A23L9308 Series Preliminary 524,288 X 8 BIT CMOS MASK ROM Document Title 524,288 X 8 BIT CMOS MASK ROM Revision History Rev. No. 0.0 PRELIMINARY History Issue Date Remark Initial issue October 2, 2001 Preliminary (October, 2001, Version 0.0) AMIC Technology, Inc. A23L9308 Series Preliminary 524,288 X 8 BIT CMOS MASK ROM Features n 524,288 x 8 bit organization n Wide power supply range: +2.7V to +3.6V n Access time: 150ns (max.)/3V~3.6V 200ns (max.)/2.7V~3.3V n Current: Operating: 15mA (max.)/3V~3.6V 10mA (max.)/2.7V~3.3V Standby: 25ìA (max.)/3V~3.6V 5ìA (max.)/2.7V~3.3V n Mask Programmed for Chip Enable (power-down) CE/ CE , Output Enable OE/ OE /NC n Three-state outputs for wired-OR expansion n Full static operation n All inputs and outputs are directly TTL-compatible n Available in 32-pin DIP, 32-pin SOP, 32-pin PLCC packages or in DICE FORM. General Description The A23L9308 offers an automatic POWER-DOWN controlled by the Chip Enable CE/ CE input. When CE/ CE goes low/high, the device will automatically POWER-DOWN and remain in a low power STANDBY mode as long as CE/ CE remains low/high. A23L9308 also offers OE/ OE /NC (Active High or Low or No Connection), which eliminates bus contention in multiple bus microprocessor systems. The A23L9308 high-performance Read Only Memory is configured as 524,288 x 8 bits. It is designed to be compatible with all microprocessors and similar applications where high-performance, large-bit storage, and simple interfacing are important design considerations. This device is designed for use with operating voltage from 2.7V to 3.6V. Pin Configurations A12 A15 A16 NC VCC A18 A17 3 2 1 32 31 30 n PLCC 4 n P-DIP / SOP 1 32 VCC 2 31 A18 A15 3 30 A17 A12 4 29 A14 A7 5 29 A14 A7 5 28 A13 A6 6 28 A13 A6 6 27 A8 A5 7 27 A8 A5 7 26 A9 A4 8 26 A9 A3 9 A10 22 CE/CE O0 13 21 O7 12 21 O7 O0 13 20 O6 O1 14 19 O5 O2 15 18 O4 GND 16 17 O3 (October, 2001, Version 0.0) 1 20 12 O6 CE/CE 19 23 22 18 11 A0 O5 A1 O4 A10 17 OE/OE/NC 23 O3 24 A0 PRELIMINARY OE/OE/NC 16 11 24 15 A1 A11 10 A2 O2 10 A11 GND 9 A2 25 25 14 8 A3 A23L9308 O1 A4 A23L9308 NC A16 AMIC Technology, Inc. A23L9308 Series Block Diagram ROW MEMORY CELL DECODER ARRAY DRIVER 524,288 X 8 A0 - A18 ADDRESS INPUTS COLUMN DECODER COLUMN SELECTOR CIRCUITRY DRIVER O0 O1 CE/CE OE/OE/NC O2 POWER-DOWN OR OUTPUT ENABLE CIRCUITRY O3 O4 O5 O6 O7 PRELIMINARY (October, 2001, Version 0.0) 2 AMIC Technology, Inc. A23L9308 Series Pin Descriptions Pin No. Symbol Description 32L DIP/SOP 32L PLCC 2 - 12, 23, 25 - 31 2 - 12, 23, 25 - 31 A0 - A18 Address Inputs 22 22 CE/ CE Chip Enable Input (Note 1) 24 24 OE/ OE /NC 13 - 15, 17 - 21 13 - 15, 17 - 21 O0 - O7 Data Outputs 32 32 VCC Power Supply 16 16 GND Ground 1 1 NC Output Enable (Note 1) No Connection (Note 2) Notes: 1. This pin is user-definable as active high or active low. 2. NC indicates "No Connection." Recommended DC Operating Conditions (TA = 0°C to + 70°C) Symbol Parameter Min. Max. Unit VCC Supply Voltage 2.7 3.6 V GND Ground 0 0 V VIH Input High Voltage 0.7* VCC VCC+0.3 V VIL Input Low Voltage - 0.5 0.8 V PRELIMINARY (October, 2001, Version 0.0) 3 AMIC Technology, Inc. A23L9308 Series Absolute Maximum Ratings* *Comments Ambient Operating Temperature . . . . . . . -10°C to + 80°C Storage Temperature . . . . . . . . . . . . . . -65°C to + 150°C Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to + 7.0V Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mW Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (TA = 0°C to + 70°C, GND = 0V) Symbol Parameter 3V~3.6V Min. Max. VOH Output High Voltage VOL Output Low Voltage VlH Input High Voltage 0.7*VCC VCC+0.5 VlL Input Low Voltage -0.5 0.6 lLI Input Leakage Current lLO Min. Unit Conditions Note Max. V IOH = -0.4mA (3V) 0.4 V IOL = 1.6mA (3V) 0.7*VCC VCC+0.5 V -0.5 0.6 V +5 +5 µA VCC = max. VIN = VCC to GND Output Leakage Current +5 +5 µA VCC = max. VOUT = VCC to GND 1 ICC Operating Supply Current 15 10 mA tCYC = min. 2 ISB Standby Supply Current (TTL) 0.5 0.3 mA CE = VIH, CE = VIL ISB1 Standby Supply Current (CMOS) 25 5 µA CE = VCC - 0.2V, CE = 0.2V PRELIMINARY (October, 2001, Version 0.0) 2.15 2.7V~3.3V 2.15 0.4 4 AMIC Technology, Inc. A23L9308 Series Capacitance Symbol Parameter Min. Max. Unit CI Input Capacitance 10 pF CO Output Capacitance 10 pF AC Characteristics Test Conditions Note TA = 25°C f = 1.0MHz 3 (TA = 0°C to +70°C, VCC=3.0V~3.6V for -15, VCC=2.7V~3.3V for -20, GND = 0V) Symbol Parameter A23L9308-15 Min. Max. 150 A23L9308-20 Min. Unit Note Max. tCYC Cycle Time 200 tAA Address Access Time 150 200 ns tACE Chip Enable Access Time 150 200 ns tAOE Output Enable Access Time 90 160 ns tOH Output Hold after Address Change 10 10 ns tLZ Output Low Z Delay 10 10 ns 4, 6 tHZ Output High Z Delay* ns 5, 6 70 ns 70 * tHZ is specified from either OE / OE or CE / CE going disabled, whichever occurs first. Notes: 1. OE/CE = VIL, OE / CE = VIH (Output is unloaded) 2. VIN = VIH/VIL, but OE/CE = VIH, OE / CE = VIL (Output is unloaded) 3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground. 4. Output LOW impedance delay (tLZ) is measured from CE or OE going active. 5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive. 6. This parameter is sampled and not 100% tested. PRELIMINARY (October, 2001, Version 0.0) 5 AMIC Technology, Inc. A23L9308 Series Timing Waveforms Propagation Delay from Address (CE/ CE = Active, OE/ OE = Active) tCYC ADDRESS INPUTS VALID tAA tOH VALID DATA OUT Propagation Delay from Chip Enable or Output Enable (Address Valid) CHIP ENABLE VALID tACE OUTPUT ENABLE VALID tAOE tHZ tLZ VALID DATA OUT tLZ AC Test Conditions Applied Voltage 2.7V~3.6V Input Pulse Levels 0.4V to 2.4V Input Rise and Fall Time 10 ns VIN = 1.5V VOUT = 1.5V Timing Measurement Reference Level Output Load PRELIMINARY 1 TTL gate and CL = 100pF (October, 2001, Version 0.0) 6 AMIC Technology, Inc. A23L9308 Series Function Table CE/ CE OE/ OE /NC O0 - O7 Mode A A Data Out Read I X Hi - Z Power-down A I Hi - Z Output Disable 1. CE/ CE and OE/ OE /NC are mask programmable as either active low, active high, or no connection. 2. "A" means "Active," "I" means "Inactive," and "X" means "Either." Ordering Information Part No. Access Time (ns) Package A23L9308-15 150 32L DIP A23L9308M-15 150 32L SOP A23L9308L-15 150 32L PLCC A23L9308H-15 150 DICE FORM A23L9308-20 200 32L DIP A23L9308M-20 200 32L SOP A23L9308L-20 200 32L PLCC A23L9308H-20 200 DICE FORM PRELIMINARY (October, 2001, Version 0.0) 7 AMIC Technology, Inc. A23L9308 Series A17 32 31 30 A11 A18 33 29 28 27 26 17 18 19 20 21 22 23 24 25 OE/OE/NC VCC 1 A9 VCC 2 A10 A16 3 A8 A15 4 CE/CE A12 5 A13 A7 6 A14 A6 7 O6 A5 8 GND A4 Pad Configurations Y X O7 O5 O4 GND O2 O1 A0 13 14 15 16 O0 11 12 A1 10 A2 A3 9 O3 (0,0) Pad Location Pad No. Pad Name 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VCC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND GND PRELIMINARY Coordinate (um) X Y -73.6 1406.3 -259.9 1419.2 -409.9 1419.2 -532.9 1419.2 -682.9 1419.2 -805.9 1419.2 -955.9 1419.2 -1078.9 1419.2 -1079.3 -1419.7 -956.3 -1419.2 -806.3 -1419.2 -683.3 -1419.2 -529.3 -1419.7 -406.3 -1419.7 -254.8 -1419.7 -131.8 -1419.7 -8.8 -1417.7 (October, 2001, Version 0.0) 8 Pad No. Pad Name 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 O3 O4 O5 O6 O7 CE/ CE A10 OE/ OE /NC A11 A9 A8 A13 A14 A17 A18 VCC Coordinate (um) X Y 138.7 -1419.7 261.7 -1419.7 413.2 -1419.7 536.2 -1419.7 687.7 -1419.7 810.7 -1419.2 960.7 -1419.2 1083.7 -1419.2 1083.3 1419.2 960.3 1419.2 810.3 1419.2 687.3 1419.2 537.3 1419.2 414.3 1419.2 264.3 1419.2 97.1 1417.7 AMIC Technology, Inc. A23L9308 Series Package Information P-DIP 32L Outline Dimensions unit: inches/mm D 17 1 16 E 32 A1 A2 Base Plane L A C E1 Seating Plane B Symbol θ e B1 Dimensions in inches Min Nom Max EA Dimensions in mm Min Nom Max A - - 0.210 - - 5.334 A1 0.015 - - 0.381 - - A2 0.149 0.154 0.159 3.785 3.912 4.039 B - 0.018 - - 0.457 - B1 - 0.050 - - 1.270 - C D 1.645 0.010 1.650 1.655 41.783 0.254 41.91 42.037 E 0.537 0.542 0.547 13.64 13.767 13.894 E1 0.590 0.600 0.610 14.986 15.240 15.494 EA 0.630 0.650 0.670 16.002 16.510 17.018 e - 0.100 - - 2.540 - L 0.120 0.130 0.140 3.048 3.302 3.556 θ 0° - 15° 0° - 15° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. PRELIMINARY (October, 2001, Version 0.0) 9 AMIC Technology, Inc. A23L9308 Series Package Information SOP (W.B.) 32L Outline Dimensions unit: inches/mm HE 17 E 32 θ L 1 b 16 Detail F D Seating Plane LE A1 e S A A2 c D y See Detail F Dimensions in inches Dimensions in mm Symbol Min Nom Max Min Nom Max A - - 0.118 - - 3.00 A1 0.004 - - 0.10 - - A2 0.101 0.106 0.111 2.57 2.69 2.82 b 0.014 0.016 0.020 0.36 0.41 0.51 c 0.006 0.008 0.012 0.15 0.20 0.31 D - 0.805 0.817 - 20.45 20.75 E 0.440 0.445 0.450 11.18 11.30 11.43 e 0.044 0.050 0.056 1.12 1.27 1.42 HE 0.546 0.556 0.566 13.87 14.12 14.38 0.99 L 0.023 0.031 0.039 0.58 0.79 LE 0.047 0.055 0.063 1.19 1.40 1.60 S - - 0.036 - - 0.91 y - - 0.004 - - 0.10 θ 0° - 10° 0° - 10° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (October, 2001, Version 0.0) 10 AMIC Technology, Inc. A23L9308 Series Package Information PLCC 32L Outline Dimension unit: inches/mm HD D 13 5 E 1 HE 4 14 32 20 30 29 c A1 b e L A A2 21 b1 D GE GD y θ Dimensions in inches Symbol Dimensions in mm Min Nom Max Min Nom Max A - - 0.134 - - 3.40 A1 0.0185 - - 0.47 - - A2 0.105 0.110 0.115 2.67 2.80 2.93 b1 0.026 0.028 0.032 0.66 0.71 0.81 b 0.016 0.018 0.021 0.41 0.46 0.54 C 0.008 0.010 0.014 0.20 0.254 0.35 D 0.547 0.550 0.553 13.89 13.97 14.05 E 0.447 0.450 0.453 11.35 11.43 11.51 e 0.044 0.050 0.056 1.12 1.27 1.42 GD 0.490 0.510 0.530 12.45 12.95 13.46 GE 0.390 0.410 0.430 9.91 10.41 10.92 HD 0.585 0.590 0.595 14.86 14.99 15.11 HE 0.485 0.490 0.495 12.32 12.45 12.57 L 0.075 0.090 0.095 1.91 2.29 2.41 y - - 0.003 - - 0.075 θ 0° - 10° 0° - 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. PRELIMINARY (October, 2001, Version 0.0) 11 AMIC Technology, Inc.