DYNEX MP04TT600-17

MP04TT600
MP04TT600
Dual Thyristor Water Cooled Module
Preliminary Information
DS5466-1.1 June 2001
FEATURES
■
Dual Device Module
■
Electrically Isolated Package
■
Pressure Contact Construction
■
International Standard Footprint
■
Alumina (Non Toxic) Isolation Medium
■
Integral Water Cooled Heatsink
KEY PARAMETERS
VDRM
IT(AV)
ITSM(per arm)
IT(RMS)
Visol
5 (G1)
1800V
580A
14000A
912A
3000V
4 (K1)
3 (A)
6 (G2)
APPLICATIONS
■
Motor Control
■
Controlled Rectifier Bridges
■
Heater Control
■
AC Phase Control
7 (K2)
1 (AK)
2 (A)
Fig. 1 TT Circuit diagram
VOLTAGE RATINGS
Type Number
MP04TT600-18
MP04TT600-17
MP04TT600-16
MP04TT600-15
Repetitive Peak
Voltages
VDRM VRRM
V
1800
1700
1600
1500
Conditions
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 50mA
VDSM = VRSM =
Module outline type code:
MP04-W3
Module outline type code:
MP04-W3A
VDRM = VRRM + 100V
respectively
Lower voltage grades available
ORDERING INFORMATION
Order As:
MP04TT600-XX-W2
MP04TT600-XX-W3
MP04TT600-XX-W3A
1/4 - 18 NPT connection
1/4 - 18 NPT connection
1/4 - 18 NPT water connection
thread
XX shown in the part number about represents VDRM/100
selection required, eg. MP04TT600-27-W2
Note: When ordering, please use the complete part number.
Module outline type code: MP04-W2
(See Package Details for further information)
Fig. 2 Module package variants - (not to scale)
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MP04TT600
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
IT(AV)
IT(RMS
ITSM
I2t
ITSM
I2t
Visol
Parameter
Mean on-state current
RMS value
Test Conditions
Units
Half wave resistive load,
Twater (in) = 25˚C
650
A
4.5 Ltr/min
Twater (in) = 40˚C
580
A
Twater (in) = 25˚C @ 4.5 Ltr/min
1020
A
Twater (in) = 40˚C @ 4.5 Ltr/min
912
A
10ms half sine, Tj = 125˚C
14
kA
VR = 0
0.975x106
A2s
10ms half sine, Tj = 125˚C
11.2
kA
VR = 50% VDRM
0.625x106
A2s
3000
V
Surge (non-repetitive) on-current
I2t for fusing
Surge (non-repetitive) on-current
I2t for fusing
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Isolation voltage
Max.
THERMAL AND MECHANICAL RATINGS
Parameter
Symbol
Rth(j-w)
Max.
Units
dc, 4.5 Ltr/min
-
0.102
˚C/kW
(per thyristor)
Half wave, 4.5 Ltr/min
-
0.106
˚C/kW
3 Phase, 4.5 Ltr/min
-
0.112
˚C/kW
Reverse (blocking)
-
125
˚C
–40
125
˚C
6(53)
-
Nm (lb.ins)
Virtual junction temperature
Tstg
Storage temperature range
Screw torque
Mounting - M6
Electrical connections - M10
-
Min.
Thermal resistance - junction to water
Tvj
-
Test Conditions
Weight (nominal)
-
-
12(106) Nm (lb.ins)
-
Refer to
drawings
g
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MP04TT600
DYNAMIC CHARACTERISTICS
Parameter
Symbol
Test Conditions
Min.
Max.
Units
Peak reverse and off-state current
At VRRM/VDRM, Tj = 125˚C
-
50
mA
dV/dt
Linear rate of rise of off-state voltage
To 67% VDRM, Tj = 125˚C
-
1000
V/µs
dI/dt
Rate of rise of on-state current
From 67% VDRM to 500A, gate source 10V, 5Ω
-
500
A/µs
IRRM/IDRM
tr = 0.5µs, Tj = 125˚C
VT(TO)
rT
Threshold voltage
At Tvj = 125˚C
-
0.85
V
On-state slope resistance
At Tvj = 125˚C
-
0.38
mΩ
Note: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
Parameter
Test Conditions
Max.
Units
VGT
Gate trigger voltage
VDRM = 5V, Tcase = 25oC
3.5
V
IGT
Gate trigger current
VDRM = 5V, Tcase = 25oC
200
mA
VGD
Gate non-trigger voltage
At VDRM Tcase = 125oC
0.25
V
VFGM
Peak forward gate voltage
Anode positive with respect to cathode
30
V
VFGN
Peak forward gate voltage
Anode negative with respect to cathode
0.25
V
VRGM
Peak reverse gate voltage
5
V
IFGM
Peak forward gate current
Anode positive with respect to cathode
10
A
PGM
Peak gate power
See table fig. 5
150
W
PG(AV)
Mean gate power
10
W
-
-
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MP04TT600
1
2
1: Tj = 125˚C Min
2: Tj = 125˚C Max
2000
1500
500
0
0.5
1.0
1.5
2.0
Instantaneous on-state voltage VT - (V)
2.5
I2t = Î2 x t
2
20
700
15
I2t
5
10
1
ms
2 3 45
10
400
20 30 50
Cycles at 50Hz
Duration
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% VRSM at Tcase = 125˚C)
Up
lim
per
it 9
0W
10
W
50
W
20
W
10
5W
Pulse width Frequency Hz Table gives pulse power PGM in Watts
µs
50 100 400
100
150 150 150
200
150 150 125
500
150 150 100
1ms
150 100 25
10ms
20 - -
9%
0.1
0.001
0.1
0.08
0.06
0.04
Lo
0.01
Tj = 25˚C
Tj = -40˚C
%
it 99
lim
wer
Tj = 125˚C
1
VGD
Thermal resistance, Junction to water, Rth(j-w) - (°C/W)
0.12
100
Gate trigger voltage, VGT - (V)
500
0
1
Fig. 3 Maximum (limit) on-state characteristics
10
600
10
I2t value - (A2s x 103)
1000
Peak half sine wave on-state current - (kA)
25
Measured under pulse
conditions
Instantaneous on-state current IT - (A)
2500
Region of certain
0.1
Gate trigger current, IGT - (A)
Fig. 5 Gate characteristics
triggering
1
0.02
10
IFGM
0
0.001
0.01
0.1
1
10
Time (Seconds)
100
1000
Fig. 6 Transient thermal impedance - dc
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MP04TT600
2200
Conduction Angle
30°
2000
60°
90°
120°
1800
180°
Conduction Angle
30°
60°
90°
120°
1800
180°
DC
1600
2000
Power dissipation - (Watts, per arm)
Power dissipation - (Watts, per arm)
2200
1600
1400
1200
1000
800
600
1400
1200
1000
800
600
400
400
200
200
0
0
200
400
600
800
1000
0
0
1200
Sine wave current (Average, per arm)
Fig. 7 On-state power loss per arm vs on-state current at
specified conduction angles, sine wave 50/60Hz
1600
Fig. 8 On-state power loss per arm vs on-state current at
specified conduction angles, square wave 50/60Hz
Maximum permissible water inlet temperature - (°C)
Maximum permissble inlet water temperature - (°C)
400
600
800 1000 1200 1400
Square wave current - (Average, per arm)
100
100
90
80
70
60
50
40
30
20 Conduction Angle
30°
60°
10
90°
120°
180°
0
0
100
200
300
400
500
600
Sine wave current (Average, per arm)
200
700
Fig. 9 Maximum permissible water inlet temperature vs
on-state current at specified conduction angles,
sine wave 50/60Hz
90
80
70
60
50
40
30
Conductin Angle
30°
60°
90°
10
120°
180°
DC
0
0
100 200 300
20
400
500
600
700
800
900
Square wave current (Average, per arm)
Fig. 10 Maximum permissible water inlet temperature vs
on-state current at specified conduction angles,
square wave 50/60Hz
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MP04TT600
6000
4000
90
90
3000
80
2500
70
2000
60
1500
50
1000
40
5000
500
0
500
Power resistive load
Power inductive load
Temp resistive load
Temp inductive load
600
Total device power loss - (W)
Max permissible case temp. - (˚C)
Total device power loss - (W)
80
4000
70
60
3000
50
2000
40
1000
30
30
20
700 800 900 1000 1100 1200 1300 1400 1500
DC bridge output current - (A dc)
Fig. 11 50/60Hz single phase bridge DC output current vs
power loss and maximum permissible water inlet
Max permissible case temp. - (˚C)
3500
Power resistive or inductive load
Temp resistive or inductive load
0
20
700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800
DC bridge output current - (A dc)
Fig. 12 Fig. 11 50/60Hz Three phase bridge DC output current
vs power loss and maximum permissible water inlet
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MP04TT600
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W2
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MP04TT600
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3
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MP04TT600
PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2530g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3A
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MP04TT600
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5466-1 Issue No. 1.1 June 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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