25–31 GHz Amplifier AA028P2-99 Features ■ 15 dB Gain ■ +16 dBm Output Power ■ Rugged, Reliable Package ■ Single Voltage Operation ■ 100% RF and DC Testing Description The AA028P2-99 is a broadband millimeterwave amplifier in a rugged package. The amplifier is designed for use in millimeterwave communication and sensor systems as a gain stage in the receiver, transmitter, or local oscillator chain. The robust ceramic and metal package provides excellent electrical performance, excellent thermal performance, and a high degree of environmental protection for long-term reliability. A single supply voltage simplifies bias requirements. All amplifiers are screened at the operating frequencies prior to shipment for guaranteed performance. Amplifier is targeted for millimeterwave point-to-point and point-to-multipoint wireless communications systems. Pin Out N/C VD RF In RF Out N/C PIN 1 INDICATOR N/C Electrical Specifications at 25°C (VD = 5.5 V) RF Parameter Symbol Min. Typ. Max. Unit BW 25 24—32 31 GHz Small Signal Gain G 12.5 15 Input Return Loss RLI 7 dB Output Return Loss RLO 11 dB Output Power at 1 dB Gain Compression P1 dB 16 dBm Temperature Coefficient of Gain dG/dT -0.025 dB/C Bandwidth 14 dB DC Parameter Symbol Drain Current ID Min. Typ. Max. Unit 70 110 mA Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A 1 25–31 GHz Amplifier AA028P2-99 Typical Performance Data 0 20 Return Loss (dB) S22 Gain (dB) 15 -55˚C 10 +25˚C +85˚C 5 -5 -10 S11 -15 0 20 25 30 35 25 30 35 Frequency (GHz) Frequency (GHz) Gain vs. Frequency Return Loss vs. Frequency Absolute Maximum Ratings 20 Characteristic 18 P1 dB (dBm) 20 16 14 Value Operating Temperature (TC) -55°C to +90°C Storage Temperature (TST) -65°C to +150°C Bias Voltage (VD1) 7 VDC Power In (PIN) 13 dBm 12 10 25 27 29 31 Frequency (GHz) Output Power vs. Frequency Outline 0.295 (7.49 mm) 0.225 (5.72 mm) 0.011 (0.28 mm) 0.022 (0.56 mm) 0.180 (4.57 mm) 0.090 (2.29 mm) AA028P2-99 YYWW 0.008 (0.20 mm) PIN 1 IDENTIFICATION 0.028 (0.71 mm) 2 0.057 (1.45 mm) Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A 25–31 GHz Amplifier AA028P2-99 Typical S-Parameters at 25°C (VD = 5.5 V) Frequency (GHz) S11 S21 S12 S22 Mag. Ang. Mag. Ang. Mag. Ang. Mag. Ang. 16.0 -4.85 152.7 -25.23 -153.3 -63.11 164.5 -1.85 -100.5 18.0 -22.12 70.9 -13.67 123.7 -56.09 3.3 -2.09 -135.0 19.0 -6.24 78.7 -5.74 120.8 -51.64 -45.9 -1.95 -151.8 20.0 -9.94 -19.7 2.66 47.9 -44.79 -43.6 -1.76 -172.1 21.0 -12.26 -100.9 8.02 -27.2 -36.34 -101.1 -2.80 162.8 22.0 -10.95 -129.8 9.36 -103.7 -33.60 178.6 -4.86 147.3 23.0 -7.28 -160.3 9.96 -160.3 -32.63 122.6 -6.35 125.1 24.0 -4.80 167.0 11.61 147.9 -31.12 61.7 -11.42 97.0 24.5 -4.09 148.3 12.40 119.7 -31.48 29.4 -17.03 91.7 25.0 -3.63 130.1 13.50 90.6 -31.62 3.6 -25.61 163.6 25.5 -3.34 109.9 14.51 59.3 -32.27 -18.7 -15.07 -168.1 26.0 -3.68 89.4 15.41 25.1 -31.92 -43.2 -10.85 -179.3 26.5 -4.84 69.8 15.46 -10.0 -32.99 -65.3 -8.85 167.5 27.0 -6.43 50.7 15.24 -44.0 -31.91 -96.7 -7.86 151.6 27.5 -8.29 34.2 14.76 -76.6 -32.44 -112.7 -8.01 136.5 28.0 -10.93 19.1 14.15 -106.7 -31.83 -149.7 -8.98 123.5 28.5 -14.13 7.9 13.49 -132.6 -32.00 -165.7 -10.81 115.6 29.0 -18.80 16.5 13.32 -160.2 -32.53 162.0 -12.53 116.1 29.5 -21.91 37.3 12.75 170.7 -32.92 132.5 -13.15 123.2 30.0 -21.44 46.2 13.03 141.9 -32.84 107.7 -12.56 129.1 30.5 -21.35 23.6 13.57 106.6 -32.41 75.0 -12.21 122.5 31.0 -23.03 -38.4 13.60 70.9 -32.28 41.7 -13.63 114.3 31.5 -15.72 -140.9 13.75 29.7 -30.59 -3.3 -19.81 142.5 32.0 -8.48 167.1 12.55 -19.9 -32.45 -54.3 -9.85 -177.8 32.5 -5.19 127.6 9.33 -73.4 -34.70 -74.9 -5.11 159.1 33.0 -3.37 99.0 4.60 -112.3 -35.29 -100.0 -2.79 140.9 34.0 -1.37 52.2 -6.55 -169.7 -35.54 -139.1 -1.15 101.2 36.0 -1.39 -18.7 -25.55 111.9 -32.62 106.3 6.24 36.6 38.0 -2.82 -77.9 -36.95 34.4 -52.23 66.3 2.80 -49.7 40.0 -4.29 -123.0 -38.71 -98.0 -47.21 147.9 -0.80 -94.1 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A 3 25–31 GHz Amplifier AA028P2-99 Co-Planar Millimeterwave Package Handling and Mounting Millimeterwave amplifiers require careful mounting design to maintain optimal performance. Handling The co-planar millimeterwave package is very rugged. However, due to ceramic’s brittle nature one should exercise care when handling with metal tools. Do not apply heavy pressure to the lid. Vacuum tools may be used to pick and place this part. Only personnel trained in both ESD precautions and handling precautions should be allowed to handle these packages. package to minimize the gap between package and printed circuit board. The gap should be no more than 0.005" (0.127 mm). The base of the package should be mounted directly to a surface which provides a good ground plane for the printed circuit board and provides a good thermal ground. The RF connection on the printed circuit board should include a microstrip line and two grounded pads, one on either side of the microstrip line. The RF connection between the package and the printed circuit board should be accomplished with three ribbon bonds, one connecting the RF lines on package and printed circuit board and two connecting the ground pads on the package and printed circuit board. Mounting the Package Package Construction The co-planar millimeterwave package is constructed from metal and ceramic. The base of the package is gold-plated copper-molybdenum-copper. The lid is unplated alumina. The lid seal is epoxy. The package should be attached to its mounting surface using a silver-filled conductive paste epoxy. Care should be taken to ensure that there are no voids or gaps in the epoxy underfill so that a good ground contact is maintained. Mounting Design Connecting the Package The co-planar millimeterwave package is mounted by placing it in a hole cut in a printed circuit board. The RF interface on the package should be in the same plane as the surface of the printed circuit board. The hole should be cut as close as possible to the outer dimensions of the Thermosonic ribbon attachment with 0.00025" x 0.005" (0.0064 mm x 0.127 mm) gold ribbon is used to make the connections from the RF and DC package interfaces to the printed circuit board. Lengths of ribbons should be minimized. Printed Circuit Board Rogers 4003 0.008" (0.20 mm) Thick Ribbon Bonds RF Out Minimize RF Gap Widths RF In Electrically & Thermally Conductive Ground Plane Grounded Pad on Printed Circuit Board DC Lines Co-Planar Millimeterwave Package Mounting 4 Alpha Industries, Inc. [781] 935-5150 • Fax [617] 824-4579 • Email [email protected] • www.alphaind.com Specifications subject to change without notice. 2/00A