TI SN74AC534PW

 SCAS554D − NOVEMBER 1995 − REVISED OCTOBER 2003
D
SN54AC534 . . . J OR W PACKAGE
SN74AC534 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
2-V to 6-V VCC Operation
Inputs Accept Voltages to 6 V
Max tpd of 11 ns at 5 V
3-State Inverting Outputs Drive Bus Lines
Directly
Full Parallel Access for Loading
OE
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description/ordering information
These octal edge-triggered D-type flip-flops
feature 3-state outputs designed specifically for
driving
highly
capacitive
or
relatively
low-impedance loads. The devices are
particularly suitable for implementing buffer
registers, I/O ports, bidirectional bus drivers, and
working registers.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
SN54AC534 . . . FK PACKAGE
(TOP VIEW)
1D
1Q
OE
VCC
On the positive transition of the clock (CLK) input,
the Q outputs are set to the complements of the
logic levels set up at the data (D) inputs.
2D
2Q
3Q
3D
4D
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
CLK
5Q
5D
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines without need for interface or pullup
components.
8Q
D
D
D
D
OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
ORDERING INFORMATION
PDIP − N
SN74AC534N
Tube
SN74AC534DW
Tape and reel
SN74AC534DWR
SOP − NS
Tape and reel
SN74AC534NSR
AC534
SSOP − DB
Tape and reel
SN74AC534DBR
AC534
Tube
SN74AC534PW
Tape and reel
SN74AC534PWR
CDIP − J
Tube
SNJ54AC534J
SNJ54AC534J
CFP − W
Tube
SNJ54AC534W
SNJ54AC534W
LCCC − FK
Tube
SNJ54AC534FK
SNJ54AC534FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube
SOIC − DW
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AC534N
AC534
AC534
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
!"#$ $%$ $&'"%$ !''#$ % & (!)*%$ %#+ '! $&'" (#&%$ (#' # #'" & #,% $'!"#$ %$%' -%''%$.+
'!$ ('#$/ # $ $##%'*. $*!# #$/ & %**
(%'%"##'+
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCAS554D − NOVEMBER 1995 − REVISED OCTOBER 2003
description/ordering information (continued)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
L
L
↑
L
H
L
H or L
X
Q0
H
X
X
Z
logic diagram (positive logic)
OE
LE
1
11
C1
1D
3
2
1Q
1D
To Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCAS554D − NOVEMBER 1995 − REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
SN54AC534
VCC
VIH
Supply voltage
VCC = 3 V
VCC = 4.5 V
High-level input voltage
VCC = 5.5 V
VCC = 3 V
VIL
Input voltage
IOL
∆t/∆v
2
6
Low-level output current
MAX
2
6
2.1
3.15
3.15
3.85
3.85
0
High-level output current
MIN
2.1
0
Output voltage
IOH
MAX
VCC = 4.5 V
VCC = 5.5 V
Low-level input voltage
VI
VO
MIN
SN74AC534
0.9
1.35
1.35
1.65
1.65
0
0
VCC
VCC
VCC = 3 V
VCC = 4.5 V
−12
−12
−24
−24
VCC = 5.5 V
VCC = 3 V
−24
−24
12
12
VCC = 4.5 V
VCC = 5.5 V
24
24
24
24
8
8
Input transition rise or fall rate
V
V
0.9
VCC
VCC
UNIT
V
V
V
mA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50 µA
VOH
VOL
IOH = −12 mA
TA = 25°C
TYP
MAX
SN54AC534
SN74AC534
VCC
MIN
3V
2.9
2.9
2.9
4.5 V
4.4
4.4
4.4
5.5 V
5.4
5.4
5.4
3V
2.56
2.4
2.46
MIN
MAX
MIN
MAX
UNIT
V
4.5 V
3.86
3.7
3.76
IOH = −24 mA
5.5 V
4.86
4.7
4.76
3V
0.1
0.1
0.1
IOL = 50 µA
4.5 V
0.1
0.1
0.1
5.5 V
0.1
0.1
0.1
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
5.5 V
0.36
0.5
0.44
5.5 V
±0.5
±5
±2.5
µA
5.5 V
±0.1
±1
±1
µA
4
80
40
µA
IOL = 12 mA
IOL = 24 mA
IOZ
II
VO = VCC or GND
VI = VCC or GND
ICC
Ci
VI = VCC or GND,
VI = VCC or GND
IO = 0
5.5 V
5V
4.5
V
pF
0 $&'"%$ $#'$ ('! $ # &'"%1# '
#/$ (%# & #1#*("#$+ %'%#' %% %$ #'
(#&%$ %'# #/$ /%*+ #,% $'!"#$ '##'1# # '/ %$/# ' $$!# ## ('! -! $#+
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCAS554D − NOVEMBER 1995 − REVISED OCTOBER 2003
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
SN54AC534
MIN
70
SN74AC534
MAX
MIN
60
MAX
70
UNIT
fclock
tw
Clock frequency
Pulse duration, CLK high or low
5
8
6.5
MHz
ns
tsu
th
Setup time, data before CLK↑
5
8
6.5
ns
Hold time, data after CLK↑
1
3
1.5
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
SN54AC534
MIN
150
SN74AC534
MAX
MIN
Clock frequency
Pulse duration, CLK high or low
3.5
5.5
4
ns
tsu
th
Setup time, data before CLK↑
3.5
5.5
4
ns
1
3
1.5
ns
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
TA = 25°C
MIN
MAX
CLK
Q
tPZH
tPZL
OE
Q
tPHZ
tPLZ
OE
Q
MIN
TO
(OUTPUT)
MAX
MIN
MAX
70
14
2
17.5
2.5
16
3
13
2
16.5
2.5
15
3
12.5
2
15.5
2.5
14
3
12.5
2
15.5
2.5
14
2
13.5
1
16.5
1.5
15
2
12
1
15
1.5
13.5
TA = 25°C
MIN
MAX
temperature
SN54AC534
MIN
range,
UNIT
MHz
3
free-air
MHz
SN74AC534
60
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
temperature
SN54AC534
70
tPLH
tPHL
PARAMETER
free-air
140
UNIT
fclock
tw
Hold time, data after CLK↑
75
MAX
ns
ns
ns
range,
SN74AC534
MAX
75
MIN
MAX
fmax
150
tPLH
tPHL
2.5
10.5
1.5
13.5
140
2
12
CLK
Q
2.5
9.5
1.5
12.5
2
11
tPZH
tPZL
2.5
10
1.5
13
2
11.5
OE
Q
2.5
10
1.5
13
2
11.5
tPHZ
tPLZ
OE
Q
1.5
11.5
1
14
1
12.5
1.5
10
1
12.5
1
11
UNIT
MHz
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
0 $&'"%$ $#'$ ('! $ # &'"%1# '
#/$ (%# & #1#*("#$+ %'%#' %% %$ #'
(#&%$ %'# #/$ /%*+ #,% $'!"#$ '##'1# # '/ %$/# ' $$!# ## ('! -! $#+
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
TYP
UNIT
40
pF
SCAS554D − NOVEMBER 1995 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
CL = 50 pF
(see Note A)
Open
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
Open
LOAD CIRCUIT
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
th
50% VCC
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
Output
Control
(low-level
enabling)
VCC
50% VCC
Input
50% VCC
0V
tPLH
tPHL
50% VCC
In-Phase
Output
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
tPLZ
tPZL
VOH
50% VCC
VOL
50% VCC
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
≈VCC
50% VCC
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
50% VCC
VCC
50% VCC
Output
Waveform 2
S1 at Open
(see Note B)
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74AC534DBLE
OBSOLETE
SSOP
DB
20
SN74AC534DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AC534NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74AC534NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534PWLE
OBSOLETE
TSSOP
PW
20
TBD
Call TI
SN74AC534PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC534PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
(1)
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2007
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AC534DBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74AC534DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74AC534PWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AC534DBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74AC534DWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74AC534PWR
TSSOP
PW
20
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated