MDFB51 MDFB51 Fast Recovery Diode Advance Information Replaces March 1999 version, DS4149-4.0 DS4148-5.0 January 2000 KEY PARAMETERS VRRM 2500V IF(AV) 2212A IFSM 24000A Qr 1000µC trr 6.0µs FEATURES ● Double side cooling ● High surge capability ● Low recovery charge APPLICATIONS ● Freewheel Diode ● D.C. Motor Drives ● Welding ● High Frequency Rectification ● Power Supplies VOLTAGE RATINGS Type Number Repetitive Peak Reverse Voltage VRRM V MDFB51 25 MDFB51 24 MDFB51 22 MDFB51 20 2500 2400 2200 2000 Conditions VRSM = VRRM + 100V Lower voltage grades available. Outline type code: CB486. See Package Details for further information. CURRENT RATINGS Symbol Parameter Conditions Max. Units Double Side Cooled IF(AV) Mean forward current Half wave resistive load, Tcase = 65oC 2212 A IF(RMS) RMS value Tcase = 65oC 3850 A Continuous (direct) forward current Tcase = 65oC 3560 A IF Single Side Cooled (Anode side) IF(AV) Mean forward current Half wave resistive load, Tcase = 65oC 1627 A IF(RMS) RMS value Tcase = 65oC 2555 A Continuous (direct) forward current Tcase = 65oC 2272 A IF 1/8 MDFB51 SURGE RATINGS Symbol IFSM I2t IFSM I2t Conditions Parameter Max. Units 24.0 kA 2880 x 103 A2s 19.2 kA 1843 x 103 A2s Surge (non-repetitive) forward current 10ms half sine; with 0% VRRM, Tj = 150oC I2t for fusing Surge (non-repetitive) forward current 10ms half sine; with 50% VRRM, Tj = 150oC I2t for fusing THERMAL AND MECHANICAL DATA Conditions Parameter Symbol Double side cooled Rth(j-c) Thermal resistance - junction to case Min. Max. Units dc - 0.011 o Anode dc - 0.021 o Cathode dc - 0.023 o Double side - 0.03 o Single side - 0.06 o - 150 o C/W C/W Single side cooled Rth(c-h) Thermal resistance - case to heatsink Clamping force 44.0kN with mounting compound C/W C/W C/W Tvj Virtual junction temperature Tstg Storage temperature range –55 175 o Clamping force 40.0 44.0 kN Typ. Max. Units - Foward (conducting) C C CHARACTERISTICS Symbol Conditions VFM Forward voltage At 1500A peak, Tcase = 25oC - 1.6 V IRRM Peak reverse current At VRRM, Tcase = 150oC - 100 mA 6.0 - µs trr Reverse recovery time Recovered charge (50% chord) IF = 1000A, diRR/dt = 100A/µs - 1000 µC IRM Reverse recovery current Tcase = 150oC, VR = 100V - 400 A K Soft factor 1.8 - - QRA1 VTO Threshold voltage At Tvj = 150oC - 1.1 V rT Slope resistance At Tvj = 150oC - 0.3 mΩ Forward recovery voltage di/dt = 1000A/µs, Tj = 125oC - 40 V VFRM 2/8 Parameter MDFB51 DEFINITION OF K FACTOR AND QRA1 QRA1 = 0.5x IRR(t1 + t2) dIR/dt t1 k = t1/t2 t2 τ 0.5x IRR IRR CURVES 5000 Measured under pulse conditions Instantaneous forward current, IF - (A) 4000 3000 2000 Tj = 150˚C Tj = 25˚C 1000 0 0.5 1.0 1.5 2.0 2.5 3.0 Instantaneous forward voltage, VF - (V) Figure 1 Maximim (limit) forward characteristics 3/8 MDFB51 500 Measured under pulse conditions Instantaneous forward current, IF - (A) 400 Tj = 150˚C 300 Tj = 25˚C 200 100 0 0.8 1.0 1.2 1.4 1.6 Instantaneous forward voltage, VF - (V) Figure 2 Maximim (limit) forward characteristics 65 Current waveform VFR Voltage waveform 55 Transient forward votage, VFP - (V) δy di = δy dt δx δx 45 Tj = 125˚C limit 35 25 Tj = 25˚C limit 15 0 500 1000 1500 2000 Rate of rise of forward current, dIF/dt - (A/µs) Figure 3 Transient forward voltage vs rate of rise of forward current 4/8 MDFB51 100000 IF QS = ∫ 50µs Conditions: 0 Tj = 150˚C, VR = 100V Reverse recovered charge, QS - (µC) QS tp = 1ms dIR/dt 10000 IRR A B C D E 1000 A: IF = 4000A F B: IF = 2000A C: IF = 1000A D: IF = 500A E: IF = 200A F: IF = 100A 100 1 10 100 Rate of rise of reverse current, dIR/dt - (A/µs) 1000 Figure 4 Recovered charge 10000 Conditions: Tj = 150˚C, Reverse recovery current, IRR - (A) VR = 100V A B C D 1000 E F 100 A: IF = 4000A B: IF = 2000A C: IF = 1000A D: IF = 500A E: IF = 200A F: IF = 100A 10 1 10 100 Rate of rise of reverse current, dIR/dt - (A/µs) 1000 Figure 5 Maximum reverse recovery current vs rate of fall of forward current 5/8 MDFB51 0.1 Thermal impedance - (˚C/W) d.c. Double side Cooled 0.01 0.001 0.0001 0.001 0.01 0.1 1 10 Time - (s) Figure 6 Maximum (limit) transient thermal impedance - junction to case 6/8 100 MDFB51 Package Details For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. 2 holes Ø3.6 ± 0.2 x 2.1 ± 0.5 (One in each electrode) Cathode Ø89 ± 2 25.6 ± 0.5 Ø63 ± 1 Ø63 ± 1 Ø102 max Anode Nominal weight: 1100g Clamping force: 40kN ±10% Package outine type code: CB486 ASSOCIATED PUBLICATIONS Title Application Note Number Calculating the junction temperature or power semiconductors Recommendations for clamping power semiconductors AN4506 AN4839 Thyristor and diode measurement with a multi-meter AN4853 Use of V , r on-state characteristic AN5001 TO T 7/8 MDFB51 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution (PACs). DEVICE CLAMPS Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839 HEATSINKS Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the factory. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS4148-5 Issue No. 5.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 8/8