TI SN74LV74AQDRQ1

SCLS556A − DECEMBER 2003 − REVISED MAY 2004
D Qualification in Accordance With
D OR PW PACKAGE
(TOP VIEW)
AEC-Q100†
D Qualified for Automotive Applications
D Customer-Specific Configuration Control
D
D
D
D
D
D
D
D
1CLR
1D
1CLK
1PRE
1Q
1Q
GND
Can Be Supported Along With
Major-Change Approval
2-V to 5.5-V VCC Operation
Max tpd of 13 ns at 5 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
2CLR
2D
2CLK
2PRE
2Q
2Q
† Contact factory for details. Q100 qualification data available on
request.
description/ordering informationS
This dual positive-edge-triggered D-type flip-flop is designed for 2-V to 5.5-V VCC operation.
A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) inputs meeting the setup-time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
−40°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE‡
TA
SOIC − D
Tape and reel
SN74LV74AQDRQ1
TOP-SIDE
MARKING
LV74A
TSSOP − PW
Tape and reel SN74LV74AQPWRQ1
LV74A
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS556A − DECEMBER 2003 − REVISED MAY 2004
FUNCTION TABLE
OUTPUTS
INPUTS
PRE
CLR
CLK
D
Q
L
H
X
X
H
Q
L
H
L
X
X
H
H†
L
L
L
X
X
L
H†
H
H
↑
H
H
H
H
↑
L
L
H
H
H
L
X
Q0
Q0
† This configuration is nonstable; that is, it does not
persist when PRE or CLR returns to its inactive
(high) level.
logic diagram, each flip-flop (positive logic)
PRE
CLK
C
C
C
Q
TG
C
C
C
C
D
TG
TG
TG
C
C
C
Q
CLR
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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• DALLAS, TEXAS 75265
SCLS556A − DECEMBER 2003 − REVISED MAY 2004
recommended operating conditions (see Note 4)
VCC
VIH
VIL
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level input voltage
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
IOH
IOL
∆t/∆v
MAX
2
5.5
V
VCC × 0.7
0.5
VCC × 0.3
VCC × 0.3
Input voltage
0
Output voltage
0
VCC × 0.3
5.5
VCC
−50
VCC = 2 V
VCC = 2.3 V to 2.7 V
V
V
µA
−6
mA
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
µA
50
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
mA
12
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
V
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
V
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
High-level output current
UNIT
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
Low-level input voltage
VI
VO
MIN
200
100
ns/V
20
TA
Operating free-air temperature
−40
125
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
TEST CONDITIONS
2 V to 5.5 V
IOH = −6 mA
IOH = −12 mA
IOL = 50 µA
IOL = 2 mA
VI = 5.5 V or GND
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
2.3 V
3V
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
0.1
2.3 V
0.4
3V
0.44
4.5 V
0.55
V
0 to 5.5 V
±1
µA
5.5 V
20
µA
0
5
µA
IO = 0
VI = VCC or GND
POST OFFICE BOX 655303
MIN
VCC−0.1
2
2 V to 5.5 V
IOL = 6 mA
IOL = 12 mA
II
ICC
Ci
VCC
IOH = −50 µA
IOH = −2 mA
• DALLAS, TEXAS 75265
3.3 V
2
5V
2
pF
3
SCLS556A − DECEMBER 2003 − REVISED MAY 2004
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
PARAMETER
tw
Pulse duration
tsu
Setup time before CLK↑
th
Hold time, data after CLK↑
MIN
PRE or CLR low
8
9
CLK
8
9
Data
8
9
PRE or CLR inactive
7
7
0.5
0.5
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
PARAMETER
tw
Pulse duration
tsu
Setup time before CLK↑
th
Hold time, data after CLK↑
MIN
PRE or CLR low
6
7
CLK
6
7
Data
6
7
PRE or CLR inactive
5
5
0.5
0.5
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
PARAMETER
tw
Pulse duration
tsu
Setup time before CLK↑
th
Hold time, data after CLK↑
PRE or CLR low
5
5
CLK
5
5
Data
5
5
PRE or CLR inactive
3
3
0.5
0.5
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
LOAD
CAPACITANCE
CLK
Q or Q
30
CL = 50 pF
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
4
LOAD
CAPACITANCE
CL = 50 pF
PRE or CLR
CLK
Q or Q
POST OFFICE BOX 655303
free-air
MIN
CL = 50 pF
PRE or CLR
MIN
CL = 50 pF
• DALLAS, TEXAS 75265
70
MIN
ns
ns
MAX
25
17.4
1
20
14.2
20
1
23
temperature
90
MIN
range,
UNIT
MHz
13
TA = 25°C
MIN
TYP
MAX
UNIT
ns
temperature
TA = 25°C
TYP
MAX
free-air
50
MAX
MAX
45
ns
range,
UNIT
MHz
9.2
15.8
1
18
10.2
15.4
1
18
ns
SCLS556A − DECEMBER 2003 − REVISED MAY 2004
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
LOAD
CAPACITANCE
MIN
CL = 50 pF
PRE or CLR
Q or Q
CLK
free-air
temperature
TA = 25°C
TYP
MAX
90
CL = 50 pF
140
MIN
MAX
75
range,
UNIT
MHz
6.6
9.7
1
12
7.2
9.3
1
13
MIN
TYP
MAX
ns
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 5)
PARAMETER
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.1
0.8
V
Quiet output, minimum dynamic VOL
0
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3.2
High-level dynamic input voltage
V
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
23
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
21
pF
5
SCLS556A − DECEMBER 2003 − REVISED MAY 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
50% VCC
50% VCC
50% VCC
0V
tPLZ
tPZL
Output
Waveform 1
S1 at VCC
(see Note B)
tPLH
VOH
50% VCC
VOL
VCC
Output
Control
≈VCC
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV74AQDRQ1
NRND
SOIC
D
14
2500
SN74LV74AQPWRQ1
NRND
TSSOP
PW
14
2000
Lead/Ball Finish
MSL Peak Temp (3)
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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