SN65LVEP11 www.ti.com ........................................................................................................................................ SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 2.5 V/3.3 V PECL/ECL 1:2 Fanout Buffer FEATURES 1 • • • • • • • • • • 1:2 PECL/ECL Fanout Buffer Operating Range – PECL: VCC = 2.375 V to 3.8V With VEE = 0 V – NECL: VCC = 0 V With VEE = –2.375V to –3.8 V Open Input Default State Support for Clock Frequencies > 3.0 GHz 240 ps Typical Propagation Delay Deterministic Output Value for Open Input Conditions Q Output Will Default Low When Input Open or at VEE Built-in Temperature Compensation Drop in Compatible to MC10LVEP11, MC100LVEP11 LVDS Input Compatible DESCRIPTION PINOUT ASSIGNMENT + Q0 1 Q0 2 7 D + Q1 3 6 D Q1 4 5 VEE Table 1. PIN DESCRIPTION PIN FUNCTION D, D PECL/ECL data inputs Q0, Q0, Q1, Q1 PECL/ECL outputs VCC Positive supply VEE Negative supply The SN65LVEP11 is a differential 1:2 PECL/ECL fanout buffer. The device includes circuitry to maintain known logic levels when the inputs are in an open condition. Single-ended clock input operation is limited to VCC ≥ 3 V in PECL mode, or VEE ≤ 3 V in NECL mode. The device is housed in an industry-standard SOIC-8 package and is also available in TSSOP-8 package option. ORDERING INFORMATION (1) (1) 8 VCC PART NUMBER PART MARKING PACKAGE LEAD FINISH SN65LVEP11D SN65LVEP11 SOIC NiPdAu SN65LVEP11DGK SN65LVEP11 SOIC-TSSOP NiPdAu Leaded device option not initially available; contact TI sales representative for further information. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN65LVEP11 SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 ........................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS PARAMETER CONDITION VALUE UNIT Absolute PECL mode supply voltage VCC VEE = 0 V 6 V Absolute NECL mode supply voltage, VEE VCC = 0 V –6 V PECL mode input voltage VEE = 0 V; VI ≤ VCC 6 V NECL mode input voltage VCC = 0 V; VI ≥ VEE –6 V Continuous 50 mA Output current 100 mA Operating temperature range Surge –40 to 85 °C Storage temperature range –65 to 150 °C POWER DISSIPATION RATINGS PACKAGE CIRCUIT BOARD MODEL POWER RATING TA < 25°C (mW) THERMAL RESISTANCE, JUNCTION TO AMBIENT NO AIRFLOW DERATING FACTOR TA > 25°C (mW/°C) POWER RATING TA = 85°C (mW) SOIC SOIC-TSSOP Low-K 719 139 7 288 High-K 840 119 8 336 Low-K 469 213 5 188 High-K 527 189 5 211 THERMAL CHARACTERISTICS PARAMETER θJB Junction-to Board Thermal Resistance θJC Junction-to Case Thermal Resistance PACKAGE VALUE UNIT SOIC 79 °C/W SOIC-TSSOP 120 SOIC 98 SOIC-TSSOP 74 °C/W KEY ATTRIBUTES CHARACTERISTICS VALUE Internal input pull down resistor 75 kΩ Internal input pull up resistor 37.5 kΩ Moisture sensitivity level Level 1 Flammability rating (Oxygen Index: 28 to 34) UL 94 V-0 at 0.125 in ESD-HBM 4 kV ESD-machine model 200 V ESD-charged device model 2 kV Meets or exceeds JEDEC Spec EIA/JESD78 latchup test 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65LVEP11 SN65LVEP11 www.ti.com ........................................................................................................................................ SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 PECL DC CHARACTERISTICS (1) (VCC = 2.5 V; VEE = 0.0 V) (2) –40°C PARAMETER ICC Power supply current VOH Output HIGH voltage (3) MIN 25°C TYP MAX 28 1355 (3) MIN 45 85°C TYP MAX 31 MIN 45 TYP MAX 35 45 mA 1605 mV 555 900 mV 1620 1335 1620 mV 1605 1355 1425 1605 1335 VOL Output LOW voltage VIH Input high voltage (Single-Ended) 1335 VIL Input low voltage (Single-Ended) 555 900 555 900 555 900 mV VIHCMR Input HIGH voltage common mode range (Differential) (4) 1.2 2.5 1.2 2.5 1.2 2.5 V IIH Input HIGH current 150 µA IIL Input LOW current (D) 0.5 0.5 0.5 nput LOW current (–D) –150 –150 –150 (1) (2) (3) (4) 555 900 555 759 UNIT 1620 1335 150 900 150 µA The device will meet the specifications after the thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to – 1.3 V. All loading with 50 Ω to VCC –2 V. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Single ended input clock pin operation is limited to VCC ≥ 3.0 V in PECL mode. PECL DC CHARACTERISTICS (1) (VCC = 3.3 V; VEE = 0.0 V) (2) –40°C PARAMETER MIN 25°C TYP MAX 28 MIN TYP MAX 32 MIN 45 TYP MAX 36 UNIT ICC Power supply current 45 mA VOH Output HIGH voltage (3) 2155 2405 2155 2221 2405 2155 2405 mV VOL Output LOW voltage (3) 1355 1700 1355 1543 1700 1355 1700 mV 2135 2420 2135 2420 2135 2420 mV 1355 1700 1355 1700 1355 1700 mV (4) 45 85°C VIH Input high voltage (Single-Ended) VIL Input low voltage (Single-Ended) (4) VIHCMR Input HIGH voltage common mode range (Differential) (5) IIH Input HIGH current IIL Input LOW current (D) 0.5 0.5 0.5 nput LOW current (–D) –150 –150 –150 (1) (2) (3) (4) (5) 1.2 3.3 1.2 150 3.3 1.2 150 3.3 V 150 µA µA The device will meet the specifications after the thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are specified only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to –0.5 V. All loading with 50 Ω to VCC – 2 V. Single Ended input clock pin operation is limited to VCC ≥ 3 V in PECL mode. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65LVEP11 3 SN65LVEP11 SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 ........................................................................................................................................ www.ti.com NECL DC CHARACTERISTICS (1) (VCC = 0.0 V; VEE = –3.8V to –2.375 V) (2) –40°C PARAMETER MIN ICC Power supply current VOH Output HIGH voltage (3) 25°C TYP MAX 28 (3) 85°C MIN TYP 45 MAX MIN TYP MAX 36 UNIT 32 45 45 mA –1145 –895 –1145 –1065 –895 –1145 –895 mV VOL Output LOW voltage –1945 –1600 –1945 –1777 –1600 –1945 –1600 mV VIH Input high voltage (Single-Ended) (4) –1165 –880 –1165 –880 –1165 –880 mV VIL Input low voltage (Single-Ended) (4) –1945 –1600 –1945 –1600 –1945 –1600 mV VIHCM Input HIGH voltage common mode range (Differential) (5) 0.0 VEE+1.2 0.0 VEE+1.2 R IIH Input HIGH current IIL Input LOW current (D) 0.5 0.5 0.5 nput LOW current (–D) –150 –150 –150 (1) (2) (3) (4) (5) VEE+1.2 VEE+1.2 VEE+1.2 150 VEE+1.2 150 0.0 V 150 µA µA The device will meet the specifications after thermal balance has been established when mounted in a socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously Input and output parameters vary 1:1 with VCC. All loading with 50 Ω to VCC – 2 V. Single Ended input clock pin operation is limited to VCC ≤ –3 V in NECL mode. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. AC CHARACTERISTICS (1) (VCC = 2.375 V to 3.8 V; VEE = 0.0 V or VCC = 0.0 V; VEE = –3.8 V to –2.375 V (2) PARAMETER –40°C MIN fMAX Max switching frequency (3) (see Figure 6) tPLH/tPHL Propagation delay to output differential (CLK, Q, –Q) tSKEW Device skew ( Q, –Q) Device to Device Skew (Q, –Q) tJITTER 25°C TYP MAX MIN 3.8 200 MIN 3.5 300 200 8 (4) 85°C TYP MAX 3.1 300 8 TYP MAX 200 15 8 GHz 300 ps 15 ps 25 25 25 Random clock jitter (RMS) ≤ 1.0 GHz 0.3 0.3 0.3 Random Clock Jitter (RMS) ≤ 1.5 GHz 0.2 0.2 0.2 Random Clock Jitter (RMS) ≤ 2.0 GHz 0.2 0.2 0.2 Random Clock Jitter (RMS) ≤ 2.5 GHz 0.2 0.2 0.2 Random Clock Jitter (RMS) ≤ 3.0 GHz 0.2 0.2 UNIT ps 0.2 VPP Input swing Differential Config. 150 800 1200 150 1200 150 1200 mV tr/tf Output rise/fall times Q, –Q (20%–80%) 100 200 100 200 100 200 ps (1) (2) (3) (4) 4 The device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are assured only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 Ω to VCC –2 V. The maximum switching frequency measured at the output amplitude of 300 mVpp. Skew is measured between outputs under identical transitions Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65LVEP11 SN65LVEP11 www.ti.com ........................................................................................................................................ SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 Typical Termination for Output Driver ZO = 50 W P P Driver Receiver ZO = 50 W N N 50 W 50 W VTT VTT = VCC -2 V Figure 1. Typical Termination for Output Driver D D Q Q tPHL tPLH Figure 2. Propagation Delay D VPP(min) VPP(max) D Figure 3. Input Voltage Swing 80% 20% tr tf Figure 4. Output Rise and Fall Times Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65LVEP11 5 SN65LVEP11 SLLS930A – NOVEMBER 2008 – REVISED DECEMBER 2008 ........................................................................................................................................ www.ti.com D D Q0 Q0 tPHL0 tPLH0 Q1 Q1 tPHL1 tPLH1 Device Skew = Higher [(tPLH1 - tPLH0), (tPHL1 - tPHL0)] Figure 5. Device Skew 1000 VCC = 3.3V VCC = 0.0V 900 Output Amplitude - mV 800 700 600 -40°C 500 25°C 400 85°C 300 200 100 0 0 1000 2000 3000 4000 4500 Frequency - MHz Figure 6. Output Amplitude vs Frequency 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65LVEP11 PACKAGE OPTION ADDENDUM www.ti.com 2-Jan-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65LVEP11D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVEP11DGK ACTIVE MSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVEP11DGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVEP11DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DLP® Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2009, Texas Instruments Incorporated