TI CY74FCT573TSOCT

CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
D
D
D
D
D
D
D
D
D
D
Function and Pinout Compatible With FCT
and F Logic
Reduced VOH (Typically = 3.3 V) Versions
of Equivalent FCT Functions
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
Ioff Supports Partial-Power-Down Mode
Operation
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
3-State Outputs
CY54FCT573T
– 32-mA Output Sink Current
– 12-mA Output Source Current
CY74FCT573T
– 64-mA Output Sink Current
– 32-mA Output Source Current
CY54FCT573T . . . D PACKAGE
CY74FCT573T . . . P, Q, OR SO PACKAGE
(TOP VIEW)
OE
D0
D1
D2
D3
D4
D5
D6
D7
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
O0
O1
O2
O3
O4
O5
O6
O7
LE
description
The ’FCT573T devices consist of eight latches with 3-state outputs for bus-organized applications. When the
latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup
times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE)
input is low. When OE is high, the bus output is in the high-impedance state. In this mode, data can be entered
into the latches. The ’FCT573T devices are identical to the ’FCT373T devices, except for the flow-through
pinout of the ’FCT573T, which simplifies board design.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
ORDERING INFORMATION
QSOP – Q
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Tape and reel
4.7
CY74FCT573CTQCT
Tube
4.7
CY74FCT573CTSOC
Tape and reel
4.7
CY74FCT573CTSOCT
DIP – P
Tube
5.2
CY74FCT573ATPC
CY74FCT573ATPC
QSOP – Q
Tape and reel
5.2
CY74FCT573ATQCT
FCT573A
Tube
5.2
CY74FCT573ATSOC
Tape and reel
5.2
CY74FCT573ATSOCT
Tape and reel
8
CY74FCT573TQCT
Tube
8
CY74FCT573TSOC
Tape and reel
8
CY74FCT573TSOCT
SOIC – SO
–40°C
40°C to 85°C
SPEED
(ns)
PACKAGE†
TA
SOIC – SO
QSOP – Q
SOIC – SO
FCT573C
FCT573C
FCT573A
FCT573
FCT573
–55°C to 125°C
CDIP – D
Tube
8.5
CY54FCT573ATLMB
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OE
LE
D
OUTPUT
O
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
H = High logic level, L = Low logic level,
X = Don’t care, Z = High-impedance state,
Qn = Previous state of flip flops (Qn–1)
logic diagram (positive logic)
OE
LE
1
11
CP
D0
2
D
Q
To Seven Other Channels
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
O0
CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
absolute maximum rating over operating free-air temperature range (unless otherwise noted)†
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θJA (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
CY54FCT573T
CY74FCT573T
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VIH
Supply voltage
VIL
IOH
Low-level input voltage
0.8
0.8
V
High-level output current
–12
–32
mA
IOL
TA
Low-level output current
32
64
mA
85
°C
High-level input voltage
2
Operating free-air temperature
–55
2
125
–40
V
V
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
CY54FCT573T
TYP† MAX
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.75 V,
IIN = –18 mA
IIN = –18 mA
VCC = 4.5 V,
IOH = –12 mA
IOH = –32 mA
VCC = 4
4.75
75 V
MIN
–0.7
–1.2
–0.7
2.4
2.4
Vhys
All inputs
II
VCC = 5.5 V,
VCC = 5.25 V,
VIN = VCC
VIN = VCC
5
IIH
VCC = 5.5 V,
VCC = 5.25 V,
VIN = 2.7 V
VIN = 2.7 V
±1
IIL
VCC = 5.5 V,
VCC = 5.25 V,
VIN = 0.5 V
VIN = 0.5 V
±1
IOZH
VCC = 5.5 V,
VCC = 5.25 V,
VOUT = 2.7 V
VOUT = 2.7 V
10
IOZL
VCC = 5.5 V,
VCC = 5.25 V,
VOUT = 0.5 V
VOUT = 0.5 V
–10
IOS‡
VCC = 5.5 V,
VCC = 5.25 V,
VOUT = 0 V
VOUT = 0 V
VCC = 0 V,
VCC = 5.5 V,
VOUT = 4.5 V
VIN ≤ 0.2 V,
∆ICC
ICCD¶
0.3
3.3
0.55
IOL = 64 mA
0.3
0.2
0.55
0.2
±1
±1
10
–10
–120
–225
–60
–120
±1
VIN ≥ VCC – 0.2 V
VIN ≥ VCC – 0.2 V
0.1
VCC = 5.25 V,
VIN ≤ 0.2 V,
VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open
VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open
0.5
VCC = 5.5 V, Outputs open,
One input switching at 50% duty cycle, OE = GND,
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
0.06
V
V
5
–60
V
V
2
IOH = –15 mA
IOL = 32 mA
VCC = 4.5 V,
VCC = 4.75 V,
ICC
–1.2
UNIT
3.3
VOL
Ioff
CY74FCT573T
TYP† MAX
MIN
–225
±1
0.2
0.1
0.2
0.5
2
2
µA
µA
µA
µA
µA
mA
µA
mA
mA
0.12
mA/
MHz
VCC = 5.25 V, Outputs open,
One input switching at 50% duty cycle, OE = GND,
VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V
0.06
0.12
† Typical values are at VCC = 5 V, TA = 25°C.
‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or
sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence
of parameter tests, IOS tests should be performed last.
§ Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND
¶ This parameter is derived for use in total power-supply calculations.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
PARAMETER
CY54FCT573T
TYP† MAX
TEST CONDITIONS
5V
VCC = 5
5.5
V,
Outputs open,,
OE = GND,
LE = VCC
IC#
VCC = 5
5.25
25 V
V,
Outputs open,,
OE = GND,
LE = VCC
One bit switching
at f1 = 10 MHz
at 50% duty cycle
Eight bits switching
at f1 = 2.5 MHz
at 50% duty cycle
One bit switching
at f1 = 10 MHz
at 50% duty cycle
Eight bits switching
at f1 = 2.5 MHz
at 50% duty cycle
MIN
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
VIN = 3.4 V or GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
VIN = 3.4 V or GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
0.7
1.4
1
2.4
1.3
2.6||
3.3
10.6||
CY74FCT573T
TYP† MAX
MIN
UNIT
mA
VIN = 3.4 V or GND
VIN ≤ 0.2 V or
VIN ≥ VCC – 0.2 V
VIN = 3.4 V or GND
0.7
1.4
1
2.4
1.3
2.6||
3.3
10.6||
Ci
6
10
6
10
pF
Co
8
12
8
12
pF
† Typical values are at VCC = 5 V, TA = 25°C.
# IC
= ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1)
Where:
IC
= Total supply current
ICC = Power-supply current with CMOS input levels
∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V)
DH
= Duty cycle for TTL inputs high
NT
= Number of TTL inputs at DH
ICCD = Dynamic current caused by an input transition pair (HLH or LHL)
f0
= Clock frequency for registered devices, otherwise zero
f1
= Input signal frequency
N1
= Number of inputs changing at f1
All currents are in milliamperes and all frequencies are in megahertz.
|| Values for these conditions are examples of the ICC formula.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY54FCT573T
MIN
MAX
CY54FCT573AT
MIN
MAX
UNIT
tw
tsu
Pulse duration, LE high
6
6
ns
Setup time, data before LE↑
2
2
ns
th
Hold time, data after LE↑
1.5
1.5
ns
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY74FCT573T
MIN
MAX
CY74FCT573AT
MIN
MAX
CY74FCT573CT
MIN
MAX
UNIT
tw
tsu
Pulse duration, LE high
6
5
5
ns
Setup time, data before LE↑
2
2
2
ns
th
Hold time, data after LE↑
1.5
1.5
1.5
ns
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
switching characteristics over operating free-air temperature range (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
O
tPLH
tPHL
LE
O
tPZH
tPZL
OE
O
tPHZ
tPLZ
OE
O
CY54FCT573AT
MIN
MAX
1.5
5.6
1.5
5.6
2
9.8
2
9.8
1.5
7.5
1.5
7.5
1.5
6.5
1.5
6.5
UNIT
ns
ns
ns
ns
switching characteristics over operating free-air temperature range (see Figure 1)
6
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
D
O
tPLH
tPHL
LE
O
tPZH
tPZL
OE
O
tPHZ
tPLZ
OE
O
POST OFFICE BOX 655303
CY74FCT573T
CY74FCT573AT
CY74FCT573CT
MIN
MAX
MIN
MAX
MIN
MAX
1.5
8
1.5
5.2
1.5
4.7
1.5
8
1.5
5.2
1.5
4.7
2
13
2
8.5
2
5.5
2
13
2
8.5
2
5.5
1.5
12
1.5
6.5
1.5
5.5
1.5
12
1.5
6.5
1.5
5.5
1.5
7.5
1.5
5.5
1.5
5
1.5
7.5
1.5
5.5
1.5
5
• DALLAS, TEXAS 75265
UNIT
ns
ns
ns
ns
CY54FCT573T, CY74FCT573T
8-BIT LATCHES
WITH 3-STATE OUTPUTS
SCCS068 – OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7V
From Output
Under Test
From Output
Under Test
Test
Point
CL = 50 pF
(see Note A)
Open
TEST
GND
CL = 50 pF
(see Note A)
500 Ω
S1
500 Ω
S1
Open
7V
Open
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
500 Ω
LOAD CIRCUIT FOR
3-STATE OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.5 V
Timing Input
0V
tw
tsu
3V
1.5 V
Input
1.5 V
th
3V
1.5 V
Data Input
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
1.5 V
1.5 V
VOL
tPHL
Out-of-Phase
Output
tPLZ
≈3.5 V
1.5 V
tPZH
VOH
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
Output
Waveform 1
(see Note B)
tPLH
1.5 V
1.5 V
tPZL
VOH
In-Phase
Output
3V
Output
Control
Output
Waveform 2
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
5962-9223801MRA
ACTIVE
CDIP
J
20
1
TBD
5962-9223802M2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
CY54FCT573ATLMB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE N / A for Pkg Type
CY74FCT573ATPC
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CY74FCT573ATPCE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CY74FCT573ATQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573ATQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573ATQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573ATSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573ATSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573ATSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573ATSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573ATSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573ATSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573CTQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573CTQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573CTQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573CTSOC
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573CTSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573CTSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573CTSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573CTSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573TQCT
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573TQCTE4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573TQCTG4
ACTIVE
SSOP/
QSOP
DBQ
20
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
CY74FCT573TSOC
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
25
Addendum-Page 1
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
A42 SNPB
MSL Peak Temp (3)
N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CY74FCT573TSOCE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573TSOCG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573TSOCT
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573TSOCTE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CY74FCT573TSOCTG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CY74FCT573ATQCT
Package Package Pins
Type Drawing
SSOP/
QSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT573ATSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT573CTQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT573CTSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
CY74FCT573TQCT
SSOP/
QSOP
DBQ
20
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
CY74FCT573TSOCT
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CY74FCT573ATQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT573ATSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT573CTQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT573CTSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
CY74FCT573TQCT
SSOP/QSOP
DBQ
20
2500
346.0
346.0
33.0
CY74FCT573TSOCT
SOIC
DW
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated