SN74ALVCH16821 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES037F – JULY 1995 – REVISED SEPTEMBER 2004 FEATURES • • • • Member of the Texas Instruments Widebus™ Family Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) DESCRIPTION/ORDERING INFORMATION This 20-bit bus-interface flip-flop is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16821 can be used as two 10-bit flip-flops or one 20-bit flip-flop. The 20 flip-flops are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs. A buffered output-enable (OE) input can be used to place the ten outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. DGG OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 1Q7 GND 1Q8 1Q9 1Q10 2Q1 2Q2 2Q3 GND 2Q4 2Q5 2Q6 VCC 2Q7 2Q8 GND 2Q9 2Q10 2OE 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 1CLK 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 1D7 GND 1D8 1D9 1D10 2D1 2D2 2D3 GND 2D4 2D5 2D6 VCC 2D7 2D8 GND 2D9 2D10 2CLK To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. ORDERING INFORMATION PACKAGE (1) TA -40°C to 85°C SSOP - DL TSSOP - DGG (1) ORDERABLE PART NUMBER Tube SN74ALVCH16821DL Tape and reel SN74ALVCH16821DLR Tape and reel SN74ALVCH16821DGGR TOP-SIDE MARKING ALVCH16821 ALVCH16821 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2004, Texas Instruments Incorporated SN74ALVCH16821 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES037F – JULY 1995 – REVISED SEPTEMBER 2004 FUNCTION TABLE (each 10-bit flip-flop) INPUTS OUTPUT OE CLK D Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1 1OE 56 1CLK One of Ten Channels C1 55 1D1 2 1D 1Q1 To Nine Other Channels 28 2OE 29 2CLK One of Ten Channels C1 42 2D1 1D To Nine Other Channels 2 15 2Q1 SN74ALVCH16821 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES037F – JULY 1995 – REVISED SEPTEMBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) mA -50 mA ±50 mA ±100 mA DGG package 48 DL package 56 -65 V -50 150 °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74ALVCH16821 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES037F – JULY 1995 – REVISED SEPTEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = -100 µA 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA IOH = -12 mA V 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 2.7 V 0.4 3V 0.55 V ±5 VI = VCC or GND 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = 2 V UNIT 1.2 1.65 V to 3.6 V IOL = 24 mA II(hold) MAX IOL = 4 mA IOL = 12 mA II TYP (1) VCC - 0.2 IOH = -4 mA VOH VOL MIN µA µA 3.6 V ±500 IOZ VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 40 µA ∆ICC One input at VCC - 0.6 V, Other inputs at VCC or GND 3 V to 3.6 V 750 µA VI = 0 to 3.6 Control inputs Ci Data Inputs Co (1) (2) Outputs V (2) VI = VCC or GND 3.3 V VO = VCC or GND 3.3 V 3.5 pF 6 7 pF All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.8 V MIN fclock MAX VCC = 2.5 V ± 0.2 V MIN (1) Clock frequency MAX VCC = 2.7 V MIN 150 MAX VCC = 3.3 V ± 0.3 V MIN 150 UNIT MAX 150 MHz tw Pulse duration, CLK high or low (1) 3.3 3.3 3.3 ns tsu Setup time, data before CLK↑ (1) 4.4 3.9 3.4 ns th Hold time, data after CLK↑ (1) 0 0 0 ns (1) 4 This information was not available at the time of publication. SN74ALVCH16821 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES037F – JULY 1995 – REVISED SEPTEMBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) (1) MIN TYP (1) fmax tpd VCC = 2.5 V ± 0.2 V VCC = 1.8 V CLK MIN VCC = 3.3 V ± 0.3 V VCC = 2.7 V MAX MIN 150 MAX 150 MIN UNIT MAX 150 MHz Q (1) 1 5.8 5.3 1 4.5 ns 1 6.6 6.2 1 5.1 ns 1 5.7 5 1 4.6 ns ten OE Q (1) tdis OE Q (1) This information was not available at the time of publication. OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd (1) Power dissipation capacitance Outputs enabled Outputs disabled TEST CONDITIONS CL = 50 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 36 40 (1) 22 24 UNIT pF This information was not available at the time of publication. 5 SN74ALVCH16821 3.3-V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES037F – JULY 1995 – REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCH16821DGGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16821DGGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16821DLG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16821DLRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16821DGGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16821DL ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16821DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74ALVCH16821DGGR TSSOP SN74ALVCH16821DLR SSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCH16821DGGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74ALVCH16821DLR SSOP DL 56 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. 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