Fiber Optic Transmitter and Receiver Data Links for 125 MBd Technical Data HFBR-1115T Transmitter HFBR-2115T Receiver Features Description • Full Compliance with the Optical Performance Requirements of the FDDI PMD Standard • Full Compliance with the Optical Performance Requirements of the ATM 100 Mbps Physical Layer • Full Compliance with the Optical Performance Requirements of the 100 Mbps Fast Ethernet Physical Layer • Other Versions Available for: - ATM - Fibre Channel • Compact 16-pin DIP Package with Plastic ST* Connector • Wave Solder and Aqueous Wash Process Compatible Package • Manufactured in an ISO 9001 Certified Facility The HFBR-1115/-2115 series of data links are high-performance, cost-efficient, transmitter and receiver modules for serial optical data communication applications specified at 100 Mbps for FDDI PMD or 100 BaseFX Fast Ethernet applications. Applications • FDDI Concentrators, Bridges, Routers, and Network Interface Cards • 100 Mbps ATM Interfaces • Fast Ethernet Interfaces • General Purpose, Point-toPoint Data Communications • Replaces DLT/R1040-ST1 Model Transmitters and Receivers These modules are designed for 50 or 62.5 µm core multi-mode optical fiber and operate at a nominal wavelength of 1300 nm. They incorporate our highperformance, reliable, longwavelength, optical devices and proven circuit technology to give long life and consistent performance. Transmitter The transmitter utilizes a 1300 nm surface-emitting InGaAsP LED, packaged in an optical subassembly. The LED is dc-coupled to a custom IC which converts differential-input, PECL logic signals, ECL-referenced (shifted) to a +5 V power supply, into an analog LED drive current. Receiver The receiver utilizes an InGaAs PIN photodiode coupled to a custom silicon transimpedance preamplifier IC. The PINpreamplifier combination is accoupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. Both the Data and Signal Detect Outputs are differential. Also, both Data and Signal Detect Outputs are PECL compatible, ECL-referenced (shifted) to a +5 V power supply. Package The overall package concept for the Data Links consists of the following basic elements: two optical subassemblies, two electrical subassemblies, and the outer housings as illustrated in Figure 1. *ST is a registered trademark of AT&T Lightguide Cable Connectors. 5965-3481E (8/96) 177 RECEIVER DIFFERENTIAL DATA IN DIFFERENTIAL SIGNAL DETECT OUT The package outline drawing and pinout are shown in Figures 2 and 3. The details of this package outline and pinout are compatible with other data-link modules from other vendors. PIN PHOTODIODE QUANTIZER IC PREAMP IC OPTICAL SUBASSEMBLIES ELECTRICAL SUBASSEMBLIES SIMPLEX ST® RECEPTACLE TRANSMITTER DIFFERENTIAL DATA IN VBB DRIVER IC LED TOP VIEW Figure 1. Transmitter and Receiver Block Diagram. THREADS 3/8 – 32 UNEF-2A HFBR-111X/211XT DATE CODE (YYWW) SINGAPORE 12.19 MAX. 8.31 41 MAX. 5.05 0.9 7.01 9.8 MAX. 5.0 2.45 19.72 NOTES: 1. MATERIAL ALLOY 194 1/2H – 0.38 THK FINISH MATTE TIN PLATE 7.6 µm MIN. 2. MATERIAL PHOSPHOR BRONZE WITH 120 MICROINCHES TIN LEAD (90/10) OVER 50 MICROINCHES NICKEL. 12 17.78 (7 x 2.54) 8 x 7.62 3. UNITS = mm HOUSING PINS 0.38 x 0.5 mm NOTE 1 PCB PINS DIA. 0.46 mm NOTE 2 Figure 2. Package Outline Drawing. 178 3 NC OPTICAL PORT 9 8 NC GND 10 7 NO PIN 9 8 NC NO PIN VCC 11 6 VCC 12 GND DATA 10 7 GND GND GND 11 6 VCC 5 GND GND 12 5 VCC 13 4 GND GND 13 4 VCC 14 3 GND SD 14 3 DATA SD 15 2 DATA NO PIN 16 1 NC DATA 15 2 VBB NC 16 1 NC NC TRANSMITTER RECEIVER Figure 3. Pinout Drawing. The optical subassemblies consist of a transmitter subassembly in which the LED resides and a receiver subassembly housing the PIN-preamplifier combination. The electrical subassemblies consist of a multi-layer printed circuit board on which the IC chips and various sufrace-mounted, passive circuit elements are attached. Each transmitter and receiver package includes an internal shield for the electrical subassembly to ensure low EMI emissions and high immunity to external EMI fields. The outer housing, including the ST* port, is molded of filled, nonconductive plastic to provide mechanical strength and electrical isolation. For other port styles, please contact your HewlettPackard Sales Representative. Each data-link module is attached to a printed circuit board via the 16-pin DIP interface. Pins 8 and 9 provide mechanical strength for these plastic-port devices and will provide port-ground for forthcoming metal-port modules. Application Information The Applications Engineering group of the Optical Communication Division is available to assist you with the technical understanding and design tradeoffs associated with these transmitter and receiver modules. You can contact them through your Hewlett-Packard sales representative. The following information is provided to answer some of the most common questions about the use of these parts. Transmitter and Receiver Optical Power Budget versus Link Length The Optical Power Budget (OPB) is the available optical power for a fiber-optic link to accommodate fiber cable losses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. Figure 4 illustrates the predicted OPB associated with the transmitter and receiver specified in this data sheet at the Beginning of Life (BOL). This curve represents the attenuation and chromatic plus modal dispersion losses associated with 62.5/125 µm and 50/125 µm fiber cables only. The area under the curve represents the remaining OPB at any link length, which is available for overcoming non-fiber cable related losses. OPB – OPTICAL POWER BUDGET – dB OPTICAL PORT 14 12 62.5/125 µm 10 8 6 50/125 µm 4 2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 FIBER OPTIC CABLE LENGTH – km Figure 4. Optical Power Budget at BOL vs. Fiber Optic Cable Length. Hewlett-Packard LED technology has produced 1300 nm LED devices with lower aging characteristics than normally associated with these technologies in the industry. The industry convention is 1.5 dB aging for 1300 nm LEDs; however, HP 1300 nm LEDs will experience less than 1 dB of aging over normal commercial equipment mission-life periods. Contact your HewlettPackard sales representative for additional details. Figure 4 was generated with a Hewlett-Packard fiber-optic link model containing the current industry conventions for fiber 179 Transmitter and Receiver Signaling Rate Range and BER Performance For purposes of definition, the symbol rate (Baud), also called signaling rate, is the reciprocal of the symbol time. Data rate (bits/ sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). When used in FDDI, ATM 100 Mbps, and Fast Ethernet applications, the performance of Hewlett-Packard’s 1300 nm HFBR1115/-2115 data link modules is guaranteed over the signaling rate of 10 MBd to 125 MBd to the full conditions listed in the individual product specification tables. The data link modules can be used for other applications at signaling rates outside of the 10 MBd to 125 MBd range with some penalty in the link optical power budget primarily caused by a reduction of receiver sensitivity. Figure 5 gives an indication of the typical performance of these 1300 nm products at different rates. 180 TRANSMITTER/RECEIVER RELATIVE OPTICAL POWER BUDGET AT CONSTANT BER (dB) Data Link Jitter Performance 3.0 The Hewlett-Packard 1300 nm data link modules are designed to operate per the system jitter allocations stated in Table E1 of Annex E of the FDDI PMD standard. 2.5 2.0 1.5 1.0 0.5 0 0 25 50 75 100 125 150 175 200 SIGNAL RATE (MBd) CONDITIONS: 1. PRBS 27-1 2. DATA SAMPLED AT CENTER OF DATA SYMBOL. 3. BER = 10-6 4. TA = 25° C 5. VCC = 5 Vdc 6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. Figure 5. Transmitter/Receiver Relative Optical Power Budget at Constant BER vs. Signaling Rate. These data link modules can also be used for applications which require different bit-error-ratio (BER) performance. Figure 6 illustrates the typical trade-off between link BER and the receiver input optical power level. 1 x 10-3 CENTER OF SYMBOL 1 x 10-4 1 x 10-5 1 x 10-6 1 x 10-7 1 x 10-8 2.5 x 10-10 1 x 10-11 1 x 10-12 -6 -4 -2 0 2 4 RELATIVE INPUT OPTICAL POWER – dB CONDITIONS: 1. 125 MBd 2. PRBS 27-1 3. TA = 25° C 4. VCC = 5 Vdc 5. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. Figure 6. Bit-Error-Ratio vs. Relative Receiver Input Optical Power. The 1300 nm transmitter will tolerate the worst-case input electrical jitter allowed in the table without violating the worst-case output jitter requirements of Section 8.1 Active Output Interface of the FDDI PMD standard. The 1300 nm receiver will tolerate the worst-case input optical jitter allowed in Section 8.2 Active Input Interface of the FDDI PMD standard without violating the worst-case output electrical jitter allowed in the Table E1 of the Annex E. The jitter specifications stated in the following transmitter and receiver specification table are derived from the values in Table E1 of Annex E. They represent the worst-case jitter contribution that the transmitter and receiver are allowed to make to the overall system jitter without violating the Annex E allocation example. In practice, the typical jitter contribution of the HewlettPackard data link modules is well below the maximum amounts. 1 x 10-2 BIT ERROR RATIO cable specifications and the FDDI PMD optical parameters. These parameters are reflected in the guaranteed performance of the transmitter and receiver specifications in this data sheet. This same model has been used extensively in the ANSI and IEEE committees, including the ANSI X3T9.5 committee, to establish the optical performance requirements for various fiber-optic interface standards. The cable parameters used come from the ISO/IEC JTC1/ SC 25/WG3 Generic Cabling for Customer Premises per DIS 11801 document and the EIA/TIA-568-A Commercial Building Telecommunications Cabling Standard per SP-2840. Recommended Handling Precautions It is advised that normal static precautions be taken in the handling and assembly of these data link modules to prevent damage which may be induced by electrostatic discharge (ESD). The HFBR-1115/-2115 series meets MIL-STD-883C Method 3015.4 Class 2. Care should be taken to avoid shorting the receiver Data or Signal Detect Outputs directly to ground without proper currentlimiting impedance. These data link modules are compatible with either industry standard wave- or hand-solder processes. Solder and Wash Process Compatibility The data link modules are packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage. Rx Tx * L2 1 +5 Vdc C2 0.1 GND It is important to take care in the layout of your circuit board to achieve optimum performance from these data link modules. Figure 7 provides a good example of a power supply filter circuit that works well with these parts. Also, suggested signal terminations for the Data, Data-bar, Signal Detect and Signal Detect-bar lines are shown. Use of a multilayer, ground-plane printed circuit board will provide good high-frequency Shipping Container The transmitter and receiver are delivered with protective process caps covering the individual ST* ports. These process caps protect the optical subassemblies during wave solder and aqueous wash processing and act as dust covers during shipping. A Board Layout–Interface Circuit and Layout Guidelines 9 NC NC 8 10 GND NO 7 PIN 11 VCC * * 9 NC NC 8 GND 7 GND 6 10 NO PIN 11 GND 12 VCC GND 5 12 GND VCC 5 VCC 4 * L1 1 VCC 6 C1 0.1 C7 10 (OPTIONAL) C3 0.1 C4 10 A 13 GND GND 4 13 GND DATA 14 D GND 3 14 SD D 3 DATA DATA 15 D VBB 2 15 SD D 2 DATA NC 1 NO 16 PIN NC 1 R3 82 R2 82 R4 130 R1 130 16 NC R7 82 C6 0.1 R5 82 R8 130 R6 130 R9 82 C5 0.1 R11 82 SD SD TERMINATE D, D AT Tx INPUTS TOP VIEWS R10 130 R12 130 TERMINATE D, D, SD, SD AT INPUTS OF FOLLOW-ON DEVICES NOTES: 1. RESISTANCE IS IN OHMS. CAPACITANCE IS IN MICROFARADS. INDUCTANCE IS IN MICROHENRIES. 2. TERMINATE TRANSMITTER INPUT DATA AND DATA-BAR AT THE TRANSMITTER INPUT PINS. TERMINATE THE RECEIVER OUTPUT DATA, DATA-BAR, AND SIGNAL DETECTBAR AT THE FOLLOW-ON DEVICE INPUT PINS. FOR LOWER POWER DISSIPATION IN THE SIGNAL DETECT TERMINATION CIRCUITRY WITH SMALL COMPROMISE TO THE SIGNAL QUALITY, EACH SIGNAL DETECT OUTPUT CAN BE LOADED WITH 510 OHMS TO GROUND INSTEAD OF THE TWO RESISTOR, SPLIT-LOAD PECL TERMINATION SHOWN IN THIS SCHEMATIC. 3. MAKE DIFFERENTIAL SIGNAL PATHS SHORT AND OF SAME LENGTH WITH EQUAL TERMINATION IMPEDANCE. 4. SIGNAL TRACES SHOULD BE 50 OHMS MICROSTRIP OR STRIPLINE TRANSMISSION LINES. USE MULTILAYER, GROUND-PLANE PRINTED CIRCUIT BOARD FOR BEST HIGHFREQUENCY PERFORMANCE. 5. USE HIGH-FREQUENCY, MONOLITHIC CERAMIC BYPASS CAPACITORS AND LOW SERIES DC RESISTANCE INDUCTORS. RECOMMEND USE OF SURFACE-MOUNT COIL INDUCTORS AND CAPACITORS. IN LOW NOISE POWER SUPPLY SYSTEMS, FERRITE BEAD INDUCTORS CAN BE SUBSTITUTED FOR COIL INDUCTORS. LOCATE POWER SUPPLY FILTER COMPONENTS CLOSE TO THEIR RESPECTIVE POWER SUPPLY PINS. C7 IS AN OPTIONAL BYPASS CAPACITOR FOR IMPROVED, LOW-FREQUENCY NOISE POWER SUPPLY FILTER PERFORMANCE. 6. DEVICE GROUND PINS SHOULD BE DIRECTLY AND INDIVIDUALLY CONNECTED TO GROUND. 7. CAUTION: DO NOT DIRECTLY CONNECT THE FIBER-OPTIC MODULE PECL OUTPUTS (DATA, DATA-BAR, SIGNAL DETECT, SIGNAL DETECT-BAR, VBB) TO GROUND WITHOUT PROPER CURRENT LIMITING IMPEDANCE. 8. (*) OPTIONAL METAL ST OPTICAL PORT TRANSMITTER AND RECEIVER MODULES WILL HAVE PINS 8 AND 9 ELECTRICALLY CONNECTED TO THE METAL PORT ONLY AND NOT CONNECTED TO THE INTERNAL SIGNAL GROUND. Figure 7. Recommended Interface Circuitry and Power Supply Filter Circuits. 181 circuit performance with a low inductance ground return path. See additional recommendations noted in the interface schematic shown in Figure 7. Board Layout–Hole Pattern The Hewlett-Packard transmitter and receiver hole pattern is compatible with other data link modules from other vendors. The drawing shown in Figure 8 can be used as a guide in the mechanical layout of your circuit board. Regulatory Compliance These data link modules are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of Information Technology Equipment. Additional information is available from your Hewlett-Packard sales representative. All HFBR-1115T LED transmitters are classified as IEC-825-1 Accessible Emission Limit (AEL) Class 1 based upon the current proposed draft scheduled to go (16X) ø 0.8 ± 0.1 .032 ± .004 –A– Ø 0.000 M A 17.78 .700 (7X) 2.54 .100 7.62 .300 TOP VIEW UNITS = mm/INCH Figure 8. Recommended Board Layout Hole Pattern. 182 into effect on January 1, 1997. AEL Class 1 LED devices are considered eye safe. See Application Note 1094, LED Device Classifications with Respect to AEL Values as Defined in the IEC 825-1 Standard and the European EN60825-1 Directive. The material used for the housing in the HFBR-1115/-2115 series is Ultem 2100 (GE). Ultem 2100 is recognized for a UL flammability rating of 94V-0 (UL File Number E121562) and the CSA (Canadian Standards Association) equivalent (File Number LS88480). 180 4.40 1.975 1.25 3.0 4.850 1.5 10.0 160 2.0 140 2.5 120 1.025 1.00 0.975 0.90 3.5 tr/f – TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES – ns 3.0 RELATIVE AMPLITUDE ∆λ – TRANSMITTER OUTPUT OPTICAL SPECTRAL WIDTH (FWHM) –nm 200 3.5 100 1280 1300 1320 1340 1360 1380 λC – TRANSMITTER OUTPUT OPTICAL CENTER WAVELENGTH –nm HFBR-1115T FDDI TRANSMITTER TEST RESULTS OF λC, ∆λ AND tr/f ARE CORRELATED AND COMPLY WITH THE ALLOWED SPECTRAL WIDTH AS A FUNCTION OF CENTER WAVELENGTH FOR VARIOUS RISE AND FALL TIMES. 1.525 0.525 5.6 0.075 100% TIME INTERVAL 40 ± 0.7 0.50 ± 0.725 ± 0.725 0% TIME INTERVAL 0.10 0.025 0.0 -0.025 -0.05 Figure 9. HFBR-1115T Transmitter Output Optical Spectral Width (FWHM) vs. Transmitter Output Optical Center Wavelength and Rise/ Fall Times. 0.075 5.6 10.0 1.525 0.525 4.850 80 ± 500 ppm 1.975 4.40 TIME – ns THE HFBR-1115T OUTPUT OPTICAL PULSE SHAPE FITS WITHIN THE BOUNDARIES OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTS. -31.0 dBm 5 3 2.5 x 10-10 BER 2 1.0 x 10-12 BER 0 -3 -2 -1 0 1 PA (PO + 1.5 dB < PA < -31.0 dBm) INPUT OPTICAL POWER (> 1.5 dB STEP INCREASE) PO = MAX (PS OR -45.0 dBm) (PS = INPUT POWER FOR BER < 102) INPUT OPTICAL POWER (> 4.0 dB STEP DECREASE) -45.0 dBm 1 -4 MIN (PO + 4.0 dB OR -31.0 dBm) OPTICAL POWER 4 2 3 4 EYE SAMPLING TIME POSITION (ns) CONDITIONS: 1.TA = 25° C 2. VCC = 5 Vdc 3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns. 4. INPUT OPTICAL POWER IS NORMALIZED TO CENTER OF DATA SYMBOL. 5. NOTE 21 AND 22 APPLY. Figure 11. HFBR-2115T Receiver Relative Input Optical Power vs. Eye Sampling Time Position. SIGNAL DETECT OUTPUT RELATIVE INPUT OPTICAL POWER – dB Figure 10. Output Optical Pulse Envelope. AS – MAX ANS – MAX SIGNAL – DETECT (ON) SIGNAL – DETECT (OFF) TIME AS – MAX — MAXIMUM ACQUISITION TIME (SIGNAL). AS – MAX IS THE MAXIMUM SIGNAL – DETECT ASSERTION TIME FOR THE STATION. AS – MAX SHALL NOT EXCEED 100.0 µs. THE DEFAULT VALUE OF AS – MAX IS 100.0 µs. ANS – MAX — MAXIMUM ACQUISITION TIME (NO SIGNAL). ANS – MAX IS THE MAXIMUM SIGNAL – DETECT DEASSERTION TIME FOR THE STATION. ANS – MAX SHALL NOT EXCEED 350 µs. THE DEFAULT VALUE OF AS – MAX IS 350 µs. Figure 12. Signal Detect Thresholds and Timing. 183 HFBR-1115T Transmitter Pin-Out Table Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol NC VBB GND GND GND GND OMIT NC NC GND VCC VCC GND DATA DATA NC Functional Description No internal connect, used for mechanical strength only VBB Bias output Ground Ground Ground Ground No pin No internal connect, used for mechanical strength only No internal connect, used for mechanical strength only Ground Common supply voltage Common supply voltage Ground Data input Inverted Data input No internal connect, used for mechanical strength only Reference Note 3 Note 3 Note 3 Note 3 Note 5 Note 5 Note 3 Note 1 Note 1 Note 3 Note 4 Note 4 HFBR-2115T Receiver Pin-Out Table Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Symbol NC DATA DATA VCC VCC VCC GND NC NC OMIT GND GND GND SD SD OMIT Functional Description No internal connect, used for mechanical strength only Inverted Data input Data input Common supply voltage Common supply voltage Common supply voltage Ground No internal connect, used for mechanical strength only No internal connect, used for mechanical strength only No pin Ground Ground Ground Signal Detect Inverted Signal Detect No pin Reference Note 4 Note 4 Note 1 Note 1 Note 1 Note 3 Note 5 Note 5 Note 3 Note 3 Note 3 Note 2, 4 Note 2, 4 Notes: 1. Voltages on VCC must be from the same power supply (they are connected together internally). 2. Signal Detect is a logic signal that indicates the presence or absence of an input optical signal. A logic-high, VOH, on Signal Detect indicates presence of an input optical signal. A logic-low, VOL, on Signal Detect indicates an absence of input optical signal. 3. All GNDs are connected together internally and to the internal shield. 4. DATA, DATA, SD, SD are open-emitter output circuits. 5. On metal-port modules, these pins are redefined as “Port Connection.” 184 Specifications–Absolute Maximum Ratings Parameter Storage Temperature Lead Soldering Temperature Lead Soldering Time Supply Voltage Data Input Voltage Differential Input Voltage Output Current Symbol TS TSOLD tSOLD VCC VI VD IO Min. -40 Typ. -0.5 -0.5 Max. 100 260 10 7.0 VCC 1.4 50 Unit °C °C sec. V V V mA Reference Max. 70 5.5 -1.475 -0.880 Unit °C V V V Ω MBd Reference Reference Note 4 Note 7 Note 5 350 Unit mA W V µA µA Unit mA W V V ns ns V Reference Note 6 Note 7 Note 8 Note 8 Note 9 Note 9 Note 8 Note 1 Recommended Operating Conditions Parameter Ambient Operating Temperature Supply Voltage Data Input Voltage–Low Data Input Voltage–High Data and Signal Detect Output Load Signaling Rate Symbol TA VCC VIL - VCC VIH - VCC RL fS Min. 0 4.5 -1.810 -1.165 10 Typ. 50 125 Note 2 Note 3 Figure 5 HFBR-1115T Transmitter Electrical Characteristics (TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V) Parameter Supply Current Power Dissipation Threshold Voltage Data Input Current–Low Data Input Current–High Symbol ICC PDISS VBB - VCC IIL I IH Min. -1.42 -350 Typ. 145 0.76 -1.3 0 14 Max. 185 1.1 -1.24 HFBR-2115T Receiver Electrical Characteristics (TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V) Parameter Supply Current Power Dissipation Data Output Voltage–Low Data Output Voltage–High Data Output Rise Time Data Output Fall Time Signal Detect Output Voltage–Low (De-asserted) Signal Detect Output Voltage–High (Asserted) Signal Detect Output Rise Time Signal Detect Output Fall Time Symbol ICC PDISS VOL - VCC VOH - VCC tr tf VOL - VCC Min. Typ. 82 0.3 -1.840 -1.045 0.35 0.35 -1.840 Max. 145 0.5 -1.620 -0.880 2.2 2.2 -1.620 VOH - VCC -1.045 -0.880 V Note 8 tr tf 0.35 0.35 2.2 2.2 ns ns Note 9 Note 9 185 HFBR-1115T Transmitter Optical Characteristics (TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V) Parameter Output Optical Power 62.5/125 µm, NA = 0.275 Fiber Output Optical Power 50/125 µm, NA = 0.20 Fiber Optical Extinction Ratio Symbol PO, BOL PO, EOL PO, BOL PO, EOL Output Optical Power at Logic “0” State PO(“0”) Min. -19 -20 -22.5 -23.5 Typ. -16.8 1308 1380 Unit dBm avg. dBm avg. % dB dBm avg. nm 137 170 nm 0.6 1.0 3.0 ns 0.6 2.1 3.0 ns DCD 0.02 0.6 ns p-p DDJ 0.02 0.6 ns p-p Note 16 Figure 9 Note 16 Figure 9 Note 16, 17 Figure 9, 10 Note 16, 17 Figure 9, 10 Note 18 Figure 10 Note 19 RJ 0 0.69 ns p-p Note 20 -20.3 0.001 -50 Center Wavelength λC Spectral Width–FWHM ∆λ Optical Rise Time tr Optical Fall Time tf Duty Cycle Distortion Contributed by the Transmitter Data Dependent Jitter Contributed by the Transmitter Random Jitter Contributed by the Transmitter 1270 Max. -14 -14 -14 -14 0.03 -35 -45 Reference Note 13 Note 13 Note 14 Note 15 HFBR-2115T Receiver Optical and Electrical Characteristics (TA = 0°C to 70°C, VCC = 4.5 V to 5.5 V) Parameter Symbol Input Optical Power PIN Min. (W) Minimum at Window Edge Input Optical Power Minimum at Eye Center Input Optical Power Maximum Operating Wavelength Min. PIN Min. (C) PIN Max. -14 λ 1270 Typ. -33.5 Max. -31 Unit dBm avg. Reference Note 21, Figure 11 -34.5 -31.8 dBm avg. Note 22, Figure 8 dBm avg. Note 21 -11.8 1380 nm Duty Cycle Distortion Contributed by the Receiver DCD 0.02 0.4 ns p-p Note 10 Data Dependent Jitter Contributed by the Receiver DDJ 0.35 1.0 ns p-p Note 11 Random Jitter Contributed by the Receiver RJ 1.0 2.14 ns p-p Note 12 Signal Detect–Asserted PA PD+1.5 dB -33 dBm avg. Note 23, 24 Figure 9 Signal Detect–De-asserted PD -45 dBm avg. Note 25, 26 Figure 12 Signal Detect–Hysteresis PA-PD 1.5 2.4 dB Figure 9 Signal Detect Assert Time (off to on) AS_Max 0 55 100 µs Note 23, 24 Figure 12 ANS_Max 0 110 350 µs Note 25, 26 Figure 12 Signal Detect De-assert Time (on to off) 186 Notes: 1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs to prevent damage to the input ESD protection circuit. 2. The outputs are terminated with 50 Ω connected to VCC - 2 V. 3. The specified signaling rate of 10 MBd to 125 MBd guarantees operation of the transmitter and receiver link to the full conditions listed in the FDDI Physical Layer Medium Dependent standard. Specifically, the link bit-error-ratio will be equal to or better than 2.5 x 10-10 for any valid FDDI pattern. The transmitter section of the link is capable of dc to 125 MBd. The receiver is internally ac-coupled which limits the lower signaling rate to 10 MBd. For purposes of definition, the symbol rate (Baud), also called signaling rate, fs, is the reciprocal of the symbol time. Data rate (bits/sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). 4. The power supply current needed to operate the transmitter is provided to differential ECL circuitry. This circuitry maintains a nearly constant current flow from the power supply. Constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 5. This value is measured with an output load RL = 10 kΩ. 6. This value is measured with the outputs terminated into 50 Ω connected to VCC - 2 V and an Input Optical Power level of -14 dBm average. 7. The power dissipation value is the power dissipated in the transmitter and receiver itself. Power dissipation is calculated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 8. This value is measured with respect to VCC with the output terminated into 50 Ω connected to VCC - 2 V. 9. The output rise and fall times are measured between 20% and 80% levels with the output connected to VCC - 2 V through 50 Ω. 10. Duty Cycle Distortion contributed by the receiver is measured at the 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power 11. 12. 13. 14. level is -20 dBm average. See Application Information–Data Link Jitter Section for further information. Data Dependent Jitter contributed by the receiver is specified with the FDDI DDJ test pattern described in the FDDI PMD Annex A.5. The input optical power level is -20 dBm average. See Application Information–Data Link Jitter Section for further information. Random Jitter contributed by the receiver is specified with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. The input optical power level is at the maximum of “PIN Min. (W).” See Application Information–Data Link Jitter Section for further information. These optical power values are measured with the following conditions: • The Beginning of Life (BOL) to the End of Life (EOL) optical power degradation is typically 1.5 dB per the industry convention for long wavelength LEDs. The actual degradation observed in HewlettPackard’s 1300 nm LED products is < 1dB, as specified in this data sheet. • Over the specified operating voltage and temperature ranges. • With HALT Line State, (12.5 MHz square-wave), input signal. • At the end of one meter of noted optical fiber with cladding modes removed. The average power value can be converted to a peak power value by adding 3 dB. Higher output optical power transmitters are available on special request. The Extinction Ratio is a measure of the modulation depth of the optical signal. The data “0” output optical power is compared to the data “1” peak output optical power and expressed as a percentage. With the transmitter driven by a HALT Line State (12.5 MHz square-wave) signal, the average optical power is measured. The data “1” peak power is then calculated by adding 3 dB to the measured average optical power. The data “0” output optical power is found by measuring the optical power when the transmitter is driven by a logic “0” input. The extinction ratio is the ratio of the optical power at the “0” level compared to the optical power at the “1” level expressed as a percentage or in decibels. 15. The transmitter provides compliance with the need for Transmit_Disable commands from the FDDI SMT layer by providing an Output Optical Power level of <-45 dBm average in response to a logic “0” input. This specification applies to either 62.5/ 125 µm or 50/125 µm fiber cables. 16. This parameter complies with the FDDI PMD requirements for the tradeoffs between center wavelength, spectral width, and rise/fall times shown in Figure 9. 17. This parameter complies with the optical pulse envelope from the FDDI PMD shown in Figure 10. The optical rise and fall times are measured from 10% to 90% when the transmitter is driven by the FDDI HALT Line State (12.5 MHz square-wave) input signal. 18. Duty Cycle Distortion contributed by the transmitter is measured at a 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Application Information–Data Link Jitter Performance Section of this data sheet for further details. 19. Data Dependent Jitter contributed by the transmitter is specified with the FDDI test pattern described in FDDI PMD Annex A.5. See Application Information–Data Link Jitter Performance Section of this data sheet for further details. 20. Random Jitter contributed by the transmitter is specified with an IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See Application Information–Data Link Jitter Performance Section of this data sheet for further details. 21. This specification is intended to indicate the performance of the receiver when Input Optical Power signal characteristics are present per the following definitions. The Input Optical Power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a Bit-Error-Ratio (BER) better than or equal to 2.5 x 10-10. • At the Beginning of Life (BOL). • Over the specified operating voltage and temperature ranges. • Input symbol pattern is the FDDI test pattern defined in FDDI PMD Annex A.5 with 4B/5B NRZI encoded data that contains a dutycycle base-line wander effect of 187 50 kHz. This sequence causes a near worst-case condition for intersymbol interference. • Receiver data window time-width is 2.13 ns or greater and centered at mid-symbol. This worst-case window time-width is the minimum allowed eye-opening presented to the FDDI PHY PM_Data indication input (PHY input) per the example in FDDI PMD Annex E. This minimum window time-width of 2.13 ns is based upon the worstcase FDDI PMD Active Input Interface optical conditions for peak-to-peak DCD (1.0 ns), DDJ (1.2 ns) and RJ(0.76 ns) presented to the receiver. To test a receiver with the worst-case FDDI PMD Active Input jitter condition requires exacting control over DCD, DDJ, and RJ jitter components that is difficult to implement with production test equipment. The receiver can be equivalently tested to the worst-case FDDI PMD input jitter conditions and meet the minimum output data window time-width of 2.13 ns. This is accomplished by using a nearly ideal input optical signal (no DCD, insignificant DDJ and RJ) and measuring for a wider window timewidth of 4.6 ns. This is possible due to the cumulative effect of jitter 188 components through their superposition (DCD and DDJ are directly additive and RJ components are rms additive). Specifically, when a nearly ideal input optical test signal is used and the maximum receiver peak-to-peak jitter contributions of DCD (0.4 ns), DDJ (1.0 ns), and RJ (2.14 ns) exist, the minimum window time-width becomes 8.0 ns - 0.4 ns 1.0 ns - 2.14 ns = 4.46 ns, or conservatively 4.6 ns. This wider window time-width of 4.6 ns guarantees the FDDI PMD Annex E minimum window time-width of 2.13 ns under worst-case input jitter conditions to the Hewlett-Packard receiver. 22. All conditions of Note 21 apply except that the measurement is made at the center of the symbol with no window time-width. 23. This value is measured during the transition from low to high levels of input optical power. 24. The Signal Detect output shall be asserted, logic-high (VOH), within 100 µs after a step increase of the Input Optical Power. The step will be from a low Input Optical Power, ≤ -45 dBm, into the range between greater than PA, and -14 dBm. The BER of the receiver output will be 10-2 or better during the time, LS_Max (15 µs) after Signal Detect has been asserted. See Figure 12 for more information. 25. This value is measured during the transition from high to low levels of input optical power. The maximum value will occur when the input optical power is either -45 dBm average or when the input optical power yields a BER of 10-2 or better, whichever power is higher. 26. Signal Detect output shall be deasserted, logic-low (VOL), within 350 µs after a step decrease in the Input Optical power from a level which is the lower of -31 dBm or PD + 4 dB (PD is the power level at which Signal Detect was de-asserted), to a power level of -45 dBm or less. This step decrease will have occurred in less than 8 ns. The receiver output will have a BER of 10-2 or better for a period of 12 µs or until signal detect is de-asserted. The input data stream is the Quiet Line State. Also, Signal Detect will be de-asserted within a maximum of 350 µs after the BER of the receiver output degrades above 10-2 for an input optical data stream that decays with a negative ramp function instead of a step function. See Figure 12 for more information.