FUJITSU SEMICONDUCTOR DATA SHEET DS07-20101-7E Resonator Piezoelectric Resonator FAR Family (C1, C3, C4 series) ■ DESCRIPTION Fujitsu resonators (C1, C3, C4 series) feature originally developed single crystals with a high electromechanical coupling coefficient (LiTaO3: lithium tantalate, LiNbO3: lithium niobate), the result is compact packaging. Three series are available: the C3 and C4 series with built-in capacitors for high integration, for exclusive use in microcomputer clocks; and the C1 series for high precision. All series include the CHIP type device for surfacemount and the SIP type device for general PC boards. ■ FEATURES • • • • Surface-mount technology can be applied to the CHIP type to increase packaging density. The SIP type is only half the height of conventional quartz crystal resonators, and can be easily mounted on general PC boards. The C3 and C4 series have been developed for exclusive use in microcomputer clocks. They have built-in capacitors, and the number of components has been reduced to one-third of that of conventional circuits. Both the SIP and CHIP types can be shipped in taped packages for automatic mounting. The resonators have superior shock and vibration resistance, preventing damage during automatic insertion process. ■ PACKAGE FAR Family (C1, C3, C4 series) ■ STANDARD CHARACTERISTICS Series C1 series Parameter Material C3 series C4 series Lithium Tantalate (LiTaO3) Lithium Niobate (LiNbO3) 3.58 to 16 MHz 3 to 16 MHz Frequency Standard frequency See “■ Standard frequency.” Initial frequency tolerance ±0.05% (G) ±0.1% (J) ±0.3% (K) ±0.5% (M) ±0.1% (J) ±0.3% (K) ±0.5% (M) ±0.5% (M) ±0.3% (K) ±1% (L) ±0.02% ±0.05% ±0.5% Temperature characteristics (–20 to 60°C) Capacity of built-in capacitor — 20±8 pF (standard)* Aging stability Within ±0.1% Operating temperature –30 to 85°C Storage temperature –40 to 100°C (Resonant frequency and serial resonant resistance) 30 pF R (Oscillation frequency) R: Resonator 3 MHz to 10 MHz max. IC; 1/6MB84069B x 2 10 MHz to 16 MHz IC; MC74HC04 VCC; 5 VDC R; Resonator C1, C2: Loading capacitors (built-in) 1 MΩ R 75 Ω 75 Ω C1 C2 OSC LM Standard measuring circuit FAR (Serial resonant resistance) R 75 Ω OSC C1 C2 R: Resonator 75 Ω LM *: The capacity of the built-in capacitor is 20±8 pF by standard. 10±4 pF and 30±8 pF types are also available. However, the characteristics of 10±4 pF and 30±8 pF types are specified by Fujitsu, considering matching data with applied IC (mainly microcomputer). 2 FAR Family (C1, C3, C4 series) ■ STANDARD FREQUENCY Standard frequency (kHz) • C1/C3 series C4 series Package size Resonant resistance Package size Resonant resistance 3,580 4,000 4,194 4,915 A A A A 300 Ω max. (00) A A A A 150 Ω max. (01) 6,000 6,144 7,373 8,000 10,000 11,000 11,059 12,000 14,746 16.000 B B B B B B B B B B 150 Ω max. (01) B B B B B B B B B B 75 Ω max. (02) Package sizes and resonant resistance There are two package sizes according to frequency: Frequency Package size 3 to 5.99 MHz A 6 to 16 MHz B For resonant resistance, standard values are specified according to frequency: Frequency Standard resonant resistance C1/C3 series C4 series 3 to 3.57 MHz — 300 Ω max. (00) 3.58 to 5.99 MHz 300 Ω max. (00) 150 Ω max. (01) 6 to 16 MHz 150 Ω max. (01) 75 Ω max. (02) Note: For resonant resistance other than the standard values, they are specified by Fujitsu considering matching data with applied IC (mainly micro computer). ■ NOTES ON USE • • • • • • Handle carefully. Solder under the following conditions. CHIP type: 5 seconds max. at 230°C (PCB) SIP type: 10 seconds max. at 260°C Do not apply extreme heat to the resonator. Recommended preheating for the CHIP type is 150°C for one minute. Avoid extreme fluctuations in temperature during use. There is no specific direction in resonator mounting. Additional information is available separately, if required, for designing microcomputer oscillation circuits. CHIP type is for reflow solder, not for flow solder. 3 FAR Family (C1, C3, C4 series) ■ PART NUMBERING SYSTEM FAR (1) (2) (3) (4) (5) (6) (7) (8) (1) Series Series Single crystal Capacitor C1 LiTaO3 — C3 LiTaO3 With built-in capacitors C4 LiNbO3 With built-in capacitors (2) Package type Specification Type C CHIP S SIP (3) Package size See Table 1 in “■ Dimensions.” Specification Size A Large B Small (4) Frequency (kHz) Frequency Designation Frequency Designation Frequency Designation Frequency Designation 3,580 kHz 03580 6,000 kHz 06000 10,000 kHz 10000 14,746 kHz 14746 4,000 kHz 04000 6,144 kHz 06144 11,000 kHz 11000 16,000 kHz 16000 4,194 kHz 04194 7,373 kHz 07373 11,059 kHz 11059 4,195 kHz 04915 8,000 kHz 08000 12,000 kHz 12000 (5) Initial tolerance of frequency See “■ Standard Frequency.” 4 Specification Tolerance C1 series C3 series C4 series G ±0.05% available — — J ±0.1% available available — K ±0.3% available available available M ±0.5% avaialble available available L ±1% — — available FAR Family (C1, C3, C4 series) (6) Capacity of built-in capacitor Specification Capacitance 0 20±8 pF 1 10±4 pF 2 30±8 pF Note: For C1 series, only “0” is available. (7) Resonant resistance Specification Resonant resistance 0 300 Ω max. 1 150 Ω max. 2 75 Ω max. (8) User-specific Special Symbols Specification Description Name No specification, no taping specification — No specification, with taping specification A to Z Serial number for custom design (9)Taping specification • SIP type Specification Description –T Reel pack –U Ammo pack Specification Description –R 16 mm carrier pack • CHIP type 5 FAR Family (C1, C3, C4 series) ■ MARKING (CHIP type) (SIP type) Fujitsu’s parts abbreviation Fujitsu’s parts abbreviation Frequency (kHz) F 4000 T k m Frequency (kHz) Lot No. (Date of manufacture, conforms to EIAJ) Initial frequency tolerance Characteristics: T: LiTaO3 N: LiNbO3 F 1200 T k m Lot No. (Date of manufacture, conforms to EIAJ) Initial frequency tolerance Characteristics: T: LiTaO3 N: LiNbO3 The stamp color varies with the capacity of the capacitor. Capacitance Marking clolr 10 pF Yellow 20 pF White 30 pF Gray Data code (EIAJ standard) is specified as follows in a four-year cycle. Year 1977 1981 1985 1989 1993 6 Month Symbol Year Month Symbol Year Month Symbol Year Month Symbol 1 A 1 N 1 a 1 2 B 2 P 2 b 2 3 C 3 Q 3 4 D 4 R 5 E 5 E 6 F 6 T 7 G 7 U 8 H 9 J 10 1978 1982 1986 1990 1994 8 V 1979 1983 1987 1991 1995 3 4 d 5 e 6 f 7 1980 1984 1988 1992 8 9 n j 1996 4 r 5 6 t 7 u 8 9 W 9 K 10 X 10 10 11 L 11 Y 11 11 12 M 12 Z 12 12 FAR Family (C1, C3, C4 series) ■ PIN ASSIGNMENT • C1 series SIP type CHIP type 1 1 2 2 (Equivalent circuit) 2 1 • C3 and C4 series SIP type CHIP type 1 1 2 2 3 3 (Equivalent circuit) 3 1 2 7 FAR Family (C1, C3, C4 series) ■ DIMENSIONS Table 1 Package size Unit: mm (in.) a Type L L1 W H A 11.0 ± 0.2 (0.433 ± 0.008) — 4.3 ± 0.2 (0.169 ± 0.008) 6.3 ± 0.2 (0.248 ± 0.008) B 9.0 ± 0.2 (0.354 ± 0.008) — 4.3 ± 0.2 (0.169 ± 0.008) 5.3 ± 0.2 (0.209 ± 0.008) A 10.0 ± 0.5 (0.394 ± 0.020) 9.4 ± 0.2 (0.370 ± 0.008) 4.5 ± 0.5 (0.177 ± 0.020) 2.5 ± 0.3 (0.098 ± 0.012) B 8.0 ± 0.5 (0.315 ± 0.020) 7.4 ± 0.2 (0.291 ± 0.008) 3.2 ± 0.5 (0.126 ± 0.020) 2.5 ± 0.3 (0.098 ± 0.012) Two terminal Three terminal 5.08 ± 0.2 (0.200 ± 0.008) 2.54 ± 0.2 (0.100 ± 0.008) SIP type CHIP type SIP type L W L W H H 0.35 ± 0.1 (0.014 ± 0.004) 0.5 ± 0.2 (0.020 ± 0.008) a 0.35 ± 0.1 (0.014 ± 0.004) 0.5 ± 0.2 (0.020 ± 0.008) 3.4 ± 0.2 (0.134 ± 0.008) a a 3.4 ± 0.2 (0.134 ± 0.008) C1 series C3 and C4 series CHIP type L1 L1 L1 H H L L 1.5 (0.059) a W 0.45 (0.018) C1 series 8 H 0.95 (0.037) L 1.5 (0.059) W a a 0.45 (0.018) C3 series 0.95 (0.037) 1.5 (0.059) W a a C4 series FAR Family (C1, C3, C4 series) ■ TAPING FORM AND DIMENSIONS • SIP type 3.81 ± 0.7 (0.150 ± 0.028) 6.35 ± 1.3 (0.250 ± 0.051) Unit: mm (in.) 12.7 ± 1.0 (0.500 ± 0.394) 3.0 max. (0.118) 9.0 ± 2 (0.354 ± 0.079) 18.0 ± 0.5 (0.709 ± 0.020) 12.5 min. (0.492) Note: • Pack form +0.040 (0.709 –0.020 ) φ4.0 ± 0.3 (0.157 ± 0.012) 12.7 ± 0.3 (0.500 ± 0.012) Designation +1.0 18.0 –0.5 Pack quantity (pcs) Package size A Package size B T Reel pack 1000 1000 U Ammo pack 1500 1500 1. In reel packs, the tolerance of the cumulative feed hole pitch (20 pitches) is ±1.3 (0.051) or less. 2. In ammo packs, there must be perforations every 25 pitches. CHIP type 4 ± 0.1 (0.157 ± 0.004) 2 ± 0.1 (0.079 ± 0.004) Unit: mm (in.) 1.5 ± 0.1 (0.059 ± 0.004) 7.65 ± 0.1 (0.301 ± 0.004) 16 ± 0.2 (0.630 ± 0.008) ±0.1 (0.004) 8 ± 0.15 (0.315 ± 0.006) 6.85 (0.270) Package size W ± 0.1 (0.004) W A 4.9 (0.193) 10.4 (0.409) B 3.6 (0.142) 8.4 (0.331) 3.0 ± 0.1 (0.118 ± 0.004) Reel form 2.0 (0.080) • Pack quantity φ13.0 (0.512) φ75 (2.953) 1.0 (0.039) φ330 ± 2.0 (12.992 ± 0.079) φ21.0 (0.827) Package size Pack quantity A 3,000 pcs B 3,400 pcs 2.0 (0.079) 18.0 (0.709) 9 FAR Family (C1, C3, C4 series) ■ APPLICATION EXAMPLES • C1 series 22 pF to 47 pF R 680 Ω TTL oscillation circuit (serial resonation circuit) 1.8 kΩ 220 Ω IC Output IC R: Resonator IC: MB74LS04 • C3, C4 series 1 MB8850 MB8850H series 2 1 3 2 R R: Resonator ■ RELIABILITY Parameter 10 Test conditions Requirements Shock MIL-STD-883B, 2002, condtion C (3000G) Frequency fluctuation: within ±0.1% Vibration MIL-STD-202E, 201A (1.5 mm <0.059> at 10 Hz to 55 Hz for 2 hours) Frequency fluctuation: within ±0.1% Drop 5 times drop from 1 m (39.370 in.) height to wooden board. Frequency fluctuation: within ±0.1% Sealing Immersion in water at 85°C No bubbles observed Heat resistance fluctuation: MIL-STD-202E, 210A condition B (260°C • 5 sec.) Frequency within ±0.1% Temperature cycling MIL-STD-883B, 1010, condition A (–35 to 85°C, 10 cycle) Frequency fluctuation: within ±0.1% High-temperature loading test MIL-STD-883B, 1008, condition B 1000 h (100°C • 1000 hours) Frequency fluctuation: within ±0.1% High-temperature humidity test MIL-STD-202E, 103A, condition B (96 hours at 60°C, 90% to 95% RH, 12 VDC) Frequency fluctuation: within ±0.1% FAR Family (C1, C3, C4 series) FUJITSU LIMITED For further information please contact: Japan FUJITSU MEDIA DEVICES LIMITED Marketing and Technical Support Dept. SHINYOKOHAMA SQUARE BLDG 2-3-12,Shin-yokohama, Kouhoku-ku, Yokohama-shi, Kanagawa 222-0033, Japan Tel: +81-45-471-0067 Fax: +81-45-471-0069 http://www.fujitsu.co.jp/hypertext/fmd/English/index.html North and South America FUJITSU MICROELECTRONICS, INC. 3545 North First Street, San Jose, CA 95134-1804, U.S.A. Tel: +1-408-922-9000 Fax: +1-408-922-9179 Customer Response Center Mon. - Fri.: 7 am - 5 pm (PST) Tel: +1-800-866-8608 Fax: +1-408-922-9179 http://www.fujitsumicro.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Am Siebenstein 6-10, D-63303 Dreieich-Buchschlag, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://www.fujitsu-fme.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. #05-08, 151 Lorong Chuan, New Tech Park, Singapore 556741 Tel: +65-281-0770 Fax: +65-281-0220 http://www.fmap.com.sg/ F9703 FUJITSU LIMITED Printed in Japan All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information and circuit diagrams in this document are presented as examples of semiconductor device applications, and are not intended to be incorporated in devices for actual use. Also, FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of this information or circuit diagrams. The contents of this document may not be reproduced or copied without the permission of FUJITSU LIMITED. FUJITSU semiconductor devices are intended for use in standard applications (computers, office automation and other office equipments, industrial, communications, and measurement equipments, personal or household devices, etc.). CAUTION: Customers considering the use of our products in special applications where failure or abnormal operation may directly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with FUJITSU sales representatives before such use. The company will not be responsible for damages arising from such use without prior approval. Any semiconductor devices have inherently a certain rate of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Control Law of Japan, the prior authorization by Japanese government should be required for export of those products from Japan.