TI SN74LV8154N

SCLS589 − AUGUST 2004
D Can Be Used as Two 16-Bit Counters or a
D
D
D
D
D
D
D
N OR PW PACKAGE
(TOP VIEW)
Single 32-Bit Counter
2-V to 5.5-V VCC Operation
Max tpd of 25 ns at 5 V (RCLK to Y)
Typical VOLP (Output Ground Bounce)
<0.7 V at VCC = 5 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>4.4 V at VCC = 5 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
CLKA
CLKB
GAL
GAU
GBL
GBU
RCLK
RCOA
CLKBEN
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
CCLR
description/ordering information
The SN74LV8154 is a dual 16-bit binary counter with 3-state output registers, designed for 2-V to 5.5-V VCC
operation.
This 16-bit counter (A or B) feeds a 16-bit storage register, and each storage register is further divided into an
upper byte and lower byte. The GAL, GAU, GBL, GBU inputs are used to select the byte that needs to be output
at Y0−Y7. CLKA is the clock for A counter, and CLKB is the clock for B counter. RCLK is the clock for the A and
B storage registers. All three clock signals are positive-edge triggered.
A 32-bit counter can be realized by connecting CLKA and CLKB together and by connecting RCOA to CLKBEN.
To ensure the high-impedance state during power up or power down, GAL, GAU, GBL, and GBU should be tied
to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability
of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
PDIP − N
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TSSOP − PW
Tube
SN74LV8154N
Tube
SN74LV8154PW
Tape and reel
SN74LV8154PWR
TOP-SIDE
MARKING
SN74LV8154N
LV8154
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
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1
SCLS589 − AUGUST 2004
FUNCTION TABLE
(each buffer)
INPUTS
GAL
GAU
GBL
GBU
OUTPUT
Yn
Lower byte in A register
L
H
H
H
H
L
H
H
Upper byte in A register
H
H
L
H
Lower byte in B register
H
H
H
L
Upper byte in B register
H
H
H
H
Z
Combinations of GAL, GAU, GBL, GBU, other than those shown above, are
prohibited. If more than one input is L at the same time, the output data (Y0−Y7) may
be invalid.
timing diagram
CCKBEN
CCLR
CCKA
CCKB
RCLK
A
Counter
0000
0001
0002
0003
0004
B
Counter
0000
0001
0002
0003
0004
00
01
02
0100
0101
0100
0102
0103
FFFD FFFE FFFF
0000
0001
0101
0102
FFFD FFFE FFFF
0000
0001
GAL
GAU
GBL
GBU
Output Don’t Care
03
00
RCOA
2
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01
FF
SCLS589 − AUGUST 2004
block diagram
R
R
R
R
R
R
CCKB
CCKBEN
R
R
R
R
R
R
R
R
R
16-Bit Counter B
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
4 to 1 Dec
Y0
4 to 1 Dec
Y1
4 to 1 Dec
Y2
4 to 1 Dec
Y3
4 to 1 Dec
Y4
4 to 1 Dec
Y5
4 to 1 Dec
Y6
4 to 1 Dec
Y7
R
R
RCLK
CCKA
CCLR
16-Bit Counter A
GAL
GAU
GBL
RCOA
GBU
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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SCLS589 − AUGUST 2004
recommended operating conditions (see Note 4)
VCC
VCC
Supply voltage
2V
VIH
3 V to 3.6 V
High-level input voltage
4.5 V to 5.5 V
MIN
MAX
2
5.5
VCC × 0.7
VCC × 0.7
0.5
4.5 V to 5.5 V
VI
Input voltage
VO
Output voltage
5.5
V
High or low state
0
3-state
0
VCC
5.5
V
−50
µA
Yn outputs
Yn outputs
−6
−12
2V
−50
3 V to 3.6 V
−6
4.5 V to 5.5 V
−12
2V
50
3 V to 3.6 V
6
4.5 V to 5.5 V
12
2V
50
Low-level output current
RCOA
∆t/∆v
3 V to 3.6 V
4.5 V to 5.5 V
High-level output current
RCOA
IOL
V
0
2V
IOH
V
VCC × 0.3
VCC × 0.3
3 V to 3.6 V
Low-level input voltage
V
1.5
2V
VIL
UNIT
Input transition rise or fall rate
3 V to 3.6 V
6
4.5 V to 5.5 V
12
3 V to 3.6 V
100
4.5 V to 5.5 V
20
mA
µA
mA
µA
mA
µA
mA
ns/V
TA
Operating free-air temperature
−40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
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SCLS589 − AUGUST 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
Yn
VOH
RCOA
Yn
VOL
RCOA
MIN
IOH = −50 µA
IOH = −6 mA
2V
3V
2.48
IOH = −12 mA
IOH = −50 µA
4.5 V
3.8
2V
1.9
IOH = −6 mA
IOH = −12 mA
3V
2.48
4.5 V
3.8
TYP
MAX
V
2V
0.1
3V
0.44
IOL = 12 mA
IOL = 50 µA
4.5 V
0.55
2V
0.1
IOL = 6 mA
IOL = 12 mA
3V
0.44
4.5 V
0.55
VI = 5.5 V or GND
VO = VCC or GND
ICC
Ioff
VI = VCC or GND, IO = 0
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
VO = VCC or GND
UNIT
1.9
IOL = 50 µA
IOL = 6 mA
II
IOZ
Co
VCC
V
±1
µA
5.5 V
±5
µA
5.5 V
20
µA
0
5
µA
0 to 5.5 V
5V
3
pF
5V
5
pF
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
MIN
tw
tsu
Pulse duration
Setup time
th
Hold time
tz†
Z-period
CLKA, CLKB, RCLK high or low
10
CCLR low
22
CLKBEN low before CLKB↑
13
CCLR high (inactive) before CLKA↑
or CLKB↑
13
CLKA↑ or CLKB↑ before RCLK↑
13
RCLK↑ before GAL or GAU or GBL or
GBU low
13
GAL or GAU or GBL or GBU high
(inactive) before RCLK↑
13
CLKBEN low after CLKB↑
0
CLKA or CLKB after RCLK
0
GAL, GAU, GBL, GBU all high before
one of them switches low
200
MAX
UNIT
ns
ns
ns
ns
† tz condition: CL = 50 pF, RL = 1 kΩ
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SCLS589 − AUGUST 2004
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
MIN
tw
Pulse duration
tsu
Setup time
th
Hold time
tz†
Z-period
CLKA, CLKB, RCLK high or low
10
CCLR low
20
CLKBEN low before CLKB↑
10
CCLR high (inactive) before CLKA↑
or CLKB↑
10
CLKA↑ or CLKB↑ before RCLK↑
10
RCLK↑ before GAL or GAU or GBL or
GBU low
10
GAL or GAU or GBL or GBU high
(inactive) before RCLK↑
10
CLKBEN low after CLKB↑
0
CLKA or CLKB after RCLK
0
GAL, GAU, GBL, GBU all high before
one of them switches low
MAX
UNIT
ns
ns
ns
200
ns
temperature
range,
† tz condition: CL = 50 pF, RL = 1 kΩ
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fMAX
tpd
tPLH
TA = 25°C
MIN
TYP
MAX
MIN
CL = 15 pF
40
CL = 50 pF
25
MAX
UNIT
MHz
RCLK
Y
22
1
38
CLKA
RCOA
26
1
44
ns
CCLR
RCOA
18
1
32
ns
ten
GAL, GAU, GBL, GBU
Y
27
1
46
ns
tdis
GAL, GAU, GBL, GBU
Y
12
1
21
ns
RCLK
Y
25
1
42
CLKA
RCOA
28
1
46
CCLR
RCOA
20
1
35
ns
ten
GAL, GAU, GBL, GBU
Y
30
1
50
ns
tdis
GAL, GAU, GBL, GBU
Y
14
1
24
ns
tpd
tPLH
6
LOAD
CAPACITANCE
free-air
POST OFFICE BOX 655303
CL = 15 pF
CL = 50 pF
• DALLAS, TEXAS 75265
ns
SCLS589 − AUGUST 2004
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
fMAX
free-air
MIN
temperature
TA = 25°C
TYP
MAX
MIN
CL = 15 pF
40
CL = 50 pF
25
MAX
range,
UNIT
MHz
RCLK
Y
14
1
25
CLKA
RCOA
16
1
27
CCLR
RCOA
12
1
20
ns
ten
GAL, GAU, GBL, GBU
Y
16
1
28
ns
tdis
GAL, GAU, GBL, GBU
Y
8
1
15
ns
RCLK
Y
16
1
27
CLKA
RCOA
17
1
28
CCLR
RCOA
13
1
21
ns
ten
GAL, GAU, GBL, GBU
Y
18
1
30
ns
tdis
GAL, GAU, GBL, GBU
Y
9
1
16
ns
tpd
tPLH
tpd
tPLH
CL = 15 pF
CL = 50 pF
ns
ns
noise characteristics, VCC = 5 V, CL = 50 pF
PARAMETER
TA = 25°C
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.7
V
Quiet output, minimum dynamic VOL
−0.75
V
VOH(V)
Quiet output, minimum dynamic VOH
4.4
V
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = No load, CCLK = 10 MHz,
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TYP
RCLK = 1 MHz
56
UNIT
pF
7
SCLS589 − AUGUST 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
50% VCC
Input
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
50% VCC
VOH
50% VCC
VOL
VOH
50% VCC
VOL
50% VCC
0V
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
50% VCC
50% VCC
tPLZ
tPZL
tPHL
tPHL
Out-of-Phase
Output
0V
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
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PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV8154N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV8154NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV8154PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8154PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8154PWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8154PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8154PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV8154PWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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