55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-1104R-Y Description Features !3.0mmx1.0mm SMT !LOW The Super Bright Yellow source color devices are LED, 2.0mm THICKNESS. made with DH InGaAlP on GaAs substrate Light POWER CONSUMPTION. !WIDE !IDEAL Emitting Diode. VIEWING ANGLE. FOR BACK LIGHT AND INDICATOR. !VARIOUS 3.0x1.0 mm SMD CHIP LED LAMP COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.15(0.006") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.2 DATE:DEC/12/2002 PAGE: 1 OF 4 Selection Guide P Pa a art rt N No No. o.. S UPER BRIGHT YELLOW (InGaAlP) GHB-1104R-Y m c dd) ((mcd IIv v (mcd) @ 20 mA Lens Typ L e ens nss T Typ Tyy p e Diic ce WATER CLEAR V Viewin Viiewing i ew i n g Angle in. Miin n. T Typ Tyyyp pp.. 36 60 120° Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Sy yymbo ymbol mb o l P Pa a aramete r a m e t er De evic ev ic e peak Peak Wavelength Super Bright Yellow D D ominate Wavelength 1/2 TTyyyp pp.. Ma ax xx.. Un nit its T Test e est ss t C Cond o n d iition t io nss 590 nm IF =20mA Super Bright Yellow 588 nm IF =20mA Spectral Line Half-width Super Bright Yellow 28 nm IF =20mA C C apacitance Super Bright Yellow 25 pF V F =0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF =20mA IR Reverse Current Super Bright Yellow 10 uA VR = 5V Absolute Maximum Ratings at TA=25 C P Paramete Pa a arameter r a m e t er S Su u uper p er B Brig Brigh htt Ye Yellow Yello Br Br ig h Y Yello w U Unit nit n its Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 150 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.2 DATE:DEC/12/2002 PAGE: 2 OF 4 REV NO: V.2 DATE:DEC/12/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.2 DATE:DEC/12/2002 PAGE: 4 OF 4