DYNEX MDFB51

MDFB51
MDFB51
Fast Recovery Diode
Advance Information
Replaces March 1999 version, DS4149-4.0
DS4148-5.0 January 2000
KEY PARAMETERS
VRRM
2500V
IF(AV)
2212A
IFSM
24000A
Qr
1000µC
trr
6.0µs
FEATURES
●
Double side cooling
●
High surge capability
●
Low recovery charge
APPLICATIONS
●
Freewheel Diode
●
D.C. Motor Drives
●
Welding
●
High Frequency Rectification
●
Power Supplies
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
VRRM
V
MDFB51 25
MDFB51 24
MDFB51 22
MDFB51 20
2500
2400
2200
2000
Conditions
VRSM = VRRM + 100V
Lower voltage grades available.
Outline type code: CB486.
See Package Details for further information.
CURRENT RATINGS
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 65oC
2212
A
IF(RMS)
RMS value
Tcase = 65oC
3850
A
Continuous (direct) forward current
Tcase = 65oC
3560
A
IF
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 65oC
1627
A
IF(RMS)
RMS value
Tcase = 65oC
2555
A
Continuous (direct) forward current
Tcase = 65oC
2272
A
IF
1/8
MDFB51
SURGE RATINGS
Symbol
IFSM
I2t
IFSM
I2t
Conditions
Parameter
Max.
Units
24.0
kA
2880 x 103
A2s
19.2
kA
1843 x 103
A2s
Surge (non-repetitive) forward current
10ms half sine; with 0% VRRM, Tj = 150oC
I2t for fusing
Surge (non-repetitive) forward current
10ms half sine; with 50% VRRM, Tj = 150oC
I2t for fusing
THERMAL AND MECHANICAL DATA
Conditions
Parameter
Symbol
Double side cooled
Rth(j-c)
Thermal resistance - junction to case
Min.
Max.
Units
dc
-
0.011
o
Anode dc
-
0.021
o
Cathode dc
-
0.023
o
Double side
-
0.03
o
Single side
-
0.06
o
-
150
o
C/W
C/W
Single side cooled
Rth(c-h)
Thermal resistance - case to heatsink
Clamping force 44.0kN
with mounting compound
C/W
C/W
C/W
Tvj
Virtual junction temperature
Tstg
Storage temperature range
–55
175
o
Clamping force
40.0
44.0
kN
Typ.
Max.
Units
-
Foward (conducting)
C
C
CHARACTERISTICS
Symbol
Conditions
VFM
Forward voltage
At 1500A peak, Tcase = 25oC
-
1.6
V
IRRM
Peak reverse current
At VRRM, Tcase = 150oC
-
100
mA
6.0
-
µs
trr
Reverse recovery time
Recovered charge (50% chord)
IF = 1000A, diRR/dt = 100A/µs
-
1000
µC
IRM
Reverse recovery current
Tcase = 150oC, VR = 100V
-
400
A
K
Soft factor
1.8
-
-
QRA1
VTO
Threshold voltage
At Tvj = 150oC
-
1.1
V
rT
Slope resistance
At Tvj = 150oC
-
0.3
mΩ
Forward recovery voltage
di/dt = 1000A/µs, Tj = 125oC
-
40
V
VFRM
2/8
Parameter
MDFB51
DEFINITION OF K FACTOR AND QRA1
QRA1 = 0.5x IRR(t1 + t2)
dIR/dt
t1
k = t1/t2
t2
τ
0.5x IRR
IRR
CURVES
5000
Measured under pulse conditions
Instantaneous forward current, IF - (A)
4000
3000
2000
Tj = 150˚C
Tj = 25˚C
1000
0
0.5
1.0
1.5
2.0
2.5
3.0
Instantaneous forward voltage, VF - (V)
Figure 1 Maximim (limit) forward characteristics
3/8
MDFB51
500
Measured under
pulse conditions
Instantaneous forward current, IF - (A)
400
Tj = 150˚C
300
Tj = 25˚C
200
100
0
0.8
1.0
1.2
1.4
1.6
Instantaneous forward voltage, VF - (V)
Figure 2 Maximim (limit) forward characteristics
65
Current
waveform
VFR
Voltage
waveform
55
Transient forward votage, VFP - (V)
δy
di = δy
dt δx
δx
45
Tj = 125˚C limit
35
25
Tj = 25˚C limit
15
0
500
1000
1500
2000
Rate of rise of forward current, dIF/dt - (A/µs)
Figure 3 Transient forward voltage vs rate of rise of forward current
4/8
MDFB51
100000
IF
QS = ∫
50µs
Conditions:
0
Tj = 150˚C,
VR = 100V
Reverse recovered charge, QS - (µC)
QS
tp = 1ms
dIR/dt
10000
IRR
A
B
C
D
E
1000
A: IF = 4000A
F
B: IF = 2000A
C: IF = 1000A
D: IF = 500A
E: IF = 200A
F: IF = 100A
100
1
10
100
Rate of rise of reverse current, dIR/dt - (A/µs)
1000
Figure 4 Recovered charge
10000
Conditions:
Tj = 150˚C,
Reverse recovery current, IRR - (A)
VR = 100V
A
B
C
D
1000
E
F
100
A: IF = 4000A
B: IF = 2000A
C: IF = 1000A
D: IF = 500A
E: IF = 200A
F: IF = 100A
10
1
10
100
Rate of rise of reverse current, dIR/dt - (A/µs)
1000
Figure 5 Maximum reverse recovery current vs rate of fall of forward current
5/8
MDFB51
0.1
Thermal impedance - (˚C/W)
d.c. Double side Cooled
0.01
0.001
0.0001
0.001
0.01
0.1
1
10
Time - (s)
Figure 6 Maximum (limit) transient thermal impedance - junction to case
6/8
100
MDFB51
Package Details
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated
otherwise. DO NOT SCALE.
2 holes Ø3.6 ± 0.2 x 2.1 ± 0.5 (One in each electrode)
Cathode
Ø89 ± 2
25.6 ± 0.5
Ø63 ± 1
Ø63 ± 1
Ø102 max
Anode
Nominal weight: 1100g
Clamping force: 40kN ±10%
Package outine type code: CB486
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
Recommendations for clamping power semiconductors
AN4506
AN4839
Thyristor and diode measurement with a multi-meter
AN4853
Use of V , r on-state characteristic
AN5001
TO
T
7/8
MDFB51
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
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UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4148-5 Issue No. 5.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
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