PRELIMINARY DATA SHEET NEC's 4-PIN SOP LOW OFF-STATE LEAKAGE CURRENT PS7200U-1A 1-ch OPTICAL COUPLED MOS FET DESCRIPTION FEATURES NEC's PS7200U-1A is a low output capacitance solid state • LOW OFF-STATE LEAKAGE CURRENT: ILoff = 0.1 nA TYP. relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. • BREAK DOWN VOLTAGE: VL = 80 V It is suitable for high-frequency signal control, due to its extremely low off-state leakage current, low output • HIGH-SPEED TURN-ON TIME: ton = 0.05 ms TYP capacitance, and high-speed turn-on time. • LOW OUTPUT CAPACITANCE: Cout = 2.3 pF TYP. • C × R: C × R = 40 pF • Ω • 1 CHANNEL TYPE: 1a Output APPLICATIONS • Measurement Equipment • DESIGNED FOR AC/DC SWITCHING LINE CHANGER • SMALL AND THIN PACKAGE: 4-pin SOP, Height = 2.1 mm • LOW OFFSET VOLTAGE • ORDERING NUMBER OF TAPING PRODUCT: PS7200U-1A-E3, E4, F3, F4 The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. California Eastern Laboratories 1 PS7200U-1A PACKAGE DIMENSIONS (UNIT: mm) 4.0±0.5 TOP VIEW 4 3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 1 2 0.05+0.08 -0.05 2.05+0.08 -0.05 0.15+0.10 -0.05 7.0±0.3 4.4 0.5±0.3 2.54 0.40+0.10 -0.05 0.25 M 2 PS7200U-1A ORDERING INFORMATION PART NUMBER ORDER NUMBER SOLDER PLATING SPECIFICATION PACKING STYLE PS7200U-1A PS7200U-1A Solder Magazine case 100 pcs PS7200U-1A-E3 PS7200U-1A-E3 contains lead Embossed Tape 900 pcs/reel PS7200U-1A-E4 PS7200U-1A-E4 PS7200U-1A-F3 PS7200U-1A-F3 PS7200U-1A-F4 PS7200U-1A-F4 PS7200U-1A PS7200U-1A-A PS7200U-1A-E3 PS7200U-1A-E3-A PS7200U-1A-E4 PS7200U-1A-E4-A PS7200U-1A-F3 PS7200U-1A-F3-A PS7200U-1A-F4 PS7200U-1A-F4-A Embossed Tape 3 500 pcs/reel Pb-Free Embossed Tape 900 pcs/reel Embossed Tape 3 500 pcs/reel ABSOLUTE MAXIMUM RATINGS PARAMETER Diode MOS FET Magazine case 100 pcs (TA = 25ºC, unless otherwise specified ) SYMBOL RATINGS UNIT Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V Power Dissipation PD 50 mW Peak Forward Current *1 IFP 1 A Break Down Voltage VL 80 V Continuous Load Current IL 40 mA Pulse Load Current*2 (AC/DC Connection) ILP 80 mA PD 300 mW Isolation Voltage *3 Power Dissipation BV 1 500 Vr.m.s. Total Power Dissipation PT 350 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C *1 PW = 100 μs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 °C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together. 3 PS7200U-1A RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PARAMETER SYMBOL MIN. TYP. LED Operating Current IF 2 10 LED Off Voltage VF 0 ELECTRICAL CHARACTERISTICS PARAMETER Diode MOS FET Coupled MAX. UNIT 20 mA 0.5 V (TA = 25ºC) SYMBOL CONDITIONS MIN. TYP. MAX. UNIT Forward Voltage VF IF = 5 mA 1.1 1.3 V Reverse Current IR VR = 5 V 0.01 5.0 μA Off-state Leakage Current ILoff VD = 80 V 0.1 1.0 nA Output Capacitance Cout VD = 0 V, f = 1 MHz 2.3 3.5 pF LED On-state Current IFon IL = ±40 mA 2.0 mA On-state Resistance Ron IF = 5 mA, IL = ±40 mA 17 25 Ω Turn-on Time*1 ton IF = 5 mA, VL = 5 V, RL = 500 Ω, 0.05 0.5 ms Turn-off Time*1 toff PW ≥ 0.5 ms 0.15 0.5 109 Isolation Resistance RI-O VI-O = 1.0 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MHz Ω 0.3 pF *1 Test Circuit for Switching Time Pulse Input IF VL 50% Input 0 Input monitor VO = 5 V VO monitor Rin 90% Output RL 10% ton 4 toff PS7200U-1A TAPING SPECIFICATIONS (mm) 1.55±0.1 2.9 MAX. 7.4±0.1 5.5±0.05 1.5+0.1 -0 12.0±0.2 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.4±0.1 4.6±0.1 0.3 8.0±0.1 Tape Direction PS7200U-1A-E3 PS7200U-1A-E4 Outline and Dimensions (Reel) 2.0±0.5 φ 21.0±0.8 φ 60 +1 -0 R 1.0 φ 180 +0 -1.5 2.0±0.5 φ13.0±0.2 13.5±1.0 17.5±1.0 11.9 to 15.4 Outer edge of flange Packing: 900 pcs/reel 5 PS7200U-1A 1.55±0.1 2.9 MAX. 7.4±0.1 5.5±0.05 1.5+0.1 -0 12.0±0.2 2.0±0.05 4.0±0.1 1.75±0.1 Outline and Dimensions (Tape) 2.4±0.1 4.6±0.1 0.3 8.0±0.1 Tape Direction PS7200U-1A-F4 PS7200U-1A-F3 Outline and Dimensions (Reel) φ 21.0±0.8 φ 13.0±0.2 R 1.0 φ 100±1.0 2.0±0.5 φ13.0±0.2 φ 330±2.0 2.0±0.5 13.5±1.0 17.5±1.0 11.9 to 15.4 Outer edge of flange Packing: 3 500 pcs/reel 6 PS7200U-1A NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) Package Surface Temperature T (ºC) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 260ºC MAX. 220ºC to 60 s 180ºC 120ºC 120±30 s (preheating) Time (s) (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron • Peak Temperature (lead part temperature) 350°C or below • Time (each pins) 3 seconds or less • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100°C 7 PS7200U-1A (4) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. USAGE CAUTIONS 1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 04/11/2005 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 8