GILWAY GHB-GW20-R

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-GW20-R
Features
Description
?SUBMINIATURE PACKAGE.
The Hyper Red source color devices are made
?WIDE VIEWING ANGLE.
?LONG
LIFE - SOLID STATE RELIABILITY.
SUBMINIATURE SOLID STATE LAMP
?LOW PACKAGE PROFILE.
?PACKAGE :
with DH InGaAlP on GaAs substrate Light Emitting Diode.
1000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
REV NO: V.2
DATE: NOV/13/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No.
No
o..
HYPER RED (InGaAIP)
GHB-GW20-R
m c dd)
v ((mcd)
IIv
(mc
@ 20 mA
Lens
Typ
L
e
ens
nss T
Tyy p e
Diic
ce
WATER CLEAR
ng
ew iin
V
Viewin
Viiiew
Angle
Miin
n.
in.
T
Typ
Tyyyp
pp..
280
660
20°
Note:
1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
its
Un
nit
t io nss
o n d iition
T
Test
e
est
ss t C
Cond
640
nm
I F =20mA
Hyper Red
628
nm
I F =20mA
Spectral Line Half-width
Hyper Red
27
nm
I F =20mA
C
Capacitance
Hyper Red
45
pF
V F =0V;f =1MHz
VF
Forward Voltage
Hyper Red
1.9
2 .5
V
I F =20mA
IR
Reverse Current
Hyper Red
10
uA
V R = 5V
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r a m e t er
ev ic e
De
evic
TTyyyp
pp..
peak
Peak Wavelength
Hyper Red
D
Dominate Wavelength
1/2
xx..
ax
Ma
Absolute Maximum Ratings at TA=25 C
P
Pa
a
arameter
r am e t er
Hyper Red
its
Un
nit
Power dissipation
170
mW
DC Forward Current
30
mA
185
mA
Peak Forward Current [1]
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE: NOV/13/2002
PAGE: 2 OF 4
REV NO: V.2
DATE: NOV/13/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE: NOV/13/2002
PAGE: 4 OF 4