TI ADS1174IPAPT

 AD
ADS1174
ADS1178
AD
S1
174
S1
17
8
SBAS373 – OCTOBER 2007
Quad/Octal, Simultaneous Sampling, 16-Bit Analog-to-Digital Converters
FEATURES
1
APPLICATIONS
•
•
•
•
3-Phase Power Monitors
Defibrillators and ECG Monitors
Coriolis Flow Meters
Vibration/Modal Analysis
VREFP VREFN
Input1
DS
Input2
DS
Input3
DS
Input4
DS
AVDD
DVDD
The ADS1174 (quad) and ADS1178 (octal) are
multiple delta-sigma (ΔΣ) analog-to-digital converters
(ADCs) with data rates up to 52k samples-per-second
(SPS), which allow synchronous sampling of four and
eight channels. These devices use identical
packages, permitting drop-in expandability.
The delta-sigma architecture offers near ideal 16-bit
ac performance (97dB SNR, –105dB THD, 1LSB
linearity) combined with 0.005dB passband ripple,
and linear phase response.
The high-order, chopper- stabilized modulator
achieves very low drift (4μV/°C offset, 4ppm/°C gain)
and low noise (1LSBPP). The on-chip finite impulse
response (FIR) filter provides a usable signal
bandwidth up to 90% of the Nyquist rate with 100dB
of stop band attenuation while suppressing modulator
and signal out-of-band noise.
Two operating modes allow for optimization of speed
and power: High-speed mode (32mW/Ch at 52kSPS),
and Low-power mode (8mW/Ch at 10kSPS).
A SYNC input control pin allows the device
conversions to be started and synchronized to an
external event. SPI and Frame-Sync serial interfaces
are supported. The device is fully specified over the
extended industrial range (–40°C to +105°C) and is
available in an HTQFP-64 PowerPAD™ package.
IOVDD
SPI
and
FrameSync
Interface
Four
Digital
Filters
Control
Logic
AGND
DESCRIPTION
DGND
ADS1174
VREFP VREFN AVDD
DRDY/FSYNC
SCLK
DOUT[4:1]
DIN
TEST[1:0]
FORMAT[2:0]
CLK
SYNC
PWDN[4:1]
CLKDIV
MODE
Input1
DS
Input2
DS
Input3
DS
Input4
DS
Input5
DS
Input6
DS
Input7
DS
Input8
DS
AGND
DVDD
IOVDD
SPI
and
FrameSync
Interface
DRDY/FSYNC
SCLK
DOUT[8:1]
DIN
Control
Logic
TEST[1:0]
FORMAT[2:0]
CLK
SYNC
PWDN[8:1]
CLKDIV
MODE
Eight
Digital
Filters
DGND
ADS1178
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
SPI is a trademark of Motorola, Inc.
All other trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2007, Texas Instruments Incorporated
PRODUCT PREVIEW
• Synchronously Sample Four/Eight Channels
• Selectable Operating Modes:
High-Speed: 52kSPS Data Rate, 30mW/ch
Low-Power: 10kSPS Data Rate, 8mW/ch
• AC Performance:
25kHz Bandwidth
97dB SNR
–105dB THD
• Digital Filter:
Linear Phase Response
Passband Ripple: ±0.005dB
Stop Band Attenuation: 100dB
• Selectable SPI™ or Frame Sync Serial
Interface
• Simple Pin-Driven Control
• Low Sampling Aperture Error
• Specified from –40°C to +105°C
• Analog Supply: 5V
• I/O Supply: 1.8V to 3.3V
• Digital Core Supply: 1.8V
234
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
ADS1174, ADS1178
UNIT
AVDD to AGND
–0.3 to +6.0
V
DVDD, IOVDD to DGND
–0.3 to +3.6
V
AGND to DGND
–0.3 to +0.3
V
100, Momentary
mA
10, Continuous
mA
Analog Input to AGND
–0.3 to AVDD + 0.3
V
Digital Input or Output to DGND
–0.3 to DVDD + 0.3
V
Input Current
PRODUCT PREVIEW
+150
°C
Operating Temperature Range
–40 to +105
°C
Storage Temperature Range
–60 to +150
°C
Maximum Junction Temperature
(1)
2
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
ELECTRICAL CHARACTERISTICS
All specifications at TA = –40°C to +105°C, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V,
VREFN = 0V, and all channels active, unless otherwise noted.
ADS1174, ADS1178
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUTS
Full-scale input voltage (FSR (1))
VIN = (AINP – AINN)
Absolute input voltage
AINP or AINN to AGND
Common-mode input voltage
VCM = (AINP + AINN)/2
Differential input impedance
±VREF
AGND – 0.1
V
AVDD + 0.1
V
2.5
V
High-Speed mode
28
kΩ
Low-Power mode
140
kΩ
DC PERFORMANCE
Data rate (fDATA)
No missing codes
16
High-Speed mode
Low-Power mode
SPS
10,547
Integral nonlinearity (INL)
Differential input
Offset error
Offset drift
SPS
0.5
TBD
0.150
TBD
LSB
mV
μV/°C
1.8
Offset match
TBD
Gain error
0.1
Gain drift
mV
TBD
2
Gain match
%
ppm/°C
TBD
Noise
Shorted input
Common-mode rejection
Power-supply rejection
Bits
52,734
1
PRODUCT PREVIEW
Resolution
%
TBD
LSBPP
fCM = 60Hz
100
dB
AVDD
f = 60Hz
80
dB
DVDD
f = 60Hz
80
dB
VIN = 1kHz, –0.5dBFS
107
dB
AC PERFORMANCE
Crosstalk
Sampling aperture match
Signal-to-noise ratio (SNR) (unweighted)
Total harmonic distortion (THD) (2)
High-Speed mode
VIN = 1kHz, –0.5dBFS
Spurious-free dynamic range
200
ps
97
dB
–105
dB
–108
Passband ripple
Passband
–3dB Bandwidth
Stop band attenuation
Hz
0.49 fDATA
Hz
dB
0.547 fDATA
Group delay
Settling time (latency)
Complete settling
dB
0.453 fDATA
100
Stop band
(1)
(2)
dB
±0.005
63.453 fDATA
Hz
38/fDATA
s
76/fDATA
s
FSR = full-scale range = 2VREF
THD includes the first nine harmonics of the input signal.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
3
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
ELECTRICAL CHARACTERISTICS (continued)
All specifications at TA = –40°C to +105°C, AVDD = +5V, DVDD = +1.8V, IOVDD = +3.3V, fCLK = 27MHz, VREFP = 2.5V,
VREFN = 0V, and all channels active, unless otherwise noted.
ADS1174, ADS1178
PARAMETER
TEST CONDITIONS
MIN
TYP
0.5
2.5
MAX
UNIT
VOLTAGE REFERENCE INPUTS
Reference input voltage (VREF)
3.1
V
Negative reference input (VREFN)
VREF = VREFP – VREFN
AGND – 0.1
VREFP – 0.5
V
Positive reference input (VREFP)
VREFN + 0.5
AVDD + 0.1
ADS1174
Reference Input impedance
High-Speed mode
Low-Power mode
13
ADS1178
Reference Input impedance
High-Speed mode
1.3
Low-Power mode
6.5
V
2.6
kΩ
kΩ
DIGITAL INPUT/OUTPUT (IOVDD = 1.8V to 3.6V)
VIH
0.7 IOVDD
IOVDD
V
VIL
DGND
0.3 IOVDD
V
IOH = 5mA
0.8 IOVDD
IOVDD
V
IOL = 5mA
DGND
0.2 IOVDD
V
±10
μA
27
MHz
VOH
VOL
Input leakage
0 < VIN DIGITAL < IOVDD
PRODUCT PREVIEW
Master clock rate (fCLK)
0.1
POWER SUPPLY
AVDD
4.75
5
5.25
V
DVDD
1.65
1.8
1.95
V
IOVDD
1.65
3.3
3.6
V
High-Speed mode
22
TBD
mA
Low-Power mode
5
TBD
mA
Power-Down mode
1
TBD
μA
High-Speed mode
40
TBD
mA
Low-Power mode
9
TBD
mA
Power-Down mode
1
TBD
μA
High-Speed mode
9
TBD
mA
Low-Power mode
mA
ADS1174
AVDD current
ADS1178
AVDD current
ADS1174
DVDD current
ADS1178
DVDD current
2.5
TBD
Power-Down mode
1
TBD
μA
High-Speed mode
17
TBD
mA
Low-Power mode
4.5
TBD
mA
1
TBD
μA
High-Speed mode
100
TBD
μA
Low-Power mode
100
TBD
μA
1
TBD
μA
High-Speed mode
150
TBD
μA
Low-Power mode
150
TBD
μA
1
TBD
μA
125
TBD
mW
Power-Down mode
ADS1174
IOVDD current
Power-Down mode
ADS1178
IOVDD current
Power-Down mode
ADS1174
Power dissipation
High-Speed mode
Low-Power mode
32
TBD
mW
ADS1178
Power dissipation
High-Speed mode
225
TBD
mW
Low-Power mode
60
TBD
mW
4
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
ADS1174/ADS1178 PIN ASSIGNMENTS
AGND
AVDD
AINN5(1)
AINP5(1)
AINN6(1)
AINP6(1)
54
53
52
51
50
49
AINP2
1
48
AINN7(1)
AINN2
2
47
AINP7(1)
AINP1
3
46
AINN8(1)
AINN1
4
45
AINP8(1)
AVDD
5
44
AVDD
AGND
6
43
AGND
DGND
7
42
PWDN1
TEST0
8
41
PWDN2
TEST1
9
40
PWDN3
39
PWDN4
ADS1174/ADS1178
NOTE: (1) Boldface pin names are for ADS1178 only;
see pin descriptions.
CLKDIV
10
SYNC
11
38
PWDN5(1)
DIN
12
37
PWDN6(1)
DOUT8(1)
13
36
PWDN7(1)
DOUT7(1)
14
35
PWDN8(1)
DOUT6(1)
15
34
MODE
DOUT5(1)
16
33
IOVDD
23
24
25
26
27
28
29
30
IOVDD
DGND
DGND
DVDD
CLK
SCLK
DRDY/FSYNC
FORMAT2
32
22
IOVDD
FORMAT0
21
DGND
31
20
DOUT1
FORMAT1
19
18
DOUT3
DOUT2
17
DOUT4
(PowerPAD Outline)
PRODUCT PREVIEW
VREFP
VREFN
57
VCOM
AGND
58
55
AGND
59
56
AINP4
AVDD
AINN4
62
60
AINP3
63
61
AINN3
64
PAP PACKAGE
HTQFP-64
(TOP VIEW)
ADS1174/ADS1178 PIN DESCRIPTIONS
PIN
NAME
NO.
FUNCTION
AGND
6, 43, 54,
58, 59
DESCRIPTION
Analog ground
AINP1
3
Analog input
AINP2
1
Analog input
AINP3
63
Analog input
AINP4
61
Analog input
AINP5
51
Analog input
AINP6
49
Analog input
AINP7
47
Analog input
AINP8
45
Analog input
Analog ground; connect to DGND using a single plane.
ADS1178: AINP[8:1] Positive analog input, channels 8 through 1.
ADS1174: AINP[8:5] Connected to internal ESD rails. The inputs may float.
AINP[4:1] Positive analog input, channels 4 through 1.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
5
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
ADS1174/ADS1178 PIN DESCRIPTIONS (continued)
PIN
PRODUCT PREVIEW
6
NAME
NO.
FUNCTION
AINN1
4
Analog input
DESCRIPTION
AINN2
2
Analog input
AINN3
64
Analog input
AINN4
62
Analog input
AINN5
52
Analog input
AINN6
50
Analog input
AINN7
48
Analog input
AINN8
46
Analog input
AVDD
5, 44, 53, 60
Analog power supply
ADS1178: AINN[8:1] Negative analog input, channels 8 through 1.
ADS1174: AINN[8:5] Connected to internal ESD rails. The inputs may float.
AINN[4:1] Negative analog input, channels 4 through 1.
Analog power supply (4.75V to 5.25V).
VCOM
55
Analog output
AVDD/2 Unbuffered analog output.
VREFN
57
Analog input
Negative reference input.
VREFP
56
Analog input
Positive reference input.
CLK
27
Digital input
Master clock input (maximum 27MHz).
CLKDIV
10
Digital input
DGND
7, 21, 24, 25
Digital ground
DIN
12
Digital input
DOUT1
20
Digital output
DOUT2
19
Digital output
DOUT3
18
Digital output
DOUT4
17
Digital output
DOUT5
16
Digital output
DOUT6
15
Digital output
DOUT7
14
Digital output
DOUT8
13
Digital output
DRDY/
FSYNC
29
Digital input/output
CLK input divider control:
1 = 27MHz
0 = 13.5MHz (high-speed) / 5.4MHz (low-power)
Digital ground power supply.
Daisy-chain data input.
DVDD
26
Digital power supply
FORMAT0
32
Digital input
FORMAT1
31
Digital input
DOUT1 is TDM data output (TDM mode).
ADS1178: DOUT[8:1] Data output for channels 8 through 1.
ADS1174: DOUT[8:5] Internally connected to active circuitry; outputs are driven.
DOUT[4:1] Data output for channels 4 through 1.
Frame-Sync protocol: frame clock input; SPI protocol: data ready output.
Digital core power supply (+1.65V to +1.95V).
FORMAT[2:0] Selects between Frame-Sync/SPI protocol, TDM/discrete data
outputs, fixed/dynamic position TDM data, and modulator mode/normal operating
mode.
FORMAT2
30
Digital input
IOVDD
22, 23, 33
Digital power supply
MODE
34
Digital input
I/O power supply (+1.65V to +3.6V).
MODE:
0 = High-Speed mode
1 = Low-Power mode.
MODE1
33
Digital input
PWDN1
42
Digital input
PWDN2
41
Digital input
PWDN3
40
Digital input
PWDN4
39
Digital input
PWDN5
38
Digital input
PWDN6
37
Digital input
PWDN7
36
Digital input
PWDN8
35
Digital input
SCLK
28
Digital input
Serial clock input.
SYNC
11
Digital input
Synchronize input (all channels).
TEST0
8
Digital input
TEST1
9
Digital input
TEST[1:0] Test mode select: 00 = normal operation
11 = boundary scan test mode
ADS1178: PWDN[8:1] Power-down control for channels 8 through 1.
ADS1174: PWDN[8:5] must = 0V.
PWDN[4:1] Power-down control for channels 4 through 1.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
TIMING CHARACTERISTICS: SPI FORMAT
tCLK
tCPW
CLK
· · ·
tCPW
tCD
tCONV
DRDY
tSD
tDS
tS
tSPW
SCLK
tSPW
tMSBPD
DOUT
Bit 15 (MSB)
tDOPD
tDOHD
Bit 14
tDIST
Bit 13
tDIHD
DIN
TIMING REQUIREMENTS: SPI FORMAT
SYMBOL
PARAMETER
tCLK
CLK period (1/fCLK)
MIN
37
tCPW
CLK positive or negative pulse width
15
(1)
tCONV
Conversion period (1/fDATA)
tCD (2)
Falling edge of CLK to falling edge of DRDY
tDS (2)
Falling edge of DRDY to rising edge of first SCLK to retrieve data
tMSBPD
DRDY falling edge to DOUT MSB valid (propagation delay)
tSD (2)
Falling edge of SCLK to rising edge of DRDY
tS (3)
SCLK period
tSPW
SCLK positive or negative pulse width
tDOHD
(2) (4)
TYP
MAX
10,000
2560
22
ns
CLK periods
ns
1
CLK period
12
18
ns
ns
tCLK
SCLK falling edge to new DOUT invalid (hold time)
UNIT
ns
256
0.4tCLK
ns
0.6tCLK
10
ns
ns
tDOPD (2)
SCLK falling edge to new DOUT valid (propagation delay)
tDIST
New DIN valid to falling edge of SCLK (setup time)
6
ns
Old DIN valid to falling edge of SCLK (hold time)
6
ns
tDIHD
(1)
(2)
(3)
(4)
(4)
PRODUCT PREVIEW
For TA = –40°C to +105°C, IOVDD = 1.65V to 3.6V, and DVDD = 1.65V to 1.95V.
31
ns
Depends on MODE[1:0] and CLKDIV selection. See Table 5 (fCLK/fDATA).
Load on DRDY and DOUT = 20pF.
For best performance, use fSCLK/fCLK ratios of 1, 1/2, 1/4, 1/8, etc.
tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and
ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is 4ns.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
7
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
TIMING CHARACTERISTICS: FRAME-SYNC FORMAT
tCPW
tCLK
CLK
tCPW
tCF
tFRAME
tFPW
tFPW
FSYNC
tFS
tS
tSPW
tSF
SCLK
tSPW
tMSBPD
DOUT
Bit 15 (MSB)
tDOHD
Bit 14
tDIST
tDOPD
Bit 13
tDIHD
DIN
TIMING REQUIREMENTS: FRAME-SYNC FORMAT
For TA = –40°C to +105°C, IOVDD = 1.65V to 3.6V, and DVDD = 1.65V to 1.95V.
PRODUCT PREVIEW
SYMBOL
PARAMETER
MIN
tCLK
CLK period (1/fCLK)
37
tCPW
CLK positive or negative pulse width
15
tCF
Falling edge of CLK to falling edge of SCLK
tFRAME
Frame period (1/fDATA) (1)
tFPW
FSYNC positive or negative pulse width
1
SCLK periods
tFS
Rising edge of FSYNC to rising edge of SCLK
5
ns
tSF
Rising edge of SCLK to rising edge of FSYNC
5
ns
(2)
tS
SCLK period
tSPW
SCLK positive or negative pulse width
tDOHD (3) (4)
SCLK falling edge to old DOUT invalid (hold time)
tDOPD
(3)
TYP
MAX
10,000
ns
ns
–0.35 tCLK
0.35 tCLK
256
2560
tCLK
0.4 tSCLK
UNIT
ns
CLK periods
ns
0.6 tSCLK
6
ns
ns
SCLK falling edge to new DOUT valid (propagation delay)
28
ns
tMSBPD
FSYNC rising edge to DOUT MSB valid (propagation delay)
28
ns
tDIST
New DIN valid to falling edge of SCLK (setup time)
6
ns
tDIHD (4)
Old DIN valid to falling edge of SCLK (hold time)
6
ns
(1)
(2)
(3)
(4)
8
Depends on MODE[1:0] and CLKDIV selection. See Table 5 (fCLK/fDATA).
tDOHD (DOUT hold time) and tDIHD (DIN hold time) are specified under opposite worst-case conditions (digital supply voltage and
ambient temperature). Under equal conditions, with DOUT connected directly to DIN, the timing margin is 4ns.
SCLK must be continuously running and limited to ratios of 1, 1/2, 1/4, and 1/8 of fCLK.
Load on DOUT = 20pF.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
OVERVIEW
VREFP
AVDD
VREFN
To allow tradeoffs between speed and power, two
modes of operation are supported: High-Speed and
Low-Power. Table 1 summarizes the performance of
each mode.
In High-Speed mode, the data rate is 52kSPS, and in
Low-Power mode, the power dissipation is only
8mW/channel at 10.5kSPS.
The ADS1174/78 is configured by simply setting the
appropriate I/O pins—there are no registers to
program. Data is retrieved over a serial interface that
supports both SPI and Frame-Sync formats. The
ADS1174/78 has a daisy-chainable output and the
ability to synchronize externally, so it can be used
conveniently in systems requiring more than eight
channels.
DVDD
IOVDD
PRODUCT PREVIEW
The ADS1174 (quad) and ADS1178 (octal) are 16-bit,
delta-sigma ADCs. They offer the combination of
excellent linearity, low noise, and low power
consumption. Figure 1 shows the block diagram. Note
that both devices are the same, except the ADS1174
has four ADCs, and the ADS1178 has eight ADCs.
The pinout and package of the ADS1178 is
compatible with the ADS1174, permitting drop-in
expandability. The converters are comprised of either
four (ADS1174) or eight (ADS1178) advanced,
6th-order, chopper-stabilized, delta-sigma modulators
followed by low-ripple, linear phase FIR filters. The
modulators measure the differential input signal, VIN =
(AINP – AINN), against the differential reference,
VREF = (VREFP – VREFN). The digital filters receive
the modulator signal and provide a low-noise digital
output.
S
R
VCOM
VREF
R
AINP1
AINN1
AINP2
AINN2
S
S
VIN1
DS
Modulator1
VIN2
DS
Modulator2
Digital
Filter1
DRDY/FSYNC
SPI
and
Frame-Sync
Interface
SCLK
DOUT[4:1]/[8:1](1)
DIN
Digital
Filter2
TEST[1:0]
FORMAT[2:0]
CLK
Control
Logic
AINP4/8(1)
AINN4/8(1)
S
VIN4/8
DS
Modulator4/8(1)
SYNC
PWDN[4:1]/[8:1](1)
Digital
Filter4/8(1)
CLKDIV
MODE
AGND
DGND
NOTE: (1) The ADS1174 has four channels; the ADS1178 has eight channels.
Figure 1. ADS1174/ADS1178 Block Diagram
Table 1. Operating Mode Performance Summary
(1)
MODE
DATA RATE
(SPS)
PASSBAND
(Hz)
SNR
(dB)
NOISE
(LSBPP)
POWER DISSIPATION
PER CHANNEL (1)
(mW)
High-Speed
52,734
23,889
97
1
32
Low-Power
10,547
4,536
97
1
8
Measured with all channels operating.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
9
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
FUNCTIONAL DESCRIPTION
The ADS1174 and ADS1178 are delta/sigma ADCs
consisting of independent converters that digitize
input signals in parallel. The ADS1174 consists of
four independent converters, while the ADS1178 has
eight independent converters.
The converter is composed of two main functional
blocks to perform the ADC conversions: the
modulator and the digital filter. The modulator
samples the input signal together with sampling the
reference voltage to produce a 1's density output
stream. The density of the output stream is
proportional to the analog input level relative to the
reference voltage. The pulse stream is filtered by the
internal digital filter where the output conversion
result is produced.
PRODUCT PREVIEW
In operation, the signal inputs and reference inputs
are sampled by the modulator at a high rate (typically
64x higher than the final output data rate). The
quantization noise of the modulator is moved to a
higher frequency range where the internal digital filter
removes it. This process results in very low levels of
noise within the signal passband.
10
Because the input signal is sampled at a very high
rate, input signal aliasing does not occur until the
input signal frequency is at the modulator sampling
rate. This high sampling rate greatly relaxes the
requirement of external antialiasing filters allowing
very low passband phase errors.
SAMPLING APERTURE MATCHING
The converters of the ADS1174/78 operate from the
same CLK input. The CLK input controls the timing of
the modulator sampling instant. The converter is
designed such that the sampling skew, or modulator
sampling aperture match, between channels is
controlled to within 200ps. Furthermore, the digital
filters are synchronized to start the convolution phase
at the same modulator clock cycle. This design
results in excellent phase match among the
ADS1174/78 channels.
The phase match of one four-channel ADS1174 to
that of another ADS1174 may not have the same
degree of sampling match (the same is true for the
8-channel ADS1178). As a result of manufacturing
variations, differences in internal propagation delay of
the internal CLK signal coupled with differences of
the arrival of the external CLK signal to each device
may cause larger sampling match errors. Equal
length CLK traces or external clock distribution
devices can be used to control the arrival of the CLK
signals to help reduce the sampling match error.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
FREQUENCY RESPONSE
0
-2
Amplitude (dB)
The digital filter sets the overall frequency response.
The filter uses a multi-stage FIR topology to provide
linear phase with minimal passband ripple and high
stop band attenuation. The oversampling ratio of the
digital filter (that is, the ratio of the modulator
sampling to the output data rate: fMOD/fDATA) is 64 for
both High-Speed and Low-Power modes.
-1
-3
-4
-5
-6
-7
Figure 2 shows the frequency response of the
ADS1174/78 normalized to fDATA. Figure 3 shows the
passband ripple. The transition from passband to stop
band is illustrated in Figure 4. The overall frequency
response repeats at 64x multiples of the modulator
frequency fMOD, as shown in Figure 5.
-8
-9
-10
0.45
0.47
0.49
0.51
0.53
0.55
Normalized Input Frequency (fIN/fDATA)
Figure 4. Transition Band Response
0
-20
-20
-80
-40
-100
-60
-80
-120
-100
-140
-120
0
0.2
0.6
0.4
0.8
1.0
-140
Normalized Input Frequency (fIN/fDATA)
-160
0
Figure 2. Frequency Response
32
48
64
Input Frequency (fIN/fDATA)
Figure 5. Frequency Response Out to fMOD
0.02
0
Amplitude (dB)
16
These image frequencies, if present in the signal and
not externally filtered, will fold back (or alias) into the
passband, causing errors. Table 2 lists the degree of
image rejection versus external antialiasing filter
order. The stop band of the ADS1174/78 provides
100dB attenuation of frequencies that begin just
beyond the passband and continue out to fMOD.
Placing an antialiasing, low-pass filter in front of the
ADS1174/78 inputs is recommended to limit possible
high-amplitude, out-of-band signals and noise.
-0.02
-0.04
-0.06
-0.08
-0.10
0
0.1
0.2
0.3
0.4
0.5
Normalized Input Frequency (fIN/fDATA)
Figure 3. Passband Response
0.6
Table 2. Antialiasing Filter Order Image Rejection
ANTIALIASING FILTER
ORDER
IMAGE REJECTION (dB)
(f–3dB at fDATA)
1
39
2
75
3
111
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
11
PRODUCT PREVIEW
0
-60
Gain (dB)
Amplitude (dB)
20
-40
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
PHASE RESPONSE
DATA FORMAT
The ADS1174/78 incorporates a multiple stage, linear
phase digital filter. Linear phase filters exhibit
constant delay time versus input frequency (constant
group delay), which means the time delay from any
instant of the input signal to the same instant of the
output data is constant, and is independent of input
signal frequency. This behavior results in essentially
zero phase errors when analyzing multi-tone signals.
The ADS1174/78 outputs 16 bits of data in two’s
complement format.
SETTLING TIME
A positive full-scale input produces an ideal output
code of 7FFFh, and the negative full-scale input
produces an ideal output code of 8000h. The output
clips at these codes for signals exceeding full-scale.
Table 3 summarizes the ideal output codes for
different input signals.
Table 3. Ideal Output Code versus Input Signal
As with frequency and phase response, the digital
filter also determines settling time. Figure 6 shows
the output settling behavior after a step change on
the analog inputs normalized to conversion periods.
The X-axis is given in units of conversion. Note that
after the step change on the input occurs, the output
data changes very little prior to 30 conversion
periods. The output data is fully settled after 76
conversion periods.
INPUT SIGNAL VIN
(AINP – AINN)
IDEAL OUTPUT CODE(1)
PRODUCT PREVIEW
≥ +VREF
7FFFh
) VREF
2 15 * 1
0001h
0
0000h
* VREF
2 15 * 1
FFFFh
ǒ2 2* 1Ǔ
v −VREF
Final Value
100
15
15
8000h
(1) Excludes effects of noise, INL, offset, and gain errors.
Settling (%)
Fully Settled Data
at 76 Conversions
Initial Value
0
0
10
20
30
40
50
60
70
80
Conversions (1/fDATA)
Figure 6. Step Response
12
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
ANALOG INPUTS (AINP, AINN)
The ADS1174/78 measures each differential input
signal VIN = (AINP – AINN) against the common
differential reference VREF = (VREFP – VREFN). The
most positive measurable differential input is +VREF,
which produces the most positive digital output code
of 7FFFh. Likewise, the most negative measurable
differential input is –VREF, which produces the most
negative digital output code of 8000h.
While the ADS1174/78 measures the differential input
signal, the absolute input voltage is also important.
This is the voltage on either input (AINP or AINN)
with respect to AGND. The range for this voltage is:
–0.1V < (AINN or AINP) < AVDD + 0.1V
If either input is taken below –0.4V or above (AVDD +
0.4), ESD protection diodes on the inputs may turn
on.
If these conditions are possible, external Schottky
clamp diodes or series resistors may be required to
limit the input current to safe levels (see Absolute
Maximum Ratings table).
The ADS1174/78 is a high-performance ADC. For
optimum performance, it is critical that the appropriate
circuitry be used to drive the ADS1174/78 inputs. See
the Applications Information section for the
recommended circuits.
The ADS1174/78 uses switched-capacitor circuitry to
measure the input voltage. Internal capacitors are
charged by the inputs and then discharged. Figure 7
shows a conceptual diagram of these circuits. Switch
S2 represents the net effect of the modulator circuitry
in discharging the sampling capacitor; the actual
implementation is different. The timing for switches S1
and S2 is shown in Figure 8. The sampling time
(tSAMPLE) is the inverse of modulator sampling
frequency (fMOD) and is a function of the mode, the
CLKDIV input, and frequency of CLK, as shown in
Table 4.
S1
AINP
9pF
S2
AINN
S1
AGND AVDD
ESD Protection
Figure 7. Equivalent Analog Input Circuitry
tSAMPLE = 1/fMOD
S1
ON
OFF
S2
ON
OFF
Figure 8. S1 and S2 Switch Timing for Figure 7
Table 4. Modulator Frequency (fMOD) versus Mode
Selection
MODE SELECTION
High-Speed
Low-Power
CLKDIV
fMOD
1
fCLK/8
0
fCLK/4
1
fCLK/40
0
fCLK/8
The average load presented by the switched
capacitor input can be modeled with an effective
differential impedance, as shown in Figure 9. Note
that the effective impedance is a function of fMOD.
AINP
Zeff = 14kW ´ (6.75MHz/fMOD)
AINN
Figure 9. Effective Input Impedances
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
13
PRODUCT PREVIEW
For optimum performance, the inputs of the
ADS1174/78 are intended to be driven differentially.
For single-ended input applications, one of the inputs
(AINP or AINN) can be driven while the other input is
fixed (typically, to AGND or +2.5V); fixing the input to
+2.5V permits bipolar operation, thereby using the full
range of the converter.
AVDD AGND
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
VOLTAGE REFERENCE INPUTS
(VREFP, VREFN)
The voltage reference for the ADS1174/78 ADC is
the differential voltage between VREFP and VREFN:
VREF = (VREFP – VREFN). The voltage reference is
common to the four channels. The reference inputs
use a structure similar to that of the analog inputs
with the equivalent circuitry on the reference inputs
shown in Figure 10. As with the analog inputs, the
load presented by the switched capacitor can be
modeled with an effective impedance, as shown in
Figure 11. However, the reference input impedance
depends on the number of active (enabled) channels
in addition to fMOD. As a result of the change of
reference input impedance caused by enabling and
disabling channels, the regulation and settling time of
the external reference should be noted, so as not to
affect the readings of other channels.
VREFP
VREFN
PRODUCT PREVIEW
AGND
AGND
AVDD
AVDD
ESD
Protection
Figure 10. Equivalent Reference Input Circuitry
VREFP
If these conditions are possible, external Schottky
clamp diodes or series resistors may be required to
limit the input current to safe levels (see Absolute
Maximum Ratings table).
Note that the valid operating range of the reference
inputs is limited to the following:
–0.1V ≤ VREFN ≤ VREFP – 0.5V
VREFN + 0.5V ≤ VREFP ≤ AVDD + 0.1V
A high-quality reference voltage with the appropriate
drive strength is essential for achieving the best
performance from the ADS1174/78. Noise and drift
on the
reference
degrade
overall system
performance. See the Application Information section
for example reference circuits.
CLOCK INPUT (CLK)
The ADS1174/78 requires a clock input for operation.
Each ADS1174/78 converter operates from the same
clock input. At the maximum data rate, the clock input
can be either 27MHz or 13.5MHz (5.4MHz, low
power), determined by the setting of the CLKDIV
input. The selection of the external clock frequency
(fCLK) does not affect the resolution (the oversampling
ratio, OSR, remains fixed) or power dissipation of the
ADS1174/78. However, using a slower fCLK can
reduce the power consumption of an external clock
driver. The output data rate scales with clock
frequency, down to a minimum clock frequency of
fCLK = 100kHz. Table 5 summarizes the ratio of clock
input frequency (fCLK) to data rate (fDATA), maximum
data rate and corresponding maximum clock input for
the two operating modes.
Table 5. Clock Input Options
VREFN
MODE
SELECTION
High-Speed
5.2kW
Zeff =
´ (6.75MHz/fMOD)
N
Low-Power
fCLK
(MHz)
CLKDIV
fCLK/fDATA
27
1
512
13.5
0
256
27
1
2,560
5.4
0
512
DATA RATE
(SPS)
52,734
10,547
N = number of active channels.
Figure 11. Effective Reference Impedance
ESD diodes protect the reference inputs. To keep
these diodes from turning on, make sure the voltages
on the reference pins do not go below AGND by
more than 0.4V, and likewise do not exceed AVDD by
0.4V.
14
As with any high-speed data converter, a high-quality,
low-jitter clock is essential for optimum performance.
Crystal clock oscillators are the recommended clock
source. Make sure to avoid excess ringing on the
clock input; keeping the clock trace as short as
possible using a 50Ω series resistor, placed close to
the source end, often helps.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
MODE SELECTION (MODE)
SYNCHRONIZATION (SYNC)
The ADS1174/78 supports two modes of operation:
High-Speed and Low-Power. These modes offer
optimization of speed or power. The mode selection
is determined by the status of the digital input MODE
pins, as shown in Table 6. The ADS1174/78
constantly monitors the status of the MODE pin
during operation.
The ADS1174/78 can be synchronized by pulsing the
SYNC pin low and then returning the pin high. When
the pin goes low, the conversion process stops, and
the internal counters used by the digital filter are
reset. When the SYNC pin returns high, the
conversion process restarts. Synchronization allows
the conversion to be aligned with an external event,
such as a reference timing pulse.
MODE SELECTION
MAX fDATA(1)
0
High-Speed
52,734
1
Low-Power
10,547
(1) fCLK = 27MHz (CLKDIV = 1).
When using the SPI protocol, DRDY is held high after
a mode change occurs until settled (or valid) data are
ready, as shown in Figure 12 and Table 7.
In Frame-Sync protocol, the DOUT pins are held low
after a mode change occurs until settled data are
ready, as shown in Figure 12 and Table 7. Data can
be read from the device to detect when DOUT
changes to logic 1, indicating valid data.
Since the converters of the ADS1174/78 operate in
parallel from the same master clock and use the
same SYNC input control, they are, by default, in
synchronization with each other. The sampling
aperture match among the channels is 200ps
(typical). However, the synchronization of multiple
ADS1174/78s is somewhat different. At device
power-on, variations in internal reset thresholds from
device to device may result in uncertainty in
conversion timing.
The SYNC pin can be used to synchronize multiple
ADS1174/78s to within the same CLK cycle.
Figure 13 illustrates the timing requirement of SYNC
and CLK in SPI format.
See Figure 14 for the Frame-Sync format timing
requirement.
MODE[1:0]
Pins
ADS1174/78
Mode
Previous
Mode
New Mode
tNDR-SPI
SPI
Protocol
DRDY
New Mode
Valid Data Ready
tNDR-FS
Frame-Sync DOUT
Protocol
New Mode
Valid Data on DOUT
Figure 12. Mode Change Timing
Table 7. Mode Change
SYMBOL
DESCRIPTION
MIN
tNDR-SPI
Time for new data to be ready (SPI)
tNDR-FS
Time for new data to be ready (Frame-Sync)
127
TYP
MAX
UNITS
129
Conversions (1/fDATA)
128
Conversions (1/fDATA)
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
15
PRODUCT PREVIEW
Table 6. Mode Selection
MODE
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
After synchronization, indication of valid data
depends on the whether SPI or Frame-Sync format
was used.
In the SPI format, DRDY goes high as soon as SYNC
is taken low; see Figure 13. After SYNC is returned
high, DRDY stays high while the digital filter is
settling. Once valid data are ready for retrieval,
DRDY goes low.
In the Frame-Sync format, DOUT goes low as soon
as SYNC is taken low; see Figure 14. After SYNC is
returned high, DOUT stays low while the digital filter
is settling. Once valid data are ready for retrieval,
DOUT begins to output valid data. For proper
synchronization, FSYNC, SCLK, and CLK must be
established before taking SYNC high, and must then
remain running.
tCSHD
CLK
tSCSU
tSYN
SYNC
tNDR
DRDY
Figure 13. Synchronization Timing for SPI Protocol
PRODUCT PREVIEW
Table 8. SPI Protocol
SYMBOL
DESCRIPTION
MIN
TYP
MAX
UNITS
tCSHD
CLK to SYNC hold time
10
ns
tSCSU
SYNC to CLK setup time
5
ns
tSYN
Synchronize pulse width
1
tNDR
Time for new data to be ready
CLK periods
129
Conversions (1/fDATA)
tCSHD
CLK
tSCSU
tSYN
SYNC
FSYNC
tNDR
Valid Data
DOUT
Figure 14. Synchronization Timing for Frame-Sync Protocol
Table 9. Frame-Sync Protocol
SYMBOL
16
DESCRIPTION
MIN
TYP
MAX
UNITS
tCSHD
CLK to SYNC hold time
10
ns
tSCSU
SYNC to CLK setup time
5
ns
tSYN
Synchronize pulse width
tNDR
Time for new data to be ready
1
127
Submit Documentation Feedback
CLK periods
128
Conversions (1/fDATA)
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
POWER-DOWN (PWDN)
2. Wait for 129/fDATA after taking the PWDN pins
high.
3. Detect for non-zero data in the powered-up
channel.
The ADS1174/78 measurement channels can be
independently powered down by use of the PWDN
inputs. To enter the power-down mode, take the
respective PWDN pin low. Power-down occurs after
two fCLK cycles have elapsed. This delay guards
against false transitions caused by external noise. To
exit power-down, return the corresponding PWDN pin
high. Note that when all channels are powered down,
the ADS1174/78 enters a microwatt (μW) power state
where all internal biasing is powered-down. In this
event, the TEST[1:0] input pins must be driven; all
other input pins can float (the ADS1174/78 outputs
remain driven).
After powering-up one or more channels, the
channels are synchronized to each other. It is not
necessary to use the SYNC pin to synchronize them.
As shown in Figure 15 and Table 10, a maximum of
129 conversion cycles must elapse before reading
data after exiting power-down. The data from
channels already running are not affected. The user
software can perform the required delay time in the
following ways:
1. Count the number of data conversions after
taking the PWDN pin high.
In discrete data format, the data are always forced to
zero.
When
powering-up
a
channel
in
dynamic-position TDM data format mode, the channel
data remain packed until the data are ready, at which
time the data frame is expanded to include the
just-powered channel data. See the Data Format
section for details.
···
tPDWN
tNDR
(1)
DRDY/FSYNC
DOUT
(Discrete Data Output Mode)
Post Power-Up Data
DOUT1
(TDM Mode, Dynamic Position)
Normal Position
Data Shift Position
Normal Position
DOUT1
(TDM Mode, Fixed Position)
Normal Position
Data Remain in Position
Normal Position
NOTE: (1) In SPI protocol, the timing occurs on the falling edge of DRDY/FSYNC. Powering down all channels forces DRDY/FSYNC high.
Figure 15. Power-Down Timing
Table 10. Power-Down Timing
SYMBOL
tPDWN
tNDR
DESCRIPTION
MIN
PDWN pulse width to enter Power-Down mode
TYP
MAX
UNITS
2
CLK periods
Time for new data to be ready (SPI)
129
130
Conversions (1/fDATA)
Time for new data to be ready (Frame-Sync)
128
129
Conversions (1/fDATA)
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
17
PRODUCT PREVIEW
···
CLK
PWDN
When a channel is powered down in TDM data
format, the data for the powered-down channel will
either be forced to zero (fixed-position TDM data
mode) or be replaced by shifting the data from the
next channel into the vacated data position
(dynamic-position TDM data mode).
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
FORMAT[2:0]
Data can be read from the ADS1174/78 with two
serial interface protocols (SPI or Frame-Sync) and
several options of data formats (TDM/Discrete and
Fixed/Dynamic data positions). The FORMAT[2:0]
inputs are used to select among the options. Table 11
lists the available options. See the DOUT Modes
section for details of the DOUT modes and data
positions.
recommended to keep SCLK as clean as possible to
prevent glitches from accidentally shifting the data.
SCLK may be run as fast as the CLK frequency.
SCLK may be either in free-running or stop-clock
operation
between
conversions.
For
best
performance, use fSCLK/fCLK ratios of 1, 1/2, 1/4, 1/8,
etc. NOTE: One CLK period is required after DRDY
falls, to start shifting data (see Timing Requirements:
SPI Format ).
DRDY/FSYNC (SPI Format)
Table 11. Data Output Format
FORMAT[2:0]
INTERFACE
PROTOCOL
DOUT
MODE
DATA
POSITION
000
SPI
TDM
Dynamic
001
SPI
TDM
Fixed
010
SPI
Discrete
—
011
Frame-Sync
TDM
Dynamic
100
Frame-Sync
TDM
Fixed
101
Frame-Sync
Discrete
—
In the SPI format, this pin functions as the DRDY
output. It goes low when data are ready for retrieval
and then returns high on the falling edge of the first
subsequent SCLK. If data are not retrieved (that is,
SCLK is held low), DRDY will pulse high just before
the next conversion data are ready, as shown in
Figure 16. The new data are loaded within one CLK
cycle before DRDY goes low. All data must be shifted
out before this time to avoid being overwritten.
PRODUCT PREVIEW
1/fDATA
SERIAL INTERFACE PROTOCOLS
1/fCLK
DRDY
Data are retrieved from the ADS1174/78 using the
serial interface. Two protocols are available: SPI and
Frame-Sync. The same pins are used for both
interfaces: SCLK, DRDY/FSYNC, DOUT[4:1] (or
DOUT[8:1] for the ADS1178), and DIN. The
FORMAT[2:0] pins select the desired interface
protocol.
SCLK
Figure 16. DRDY Timing with No Readback
DOUT
The SPI-compatible format is a simple read-only
interface. Data ready for retrieval are indicated by the
falling DRDY output and are shifted out on the falling
edge of SCLK, MSB first. The interface can be
daisy-chained using the DIN input when using
multiple ADS1174/78s. See the Daisy-Chaining
section for more information.
In Discrete Data Output mode, the conversion data
are output on the individual DOUT pins (DOUT1,
DOUT2, etc.), whereas in TDM mode, data are output
only on DOUT1. The MSB data are valid on
DOUT[4:1]/[8:1] when DRDY goes low. The
subsequent bits are shifted out with each falling edge
of SCLK. If daisy-chaining (TDM mode), the data
shifted in using DIN will appear on DOUT1 after all
channel data have been shifted out.
SCLK
DIN
The serial clock (SCLK) features a Schmitt-triggered
input and shifts out data on DOUT on the falling
edge. It also shifts in data on the falling edge on DIN
when this pin is being used for daisy-chaining. The
device shifts data out on the falling edge and the user
typically shifts this data in on the rising edge. Even
though the SCLK input has hysteresis, it is
This input is used when multiple ADS1174/78s are to
be daisy-chained together. The DOUT1 pin of the first
device connects to the DIN pin of the next, etc. It can
be used with either the SPI or Frame-Sync formats.
Data are shifted in on the falling edge of SCLK. When
using only one ADS1174/78, tie DIN low. See the
Daisy-Chaining section for more information.
SPI SERIAL INTERFACE
18
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
FRAME-SYNC SERIAL INTERFACE
DRDY/FSYNC (Frame-Sync Format)
Frame-Sync format is similar to the interface often
used on audio ADCs. It operates in slave
fashion—the user must supply framing signal FSYNC
(similar to the left/right clock on stereo audio ADCs)
and the serial clock SCLK (similar to the bit clock on
audio ADCs). The data is output MSB first or
left-justified. When using Frame-Sync format, the
FSYNC and SCLK inputs must be continuously
running with the required relationships shown in the
Frame-Sync Timing Requirements.
In Frame-Sync format, this pin is used as the FSYNC
input. The frame-sync input (FSYNC) sets the frame
period which must be same as the data rate. The
required number of fCLK cycles to each FSYNC period
depends on the mode selection and the CLKDIN
input. Table 5 indicates the number of CLK cycles to
each frame (fCLK/fDATA). If the FSYNC period is not
the proper value, data readback will be corrupted.
The serial clock (SCLK) features a Schmitt-triggered
input and shifts out data on DOUT on the falling
edge. It also shifts in data on the falling edge on DIN
when this pin is being used for daisy-chaining. Even
though SCLK has hysteresis, it is recommended to
keep SCLK as clean as possible to prevent glitches
from accidentally shifting the data. When using
Frame-Sync format, SCLK must run continuously. If it
is shut down, the data readback will be corrupted.
The number of SCLKs within a frame period (FSYNC
clock) can be any power of two ratio of clock cycles
(1, 1/2, 1/4, etc.), as long as the number of cycles is
sufficient to shift the data output from all channels
within one data frame.
In Discrete Data Output mode, the conversion data
are shifted out on the individual DOUT pins (DOUT1,
DOUT2, etc.), whereas in TDM mode, data are output
only on DOUT1. The MSB data become valid on
DOUT[4:1]/[8:1] on the SCLK rising edge prior to
FSYNC going high. The subsequent bits are shifted
out with each falling edge of SCLK. If daisy-chaining
(TDM mode), the data shifted in using DIN will appear
on DOUT1 after all channel data have been shifted
out (that is, 4 channels × 16 bits per channel = 64 bits
for the ADS1174, and 8 channels × 16 bits per
channel = 128 bits for the ADS1178).
DIN
This input is used when multiple ADS1174/78s are to
be daisy-chained together. It can be used with either
SPI or Frame-Sync formats. Data are shifted in on
the falling edge of SCLK. When using only one
ADS1174/78, tie DIN low. See the Daisy-Chaining
section for more information.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
19
PRODUCT PREVIEW
SCLK
DOUT
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
DOUT MODES
For both SPI and Frame-Sync interface protocols,
either the data are shifted out through individual
channel DOUT pins in a parallel data format (Discrete
mode), or the data for all channels are shifted out in
series through common pin DOUT1 (TDM mode).
output from another ADS1174, ADS1178, or other
compatible device. Note that when all channels of the
ADS1174/78 are powered-down, the interface is
powered-down,
rendering
the
DIN
input
powered-down as well. When one or more channels
of the device are powered-down, the data format of
the TDM mode can be fixed or dynamic.
TDM Mode
TDM Mode, Fixed-Position Data
In TDM (time division multiplexed) data output mode,
the data for all channels are shifted out, in series, on
a single pin (DOUT1). As shown in Figure 17, the
data from channel 1 are shifted out first, followed by
channel 2 data, etc. After the data from the last
channel are shifted out (channel 4 for the ADS1174
or channel 8 for the ADS1178), the data from the DIN
input follow. The DIN is used to daisy-chain the data
In this TDM data output mode, the data position of
the channels remains fixed, regardless of whether
channels are disabled. If a channel is powered-down,
data are forced to zero but occupies the same
position within the data stream. Figure 18 shows the
data stream with channel 1 and channel 3
powered-down.
SCLK
1
2
15
16
17
31
32
33
47
48
49
63
64
65
66
67
PRODUCT PREVIEW
DOUT1
(ADS1174)
CH1
CH2
CH3
CH4
DIN
DOUT1
(ADS1178)
CH1
CH2
CH3
CH4
CH5
113
127
128
129
CH8
130
131
DIN
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 17. TDM Mode (All Channels Enabled)
SCLK
1
2
15
16
17
31
32
33
47
48
49
63
64
65
66
DOUT1
(ADS1174)
CH1
CH2
CH3
CH4
DIN
DOUT1
(ADS1178)
CH1
CH2
CH3
CH4
CH5
67
113
127
128
129
CH8
130
131
DIN
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 18. TDM Mode, Fixed-Position Data (Channels 1 and 3 Shown Powered-Down)
20
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
TDM Mode, Dynamic Position Data
Discrete Data Output Mode
In this TDM data output mode, when a channel is
powered-down, the data from higher channels shift
one position in the data stream to fill the vacated data
slot. Figure 19 shows the data stream with channel 1
and channel 3 powered-down.
In Discrete data output mode, the channel data are
shifted out in parallel using individual channel data
output pins DOUT[4:1] for the ADS1174, or
DOUT[8:1] for the ADS1178. After the 16th SCLK,
the channel data are forced to zero. The data are
also forced to zero for powered-down channels.
Figure 20 depicts the data format.
SCLK
1
2
15
16
17
31
32
33
34
DOUT1
(ADS1174)
CH2
CH4
DIN
DOUT1
(ADS1178)
CH2
CH4
CH5
35
80
81
95
CH8
96
97
98
99
DIN
DRDY
(SPI)
PRODUCT PREVIEW
FSYNC
(Frame- Sync)
Figure 19. TDM Mode, Dynamic Position Data (Channels 1 and 3 Shown Powered-Down)
SCLK
1
2
14
DOUT1
CH1
DOUT2
CH2
DOUT3
CH3
DOUT4
CH4
DOUT5
CH5
DOUT6
CH6
DOUT7
CH7
DOUT8
CH8
15
16
ADS1178 Only
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 20. Discrete Data Output Mode
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
21
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
DAISY-CHAINING
The maximum number of channels that may be
daisy-chained in this way is limited by the frequency
of fSCLK, the mode selection, and the CLKDIV input.
The frequency of fSCLK must be high enough to
completely shift the data out from all channels within
one fDATA period. Table 12 lists the maximum number
of daisy-chained channels when fSCLK = fCLK.
Multiple ADS1174/78s can be daisy-chained together
to simplify the serial interface connections. The
DOUT1 data output pin of one ADS1174/78 is
connected to the DIN of the next ADS1174/78. As
Figure 21 illustrates, the DOUT1 pin of device 1
provides the output data to a controller, and the DIN
of device 2 is grounded. Figure 22 describes the data
format when reading data back in a daisy-chain
configuration.
SYNC
SYNC
CLK
CLK
DIN2
DIN
ADS1178
U2
SYNC
ADS1178
U1
DRDY
CLK
DOUT1
DRDY Output from Device 1
DIN
DOUT1
SCLK
SCLK
Serial Data from Devices 1 and 2
SCLK
PRODUCT PREVIEW
Figure 21. Daisy-Chaining of Two ADS1178s, SPI Protocol (FORMAT[2:0] = 011 or 100)
SCLK
DOUT1
1
2
CH1, U1
17
18
CH2, U1
33
34
CH3, U1
49
50
CH4, U1
65
66
CH5, U1
129
130
CH1, U2
145
146
CH2, U2
257
258
DIN2
DRDY
(SPI)
FSYNC
(Frame-Sync)
Figure 22. Daisy-Chain Data Format of Figure 21
Table 12. Maximum Channels in a Daisy-Chain (fSCLK = fCLK)
MODE SELECTION
High-Speed
Low-Power
22
CLKDIV
MAXIMUM NUMBER OF CHANNELS
1
32
0
16
1
160
0
32
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
To increase the number of data channels possible in
a chain, a segmented DOUT scheme may be used,
producing two data streams. Figure 23 illustrates four
ADS1178s, with a pair of ADS1178s daisy-chained
together. The channel data of each daisy-chained
pair is shifted out in parallel and is received by the
processor through independent data channels.
Whether the interface protocol is SPI or Frame-Sync,
it is recommended to synchronize all devices by tying
the SYNC inputs together. When synchronized in SPI
protocol, it is only necessary to monitor the DRDY
output of one ADS1178.
In Frame-Sync interface protocol, the data from all
devices are ready on the rising edge of FSYNC.
Since DOUT1 and DIN are both shifted on the falling
edge of SCLK, the propagation delay on DOUT1
creates a setup time for DIN. Minimize the skew in
SCLK to avoid timing violations.
CLK
ADS1178
U4
SYNC
ADS1178
U3
SYNC
ADS1178
U2
SYNC
ADS1178
U1
SYNC
CLK
CLK
CLK
CLK
DIN
DOUT1
DIN
DOUT1
DIN
DOUT1
DIN
FSYNC
FSYNC
FSYNC
FSYNC
SCLK
SCLK
SCLK
SCLK
DOUT1
Serial
Data
from
Devices
3 and 4
Serial
Data
from
Devices
1 and 2
PRODUCT PREVIEW
SYNC
SCLK
FSYNC
Figure 23. Segmented DOUT Daisy-Chain, Frame-Sync Protocol (FORMAT[2:0] = 000 or 001)
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
23
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
POWER-UP SEQUENCE
Figure 24 shows the power-up sequence of the
ADS1174/78. The power supplies can be sequenced
in any order. Each supply has an internal reset circuit
where the outputs are summed together to generate
an internal global power-on reset. After the supplies
have exceeded the reset thresholds, 218 fCLK cycles
are counted before the converter initiates the
conversion process. After all the fCLK cycles are
counted, the data for 128 conversions is suppressed
by the ADS1174/78 to allow output of fully-settled
data. In SPI protocol, DRDY is held high during this
interval. In frame-sync protocol, DOUT is forced to
zero. The power supplies should be applied before
any analog or digital pin is driven.
The ADS1174/78 has three power supplies: AVDD,
DVDD, and IOVDD. AVDD is the analog supply that
powers the modulator, DVDD is the digital supply that
powers the digital core, and IOVDD is the digital I/O
power supply. The IOVDD and DVDD power supplies
can be tied together if desired. To achieve rated
performance, it is critical that the power supplies are
bypassed with 0.1μF and +10μF capacitors placed as
close as possible to the supply pins. A single 1μF
ceramic capacitor may be substituted in place of the
two capacitors.
AVDD
3.5V Nom
DVDD
1V Nom
IOVDD
1V Nom
(1)
(1)
(1)
PRODUCT PREVIEW
Internal Reset
CLK
218
fCLK
128
fDATA
DRDY
(SPI)
DOUT
(Frame-Sync)
Valid Data
NOTE: (1) The power-supply reset thresholds are approximate.
Figure 24. Power-Up Sequence
24
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
The Boundary Scan test mode feature of the
ADS1174/78 allows continuity testing of the digital I/O
pins. In this mode, the normal functions of the digital
pins are disabled and routed to each other as pairs
through internal logic, as shown in Table 13. Note
that some of the digital input pins become outputs.
Table 13. Test Mode Pin Map (TEST[1:0] = 11)
TEST MODE PIN MAP (1)
(1)
(2)
INPUT PINS
OUTPUT PINS
PWDN1
DOUT1
PWDN2
DOUT2
PWDN3
DOUT3
PWDN4
DOUT4
PWDN5
(2)
DOUT5 (2)
PWDN6
(2)
DOUT6 (2)
PWDN7
(2)
DOUT7 (2)
PWDN8
(2)
DOUT8 (2)
MODE
DIN
FORMAT0
CLKDIV
FORMAT1
DRDY/FSYNC
FORMAT2
SCLK
Therefore, if using boundary scan tests, the
ADS1174/78 digital I/O should connect to a
JTAG-compatible device. The analog input, power
supply, and ground pins remain connected as normal.
The test mode is engaged by the setting the pins
TEST[1:0] = 11. For normal converter operation, set
TEST[1:0] = 00.
VCOM OUTPUT
The VCOM pin is an analog output of approximately
AVDD/2. This voltage may be used to set the
common-mode voltage of the input buffers. However,
the pin must be buffered. A 0.1μF capacitor to AGND
is recommended to reduce noise pick-up.
ADS1174/ADS1178
OPA350
VCOM » (AVDD/2)
0.1mF
PRODUCT PREVIEW
BOUNDARY SCAN TEST[1:0] INPUTS
NOTE: Buffer is required if VCOM is used for any purpose.
Figure 25. VCOM Output
The CLK input does not have a test output; SYNC = 1 and is
an output.
ADS1178 only.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
25
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
APPLICATION INFORMATION
PRODUCT PREVIEW
To obtain the specified performance from the
ADS1174/78, the following layout and component
guidelines should be considered.
1. Power Supplies: The device requires three
power supplies for operation: DVDD, IOVDD, and
AVDD. The range for DVDD is 1.65V to 1.95V;
the range of IOVDD is 1.65V to 3.6V; and AVDD
is restricted to 4.75V to 5.25V. For all supplies,
use a 10μF tantalum capacitor, bypassed with a
0.1μF ceramic capacitor, placed close to the
device pins. Alternatively, a single 10μF ceramic
capacitor can be used. The supplies should be
relatively free of noise and should not be shared
with devices that produce voltage spikes (such as
relays, LED display drivers, etc.). If a switching
power supply source is used, the voltage ripple
should be low (< 2mV) and the switching
frequency outside the passband of the converter.
The power supplies may be sequenced in any
order.
2. Ground Plane: A single ground plane connecting
both AGND and DGND pins can be used. If
separate digital and analog grounds are used,
connect the grounds together at the converter.
3. Digital Inputs: It is recommended to
source-terminate the digital inputs to the device
with 50Ω series resistors. The resistors should be
placed close to the driving end of the digital
source (oscillator, logic gates, DSP, etc.) This
placement helps to reduce ringing on the digital
lines, which may lead to degraded ADC
performance.
4. Analog/Digital Circuits: Place analog circuitry
(input buffer, reference) and associated tracks
together, keeping them away from digital circuitry
(DSP, microcontroller, logic). Avoid crossing
digital tracks across analog tracks to reduce
noise coupling and crosstalk.
26
5. Reference Inputs: It is recommended to use a
minimum 10μF tantalum with a 0.1μF ceramic
capacitor directly across the reference inputs,
VREFP and VREFN. The reference input should
be driven by a low-impedance source. For best
performance, the reference should have less than
3μVRMS in-band noise. For references with noise
higher than this, external reference filtering may
be necessary.
6. Analog Inputs: The analog input pins must be
driven differentially to achieve specified
performance. A true differential driver or
transformer (for ac applications) can be used for
this purpose. Route the analog inputs tracks
(AINP, AINN) as a pair from the buffer to the
converter using short, direct tracks and away
from digital tracks.
A 1nF to 10nF capacitor should be used directly
across the analog input pins, AINP and AINN. A
low-k dielectric (such as COG or film type) should
be used to maintain low THD. Capacitors from
each analog input to ground can be used. They
should be no larger than 1/10 the size of the
difference capacitor (typically 100pF) to preserve
the AC common-mode performance.
7. Component Placement: Place the power supply,
analog input, and reference input bypass
capacitors as close as possible to the device
pins. This layout is particularly important for the
small-value ceramic capacitors. Surface-mount
components are recommended to avoid the
higher inductance of leaded components.
Figure 26 to Figure 28 illustrate basic connections
and interfaces that can be used with the
ADS1174/78.
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
OPA1632
+3.3V
ADS1174
2.2nF
Input1
(2)
TMS320VC5509
IOVDD
AINP1
DVDD (I/O)
(1)
10mF
AINN1
50W
2.2nF
Input2
(2)
AINP2
CLK
AINN2
DRDY/FSYNC
50W
SCLK
2.2nF
Input3
(2)
AINP3
DOUT1
AINN3
DOUT2
CLKOUT (27MHz)
50W
McBSP
PORT
50W
CVDD
(CORE)
200MHz
DOUT3
2.2nF
Input4
AINP4
(2)
DOUT4
AINN4
+5V
+
SYNC
AVDD
PWDN2
DVDD
+1.8V
I/O
PWDN1
(1)
10mF
+1.6V
(1)
10mF
PWDN3
20kW
PWDN4
100W
OPA350
100W
100mF
+
VREFP
+
10mF
(1)
0.1mF
(1)
+3.3V
(27MHz clock input selected)
CLKDIV
VREFN
0.1mF
PRODUCT PREVIEW
1kW
REF1004
MODE
VCOM
(1)
0.1mF
47W
Buffered
VCOM
Output
OPA350
JTAG
(3)
Device
TEST0
TEST1
DIN
AGND
DGND
(Low-Power, Frame-Sync, TDM,
and Fixed-Position data selected.)
FORMAT2
FORMAT1
+3.3V
FORMAT0
(1) Indicates ceramic capacitors.
(2) Indicates COG ceramic capacitors.
(3) Optional. For boundary scan test, the ADS1174 digital I/O should connect to a JTAG-compatible device.
Figure 26. ADS1174 Basic Connection Drawing
1kW
1kW
2.7nF
Buffered
VCOM
Output
+15V
(2)
Buffered
VCOM
Output
(1)
AINP
OPA1632
49.9W
0.1mF
AINN
-15V
+15V
VOCM
(1)
AINP
OPA1632
0.1mF
(2)
(1)
10nF
1kW
NOTES: (1) Bypass with 10mF and 0.1mF capacitors.
(2) 15nF for Low-Speed mode.
Figure 27. Basic Differential Input Signal Interface
49.9W
AINN
-15V
1kW
(2)
49.9W
(1)
2.7nF
1kW
249W
10nF
49.9W
VOCM
VIN
1kW
VIN
VO DIFF = 0.25 ´ VIN
VO COMM = VREF
(2)
249W
NOTES: (1) Bypass with 10mF and 0.1mF capacitors.
(2) 56nF for Low-Speed mode.
Figure 28. Basic Single-Ended Input Signal
Interface
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
27
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
PowerPAD THERMALLY-ENHANCED
PACKAGING
The PowerPAD concept is implemented in standard
epoxy resin package material. The integrated circuit
is attached to the leadframe die pad using thermally
conductive epoxy. The package is molded so that the
leadframe die pad is exposed at a surface of the
package. This exposure provides an extremely low
thermal resistance to the path between the IC
junction and the exterior case. The external surface
of the leadframe die pad is located on the printed
circuit board (PCB) side of the package, allowing the
IC Die
die pad to be attached to the PCB using standard
flow soldering techniques. This soldering allows
efficient attachment to the PCB and permits the board
structure to be used as a heat-sink for the package.
Using a thermal pad identical in size to the die pad
and vias connected to the PCB ground plane, the
board designer can now implement power packaging
without additional thermal hardware (for example,
external heat sinks) or the need for specialized
assembly instructions.
Figure 29 illustrates a cross-section view of a
PowerPAD package.
Mold Compount
(Epoxy)
Wire Bond
Wire Bond
PRODUCT PREVIEW
Leadframe Die Pad
Exposed at Base of Package
Die Attach Epoxy
(thermally conductive)
Leadframe
Figure 29. Cross-Section View of a PowerPAD Thermally-Enhanced Package
28
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
ADS1174
ADS1178
www.ti.com
SBAS373 – OCTOBER 2007
Figure 30 shows the recommended layer structure for
thermal management when using a PowerPad
package on a 4-layer PCB design. Note that the
thermal pad is placed on both the top and bottom
sides of the board. The ground plane is used as the
heat-sink, while the power plane is thermally isolated
from the thermal vias.
Figure 31 shows the required thermal pad etch
pattern for the 64-lead HTQFP package used for the
ADS1174/78. Nine 13mil (0.33mm) thermal vias
plated with one ounce of copper are placed within the
thermal pad area for the purpose of connecting the
pad to the ground plane layer. The ground plane is
used as a heatsink in this application. It is very
important that the thermal via diameter be no larger
than 13mils in order to avoid solder wicking during
the reflow process. Solder wicking results in thermal
voids that reduce heat dissipation efficiency and
hamper heat flow away from the IC die.
The via connections to the thermal pad and internal
ground plane should be plated completely around the
hole, as opposed to the typical web or spoke thermal
relief connection. Plating entirely around the thermal
via provides the most efficient thermal connection to
the ground plane.
Additional PowerPAD Package Information
Texas Instruments publishes the PowerPAD
Thermally Enhanced Package Application Report (TI
literature number SLMA002), available for download
at www.ti.com, which provides a more detailed
discussion of PowerPAD design and layout
considerations. Before attempting a board layout with
the ADS1174/78, it is recommended that the
hardware engineer and/or layout designer be familiar
with the information contained in this document.
PRODUCT PREVIEW
PowerPAD PCB Layout Considerations for the
ADS1174/78
Package
Thermal Pad
Component
Traces
13mils (0.33mm)
Component (top) Side
Thermal Via
Ground Plane
Power Plane
Thermal Isolation
(power plane only)
Solder (bottom) Side
Package
Thermal Pad
(bottom trace)
Figure 30. Recommended PCB Structure for a 4-Layer Board
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
29
ADS1174
ADS1178
www.ti.com
118mils (3mm)
40mils (1mm)
40mils (1mm)
SBAS373 – OCTOBER 2007
Package Outline
Thermal Pad
40mils (1mm)
40mils (1mm)
118mils (3mm)
316mils (8mm)
Thermal Via
13mils (0.33mm)
PRODUCT PREVIEW
316mils (8mm)
Figure 31. Thermal Pad Etch and Via Pattern for the 64-Lead HTQFP Package
30
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): ADS1174 ADS1178
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS1174IPAPR
PREVIEW
HTQFP
PAP
64
1000
TBD
Call TI
Call TI
ADS1174IPAPT
PREVIEW
HTQFP
PAP
64
250
TBD
Call TI
Call TI
ADS1178IPAPR
PREVIEW
HTQFP
PAP
64
1000
TBD
Call TI
Call TI
ADS1178IPAPT
PREVIEW
HTQFP
PAP
64
250
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated