55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-PLCC-O2 Features Description !SINGLE COLOR. The Super Bright Orange source color devices are made with DH InGaAlP on GaAs substrate Light Emitting Diode. !SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. 3.5x2.8 mm SMD CHIP LED LAMP !IDEAL FOR BACKLIGHTING. !AVAILABLE !PACKAGE ON TAPE AND REEL. : 1500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE: DEC/13/2002 PAGE: 1 OF 4 Selection Guide P Pa a art rt N No No. o.. S UPER BRIGHTORANGE (InGaAlP) GHB-PLCC-O2 IIv ((mcd m c dd) v (mcd) @ 20 mA Lens L e ens nss T Typ Tyy pe Diic ce WATER CLE AR V Viewin Viiewing i ew i n g Angle Miin n. in. T Typ Tyyyp pp.. 180 350 120° Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Sy yymbo ymbol mb o l P Pa a aramete r am et er De evic ev ic e TTyyyp pp.. Ma ax xx.. Un nit its T Test e est ss t C Conditio o n d it io nss peak P eak Wavelength S uper Bright Orange 610 nm I F =20mA D D ominate Wavelength S uper Bright Orange 601 nm I F =20mA 29 nm I F =20mA pF VF =0V;f=1MHz 2.5 V I F =20mA 10 uA VR = 5V 1/2 S pectral Line Half-width S uper Bright Orange C C apacitance S uper Bright Orange 30 VF Forward Voltage S uper Bright Orange 2.0 IR Reverse Current S uper Bright Orange Absolute Maximum Ratings at TA=25 C P Paramet Pa a arameter r a m e t er S Su up u uper p er er Bri B Br Bright Br igh g h t Orang O Orang r an g e U Unit n nit its Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 1 95 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.2 DATE: DEC/13/2002 PAGE: 2 OF 4 REV NO: V.2 DATE: DEC/13/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE: DEC/13/2002 PAGE: 4 OF 4