HITACHI HD74HCT541

HD74HCT540/HD74HCT541
Octal Buffers/Line Drivers (with 3-state outputs)
Description
The HD74HCT540 is an inverting buffer and the HD74HCT541 is a non-inverting buffer. The 3-state
control gate operates as a two-input NOR such that if either G1 or G2 are high, all eight outputs are in the
high-impedance state.
Features
•
•
•
•
•
•
LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility
High Speed Operation: tpd (A to Y) = 12 ns typ (CL = 50 pF)
High Output Current: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 4.5 to 5.5 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Function Table
Inputs
Outputs Y
G1
G2
A
HD74HCT540
HD74HCT541
L
L
L
H
L
L
L
H
L
H
H
X
X
Z
Z
X
H
X
Z
Z
X :
Z :
irrelevant
Off (high-impedance) state of a 3-state output.
HD74HCT540/HD74HCT541
Pin Arrangement
HD74HCT540
G1
1
20 VCC
A1
2
19 G2
A2
3
18 Y1
A3
4
17 Y2
A4
5
16 Y3
A5
6
15 Y4
A6
7
14 Y5
A7
8
13 Y6
A8
9
12 Y7
GND 10
11 Y8
(Top view)
HD74HCT541
G1
1
20 VCC
A1
2
19 G2
A2
3
18 Y1
A3
4
17 Y2
A4
5
16 Y3
A5
6
15 Y4
A6
7
14 Y5
A7
8
13 Y6
A8
9
12 Y7
GND 10
11 Y8
(Top view)
2
HD74HCT540/HD74HCT541
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Supply voltage range
VCC
–0.5 to +7.0
V
Input voltage
VIN
–0.5 to VCC + 0.5
V
Output voltage
VOUT
–0.5 to VCC + 0.5
V
Output current
I OUT
±35
mA
DC current drain per VCC, GND
I CC, I GND
±75
mA
DC input diode current
I IK
±20
mA
DC output diode current
I OK
±20
mA
Power dissipation per package
PT
500
mW
Storage temperature
Tstg
–65 to +150
°C
DC Characteristics
Ta = –40 to
+85°C
Ta = 25°C
Test Conditions
Item
Symbol
Min Typ Max Min
Max
Unit
VCC (V)
Input voltage
VIH
2.0
—
—
—
V
4.5 to
5.5
VIL
—
—
0.8 —
0.8
V
4.5 to
5.5
VOH
4.4
—
—
4.4
—
V
4.5
Vin = VIH or VIL I OH = –20 µA
4.18 —
—
4.13
—
4.5
I OH = –6 mA
—
—
0.1 —
0.1
—
—
0.26 —
0.33
Output voltage
VOL
2.0
V
4.5
Vin = VIH or VIL I OL = 20 µA
4.5
I OL = 6 mA
Off-state output
current
I OZ
—
—
±0.5 —
±5.0
µA
5.5
Vin = VIH or VIL,
Vout = VCC or GND
Input current
Iin
—
—
±0.1 —
±1.0
µA
5.5
Vin = VCC or GND
Quiescent current I CC
—
—
4.0 —
40
µA
5.5
Vin = VCC or GND, Iout = 0 µA
3
HD74HCT540/HD74HCT541
AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = –40 to
+85°C
Ta = 25°C
Test Conditions
Min Typ Max Min
Max
Unit
VCC (V)
Propagation delay t PLH
—
11
20
—
25
ns
4.5
time
t PHL
—
12
20
—
25
t PLH
—
10
23
—
29
t PHL
—
13
23
—
29
Output enable
t ZL
—
16
30
—
38
time
t ZH
—
20
30
—
38
Output disable
t LZ
—
15
30
—
38
time
t HZ
—
15
30
—
38
Output rise/fall
t TLH
—
4
12
—
15
time
t THL
—
4
12
—
15
Input capacitance
Cin
—
5
10
—
10
Item
4
Symbol
HD74HCT540 only
4.5
ns
4.5
4.5
ns
4.5
4.5
ns
4.5
4.5
ns
4.5
4.5
pF
—
HD74HCT541 only
Unit: mm
24.50
25.40 Max
6.30
11
1
7.00 Max
20
10
1.30
2.54 ± 0.25
0.48 ± 0.10
0.51 Min
1.27 Max
2.54 Min 5.08 Max
0.89
7.62
+ 0.11
0.25 – 0.05
0° – 15°
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
DP-20N
—
Conforms
1.26 g
Unit: mm
12.6
13 Max
11
1
10
1.27
*0.42 ± 0.08
0.40 ± 0.06
0.10 ± 0.10
0.80 Max
*0.22 ± 0.05
0.20 ± 0.04
2.20 Max
5.5
20
0.20
7.80 +– 0.30
1.15
0° – 8°
0.70 ± 0.20
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DA
—
Conforms
0.31 g
Unit: mm
12.8
13.2 Max
11
1
10
0.20 ± 0.10
0.935 Max
1.27
*0.42 ± 0.08
0.40 ± 0.06
*0.27 ± 0.05
0.25 ± 0.04
2.65 Max
7.50
20
0.25
10.40 +– 0.40
1.45
0° – 8°
0.57
0.70 +– 0.30
0.15
0.12 M
*Dimension including the plating thickness
Base material dimension
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
FP-20DB
Conforms
—
0.52 g
Unit: mm
6.50
6.80 Max
11
1
10
4.40
20
0.65
*0.22+0.08
–0.07
0.20 ± 0.06
1.0
0.13 M
6.40 ± 0.20
*Dimension including the plating thickness
Base material dimension
0.07 +0.03
–0.04
0.10
*0.17 ± 0.05
0.15 ± 0.04
1.10 Max
0.65 Max
0° – 8°
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TTP-20DA
—
—
0.07 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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