MP3V5004G Rev 0, 11/2008 Freescale Semiconductor Technical Data Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated MP3V5004G SERIES The MP3V5004G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • Temperature Compensated over 10° to 60°C • Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations • Durable Thermoplastic (PPS) Package INTEGRATED PRESSURE SENSOR 0 TO 3.92 kPA (0 TO 400 mm H2O) 0.6 TO 3.0 V OUTPUT SMALL OUTLINE PACKAGES THROUGH-HOLE Typical Applications • • Washing Machine Water Level Ideally Suited for Microprocessor or Microcontroller-Based Systems MP3V5004GC7U CASE 482C-03 ORDERING INFORMATION(1) Device Type Case No. MPXV Series Order No. Packing Options Device Marking ThroughHole 482C MP3V5004GC7U Rails MP3V5004G 1 N/C 5 N/C Surface Mount 482A MP3V5004GC6U Rails MP3V5004G 2 VS 6 N/C 482A MP3V5004GC6T1 Tape & Reel MP3V5004G 3 GND 7 N/C 1351 MP3V5004DP Trays MP3V5004G 4 VOUT 8 N/C 1368 MP3V5004GVP Trays MP3V5004G 1369 MP3V5004GP Trays MP3V5004G 1. MP3V5004G series pressure sensors are available with a pressure port. Three packing options are offered for the surface mount configuration. PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. SMALL OUTLINE PACKAGES SURFACE MOUNT MP3V5004GC6U CASE 482A-01 MP3V5004DP CASE 1351-01 © Freescale Semiconductor, Inc., 2008. All rights reserved. MP3V5004GVP CASE 1368-01 MP3V5004GP CASE 1369-01 VS Gain Stage #2 and Ground Reference Shift Circuitry Thin Film Temperature Compensation and Calibration Circuitry Sensing Element GND VOUT Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings (1) Rating Symbol Value Unit Maximum Pressure (P1 > P2) PMAX 16 kPa Storage Temperature TSTG –30 to +100 °C TA 0 to +85 °C Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 3.0 VDC, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Units Pressure Range POP 0 — 3.92 400 kPa mm H2O Supply Voltage(1) VS 2.7 3.0 3.3 VDC IS — — 10 mAdc Supply Current Span at 306 mm H2O (3 kPa) (2) VFSS — 1.8 — V Offset(3) (4) VOFF 0.45 0.6 0.75 V Sensitivity V/P — 0.6 5.9 — V/kPa mV/mm H2O — — — — — — ±1.5 ±2.5 %VFSS %VFSS Accuracy(4) (5) 0 to 100 mm H2O (10 to 60°C) 100 to 400 mm H2O (10 to 60°C) 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. • Offset Stability: Output deviation, after 1000 temperature cycles, –30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied. • TcSpan: Output deviation over the temperature range of 10 to 60°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. • Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement. MP3V5004G 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3V5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available Fluorosilicone Gel Die Coat from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MP3V5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10°C to 60°C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range. Stainless Steel Cap Die P1 Thermoplastic Case Wire Bond Lead Frame P2 Die Bond Differential Sensing Element Figure 2. Cross-Sectional Diagram (Not to Scale) +3 V 3.0 Vout OUTPUT Vs 0.01 μF GND 470 pF Output (V) 2.0 IPS 1.0 μF TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] ± 2.5% VFSS VS = 3.0 V ± 0.30 Vdc TEMP = 10 to 60°C Typical 1.0 Max Min 0.6 2 kPa 200 mm H2O Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) 4 kPa 400 mm H2O Figure 4. Output versus Pressure Differential at ±2.5% VFSS (See Note 5 in Operating Characteristics) MP3V5004G Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Part Number Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Case Type Pressure (P1) Side Identifier MP3V5004GC6U/T1 482A Side with Port Attached MP3V5004GC7U 482C Side with Port Attached MP3V5004GP 1369 Side with Port Attached MP3V5004DP 1351 Side with Port Marking MP3V5004GVP 1368 Stainless Steel Cap INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MP3V5004G 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MP3V5004G Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. -A4 5 N -BG 0.25 (0.010) 8 1 M T B D 8 PL S A S DIM A B C D G J K M N S V W DETAIL X S W V PIN 1 IDENTIFIER C -T- INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.500 0.520 12.70 13.21 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0˚ 15˚ 0˚ 15˚ 0.444 0.448 11.28 11.38 0.540 0.560 13.72 14.22 0.245 0.255 6.22 6.48 0.115 0.125 2.92 3.17 SEATING PLANE K M J DETAIL X CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE MP3V5004G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT MP3V5004G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MP3V5004G 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MP3V5004G Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MP3V5004G 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT MP3V5004G Sensors Freescale Semiconductor 11 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G 12 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MP3V5004G Sensors Freescale Semiconductor 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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