TI SN74ALVCH16821DLR

SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F – JULY 1995 – REVISED SEPTEMBER 2004
FEATURES
•
•
•
•
Member of the Texas Instruments Widebus™
Family
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
DESCRIPTION/ORDERING INFORMATION
This 20-bit bus-interface flip-flop is designed for
1.65-V to 3.6-V VCC operation.
The SN74ALVCH16821 can be used as two 10-bit
flip-flops or one 20-bit flip-flop. The 20 flip-flops are
edge-triggered D-type flip-flops. On the positive
transition of the clock (CLK) input, the device
provides true data at the Q outputs.
A buffered output-enable (OE) input can be used to
place the ten outputs in either a normal logic state
(high or low logic levels) or the high-impedance state.
In the high-impedance state, the outputs neither load
nor drive the bus lines significantly. The
high-impedance state and increased drive provide the
capability to drive bus lines without need for interface
or pullup components.
OE does not affect the internal operation of the
flip-flops. Old data can be retained or new data can
be entered while the outputs are in the
high-impedance state.
DGG OR DL PACKAGE
(TOP VIEW)
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
1Q7
GND
1Q8
1Q9
1Q10
2Q1
2Q2
2Q3
GND
2Q4
2Q5
2Q6
VCC
2Q7
2Q8
GND
2Q9
2Q10
2OE
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1CLK
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
1D7
GND
1D8
1D9
1D10
2D1
2D2
2D3
GND
2D4
2D5
2D6
VCC
2D7
2D8
GND
2D9
2D10
2CLK
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
ORDERING INFORMATION
PACKAGE (1)
TA
-40°C to 85°C
SSOP - DL
TSSOP - DGG
(1)
ORDERABLE PART NUMBER
Tube
SN74ALVCH16821DL
Tape and reel
SN74ALVCH16821DLR
Tape and reel
SN74ALVCH16821DGGR
TOP-SIDE MARKING
ALVCH16821
ALVCH16821
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2004, Texas Instruments Incorporated
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F – JULY 1995 – REVISED SEPTEMBER 2004
FUNCTION TABLE
(each 10-bit flip-flop)
INPUTS
OUTPUT
OE
CLK
D
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1
1OE
56
1CLK
One of Ten
Channels
C1
55
1D1
2
1D
1Q1
To Nine Other Channels
28
2OE
29
2CLK
One of Ten
Channels
C1
42
2D1
1D
To Nine Other Channels
2
15
2Q1
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F – JULY 1995 – REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
4.6
V
VI
Input voltage range (2)
-0.5
4.6
V
VO
Output voltage range (2) (3)
-0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
IO
Continuous output current
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
mA
-50
mA
±50
mA
±100
mA
DGG package
48
DL package
56
-65
V
-50
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
Low-level input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F – JULY 1995 – REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = -100 µA
1.65 V to 3.6 V
1.65 V
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
IOH = -12 mA
V
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
2.7 V
0.4
3V
0.55
V
±5
VI = VCC or GND
3.6 V
VI = 0.58 V
1.65 V
25
VI = 1.07 V
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = 2 V
UNIT
1.2
1.65 V to 3.6 V
IOL = 24 mA
II(hold)
MAX
IOL = 4 mA
IOL = 12 mA
II
TYP (1)
VCC - 0.2
IOH = -4 mA
VOH
VOL
MIN
µA
µA
3.6 V
±500
IOZ
VO = VCC or GND
3.6 V
±10
µA
ICC
VI = VCC or GND, IO = 0
3.6 V
40
µA
∆ICC
One input at VCC - 0.6 V, Other inputs at VCC or GND
3 V to 3.6 V
750
µA
VI = 0 to 3.6
Control inputs
Ci
Data Inputs
Co
(1)
(2)
Outputs
V (2)
VI = VCC or GND
3.3 V
VO = VCC or GND
3.3 V
3.5
pF
6
7
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
MIN
fclock
MAX
VCC = 2.5 V
± 0.2 V
MIN
(1)
Clock frequency
MAX
VCC = 2.7 V
MIN
150
MAX
VCC = 3.3 V
± 0.3 V
MIN
150
UNIT
MAX
150
MHz
tw
Pulse duration, CLK high or low
(1)
3.3
3.3
3.3
ns
tsu
Setup time, data before CLK↑
(1)
4.4
3.9
3.4
ns
th
Hold time, data after CLK↑
(1)
0
0
0
ns
(1)
4
This information was not available at the time of publication.
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F – JULY 1995 – REVISED SEPTEMBER 2004
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
(1)
MIN
TYP
(1)
fmax
tpd
VCC = 2.5 V
± 0.2 V
VCC = 1.8 V
CLK
MIN
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MAX
MIN
150
MAX
150
MIN
UNIT
MAX
150
MHz
Q
(1)
1
5.8
5.3
1
4.5
ns
1
6.6
6.2
1
5.1
ns
1
5.7
5
1
4.6
ns
ten
OE
Q
(1)
tdis
OE
Q
(1)
This information was not available at the time of publication.
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
(1)
Power dissipation
capacitance
Outputs enabled
Outputs disabled
TEST CONDITIONS
CL = 50 pF, f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
36
40
(1)
22
24
UNIT
pF
This information was not available at the time of publication.
5
SN74ALVCH16821
3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES037F – JULY 1995 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ALVCH16821DGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVCH16821DGGRG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVCH16821DLG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVCH16821DLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVCH16821DGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVCH16821DL
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVCH16821DLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
20
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74ALVCH16821DGGR TSSOP
SN74ALVCH16821DLR
SSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVCH16821DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74ALVCH16821DLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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