Pressure Freescale Semiconductor MP3V5004G Rev 2, 06/2010 Integrated Silicon Pressure Sensor, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MP3V5004G Series 0 to 3.92 kPa (0 to 400 mm H2O) 0.6 to 3.0 V Output The MP3V5004G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Typical Applications • Washing Machine Water Level • Ideally Suited for Microprocessor or Microcontroller-Based Systems Features • Temperature Compensated from 10°C to 60°C • Available in Gauge Surface Mount (SMT) Configuration • Durable Thermoplastic (PPS) Package ORDERING INFORMATION Package Case Device Name Options No. Small Outline Package (MP3V5004 Series) MP3V5004GC6U Rail 482A MP3V5004GC6T1 Tape & Reel 482A MP3V5004DP Trays 1351 MP3V5004GVP Trays 1368 MP3V5004GP Trays 1369 None # of Ports Single Dual Gauge • • Pressure Type Differential Absolute • • • • • MP3V5004G MP3V5004G • MP3V5004DP • • MP3V5004GV MP3V5004GP SMALL OUTLINE PACKAGES MP3V5004GC6U/6T1 CASE 482A MP3V5004DP CASE 1351 © Freescale Semiconductor, Inc., 2008, 2010. All rights reserved. MP3V5004GVP CASE 1368 Device Marking MP3V5004GP CASE 1369 Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 2.7 3.0 3.3 VDC IS — — 10 mAdc VFSS — 1.8 — V Offset(3) (4) VOFF 0.45 0.6 0.75 V Sensitivity V/P — 0.6 5.9 — V/kPa mV/mm H2O — — — — — — ±1.5 ±2.5 %VFSS %VFSS Supply Current Span at 306 mm H2O (3 Accuracy(4) (5) kPa)(2) 0 to 100 mm H2O (10 to 60°C) 100 to 400 mm H2O (10 to 60°C) 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. Offset Stability: Output deviation, after 1000 temperature cycles, -30° to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto-Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Auto-zeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ±5°C between auto-zero and measurement. MP3V5004G 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) PMAX 16 kPa Storage Temperature TSTG –30 to +100 °C TA 0 to +85 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND 3 Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS Figure 1. Fully Integrated Pressure Sensor Schematic MP3V5004G Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482A). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3V5004G series sensor operating characteristics are based on the use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available Fluorosilicone Gel Die Coat Die from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MP3V5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range. +3 V Stainless Steel Cap P1 Vout Thermoplastic Wire Bond OUTPUT Vs IPS Lead Frame 1.0 μF 0.01 μF GND 470 pF P2 Differential Sensing Element Die Bond Figure 2. Cross Sectional Diagram SSOP (not to scale) 3.0 Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 3.0 V ± 0.30 Vdc TEMP = 10 to 60°C Output (V) 2.0 Typical 1.0 Max Min 0.6 2 kPa 200 mm H2O 4 kPa 400 mm H2O Figure 4. Output vs. Pressure Differential at ±2.5% VFSS (See Note 5 in Operating Characteristics table) MP3V5004G 4 Sensors Freescale Semiconductor Pressure PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Part Number Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Case Type Pressure (P1) Side Identifier MP3V5004GC6U/T1 482A Side with Port Attached MP3V5004GP 1369 Side with Port Attached MP3V5004DP 1351 Side with Part Marking MP3V5004GVP 1368 Stainless Steel Cap MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint MP3V5004G Sensors Freescale Semiconductor 5 Pressure PACKAGE DIMENSIONS –A– D 8 PL 0.25 (0.010) 4 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– K M PIN 1 IDENTIFIER SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE C SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G 12 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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