
—
V
(3)(5)
Offset
Voff
0.152
0.265
0.378
V
Sensitivity
V/P
—
766
7.511
—
mV/kPa
mV/mm H2O
—
—
—
±2.46
—
—
—
±5.0
%VFSS with
auto zero
%VFSS without
auto zero
Accuracy(4)(5)
(10 to 60°C)
1. Device is ratiometric within this specified excitation range.
2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
Offset Stability:
TcSpan:
TcOffset:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure, at 25°C.
Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006, external mechanical stresses and mounting position can affect the
zero pressure output reading. To obtain the 2.46% FSS accuracy, the device output must be “autozeroed'' after installation. Autozeroing is
defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. The specified
accuracy assumes a maximum temperature change of ±5°C between autozero and measurement.
MPXV4006
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Parametrics
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Pmax
24
kPa
Storage Temperature
Tstg
-30° to +100°
°C
Operating Temperature
TA
+10° to +60°
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
VS 2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
3
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
4
Vout
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package device
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXV4006
4
Sensors
Freescale Semiconductor
Pressure
On-Chip Temperature Compensation and Calibration
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the Differential or Gauge configuration
in the basic chip carrier (Case 482). A gel die coat isolates the
die surface and wire bonds from the environment, while
allowing the pressure signal to be transmitted to the silicon
diaphragm.
The MPXV4006/MPVZ4006 series sensor operating
characteristics are based on use of dry air as pressure media.
Media, other than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
Fluorosilicone
Gel Die Coat
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 and Figure 5 shows the sensor output signal
relative to pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 10°C to 60°C using the decoupling circuit shown in
Figure 3. The output will saturate outside of the specified
pressure range.
Stainless
Steel Cap
Die
+5 V
P1
Wire
Bond
Thermoplastic
Case
OUTPUT
Vout
Vs
IPS
Lead
Frame
1.0 μF
0.01 μF
470 pF
GND
P2
Die Bond
Differential Sensing
Element
Figure 3. Recommended Power Supply Decoupling
and Output Filtering Recommendations
(For additional output filtering, please refer to
Application Note AN1646.)
Figure 2. Cross Sectional Diagram SOP
(not to scale)
5.0
5.0
Transfer Function (kPa):
Vout = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60°C
4.5
4.0
3.5
4.0
3.5
3.0
2.5
MAX
2.0
Output (V)
Output (V)
3.0
TYPICAL
1.5
2.5
TYPICAL
MAX
2.0
1.5
MIN
1.0
MIN
1.0
0.5
0
Transfer Function (kPa):
Vout = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS
VS = 5.0 Vdc
TEMP = 10 to 60°C
4.5
0.5
0
2.0
4.0
Differential Pressure (kPa)
Figure 4. Output versus Pressure Differential
at ±5.0% VFSS (without auto zero, Note 5 in
Operating Characteristics)
6.0
0
0
2.0
4.0
6.0
Differential Pressure (kPa)
Figure 5. Output versus Pressure Differential
at ±2.46% VFSS (with auto zero, Note 5 in
Operating Characteristics)
MPXV4006
Sensors
Freescale Semiconductor
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
isolates the die from the environment. The pressure sensor is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
Part Number
Case Type
Pressure (P1) Side Identifier
MPVZ4006GW6U
1735-01
Vertical Port Attached
MPVZ4006GW7U
1560-02
Vertical Port Attached
MPVZ4006G6U/T1
482-01
Stainless Steel Cap
482B-03
Stainless Steel Cap
MPVZ4006G7U
MPXV4006GC6U/T1
482A
Vertical Port Attached
MPXV4006GC7U
482C-03
Vertical Port Attached
MPXV4006GP
1369-01
Side with Port Attached
MPXV4006DP
1351-01
Side with Part Marking
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
Figure 6. SOP Footprint (Case 482)
MPXV4006
6
Sensors
Freescale Semiconductor
Pressure
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
7
Pressure
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
8
Sensors
Freescale Semiconductor
Pressure
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
9
Pressure
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPXV4006
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-ANOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4
5
-BG
8
1
0.25 (0.010)
M
T B
D 8 PL
S
A
S
DETAIL X
S
PIN 1 IDENTIFIER
N
C
-T-
SEATING
PLANE
DIM
A
B
C
D
G
J
K
M
N
S
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.415
0.425 10.54
10.79
0.415
0.425 10.54
10.79
0.210
0.220
5.33
5.59
0.026
0.034
0.66
0.864
0.100 BSC
2.54 BSC
0.009
0.011
0.23
0.28
0.100
0.120
2.54
3.05
0˚
15˚
0˚
15˚
0.405
0.415 10.29
10.54
0.540
0.560 13.72
14.22
K
M
J
DETAIL X
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
4
0.25 (0.010)
5
M
T B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
S
N –B–
G
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
W
V
C
H
J
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.038
0.042
0.100 BSC
0.002
0.010
0.009
0.011
0.061
0.071
0_
7_
0.444
0.448
0.709
0.725
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0_
7_
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
–T–
K
M
PIN 1 IDENTIFIER
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
13
Pressure
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPXV4006
14
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1560-02
ISSUE C
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
15
Pressure
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
16
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
17
Pressure
PACKAGE DIMENSIONS
CASE 1735-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
18
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–A–
4
5
N –B–
G
0.25 (0.010)
8
1
M
T B
D 8 PL
S A
S
DIM
A
B
C
D
G
J
K
M
N
S
V
W
DETAIL X
S
W
V
PIN 1
IDENTIFIER
C
–T–
INCHES
MIN
MAX
0.415
0.425
0.415
0.425
0.500
0.520
0.026
0.034
0.100 BSC
0.009
0.011
0.100
0.120
0_
15 _
0.444
0.448
0.540
0.560
0.245
0.255
0.115
0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.66
0.864
2.54 BSC
0.23
0.28
2.54
3.05
0_
15 _
11.28
11.38
13.72
14.22
6.22
6.48
2.92
3.17
SEATING
PLANE
K
M
J
DETAIL X
CASE 482C-03
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
19
Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.006 (0.15) C A B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
D
A1
DETAIL G
8
1
b
0.004 (0.1)
8X
F
M
C A B
E1
B
N
GND
+Vout
Vs
-Vout
N/C
N/C
N/C
N/C
STYLE 2:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
N/C
Vs
GND
Vout
N/C
N/C
N/C
N/C
∅T
M
A
P
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
7.
8.
8X
0.004 (0.1)
K
DETAIL G
C
SEATING
PLANE
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
A1
b
D
E
E1
e
F
K
L
M
N
P
T
θ
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
0.370
0.390
9.39
9.91
0.002
0.010
0.05
0.25
0.038
0.042
0.96
1.07
0.465
0.485
11.81 12.32
0.680
0.700
17.27 17.78
0.465
0.485
11.81 12.32
0.100 BSC
2.54 BSC
0.240
0.260
6.10
6.60
0.115
0.135
2.92
3.43
0.040
0.060
1.02
1.52
0.270
0.290
6.86
7.37
0.160
0.180
4.06
4.57
0.009
0.011
0.23
0.28
0.110
0.130
2.79
3.30
0˚
7˚
0˚
7˚
CASE 1351-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV4006
20
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
2 PLACES 4 TIPS
0.008 (0.20) C A B
E
A
GAGE
PLANE
e
5
4
e/2
.014 (0.35)
θ
L
D
A1
DETAIL G
8
1
b
0.004 (0.1)
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
8X
F
M
E1
B
N
∅T
K
A
P
C A B
8X
M
0.004 (0.1)
DETAIL G
C
SEATING
PLANE
DIM
A
A1
b
D
E
E1
e
F
K
L
M
N
P
T
θ
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
0.300
0.330
7.11
7.62
0.002
0.010
0.05
0.25
0.038
0.042
0.96
1.07
0.465
0.485
11.81
12.32
0.717 BSC
18.21 BSC
0.465
0.485
11.81
12.32
0.100 BSC
2.54 BSC
0.245
0.255
6.22
6.47
0.120
0.130
3.05
3.30
0.061
0.071
1.55
1.80
0.270
0.290
6.86
7.36
0.080
0.090
2.03
2.28
0.009
0.011
0.23
0.28
0.115
0.125
2.92
3.17
0˚
7˚
0˚
7˚
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV4006
Sensors
Freescale Semiconductor
21
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MPXV4006
Rev. 3
1/2009
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