HD74HCT540/HD74HCT541 Octal Buffers/Line Drivers (with 3-state outputs) Description The HD74HCT540 is an inverting buffer and the HD74HCT541 is a non-inverting buffer. The 3-state control gate operates as a two-input NOR such that if either G1 or G2 are high, all eight outputs are in the high-impedance state. Features • • • • • • LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility High Speed Operation: tpd (A to Y) = 12 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 4.5 to 5.5 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table Inputs Outputs Y G1 G2 A HD74HCT540 HD74HCT541 L L L H L L L H L H H X X Z Z X H X Z Z X : Z : irrelevant Off (high-impedance) state of a 3-state output. HD74HCT540/HD74HCT541 Pin Arrangement HD74HCT540 G1 1 20 VCC A1 2 19 G2 A2 3 18 Y1 A3 4 17 Y2 A4 5 16 Y3 A5 6 15 Y4 A6 7 14 Y5 A7 8 13 Y6 A8 9 12 Y7 GND 10 11 Y8 (Top view) HD74HCT541 G1 1 20 VCC A1 2 19 G2 A2 3 18 Y1 A3 4 17 Y2 A4 5 16 Y3 A5 6 15 Y4 A6 7 14 Y5 A7 8 13 Y6 A8 9 12 Y7 GND 10 11 Y8 (Top view) 2 HD74HCT540/HD74HCT541 Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V Output current I OUT ±35 mA DC current drain per VCC, GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C DC Characteristics Ta = –40 to +85°C Ta = 25°C Test Conditions Item Symbol Min Typ Max Min Max Unit VCC (V) Input voltage VIH 2.0 — — — V 4.5 to 5.5 VIL — — 0.8 — 0.8 V 4.5 to 5.5 VOH 4.4 — — 4.4 — V 4.5 Vin = VIH or VIL I OH = –20 µA 4.18 — — 4.13 — 4.5 I OH = –6 mA — — 0.1 — 0.1 — — 0.26 — 0.33 Output voltage VOL 2.0 V 4.5 Vin = VIH or VIL I OL = 20 µA 4.5 I OL = 6 mA Off-state output current I OZ — — ±0.5 — ±5.0 µA 5.5 Vin = VIH or VIL, Vout = VCC or GND Input current Iin — — ±0.1 — ±1.0 µA 5.5 Vin = VCC or GND Quiescent current I CC — — 4.0 — 40 µA 5.5 Vin = VCC or GND, Iout = 0 µA 3 HD74HCT540/HD74HCT541 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C Test Conditions Min Typ Max Min Max Unit VCC (V) Propagation delay t PLH — 11 20 — 25 ns 4.5 time t PHL — 12 20 — 25 t PLH — 10 23 — 29 t PHL — 13 23 — 29 Output enable t ZL — 16 30 — 38 time t ZH — 20 30 — 38 Output disable t LZ — 15 30 — 38 time t HZ — 15 30 — 38 Output rise/fall t TLH — 4 12 — 15 time t THL — 4 12 — 15 Input capacitance Cin — 5 10 — 10 Item 4 Symbol HD74HCT540 only 4.5 ns 4.5 4.5 ns 4.5 4.5 ns 4.5 4.5 ns 4.5 4.5 pF — HD74HCT541 only Unit: mm 24.50 25.40 Max 6.30 11 1 7.00 Max 20 10 1.30 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 1.27 Max 2.54 Min 5.08 Max 0.89 7.62 + 0.11 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Weight (reference value) DP-20N — Conforms 1.26 g Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DA — Conforms 0.31 g Unit: mm 12.8 13.2 Max 11 1 10 0.20 ± 0.10 0.935 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *0.27 ± 0.05 0.25 ± 0.04 2.65 Max 7.50 20 0.25 10.40 +– 0.40 1.45 0° – 8° 0.57 0.70 +– 0.30 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DB Conforms — 0.52 g Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.22+0.08 –0.07 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 *Dimension including the plating thickness Base material dimension 0.07 +0.03 –0.04 0.10 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.65 Max 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-20DA — — 0.07 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. 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Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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