DYNEX MP03XX280-16

MP03 XX 280 Series
MP03 XX 280 Series
Dual Diode Modules
Replaces December 1998 version, DS5105-2.0
DS5105-3.0 January 2000
FEATURES
KEY PARAMETERS
2000V
VRRM
IFSM
6000A
280A
IF(AV)(per arm)
Visol
2500V
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
CIRCUIT OPTIONS
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
Code
Circuit
HB
APPLICATIONS
■ Rectifier Bridges
■ DC Power Supplies
G
■ Plating Rectifiers
■ Traction Systems
GN
VOLTAGE RATINGS
Type
Number
PACKAGE OUTLINE
Conditions
Repetitive
Peak
Voltages
VRRM
MP03/280 - 20
2000
Tvj = 150oC
MP03/280 - 18
1800
IRM = 30mA
MP03/280 - 16
1600
VRSM = VRRM + 100V
MP03/280 - 14
1400
respectively
Lower voltage grades available. For full description of part
number see "Ordering Instructions" on page 3.
Module outline type code: MP03.
See Package Details for further information.
CURRENT RATINGS - PER ARM
Parameter
Symbol
IF(AV)
IF(RMS)
Mean forward current
RMS value
Conditions
Halfwave, resistive load
Tcase = 75oC
Max.
Units
Tcase = 75oC
280
A
Tcase = 85oC
252
A
Theatsink = 75oC
241
A
Theatsink = 85oC
215
A
440
A
1/9
MP03 XX 280 Series
Surge Ratings - Per Arm
Parameter
Symbol
IFSM
2
It
Surge (non-repetitive) on-state current
Max.
Units
VR = 0
6000
A
VR = 50% VRRM
4800
A
VR = 0
180000
A2s
VR = 50% VRRM
115000
A2s
Max.
Units
dc
0.21
o
C/W
halfwave
0.22
o
C/W
3 phase
0.23
o
C/W
Mounting torque = 5Nm
with mounting compound
0.05
o
C/W
Conditions
10ms half sine;
Tj = 150oC
10ms half sine;
Tj = 150oC
2
I t for fusing
THERMAL & MECHANICAL RATINGS
Parameter
Symbol
Rth(j-c)
Rth(c-hs)
Thermal resistance - junction to case
per Diode
Thermal resistance - case to heatsink
per Diode
Conditions
Tvj
Virtual junction temperature
150
o
Tsto
Storage temperature range
-40 to 150
o
Visol
Isolation voltage
Commoned terminals to base plate
AC RMS, 1min, 50Hz
C
C
2.5
kV
Max.
Units
CHARACTERISTICS
Symbol
Conditions
VFM
Forward voltage
At 400A peak, Tcase = 25oC
1.1
V
IRM
Peak reverse current
At VRRM, Tj = 150oC
30
mA
VTO
Threshold voltage
At Tvj = 150oC
0.80
V
On-state slope resistance
At Tvj = 150oC
0.6
mΩ
rT
2/9
Parameter
MP03 XX 280 Series
ORDERING INSTRUCTIONS
Part number is made up as follows:
MP03 HB 280 - 18
MP
03
HB
280
18
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at Tcase = 75oC
= VRRM/100
Examples:
MP03HB280 - 16
MP03G280 - 20
MP03GN280 - 18
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only
when requested.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of V(TO) and rT
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should be
taken to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 5Nm (44lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
3/9
MP03 XX 280 Series
CURVES
Instantaneous forward current IF - (A)
1000
800
600
Tj = 150˚C
400
200
0
0
0.5
1.0
1.5
Instantaneous forward voltage VF - (V)
2.0
Fig. 1 Maximum (limit) forward characteristics (Per diode)
Thermal Impedance - (˚C/W)
0.3
Rth(j-hs)
0.2
Rth(j-c)
0.1
0
0.001
0.010
0.100
Time - (s)
1.0
Fig. 2 Transient thermal impedance (DC) - (Per diode)
4/9
10
100
MP03 XX 280 Series
10000
9000
7000
120
6000
110
5000
100
4000
90
3000
80
I2t
2000
70
60
1000
0
I2t value - A2s x 103
Peak half sine wave forward current - (A)
8000
1
10
ms
1
2 3 5
10
50
20 30 50
cycles at 50Hz
Duration
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% VRRM, Tcase = 150˚C)
5/9
MP03 XX 280 Series
On-state power loss per device - (W)
400
d.c.
180˚ Rectangular
180˚ Sine
120˚ Rectangular
350
300
60˚ Rectangular
250
200
150
100
50
0
0
50
100
300
150
200
250
Mean forward current - (A)
350
400
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
140
120
100
d.c.
20
0
0
50
100
150
200
250
Mean forward current - (A)
180˚ Rectangular
40
180˚ Sine
60
120˚ Rectangular
80
60˚ Rectangular
Maximum permissible case temperature - (˚C)
160
300
350
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
6/9
400
MP03 XX 280 Series
1200
1000
Total power - (W)
0.08
0.04 0.02
R - Load
Rth(hs-a) ˚C/W
800
0.10
0.12
0.15
0.20
600
400
0.30
0.40
200
0
L - Load
0
20
60
40
80 100 120 140
0
Maximum ambient temperature - (˚C)
100
200
300
D.C. output current - (A)
400
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
1200
Total power - (W)
1000
800 0.12
600
0.15
400
0.20
0.30
0.40
0.10 0.08
0.04 0.02 Rth(hs-a) ˚C/W
R & L - Load
200
0
0
20
60
40
80 100 120 140
0
Maximum ambient temperature - (˚C)
100
200
300
D.C. output current - (A)
400
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
7/9
MP03 XX 280 Series
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
42.5
35
28.5
5
18
50
38
4 holes Ø5.5
80
2x M8
2
3
32
52
1
92
Recommended fixings for mounting:
Recommended mounting torque:
Recommended torque for electrical connections:
Maximum torque for electrical connections:
Nominal weight: 950g
Module outline type code: MP03
CIRCUIT CONFIGURATIONS
1
2
3
HB
1
2
3
2
3
G
1
GN
8/9
M5 socket head cap screws.
5Nm (44lb.ins)
8Nm (70lb.ins)
9Nm (80lb.ins)
MP03 XX 280 Series
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS5105-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
9/9