SCLS373I − MAY 1997 − REVISED JUNE 2004
QB
QC
QD
QE
QF
QG
QH
GND
description/ordering information
The ’AHC595 devices contain an 8-bit serial-in,
parallel-out shift register that feeds an 8-bit D-type
storage register. The storage register has parallel
3-state outputs. Separate clocks are provided for
both the shift and storage registers. The shift
register has a direct overriding clear (SRCLR)
input, serial (SER) input, and a serial output for
cascading. When the output-enable (OE) input is
high, all outputs, except QH′, are in the
high-impedance state.
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
QA
SER
OE
RCLK
SRCLK
SRCLR
QH′
QC
QB
SN54AHC595 . . . FK PACKAGE
(TOP VIEW)
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
QH
Both the shift-register clock (SRCLK) and
storage-register clock (RCLK) are positive-edge
triggered. If both clocks are connected together,
the shift register always is one clock pulse ahead
of the storage register.
4
SER
OE
NC
RCLK
SRCLK
SRCLR
QD
QE
NC
QF
QG
NC
VCC
QA
D
SN54AHC595 . . . J OR W PACKAGE
SN74AHC595 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
Operating Range 2-V to 5.5-V VCC
8-Bit Serial-In, Parallel-Out Shift
Shift Register Has Direct Clear
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
GND
NC
Q H′
D
D
D
D
NC − No internal connection
ORDERING INFORMATION
PDIP − N
SN74AHC595N
Tube
SN74AHC595D
Tape and reel
SN74AHC595DR
SOP − NS
Tape and reel
SN74AHC595NSR
AHC595
SSOP − DB
Tape and reel
SN74AHC595DBR
HA595
Tube
SN74AHC595PW
Tape and reel
SN74AHC595PWR
CDIP − J
Tube
SNJ54AHC959J
SNJ54AHC595J
CFP − W
Tube
SNJ54AHC595W
SNJ54AHC595W
LCCC − FK
Tube
SNJ54AHC595FK
SNJ54AHC595FK
TSSOP − PW
−55°C
125°C
−55
C to 125
C
TOP-SIDE
MARKING
Tube
SOIC − D
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AHC595N
AHC595
HA595
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2004, Texas Instruments Incorporated
!"#$%& "!&'& &(!)$'!& "#))%& ' !( *#+,"'!& '%- )!#" "!&(!)$ !
*%"("'!& *%) % %)$ !( %.' &)#$%& '&') /'))'&0)!#"!& *)!"%&1 !% &! &%"%'),0 &",#% %&1 !( ',,
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1
SCLS373I − MAY 1997 − REVISED JUNE 2004
FUNCTION TABLE
INPUTS
2
SER
SRCLK
X
X
X
X
X
X
L
SRCLR
FUNCTION
RCLK
OE
X
X
H
X
X
L
Outputs QA−QH are disabled.
Outputs QA−QH are enabled.
L
X
X
Shift register is cleared.
↑
H
X
X
First stage of the shift register goes low.
Other stages store the data of previous stage, respectively.
H
↑
H
X
X
First stage of the shift register goes high.
Other stages store the data of previous stage, respectively.
X
X
X
↑
X
Shift-register data is stored into the storage register.
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SCLS373I − MAY 1997 − REVISED JUNE 2004
logic diagram (positive logic)
OE
RCLK
SRCLR
SRCLK
SER
13
12
10
11
14
1D Q
C1
R
3D
C3 Q
15
2D Q
C2
R
3D
C3 Q
1
2D Q
C2
R
3D
C3 Q
2
2D Q
C2
R
3D
C3 Q
3
2D Q
C2
R
3D
C3 Q
4
2D Q
C2
R
3D
C3 Q
5
2D Q
C2
R
3D
C3 Q
6
2D Q
C2
R
3D
C3 Q
7
9
QA
QB
QC
QD
QE
QF
QG
QH
QH′
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
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3
SCLS373I − MAY 1997 − REVISED JUNE 2004
timing diagram
SRCLK
SER
RCLK
SRCLR
OE
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
QA
QB
QC
QD
QE
QF
QG
QH
QH′
ÎÎÎÎ
ÎÎÎÎ
NOTE:
4
implies that the output is in 3-State mode.
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SCLS373I − MAY 1997 − REVISED JUNE 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54AHC595
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 3 V
High-level input voltage
VCC = 5.5 V
VCC = 2 V
VIL
VI
VO
IOH
∆t/∆v
MAX
2
5.5
1.5
Input voltage
Output voltage
VCC = 2 V
VCC = 3.3 V ± 0.3 V
High-level output current
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
VCC = 3.3 V ± 0.3 V
Low-level output current
Input transition rise or fall rate
VCC = 5 V ± 0.5 V
MIN
MAX
2
5.5
UNIT
V
1.5
2.1
2.1
3.85
3.85
0.5
VCC = 3 V
VCC = 5.5 V
Low-level input voltage
VCC = 5 V ± 0.5 V
VCC = 2 V
IOL
MIN
SN74AHC595
V
0.5
0.9
0.9
1.65
1.65
V
0
5.5
0
5.5
V
0
VCC
−50
0
VCC
−50
mA
−4
−4
−8
−8
50
50
4
4
8
8
100
100
20
20
V
mA
mA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !)
%1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)3% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
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SCLS373I − MAY 1997 − REVISED JUNE 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
VCC
MIN
TA = 25°C
TYP
MAX
2V
1.9
2
1.9
1.9
3V
2.9
3
2.9
2.9
4.5 V
4.4
4.5
4.4
4.4
IOH = −4 mA
3V
2.58
2.48
2.48
IOH = −8 mA
4.5 V
3.94
PARAMETER
TEST CONDITIONS
IOH = −50 mA
VOH
IOL = 50 mA
VOL
IOZ
ICC
Ci
MAX
3.8
SN74AHC595
MIN
MAX
UNIT
V
3.8
2V
0.1
0.1
0.1
3V
0.1
0.1
0.1
0.1
0.1
0.1
3V
0.36
0.5
0.44
V
4.5 V
0.36
0.5
0.44
0 V to 5.5 V
±0.1
±1*
±1
mA
QA−QH
5.5 V
±0.25
±2.5
±2.5
mA
IO = 0
5.5 V
4
40
40
mA
10
pF
IOL = 8 mA
VI = 5.5 V or GND
VI = VCC or GND,
VO = VCC or GND,
OE = VIH or VIL
VI = VCC or GND,
MIN
4.5 V
IOL = 4 mA
II
SN54AHC595
VI = VCC or GND
VO = VCC or GND
5V
3
10
Co
5V
5.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
pF
timing requirements over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration
MAX
MIN
5
5
5
RCLK high or low
5
5
5
5
5
5
3.5
3.5
3.5
SRCLK↑ before RCLK↑†
8
8.5
8.5
SRCLR low before RCLK↑
8
9
9
SRCLR high (inactive) before SRCLK↑
3
3
3
SER before SRCLK↑
Setup time
MIN
SN74AHC595
SRCLK high or low
SRCLR low
tsu
SN54AHC595
MAX
UNIT
ns
ns
th
Hold time
SER after SRCLK↑
1.5
1.5
1.5
ns
† This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case the shift
register is one clock pulse ahead of the storage register.
2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !)
%1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)3% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
6
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SCLS373I − MAY 1997 − REVISED JUNE 2004
timing requirements over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
tsu
Pulse duration
Setup time
SN54AHC595
MIN
MAX
SN74AHC595
MIN
SRCLK high or low
5
5
5
RCLK high or low
5
5
5
SRCLR low
5
5
5
SER before SRCLK↑
3
3
3
SRCLK↑ before RCLK↑†
5
5
5
SRCLR low before RCLK↑
5
5
5
2.5
2.5
2.5
SRCLR high (inactive) before SRCLK↑
MAX
UNIT
ns
ns
th
Hold time
SER after SRCLK↑
2
2
2
ns
† This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case the shift
register is one clock pulse ahead of the storage register.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
TYP
MAX
SN54AHC595
SN74AHC595
LOAD
CAPACITANCE
MIN
CL = 15 pF
80*
120*
70*
70
CL = 50 pF
55
105
50
50
tPLH
tPHL
RCLK
QA−QH
CL = 15 pF
tPLH
tPHL
SRCLK
QH′
H
CL = 15 pF
tPHL
SRCLR
QH′
tPZH
tPZL
OE
tPLH
tPHL
MIN
MAX
MIN
MAX
UNIT
MHz
6*
11.9*
1*
13.5*
1
13.5
6*
11.9*
1*
13.5*
1
13.5
6.6*
13*
1*
15*
1
15
6.6*
13*
1*
15*
1
15
CL = 15 pF
6.2*
12.8*
1*
13.7*
1
13.7
6*
11.5*
1*
13.5*
1
13.5
QA−QH
CL = 15 pF
7.8*
11.5*
1*
13.5*
1
13.5
7.9
15.4
1
17
1
17
RCLK
QA−QH
CL = 50 pF
7.9
15.4
1
17
1
17
tPLH
tPHL
9.2
16.5
1
18.5
1
18.5
SRCLK
QH′
H
CL = 50 pF
9.2
16.5
1
18.5
1
18.5
tPHL
SRCLR
QH′
CL = 50 pF
9
16.3
1
17.2
1
17.2
tPZH
tPZL
7.8
15
1
17
1
17
OE
QA−QH
CL = 50 pF
9.6
15
1
17
1
17
tPHZ
tPLZ
OE
QA−QH
CL = 50 pF
8.1
15.7
1
16.2
1
16.2
9.3
15.7
1
16.2
1
16.2
ns
ns
ns
ns
ns
ns
ns
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !)
%1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%)
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"'&1% !) "!&&#% %% *)!#" /!# &!"%-
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SCLS373I − MAY 1997 − REVISED JUNE 2004
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TA = 25°C
TYP
MAX
SN54AHC595
SN74AHC595
LOAD
CAPACITANCE
MIN
CL = 15 pF
135*
170*
115*
115
CL = 50 pF
95
140
85
85
fmax
tPLH
tPHL
RCLK
QA−QH
CL = 15 pF
tPLH
tPHL
SRCLK
QH′
H
CL = 15 pF
tPHL
SRCLR
QH′
CL = 15 pF
tPZH
tPZL
OE
QA−QH
CL = 15 pF
tPLH
tPHL
RCLK
QA−QH
CL = 50 pF
tPLH
tPHL
SRCLK
QH′
H
CL = 50 pF
tPHL
SRCLR
QH′
CL = 50 pF
tPZH
tPZL
OE
QA−QH
CL = 50 pF
tPHZ
tPLZ
OE
QA−QH
CL = 50 pF
MIN
MAX
MIN
MAX
UNIT
MHz
4.3*
7.4*
1*
8.5*
1
8.5
4.3*
7.4*
1*
8.5*
1
8.5
4.5*
8.2*
1*
9.4*
1
9.4
4.5*
8.2*
1*
9.4*
1
9.4
4.5*
8*
1*
9.1*
1
9.1
4.3*
8.6*
1*
10*
1
10
5.4*
8.6*
1*
10*
1
10
5.6
9.4
1
10.5
1
10.5
5.6
9.4
1
10.5
1
10.5
6.4
10.2
1
11.4
1
11.4
6.4
10.2
1
11.4
1
11.4
6.4
10
1
11.1
1
11.1
5.7
10.6
1
12
1
12
6.8
10.6
1
12
1
12
3.5
10.3
1
11
1
11
3.4
10.3
1
11
1
11
ns
ns
ns
ns
ns
ns
ns
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load,
2 &(!)$'!& "!&"%)& *)!#" & % (!)$'3% !)
%1& *'% !( %3%,!*$%&- ')'"%)" '' '& !%)
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"'&1% !) "!&&#% %% *)!#" /!# &!"%-
8
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f = 1 MHz
TYP
UNIT
25.2
pF
SCLS373I − MAY 1997 − REVISED JUNE 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
Input
50% VCC
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
VOH
50% VCC
VOL
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Feb-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AHC595D
ACTIVE
SOIC
D
16
SN74AHC595DBR
ACTIVE
SSOP
DB
SN74AHC595DBRE4
ACTIVE
SSOP
SN74AHC595DBRG4
ACTIVE
SN74AHC595DE4
40
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SSOP
DB
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595DRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHC595NE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AHC595NSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595NSRE4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595NSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AHC595PWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Feb-2008
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AHC595DBR
SSOP
DB
16
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74AHC595DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74AHC595DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74AHC595NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74AHC595PWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AHC595DBR
SSOP
DB
16
2000
346.0
346.0
33.0
SN74AHC595DR
SOIC
D
16
2500
333.2
345.9
28.6
SN74AHC595DR
SOIC
D
16
2500
346.0
346.0
33.0
SN74AHC595NSR
SO
NS
16
2000
346.0
346.0
33.0
SN74AHC595PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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