HD74HCT241 Octal Buffers/Line Drivers/Line Receivers (with noninverted 3-state outputs) Description The HD74HCT241 is a noninverting buffer and has one active low enable and one active high enable. Each enable independently controls 4 buffers. This device does not have schmitt trigger inputs. Features • • • • • • LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility High Speed Operation: tpd (A to Y) = 10 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 4.5 to 5.5 V Low Input Current: 1 µA max Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Function Table Inputs Output 1G 2G A Y H L X Z L H H H L H L L H L X Z : : : : High level Low level Irrelevant Off (high impedance) state of a 3-state output HD74HCT241 Pin Arrangement 1G 1 20 VCC 1A1 2 19 2G 2Y4 3 18 1Y1 1A2 4 17 2A4 2Y3 5 16 1Y2 1A3 6 15 2A3 2Y2 7 14 1Y3 1A4 8 13 2A2 2Y1 9 12 1Y4 GND 10 11 2A1 (Top view) 2 HD74HCT241 Block Diagram To three other 1A Buffers To three other 2A Buffers VCC Two of 8 Buffers Input 1A YA VCC Input 2A YB 1G 2G Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage range VCC –0.5 to +7.0 V Input voltage VIN –0.5 to VCC + 0.5 V Output voltage VOUT –0.5 to VCC + 0.5 V DC current drain per pin I OUT ±35 mA DC current drain per VCC, GND I CC, I GND ±75 mA DC input diode current I IK ±20 mA DC output diode current I OK ±20 mA Power dissipation per package PT 500 mW Storage temperature Tstg –65 to +150 °C 3 HD74HCT241 DC Characteristics Ta = –40 to +85°C Ta = 25°C Test Conditions Item Symbol Min Typ Max Min Max Unit VCC (V) Input voltage VIH 2.0 — — — V 4.5 to 5.5 VIL — — 0.8 — 0.8 V 4.5 to 5.5 VOH 4.4 — — 4.4 — V 4.5 Vin = VIH or VIL I OH = –20 µA 4.18 — — 4.13 — 4.5 I OH = –6 mA — — 0.1 — 0.1 — — 0.26 — 0.33 Output voltage VOL 2.0 V 4.5 Vin = VIH or VIL I OL = 20 µA 4.5 I OL = 6 mA Off-state output current I OZ — — ±0.5 — ±5.0 µA 5.5 Vin = VIH or VIL, Vout = VCC or GND Input current Iin — — ±0.1 — ±1.0 µA 5.5 Vin = VCC or GND Quiescent current I CC — — 4.0 — 40 µA 5.5 Vin = VCC or GND, Iout = 0 µA AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = –40 to +85°C Ta = 25°C Test Conditions Min Typ Max Min Max Unit VCC (V) Propagation delay t PHL — 11 20 — 25 ns 4.5 time t PLH — 9 20 — 25 Output enable t ZL — 14 30 — 38 time t ZH — 12 30 — 38 Output disable t LZ — 13 30 — 38 time t HZ — 17 30 — 38 Output rise/fall time t TLH t THL — 4 12 — 15 ns 4.5 Input capacitance Cin — 5 10 — 10 pF — Item 4 Symbol 4.5 ns 4.5 4.5 ns 4.5 4.5 Unit: mm 24.50 25.40 Max 6.30 11 1 7.00 Max 20 10 1.30 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 1.27 Max 2.54 Min 5.08 Max 0.89 7.62 + 0.11 0.25 – 0.05 0° – 15° Hitachi Code JEDEC EIAJ Weight (reference value) DP-20N — Conforms 1.26 g Unit: mm 12.6 13 Max 11 1 10 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max *0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 20 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DA — Conforms 0.31 g Unit: mm 12.8 13.2 Max 11 1 10 0.20 ± 0.10 0.935 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 *0.27 ± 0.05 0.25 ± 0.04 2.65 Max 7.50 20 0.25 10.40 +– 0.40 1.45 0° – 8° 0.57 0.70 +– 0.30 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DB Conforms — 0.52 g Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.22+0.08 –0.07 0.20 ± 0.06 1.0 0.13 M 6.40 ± 0.20 *Dimension including the plating thickness Base material dimension 0.07 +0.03 –0.04 0.10 *0.17 ± 0.05 0.15 ± 0.04 1.10 Max 0.65 Max 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-20DA — — 0.07 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. 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