TL331-Q1 www.ti.com SLVS969A – OCTOBER 2009 – REVISED JULY 2010 SINGLE DIFFERENTIAL COMPARATOR Check for Samples: TL331-Q1 FEATURES 1 • • • • • • • • • • DBV PACKAGE (TOP VIEW) Qualified for Automotive Applications Single Supply or Dual Supplies Wide Range of Supply Voltage: 2 V to 36 V Low Supply-Current Drain Independent of Supply Voltage: 0.4 mA Typ Low Input Bias Current: 25 nA Typ Low Input Offset Voltage: 2 mV Typ Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage: ±36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS IN− VCC−/GND IN+ 1 5 VCC 4 OUT 2 3 DESCRIPTION/ORDERING INFORMATION This device consists of a single voltage comparator that is designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies is 2 V to 36 V and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The output can be connected to other open-collector outputs to achieve wired-AND relationships. ORDERING INFORMATION (1) PACKAGE (2) TA (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING –40°C to 85°C SOT-23 – DBV Reel of 3000 TL331IDBVRQ1 TQ1U –40°C to 125°C SOT-23 – DBV Reel of 3000 TL331QDBVRQ1 T1RU For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2010, Texas Instruments Incorporated TL331-Q1 SLVS969A – OCTOBER 2009 – REVISED JULY 2010 www.ti.com LOGIC DIAGRAM IN+ OUT IN− SCHEMATIC VCC 80-µA Current Regulator 10 µA 60 µA 10 µA 80 µA IN+ COMPONENT COUNT OUT Epi-FET Diodes Resistors Transistors 1 2 1 20 IN− GND Note: Current values shown are nominal. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage (2) 36 V (3) VID Differential input voltage VI Input voltage range (either input) ±36 V VO Output voltage IO Output current –0.3 V to 36 V 36 V 20 mA Duration of output short-circuit to ground (4) Unlimited qJA Package thermal impedance (5) 206°C/W TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) 2 (6) 150°C –65°C to 150°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground. Differential voltages are at IN+ with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can impact reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): TL331-Q1 TL331-Q1 www.ti.com SLVS969A – OCTOBER 2009 – REVISED JULY 2010 ELECTRICAL CHARACTERISTICS at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = VIC(min) IIO Input offset current VO = 1.4 V IIB Input bias current VO = 1.4 V VICR Common-mode input voltage range (2) TA TYP MAX 2 5 25°C –40°C to 125°C 9 25°C 5 –40°C to 125°C 25°C –25 0 to VCC – 1.5 –40°C to 125°C 0 to VCC – 1.5 VCC = 15 V, VO = 1.4 V to 11.4 V, RL ≥ 15 kΩ to VCC IOH High-level output current VOL Low-level output voltage IOL = 4 mA, VID = –1 V IOL Low-level output current VOL = 1.5 V, VID = 1 V 25°C ICC Supply current RL = ∞, VCC = 5 V 25°C 25°C 50 VOH = 5 V, VID = 1 V 25°C VOH = 30 V, VID = 1 V –40°C to 125°C –250 –400 25°C Large-signal differential voltage amplification 50 250 –40°C to 125°C AVD (1) (2) MIN mV nA nA V 200 V/mV 0.1 25°C UNIT 150 –40°C to 125°C 50 nA 1 mA 400 700 6 mV mA 0.4 0.7 mA All characteristics are measured with zero common-mode input voltage, unless otherwise specified. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage. SWITCHING CHARACTERISTICS VCC = 5 V, TA = 25°C PARAMETER Response time (1) (2) TEST CONDITIONS RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1) (2) TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT ms CL includes probe and jig capacitance. The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): TL331-Q1 3 PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TL331IDBVRQ1 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL331QDBVRQ1 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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OTHER QUALIFIED VERSIONS OF TL331-Q1 : • Catalog: TL331 NOTE: Qualified Version Definitions: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2010 • Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TL331IDBVRQ1 SOT-23 DBV 5 3000 179.0 8.4 TL331QDBVRQ1 SOT-23 DBV 5 3000 179.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.2 3.2 1.4 4.0 8.0 Q3 3.2 3.2 1.4 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL331IDBVRQ1 SOT-23 DBV 5 3000 203.0 203.0 35.0 TL331QDBVRQ1 SOT-23 DBV 5 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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