TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 FEATURES APPLICATIONS • • • • • • • • • • 1 Low ON-State Resistance (ron) – 0.9 Ω Max (3-V Supply) – 1.5 Ω Max (1.8-V Supply) 0.4-Ω Max ron Flatness (3-V Supply) 1.6-V to 3.6-V Single-Supply Operation Available in SOT-23 and MSOP Packages High Current-Handling Capacity (100 mA Continuous) 1.8-V CMOS Logic Compatible (3-V Supply) Fast Switching: tON = 14 ns, tOFF = 9 ns • • • • • • DGK PACKAGE . . .TS3A4741 (TOP VIEW) DCN PACKAGE . . .TS3A4741 (TOP VIEW) NO1 1 8 V+ IN1 1 8 NO1 COM1 2 7 IN1 V+ 2 7 COM1 IN2 3 6 COM2 NO2 3 6 IN2 GND 4 5 NO2 COM2 4 5 GND Power Routing Battery-Powered Systems Audio and Video Signal Routing Low-Voltage Data-Acquisition Systems Communications Circuits PCMCIA Cards Cellular Phones Modems Hard Drives DGK PACKAGE . . .TS3A4742 (TOP VIEW) DCN PACKAGE . . .TS3A4742 (TOP VIEW) NC1 1 8 V+ IN1 1 8 NC1 COM1 2 7 IN1 V+ 2 7 COM1 IN2 3 6 COM2 NC2 3 6 IN2 GND 4 5 NC2 COM2 4 5 GND DESCRIPTION/ORDERING INFORMATION The TS3A4741/TS3A4742 are low ON-state resistance (ron), low-voltage, dual single-pole/single-throw (SPST) analog switches that operate from a single 1.6-V to 3.6-V supply. These devices have fast switching speeds, handle rail-to-rail analog signals, and consume very low quiescent power. The digital logic input is 1.8-V CMOS compatible when using a single 3-V supply. The TS3A4741 has two normally open (NO) switches, and the TS3A4742 has two normally closed (NC) switches. Both devices are available in 8-pin SOT-23 and MSOP packages. ORDERING INFORMATION PACKAGE (1) (2) TA MSOP – DGK ORDERABLE PART NUMBER Reel of 2500 –40°C to 85°C SOT-23 – DCN (1) (2) Reel of 3000 TOP-SIDE MARKING TS3A4741DGKR JYR TS3A4742DGKR L7R TS3A4741DCNR 8BLR TS3A4742DCNR 8BPR Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. FUNCTION TABLE IN NO TO COM, COM TO NO (TS3A4741) NC TO COM, COM TO NC (TS3A4742) L OFF ON H ON OFF 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2008, Texas Instruments Incorporated TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX V+ Supply voltage reference to GND (2) –0.3 4 V VNO VCOM VIN Analog and digital voltage range –0.3 V+ + 0.3 V INO ICOM On-state switch current –100 100 mA I+ IGND Continuous current through V+ or GND ±100 mA ±200 mA VNO, VCOM = 0 to V+ Peak current pulsed at 1 ms, 10% duty cycle TA Operating temperature range TJ Junction temperature Tstg Storage temperature range (1) (2) COM, VNO, VCOM –40 –65 UNIT 85 °C 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Signals on COM or NO exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current rating. PACKAGE THERMAL IMPEDANCE UNIT θJA (1) 2 Package thermal impedance (1) DCN package 88 DGK package 88 °C/W The package thermal impedance is measured in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 ELECTRICAL CHARACTERISTICS FOR 3-V SUPPLY (1) (2) V+ = 2.7 V to 3.6 V, TA = –40°C to 85°C, VIH = 1.4 V, VIL = 0.5 V (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS TA MIN TYP (3) MAX UNIT Analog Switch Analog signal range VCOM, VNO ON-state resistance ron V+ = 2.7 V, ICOM = –100 mA, VNO = 1.5 V 25°C Δron V+ = 2.7 V, ICOM = –100 mA, VNO = 1.5 V 25°C ron(flat) V+ = 2.7 V, ICOM = –100 mA, VNO = 1 V, 1.5 V, 2 V 25°C ON-state resistance match between channels (4) ON-state resistance flatness (5) 0 V+ 0.7 Full 1.1 0.03 Full 0.05 0.15 0.23 Full 0.4 0.5 NO OFF leakage current (6) INO(OFF) V+ = 3.6 V, VCOM = 0.3 V, 3 V, VNO = 3 V, 0.3 V 25°C –2 Full –18 COM OFF leakage current (6) ICOM(OFF) V+ = 3.6 V, VCOM = 0.3 V, 3 V, VNO = 3 V, 0.3 V 25°C –2 Full –18 COM ON leakage current (6) ICOM(ON) V+ = 3.6 V, VCOM = 0.3 V, 3 V, VNO = 0.3 V, 3 V, or floating 25°C –2.5 Full 0.9 1 2 18 1 2 18 0.01 –5 2.5 5 V Ω Ω Ω nA nA nA Dynamic Turn-on time tON VNO = 1.5 V, RL = 50 Ω, CL = 35 pF, See Figure 14 25°C Turn-off time tOFF VNO = 1.5 V, RL = 50 Ω, CL = 35 pF, See Figure 14 25°C Charge injection QC VGEN = 0, RGEN = 0, CL = 1 nF, See Figure 15 25°C 3 pC CNO(OFF) f = 1 MHz, See Figure 16 25°C 23 pF COM OFF capacitance CCOM(OFF) f = 1 MHz, See Figure 16 25°C 20 pF COM ON capacitance CCOM(ON) f = 1 MHz, See Figure 16 25°C 43 pF 25°C 125 MHz NO OFF capacitance Bandwidth BW RL = 50 Ω, Switch ON OFF isolation (7) OISO RL = 50 Ω, CL = 5 pF, See Figure 17 f = 10 MHz Crosstalk XTALK RL = 50 Ω, CL = 5 pF, See Figure 17 f = 10 MHz Total harmonic distortion THD f = 20 Hz to 20 kHz, VCOM = 2 VP-P RL = 32 Ω f = 1 MHz f = 1 MHz RL = 600 Ω 5 Full 14 15 4 Full 9 10 –40 25°C –73 dB –95 0.04 25°C ns dB –62 25°C ns % 0.003 Digital Control Inputs (IN1, IN2) Input logic high VIH Full Input logic low VIL Full Input leakage current IIN VI = 0 or V+ 1.4 25°C Full V 0.5 0.5 –20 1 20 V nA Supply Power-supply range Positive-supply current (1) (2) (3) (4) (5) (6) (7) V+ I+ 2.7 V+ = 3.6 V, VIN = 0 or V+ 3.6 25°C 0.075 Full 0.75 V µA The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. Parts are tested at 85°C and specified by design and correlation over the full temperature range. Typical values are at V+ = 3 V, TA = 25°C. Δron = ron(max) – ron(min) Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal ranges. Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C. OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 Submit Documentation Feedback 3 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (1) (2) V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C, VIH = 1 V, VIL = 0.4 V (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS TA MIN TYP (3) MAX UNIT Analog Switch Analog signal range VCOM, VNO ON-state resistance ron V+ = 1.8 V, ICOM = –10 mA, VNO = 0.9 V 25°C Δron V+ = 1.8 V, ICOM = –10 mA, VNO = 0.9 V 25°C ron(flat) V+ = 1.8 V, ICOM = –10 mA, 0 ≤ VNO ≤ V+ 25°C ON-state resistance match between channels (4) ON-state resistance flatness (5) 0 V+ 1 Full 1.5 2 0.09 Full 0.15 0.25 0.7 Full 0.9 1.5 NO OFF leakage current (6) INO(OFF) V+ = 1.95 V, VCOM = 0.15 V, 1.65 V, VNO = 1.8 V, 0.15 V 25°C –1 Full –10 COM OFF leakage current (6) ICOM(OFF) V+ = 1.95 V, VCOM = 0.15 V, 1.65 V, VNO = 1.8 V, 0.15 V 25°C –1 Full –10 COM ON leakage current (6) ICOM(ON) V+ = 1.95 V, VCOM = 0.15 V, 1.65 V, VNO = 0.15 V, 1.65 V, or floating 25°C –1 Full –3 0.5 1 10 0.5 1 10 0.01 1 3 V Ω Ω Ω nA nA nA Dynamic Turn-on time tON VNO = 1.5 V, RL = 50 Ω, CL = 35 pF, See Figure 14 25°C Turn-off time tOFF VNO = 1.5 V, RL = 50 Ω, CL = 35 pF, See Figure 14 25°C Charge injection QC VGEN = 0, RGEN = 0, CL = 1 nF, See Figure 15 25°C 3.2 pC CNO(OFF) f = 1 MHz, See Figure 16 25°C 23 pF COM OFF capacitance CCOM(OFF) f = 1 MHz, See Figure 16 25°C 20 pF COM ON capacitance CCOM(ON) f = 1 MHz, See Figure 16 25°C 43 pF 25°C 123 MHz NO OFF capacitance 6 Full 20 5 Full Bandwidth BW RL = 50 Ω, Switch ON OFF isolation (7) OISO RL = 50 Ω, CL = 5 pF, See Figure 17 f = 10 MHz Crosstalk XTALK RL = 50 Ω, CL = 5 pF, See Figure 17 f = 10 MHz Total harmonic distortion THD f = 20 Hz to 20 kHz, VCOM = 2 VP-P RL = 32 Ω –61 –95 ns dB –73 0.14 25°C RL = 600 Ω ns dB –36 25°C f = 100 MHz 10 12 25°C f = 100 MHz 18 % 0.013 Digital Control Inputs (IN1, IN2) Input logic high VIH Full Input logic low VIL Full Input leakage current IIN 1 25°C VI = 0 or V+ Full V 0.4 0.1 5 –10 10 1.65 1.95 V nA Supply Power-supply range Positive-supply current (1) (2) (3) (4) (5) (6) (7) 4 V+ I+ VI = 0 or V+ 25°C 0.05 Full 0.5 V µA The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. Parts are tested at 85°C and specified by design and correlation over the full temperature range. Typical values are at TA = 25°C. Δron = ron(max) – ron(min) Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal ranges. Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C. OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 TYPICAL PERFORMANCE 1.6 1.6 1.4 1.4 1.2 255C 1.2 V+ = 1.8 V 1.0 ron (W) 1.0 ron (Ω) 855C 0.8 0.6 V+ = 2.7 V 0.8 0.4 0.4 0.2 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 –405C 0.6 0.0 0.0 INC/ICOM (pA) ron (W) 2.0 NO/NC (OFF) 255C –405C 100.00 COM (ON) 10.00 1.00 0.5 1.0 1.5 VCOM (V) 2.0 2.5 −40°C 3.0 Figure 4. ION 25°C 85°C TA (°C) and IOFF vs Temperature (V+ = 3.6 V) 8 35 30 7 V+ = 3 V 6 tON/tOFF (ns) 25 QC (pC) 1.5 1000.00 855C Figure 3. ron vs VCOM (V+ = 2.7 V) 20 15 V+ = 1.8 V 10 5 tON 4 3 tOFF 2 5 0 0.0 1.0 VCOM (V) Figure 2. ron vs VCOM (V+ = 1.8 V) VCOM (V) Figure 1. ron vs VCOM 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.5 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 1.6 2.0 VCOM (V) 2.4 2.8 3.2 3.6 4.0 V+ (V) Figure 5. QC vs VCOM Figure 6. tON and tOFF vs Supply Voltage Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TS3A4741 TS3A4742 5 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 TYPICAL PERFORMANCE (continued) 7 1000.000 6 855C 100.000 255C 10.000 4 I+ (nA) tON/tOFF (ns) 5 TON = 1.8 V TOFF = 1.8 V TON = 3 V TOFF = 3 V 3 2 1.000 –405C 0.100 1 0.010 0 −40°C 25°C TA (°C) 0.001 0.0 85°C 0.5 1.0 1.5 2.0 2.5 3.0 3.5 V+ (V) Figure 7. tON and tOFF vs Temperature Figure 8. I+ vs V+ 0 0 −2 −10 −20 Attenuation (dB) Gain (dB) −4 −6 −8 −10 −12 −30 −40 −50 −60 −70 −80 −14 −90 0.1 1 10 Frequency (MHz) 100 1000 0.1 Figure 9. Gain vs Frequency (V+ = 3 V) 1 10 Frequency (MHz) 100 1000 Figure 10. OFF Isolation vs Frequency (V+ = 3 V) 0.042 0.0040 0.0036 0.041 0.0032 0.0028 THD (%) THD (%) 0.040 0.039 0.038 0.0024 0.0020 0.0016 0.0012 0.0008 0.037 0.0004 0.036 0 10 1K 10K 100K Frequency (kHz) Figure 11. Total Harmonic Distortion vs Frequency (RL = 32 Ω) 6 100 Submit Documentation Feedback 0.0000 0 10 100 1K Frequency (kHz) 10K 100K Figure 12. Total Harmonic Distortion vs Frequency (RL = 600 Ω) Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 TYPICAL PERFORMANCE (continued) 0 Attenuation (dB) −20 −40 −60 −80 −100 −120 0 0.1 1 10 100 Frequency (MHz) Figure 13. Crosstalk vs Frequency (V+ = 3 V) 1000 PIN DESCRIPTION PIN NO. TS3A4741 TS3A4742 NAME MSOP (DGK) SOT-23 (DCN) MSOP (DGK) SOT-23 (DCN) 2, 6 7, 4 2, 6 7, 4 COM1, COM2 DESCRIPTION Common 4 5 4 5 GND 7, 3 1, 6 7, 3 1, 6 IN1, IN2 1, 5 8, 3 NC1, NC2 Normally closed NO1, NO2 Normally open V+ Power supply 1, 5 8, 3 8 2 8 2 Digital ground Digital control to connect COM to NO or NC Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 Submit Documentation Feedback 7 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 APPLICATION INFORMATION Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum ratings, because stresses beyond the listed ratings can cause permanent damage to the device. Always sequence V+ on first, followed by NO, NC, or COM. Although it is not required, power-supply bypassing improves noise margin and prevents switching noise propagation from the V+ supply to other components. A 0.1-µF capacitor, connected from V+ to GND, is adequate for most applications. Logic Inputs The TS3A4741 logic inputs can be driven up to 3.6 V, regardless of the supply voltage. For example, with a 1.8-V supply, IN may be driven low to GND and high to 3.6 V. Driving IN rail to rail minimizes power consumption. Analog Signal Levels Analog signals that range over the entire supply voltage (V+ to GND) can be passed with very little change in ron (see Typical Operating Characteristics). The switches are bidirectional, so the NO, NC, and COM pins can be used as either inputs or outputs. Layout High-speed switches require proper layout and design procedures for optimum performance. Reduce stray inductance and capacitance by keeping traces short and wide. Ensure that bypass capacitors are as close to the device as possible. Use large ground planes where possible. 8 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION V+ V+ IN NO VIH + 0.5 V VNO IN VNO VCOM 35 pF a 50 W 50% 50% 0 VCOM COM GND tR < 5 ns tF < 5 ns 90% 90% 0 tON tOFF Figure 14. Switching Times V+ V+ RGEN NO VGEN VI IN GND a VI VO COM CL 1000 pF V+ 0 VO DVO Figure 15. Charge Injection (QC) Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 Submit Documentation Feedback 9 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION (continued) V+ V+ NO 1-MHz Capacitance Analyzer As Required IN COM GND Figure 16. NO and COM Capacitance V+ 0.1 mF Network Analyzer V+ VI 50 W 50 W Meas Ref NO (1) VO V+ IN COM GND 50 W 50 W OFF isolation = 20 log VO/VI Measurements are standardized against short at socket terminals. OFF isolation is measured between COM and OFF terminals on each switch. Bandwidth is measured between COM and ON terminals on each switch. Signal (1)Add 50-W termination for direction through switch is reversed; worst OFF isolation values are recorded. Figure 17. OFF Isolation, Bandwidth, and Crosstalk 10 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 TS3A4741,, TS3A4742 0.9-Ω LOW-VOLTAGE SINGLE-SUPPLY DUAL SPST ANALOG SWITCHES www.ti.com SCDS228D – AUGUST 2006 – REVISED JANUARY 2008 PARAMETER MEASUREMENT INFORMATION (continued) VI = V+/2 fSOURCE = 20 Hz to 20 kHz Channel ON: COM to NO VSOURCE = V+ P-P CL = 50 pF RL = 600 W V+/2 Audio Analyzer NO Signal Source 600 W COM CL(A) IN 600 W -V+/2 A. CL includes probe and jig capacitance. Figure 18. Total Harmonic Distortion (THD) Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3A4741 TS3A4742 Submit Documentation Feedback 11 PACKAGE OPTION ADDENDUM www.ti.com 21-Jan-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS3A4741DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4741DGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4741DGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4742DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4742DGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3A4742DGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SOT-23 DCN 8 3000 180.0 9.2 TS3A4741DGKR MSOP DGK 8 2500 330.0 13.0 5.3 TS3A4742DCNR SOT-23 DCN 8 3000 180.0 9.2 3.23 TS3A4742DGKR MSOP DGK 8 2500 330.0 13.0 5.3 3.4 TS3A4741DCNR Reel Reel Diameter Width (mm) W1 (mm) Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.4 1.4 8.0 12.0 Q1 3.17 1.37 4.0 8.0 Q3 1.4 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3A4741DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0 TS3A4741DGKR MSOP DGK 8 2500 358.0 335.0 35.0 TS3A4742DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0 TS3A4742DGKR MSOP DGK 8 2500 358.0 335.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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