GILWAY GHB-PLCC-O2

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-PLCC-O2
Features
Description
!SINGLE COLOR.
The Super Bright Orange source color devices are
made with DH InGaAlP on GaAs substrate Light Emitting Diode.
!SUITABLE FOR ALL SMT ASSEMBLY AND
SOLDER PROCESS.
3.5x2.8 mm SMD CHIP LED LAMP
!IDEAL FOR BACKLIGHTING.
!AVAILABLE
!PACKAGE
ON TAPE AND REEL.
: 1500PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.2
DATE: DEC/13/2002
PAGE: 1 OF 4
Selection Guide
P
Pa
a
art
rt N
No
No.
o..
S UPER BRIGHTORANGE (InGaAlP)
GHB-PLCC-O2
IIv
((mcd
m c dd)
v (mcd)
@ 20 mA
Lens
L
e
ens
nss T
Typ
Tyy pe
Diic
ce
WATER CLE AR
V
Viewin
Viiewing
i ew i n g
Angle
Miin
n.
in.
T
Typ
Tyyyp
pp..
180
350
120°
Note:
1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r am et er
De
evic
ev ic e
TTyyyp
pp..
Ma
ax
xx..
Un
nit
its
T
Test
e
est
ss t C
Conditio
o n d it io nss
peak
P eak Wavelength
S uper Bright Orange
610
nm
I F =20mA
D
D ominate Wavelength
S uper Bright Orange
601
nm
I F =20mA
29
nm
I F =20mA
pF
VF =0V;f=1MHz
2.5
V
I F =20mA
10
uA
VR = 5V
1/2
S pectral Line Half-width S uper Bright Orange
C
C apacitance
S uper Bright Orange
30
VF
Forward Voltage
S uper Bright Orange
2.0
IR
Reverse Current
S uper Bright Orange
Absolute Maximum Ratings at TA=25 C
P
Paramet
Pa
a
arameter
r a m e t er
S
Su
up
u
uper
p er
er Bri
B
Br
Bright
Br igh
g h t Orang
O
Orang
r an g e
U
Unit
n
nit
its
Power dissipation
75
mW
DC Forward Current
30
mA
Peak Forward Current [1]
1 95
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE: DEC/13/2002
PAGE: 2 OF 4
REV NO: V.2
DATE: DEC/13/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE: DEC/13/2002
PAGE: 4 OF 4