GILWAY GHB-1206-DR

55 Commerce Way
Woburn, MA 01801
(781) 935 - 4442
(781) 938 - 5867
www.gilway.com
GHB-1206-DR
Features
Description
!3.2mmx1.6mm SMT LED, 1.1mm THICKNESS.
The Super Bright Red source color devices are made
!LOW POWER CONSUMPTION.
with Gallium Aluminum Arsenide Red Light Emitting
!WIDE VIEWING ANGLE.
Diode.
!IDEAL FOR BACKLIGHT AND INDICATOR.
3.2x1.6mm SMD CHIP LED LAMP
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is 0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
REV NO: V.2
DATE:DEC/05/2002
PAGE: 1 OF 4
Selection Guide
o..
P
Pa
a
art
rt N
No.
No
ce
D iic
SUPER BRIGHT RED(GaAlAs)
GHB-1206-DR
m c dd)
v ((mcd
IIv
(mcd)
@ 20 mA
L
e
ens
nss T
Typ
Tyy p e
Lens
WATER CLEAR
ew i n g
V
Viewin
Viiiewing
Angle
in.
Miin
n.
T
Typ
Tyyyp
pp..
36
80
120°
Note:
1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at TA=25 C
S
Sy
yymbo
ymbol
mb o l
P
Pa
a
aramete
r am et er
De
evic
ev ic e
TTyyyp
pp..
Ma
ax
xx..
Un
nit
its
T
Test
e
est
ss t C
Conditio
o n d it io nss
peak
P eak Wavelength
S uper Bright Red
660
nm
I F =20mA
D
D ominate Wavelength
S uper Bright Red
640
nm
I F =20mA
S pectral Line Half-width S uper Bright Red
20
nm
I F =20mA
pF
VF=0V;f=1MHz
2.5
V
I F =20mA
10
uA
VR = 5V
1/2
C
C apacitance
S uper Bright Red
45
VF
Forward Voltage
S uper Bright Red
1.85
IR
Reverse Current
S uper Bright Red
Absolute Maximum Ratings at TA=25 C
P
Paramete
Pa
a
arameter
r a m e t er
S
Su
u
uper
uper
p er Br
Bright
Bright
Red
Re
B
Br ig h t R
ed
U
Unit
nit
n
its
Power dissipation
100
mW
DC Forward Current
30
mA
Peak Forward Current [1]
155
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40 C To +85 C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
REV NO: V.2
DATE:DEC/05/2002
PAGE: 2 OF 4
REV NO: V.2
DATE:DEC/05/2002
PAGE: 3 OF 4
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
REV NO: V.2
DATE:DEC/05/2002
PAGE: 4 OF 4