HD74LV174A Hex D-type Flip-Flops with Clear ADE-205-269 (Z) 1st Edition April 1999 Description This device contains 6 master-slave flip-flops with a common clock and common clear. Data on the D input having the specified setup and hold times is transferred to the Q output on the low to high transition of the clock input. The clear input when low, sets all outputs to a low state. Low-voltage and high-speed operation is suitable for battery-powered products (e.g., notebook computers), and the low-power consumption extends the battery life. Features • • • • • • VCC = 2.0 V to 5.5 V operation All inputs VIH (Max.) = 5.5 V (@VCC = 0 V to 5.5 V) All outputs VO (Max.) = 5.5 V (@VCC = 0 V) Typical VOL ground bounce < 0.8 V (@VCC = 3.3 V, Ta = 25°C) Typical VOH undershoot > 2.3 V (@VCC = 3.3 V, Ta = 25°C) Output current ±6 mA (@VCC = 3.0 V to 3.6 V), ±12 mA (@VCC = 4.5 V to 5.5 V) Function Table Inputs CLR CLK D Output Q L X X L H ↑ H H H ↑ L L H ↓ X no change Note: H: L: X: ↑: ↓: High level Low level Immaterial Low to high transition High to low transition HD74LV174A Pin Arrangement CLR 1 16 VCC 1Q 2 15 6Q 1D 3 14 6D 2D 4 13 5D 2Q 5 12 5Q 3D 6 11 4D 3Q 7 10 4Q 9 CLK GND 8 (Top view) 2 HD74LV174A Absolute Maximum Ratings Item Supply voltage range Input voltage range* 1 Output voltage range* 1, 2 Symbol Ratings Unit VCC –0.5 to 7.0 V VI –0.5 to 7.0 V VO –0.5 to VCC + 0.5 V –0.5 to 7.0 Conditions Output: H or L VCC: OFF Input clamp current I IK –20 mA VI < 0 Output clamp current I OK ±50 mA VO < 0 or VO > VCC Continuous output current IO ±25 mA VO = 0 to VCC Continuous current through VCC or GND I CC or IGND ±50 mA Maximum power dissipation at Ta = 25°C (in still air)*3 PT 785 mW 500 Storage temperature Tstg –65 to 150 SOP TSSOP °C Notes: The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This value is limited to 5.5 V maximum. 3. The maximum package power dissipation was calculated using a junction temperature of 150°C. 3 HD74LV174A Recommended Operating Conditions Item Symbol Min Max Unit Supply voltage range VCC 2.0 5.5 V Input voltage range VI 0 5.5 V Output voltage range VO 0 VCC V H or L Output current I OH — –50 µA VCC = 2.0 V — –2 mA VCC = 2.3 to 2.7 V — –6 VCC = 3.0 to 3.6 V — –12 VCC = 4.5 to 5.5 V — 50 µA VCC = 2.0 V — 2 mA VCC = 2.3 to 2.7 V — 6 VCC = 3.0 to 3.6 V — 12 VCC = 4.5 to 5.5 V 0 200 0 100 VCC = 3.0 to 3.6 V 0 20 VCC = 4.5 to 5.5 V –40 85 I OL Input transition rise or fall rate Operating free-air temperature ∆t /∆v Ta Conditions ns/V VCC = 2.3 to 2.7 V °C Note: Unused or floating inputs must be held high or low. Logic Diagram CLR CLK 1D 1 9 3 1D C1 R To Five Other Channels 4 2 1Q HD74LV174A DC Electrical Characteristics • Ta = –40 to 85°C Item Symbol VCC (V)* Min Typ Max Unit Input voltage VIH 2.0 1.5 — — V 2.3 to 2.7 VCC × 0.7 — — 3.0 to 3.6 VCC × 0.7 — — 4.5 to 5.5 VCC × 0.7 — — 2.0 — — 0.5 2.3 to 2.7 — — VCC × 0.3 3.0 to 3.6 — — VCC × 0.3 4.5 to 5.5 — — VCC × 0.3 Min to Max VCC – 0.1 — — 2.3 2.0 — — IOH = –2 mA 3.0 2.48 — — IOH = –6 mA 4.5 3.8 — — IOH = –12 mA Min to Max — — 0.1 IOL = 50 µA 2.3 — — 0.4 IOL = 2 mA 3.0 — — 0.44 IOL = 6 mA 4.5 — — 0.55 IOL = 12 mA VIL Output voltage VOH VOL V Test Conditions IOH = –50 µA Input current IIN 0 to 5.5 — — ±1 µA VI = 5.5 V or GND Quiescent supply current ICC 5.5 — — 20 µA VI = VCC or GND, IO = 0 Output leakage current IOFF 0 — — 5 µA VI or VO = 0 V to 5.5 V Input capacitance CIN 3.3 — 1.7 — pF VI = VCC or GND Note: For conditions shown as Min or Max, use the appropriate values under recommended operating conditions. 5 HD74LV174A Switching Characteristics • VCC = 2.5 ± 0.2 V Ta = 25°C Ta = –40 to 85°C Item Symbol Min Typ Max Min Max Unit Test Conditions Maximum clock frequency fmax 55 115 — 50 — MHz CL = 15 pF 45 90 — 40 — — 8.4 17.1 1.0 19.0 — 10.8 20.6 1.0 23.0 CL = 50 pF — 6.3 17.3 1.0 19.5 CL = 15 pF — 8.2 21.9 1.0 23.5 CL = 50 pF 8.5 — — 9.5 — 4.0 — — 4.0 — Propagation delay time tPLH / tPHL tPHL Setup time tSU FROM (Input) TO (Output) CLK Q CL = 50 pF ns ns CL = 15 pF CLR Data before CLK ↑ CLR inactive before CLK ↑ Hold time th –0.5 — — 0.0 — ns Data after CLK↑ Pulse width tW 6.0 — — 6.5 — ns CLR L 7.0 — — 7.0 — 6 CLK H or L HD74LV174A Switching Characteristics (cont) VCC = 3.3 ± 0.3 V Ta = 25°C Ta = –40 to 85°C Item Symbol Min Typ Max Min Max Unit Test Conditions Maximum clock frequency fmax 95 170 — 50 — MHz CL = 15 pF 55 130 — 40 — — 5.8 11.0 1.0 13.0 — 7.5 14.5 1.0 16.5 CL = 50 pF — 4.5 11.4 1.0 13.5 CL = 15 pF — 6.0 14.9 1.0 17.0 CL = 50 pF 5.0 — — 6.0 — 3.0 — — 3.0 — Propagation delay time tPLH / tPHL tPHL Setup time tSU FROM (Input) TO (Output) CLK Q CL = 50 pF ns ns CL = 15 pF CLR Data before CLK ↑ CLR inactive before CLK ↑ Hold time th 0.0 — — 0.0 — ns Data after CLK↑ Pulse width tW 5.0 — — 5.0 — ns CLR L 5.0 — — 5.0 — CLK H or L 7 HD74LV174A Switching Characteristics (cont) VCC = 5.0 ± 0.5 V Ta = 25°C Ta = –40 to 85°C Item Symbol Min Typ Max Min Max Unit Test Conditions Maximum clock frequency fmax 130 240 — 110 — MHz CL = 15 pF 90 180 — 80 — — 4.1 7.2 1.0 8.5 — 5.5 9.2 1.0 10.5 CL = 50 pF — 3.0 7.6 1.0 9.0 CL = 15 pF — 4.2 9.6 1.0 11.0 CL = 50 pF 4.5 — — 4.5 — 2.5 — — 2.5 — Propagation delay time tPLH / tPHL tPHL Setup time tSU FROM (Input) TO (Output) CLK Q CL = 50 pF ns ns CL = 15 pF CLR Data before CLK ↑ CLR inactive before CLK ↑ Hold time th 0.5 — — 0.5 — ns Data after CLK↑ Pulse width tW 5.0 — — 5.0 — ns CLR L 5.0 — — 5.0 — 8 CLK H or L HD74LV174A Output-skew Characteristics Ta = 25°C Ta = –40 to 85°C Item Symbol VCC = (V) Min Typ Max Min Max Unit Output skew t sk (O) 2.3 to 2.7 — — 2.0 — 2.0 ns 3.0 to 3.6 — — 1.5 — 1.5 4.5 to 5.5 — — 1.0 — 1.0 Note: Skew between any outputs of the same package switching in the same direction. This parameter is warranted but not production tested. Operating Characteristics • CL = 50 pF Ta = 25°C Item Symbol VCC = (V) Min Typ Max Unit Test Conditions Power dissipation capacitance CPD 3.3 — 14 — pF f = 10 MHz 5.0 — 15.1 — Test Conditions Noise Characteristics • CL = 50 pF Ta = 25°C Item Symbol VCC = (V) Min Typ Max Unit Quiet output, maximum dynamic VOL VOL (P) 3.3 — 0.3 0.8 V Quiet output, minimum dynamic VOL VOL (V) 3.3 — –0.3 –0.8 Quiet output, minimum dynamic VOH VOH (V) 3.3 — 3.0 — High-level dynamic input voltage VIH (D) 3.3 2.31 — — Low-level dynamic input voltage VIL (D) 3.3 — — 0.99 V 9 HD74LV174A Test Circuit Measurement point CL* Note: C L includes the probe and jig capacitance. 10 HD74LV174A tr • Waveform-1 Timing input 10 % t su tf 90 % 50 % V CC 90 % 50 % V CC VCC 10 % th 0V VCC 50 % V CC Data input 50 % V CC 0V tw VCC Input 50 % V CC 50 % V CC 0V tr tf • Waveform-2 10 % Input 90 % 50 % V CC 90 % 50 % V CC VCC 10 % t PHL t PLH 0V VOH 50 % V CC In phase output 50 % V CC VOL t PHL t PLH VOH Out of phase output 50 % V CC 50 % V CC VOL Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns 2. The output is measured one at a time with one transition per measurement. 11 HD74LV174A Package Dimensions 10.06 10.5 Max 9 1 8 1.27 0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0.80 Max 0.22 ± 0.05 0.20 ± 0.04 2.20 Max 5.5 16 0.20 7.80 +– 0.30 1.15 0° – 8° 0.70 ± 0.20 0.15 0.12 M Dimension including the plating thickness Base material dimension 12 Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DA — Conforms 0.24 g HD74LV174A Unit: mm 9.9 10.3 Max 9 1 8 0.635 Max *0.42 ± 0.08 0.40 ± 0.06 0.15 *0.22 ± 0.03 0.20 ± 0.03 1.27 0.11 0.14 +– 0.04 1.75 Max 3.95 16 0.10 6.10 +– 0.30 1.08 0° – 8° + 0.67 0.60 – 0.20 0.25 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DN Conforms Conforms 0.15 g 13 HD74LV174A 5.0 5.3 Max 9 1 8 4.40 16 0.65 0.13 M 1.10 Max 0.65 Max 0.10 Dimension including the plating thickness Base material dimension 14 6.40 ± 0.20 0.07 +0.03 –0.04 0.20 ± 0.06 1.0 0.17 ± 0.05 0.15 ± 0.04 0.08 0.22 +– 0.07 0° – 8° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-16DA — — 0.05 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Stra§e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.