HITACHI 2SB1688

2SB1688
Silicon PNP Epitaxial
High voltage amplifier
ADE-208-975A (Z)
2nd. Edition
Mar. 2001
Features
• High breakdown voltage
VCEO = -300V min
Outline
TO-92 (1)
1. Emitter
2. Collector
3. Base
3
2
1
2SB1688
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
-300
V
Collector to emitter voltage
VCEO
-300
V
Emitter to base voltage
VEBO
-5
V
Collector current
IC
-50
mA
Collector power dissipation
PC
750
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
-55 to +150
°C
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Conditions
Collector cutoff current
I CBO
—
—
-0.1
µA
VCB = -300V, IE = 0
I CEO
—
—
-0.1
µA
VCE = -300V, RBE =∞
Emitter cutoff current
I EBO
—
—
-10
µA
VEB = -5 V, IC = 0
Base to emitter voltage
VBE
—
—
-0.75
V
VCE = -6V, I C = -1mA
DC current transfer raito
hFE
80
—
160
—
VCE = -6V, IC = -2mA
—
—
-0.9
V
I C = -30mA, IB = -3mA
Collector to emitter saturation VCE(sat)
voltage
2
1.5
1.0
0.5
0
-100
-10
-1.0
-0.1
-0.01
-0.4
Ta = 75°C
VCE = -6 V
Pulse test
-0.2
25°C
-0.6
-0.8
-25°C
Typical Transfer Characteristics
50
100
Ambient Temperature Ta (°C)
-1.0
150
Maximum Collector Dissipation Curve
0
Base to Emitter Voltage VBE (V)
-10
-50 µA
3
2SB1688
Typical Output Characteristics
-60 µA
-70 µA
-40 µA
-30 µA
-8
-6
-20 µA
-100
-20
-40
-60
-80
-100
Collector to Emitter Voltage VCE (V)
Pulse Test
IB = -10 µA
-4
-2
0
-25°C
DC Current Transfer Ratio vs.
Collector Current
25°C
-10
Collector Current IC (mA)
-1.0
VCE = -6 V
Pulse Test
Ta = 75°C
1
-0.1
10
100
1,000
Collector Current IC (mA)
DC Current Transfer Ratio hFE
Main Characteristics
Collector Power Dissipation PC (W)
Collector Current IC (mA)
2SB1688
-10
-1.0
25°C
Ta = 75°C
-0.1
-0.01
-0.1
Gain Bandwidth Product vs.
Collector Current
1,000
IC/IB = 10
Pulse Test
Gain Bandwidth Product fT (MHz)
Collector to Emitter Saturation Voltage
VCE (sat) (V)
Collector to Emitter Saturation Voltage vs.
Collector Current
-25°C
-1.0
-10
VCE = -6 V
100
10
1
-0.1
-100
-1.0
-10
Collector Current IC (mA)
Collector Output Capacitance Cob (pF)
Collector Current IC (mA)
100
Collector Output Capacitance vs.
Collector to Base Voltage
f = 1 MHz
IE = 0
10
1.0
0.1
-0.1
-1.0
-10
-100
Collector to Base Voltage VCB (V)
4
-100
2SB1688
Package Dimensions
As of January, 2001
Unit: mm
4.8 ± 0.4
0.7
0.60 Max
0.55Max
12.7 Min
2.3 Max
5.0 ± 0.2
3.8 ± 0.4
0.5Max
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Mass (reference value)
TO-92 (1)
Conforms
Conforms
0.25 g
5
2SB1688
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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Copyright  Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
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