CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 D D D D D D D D 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O0 O1 O2 O3 O4 O5 O6 O7 CP CY54FCT574T . . . L PACKAGE (TOP VIEW) D2 D3 D4 D5 D6 O0 D OE D0 D1 D2 D3 D4 D5 D6 D7 GND OE VCC D CY54FCT574T . . . D PACKAGE CY74FCT574T . . . Q OR SO PACKAGE (TOP VIEW) D1 D0 D Function, Pinout, and Drive Compatible With FCT and F Logic Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics Ioff Supports Partial-Power-Down Mode Operation Matched Rise and Fall Times Fully Compatible With TTL Input and Output Logic Levels ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) Edge-Triggered D-Type Inputs 250-MHz Typical Switching Rate CY54FCT574T – 32-mA Output Sink Current – 12-mA Output Source Current CY74FCT574T – 64-mA Output Sink Current – 32-mA Output Source Current 3-State Outputs 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 O1 O2 O3 O4 O5 D7 GND CP O7 O6 D description The ’FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE) inputs are common to all flip-flops. The ’FCT574T are identical to ’FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the ’FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE is low, the contents of the eight flip-flops are available at the outputs. When OE is high, the outputs are in the high-impedance state. The state of OE does not affect the state of the flip-flops. These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 ORDERING INFORMATION SPEED (ns) PACKAGE† TA QSOP – Q Tape and reel 5.2 CY74FCT574CTQCT Tube 5.2 CY74FCT574CTSOC Tape and reel 5.2 CY74FCT574CTSOCT Tape and reel 6.5 CY74FCT574ATQCT Tube 6.5 CY74FCT574ATSOC Tape and reel 6.5 CY74FCT574ATSOCT Tape and reel 10 CY74FCT574TQCT Tube 10 CY74FCT574TSOC Tape and reel 10 CY74FCT574TSOCT CDIP – D Tube 6.2 CY54FCT574CTDMB CDIP – D Tube 7.2 CY54FCT574ATDMB SOIC – SO QSOP – Q –40°C to 85°C SOIC – SO QSOP – Q SOIC – SO –55°C to 125°C ORDERABLE PART NUMBER TOP-SIDE MARKING FCT574C FCT574C FCT574A FCT574A FCT574 FCT574 LCC – L Tube 7.2 CY54FCT574ATLMB † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS OE OUTPUT O ↑ L H ↑ L L X H Z D CP H L X H = High logic level, L = Low logic level, X = Don’t care, Z = High-impedance state, ↑ = Low-to-high clock transition logic diagram (positive logic) OE CP 1 11 C1 D0 2 1D Q To Seven Other Channels 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 19 O0 CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA Package thermal impedance, θJA (see Note 1): Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W Ambient temperature range with power applied, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 2) CY54FCT574T CY74FCT574T MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.75 5 5.25 UNIT VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 0.8 V High-level output current –12 –32 mA IOL TA Low-level output current 32 64 mA 85 °C High-level input voltage 2 Operating free-air temperature –55 2 125 –40 V V NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH CY54FCT574T TYP† MAX TEST CONDITIONS VCC = 4.5 V, VCC = 4.75 V, IIN = –18 mA IIN = –18 mA VCC = 4.5 V, IOH = –12 mA IOH = –32 mA VCC = 4 4.75 75 V MIN –0.7 –1.2 –0.7 2.4 2.4 Vhys All inputs II VCC = 5.5 V, VCC = 5.25 V, VIN = VCC VIN = VCC 5 IIH VCC = 5.5 V, VCC = 5.25 V, VIN = 2.7 V VIN = 2.7 V ±1 IIL VCC = 5.5 V, VCC = 5.25 V, VIN = 0.5 V VIN = 0.5 V ±1 VCC = 0 V, VCC = 5.5 V, VOUT = 4.5 V VOUT = 0 V VCC = 5.25 V, VCC = 5.5 V, VOUT = 0 V VIN = 2.7 V VCC = 5.25 V, VCC = 5.5 V, VIN = 2.7 V VIN = 0.5 V VCC = 5.25 V, VCC = 5.5 V, VIN = 0.5 V VIN ≤ 0.2 V, IOZH IOZL ICC ∆ICC 0.3 3.3 0.55 IOL = 64 mA 0.3 0.2 0.55 0.2 ±1 ±1 ±1 –120 ±1 –225 –60 –120 –225 10 10 –10 –10 VIN ≥ VCC – 0.2 V VCC = 5.25 V, VIN ≤ 0.2 V, VIN ≥ VCC – 0.2 V VCC = 5.5 V, VIN = 3.4 V§, f1 = 0, Outputs open VCC = 5.25 V, VIN = 3.4 V§, f1 = 0, Outputs open 0.1 0.5 V V 5 –60 V V 2 IOH = –15 mA IOL = 32 mA VCC = 4.5 V, VCC = 4.75 V, IOS‡ –1.2 UNIT 3.3 VOL Ioff CY74FCT574T TYP† MAX MIN µA µA µA µA mA µA µA 0.2 0.1 0.2 0.5 2 2 mA mA † Typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample-and-hold techniques are preferable to minimize internal chip heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last. § Per TTL-driven input (VIN = 3.4 V); all other inputs at VCC or GND 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) (continued) PARAMETER ICCD¶ CY54FCT574T TYP† MAX TEST CONDITIONS MIN VCC = 5.5 V, Outputs open, One bit switching at 50% duty cycle, OE = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VCC = 5.25 V, Outputs open, One bit switching at 50% duty cycle, OE = GND, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V VCC = 5.5 V, f0 = 10 MHz,, Outputs open, OE = GND IC VCC = 5.25 V, f0 = 10 MHz,, Outputs open, OE = GND 0.06 CY74FCT574T TYP† MAX MIN UNIT 0.12 mA/ MHz 0.06 0.12 One bit switching at f1 = 5 MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4 VIN = 3.4 V or GND 1.2 3.4 Eight bits switching at f1 = 2.5 MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 1.6 3.2|| VIN = 3.4 V or GND 3.9 12.2|| One bit switching at f1 = 5 MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 0.7 1.4 VIN = 3.4 V or GND 1.2 3.4 Eight bits switching at f1 = 2.5 MHz at 50% duty cycle VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V 1.6 3.2|| VIN = 3.4 V or GND 3.9 12.2|| mA Ci 5 10 5 10 pF Co 9 12 9 12 pF † Typical values are at VCC = 5 V, TA = 25°C. ¶ This parameter is derived for use in total power-supply calculations. # IC = ICC + ∆ICC × DH × NT + ICCD (f0/2 + f1 × N1) Where: IC = Total supply current ICC = Power-supply current with CMOS input levels ∆ICC = Power-supply current for a TTL high input (VIN = 3.4 V) DH = Duty cycle for TTL inputs high NT = Number of TTL inputs at DH ICCD = Dynamic current caused by an input transition pair (HLH or LHL) f0 = Clock frequency for registered devices, otherwise zero f1 = Input signal frequency N1 = Number of inputs changing at f1 All currents are in milliamperes and all frequencies are in megahertz. || Values for these conditions are examples of the ICC formula. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) CY54FCT574T MIN MAX CY54FCT574AT MIN MAX CY54FCT574CT MIN MAX UNIT tw tsu Pulse duration, CP high or low 7 6 6 ns Setup time, data before CP↑ 2 2 2 ns th Hold time, data after CP↑ 1.5 1.5 1.5 ns timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) CY74FCT574T MIN MAX CY74FCT574AT MIN MAX CY74FCT574CT MIN MAX UNIT tw tsu Pulse duration, CP high or low 7 5 5 ns Setup time, data before CP↑ 2 2 2 ns th Hold time, data after CP↑ 1.5 1.5 1.5 ns switching characteristics over operating free-air temperature range (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL CP O tPZH tPZL OE O tPHZ tPLZ OE O CY54FCT574T CY54FCT574AT CY54FCT574CT MIN MAX MIN MAX MIN MAX 2 11 2 7.2 2 6.2 2 11 2 7.2 2 6.2 1.5 14 1.5 7.5 1.5 6.2 1.5 14 1.5 7.5 1.5 6.2 1.5 8 1.5 6.5 1.5 5.7 1.5 8 1.5 6.5 1.5 5.7 UNIT ns ns ns switching characteristics over operating free-air temperature range (see Figure 1) 6 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL CP O tPZH tPZL OE O tPHZ tPLZ OE O POST OFFICE BOX 655303 CY74FCT574T CY74FCT574AT CY74FCT574CT MIN MAX MIN MAX MIN MAX 2 10 2 6.5 2 5.2 2 10 2 6.5 2 5.2 1.5 12.5 1.5 6.5 1.5 5.5 1.5 12.5 1.5 6.5 1.5 5.5 1.5 8 1.5 5.5 1.5 5 1.5 8 1.5 5.5 1.5 5 • DALLAS, TEXAS 75265 UNIT ns ns ns CY54FCT574T, CY74FCT574T 8-BIT REGISTERS WITH 3-STATE OUTPUTS SCCS073 – OCTOBER 2001 PARAMETER MEASUREMENT INFORMATION 7V From Output Under Test From Output Under Test Test Point CL = 50 pF (see Note A) Open TEST GND CL = 50 pF (see Note A) 500 Ω S1 500 Ω S1 Open 7V Open tPLH/tPHL tPLZ/tPZL tPHZ/tPZH 500 Ω LOAD CIRCUIT FOR 3-STATE OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS 3V 1.5 V Timing Input 0V tw tsu 3V 1.5 V Input 1.5 V th 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL 1.5 V 1.5 V VOL tPHL Out-of-Phase Output tPLZ ≈3.5 V 1.5 V tPZH VOH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V Output Waveform 1 (see Note B) tPLH 1.5 V 1.5 V tPZL VOH In-Phase Output 3V Output Control Output Waveform 2 (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. The outputs are measured one at a time with one input transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9222203M2A ACTIVE LCCC FK 20 1 TBD 5962-9222203MRA ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type A42 SNPB N / A for Pkg Type 5962-9222205MRA ACTIVE CDIP J 20 1 TBD CY54FCT574ATLMB ACTIVE LCCC FK 20 1 TBD CY74FCT574ATQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574ATQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574ATQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574ATSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574ATSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574ATSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574ATSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574ATSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574ATSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574CTQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574CTQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574CTQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574CTSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574CTSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574CTSOCG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574CTSOCT ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574CTSOCTE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574CTSOCTG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574TQCT ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574TQCTE4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574TQCTG4 ACTIVE SSOP/ QSOP DBQ 20 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CY74FCT574TSOC ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CY74FCT574TSOCE4 ACTIVE SOIC DW 20 25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CY74FCT574TSOCG4 ACTIVE SOIC DW 20 CY74FCT574TSOCT ACTIVE SOIC DW CY74FCT574TSOCTE4 ACTIVE SOIC CY74FCT574TSOCTG4 ACTIVE SOIC Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CY74FCT574ATQCT Package Package Pins Type Drawing SSOP/ QSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT574ATSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT574CTQCT SSOP/ QSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT574CTSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 CY74FCT574TQCT SSOP/ QSOP DBQ 20 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CY74FCT574TSOCT SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CY74FCT574ATQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT574ATSOCT SOIC DW 20 2000 346.0 346.0 41.0 CY74FCT574CTQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT574CTSOCT SOIC DW 20 2000 346.0 346.0 41.0 CY74FCT574TQCT SSOP/QSOP DBQ 20 2500 346.0 346.0 33.0 CY74FCT574TSOCT SOIC DW 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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