HITACHI PF0210

PF0210
MOS FET Power Amplifier Module for ADC Mobile Phone
ADE-208-102E (Z)
Preliminary
6th Edition
July 1996
Features
• High efficiency: 34% Typ for CW
30% Typ for π/4-DQPSK
• Low input power: 0 dBm ave. Typ for π /4-DQPSK
• Simple bias circuit
• High speed switching: 8 µs Typ
Pin Arrangement
• RF-B2
5
4
3
2
5
1
1: Pin
2: VAPC
3: VDD
4: Pout
5: GND
PF0210
Internal Diagram and External Circuit
G
G
GND
GND
Pin1
Pin
Pin2
VAPC
C1
Z1
Pin
FB1
Pin3
VDD
C3
FB2
VAPC
Pin4
Pout
C2
VDD
Z2
Pout
C1 = C2 = 0.01 µF (Ceramic chip capacitor)
C3 = 330 µF (Aluminum Electrolyte Capacitor)
FB = Ferrite bead BL01RN1-A62-001 (Manufacture: MURATA) or equivalent
Z1 = Z2 = 50 Ω (Microstrip line)
Absolute Maximum Ratings (Tc = 25°C)
Item
Symbol
Rating
Unit
Supply voltage
VDD
17
V
Supply current
I DD
4
A
VAPC voltage
VAPC
5.5
V
Input power
Pin
20
mW
Operating case temperature
Tc (op)
–30 to +100
°C
Storage temperature
Tstg
–40 to +110
°C
2
PF0210
Electrical Characteristics (Tc = 25°C)
Analog Transmission
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Frequency
f
824
—
849
MHz
—
Drain cutoff current
I DS
—
—
500
µA
VDD = 17 V, VAPC = 0 V
Total efficiency(1)
ηT(1)
30
34
—
%
Pin = 3 dBm, VDD = 12.5 V,
2nd harmonic distortion
2nd H.D.
—
–55
–30
dBc
Pout = 6 W (VAPC controlled),
3rd harmonic distortion
3rd H.D.
—
–60
–40
dBc
Input VSWR
VSWR (in) —
2
3
—
Output power
Pout
6
9
—
W
Pin = 3 dBm, VDD = 12.5 V,
VAPC = 4 V
Isolation
—
—
–45
–40
dBm
Pin = 3dBm, VDD = 12.5 V,
VAPC = 0.5 V
Stability
—
No parasitic oscillation
—
Pin = 3 dBm, VDD = 12.5 V,
Pout ≤ 6 W,
Output VSWR = 20:1 All phases
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Frequency
f
824
—
849
MHz
—
Total efficiency(2)
ηT(2)
25
30
—
%
Pin controlled (π/4-DQPSK, √α =
Adjacent channel
PADJ (30k)
—
–30
–28
dBc
0.35, 48.6 kbps),
leakage power
PADJ (60k)
—
–50
–46
dBc
BW =24.3 kHz with Root Nyquist
Input power
Pin
—
—
5
dBm ave. Filter,
Pout = 5.5 W ave., VDD = 12.5 V
VAPC = 3.9 V
Digital Transmission
Mechanical Characteristics
Item
Conditions
Spec
Torque for screw up the heatsink flange
M3 Screw Bolts
4 to 6 kg•cm
Warp size of the heatsink flange: S
S=0
+0.3/– 0 mm
S
3
PF0210
Characteristics Curve
VAPC, ηT, VSWR (in) vs. Frequency
60
5
Pin = 2 mW
VDD = 12.5 V
Pout = 6 W
4
3
4
Apc Voltage VAPC (V)
V.S.W.R. (in)
5
50
VAPC
40
3
ηT
30
2
20
2
1
1
0
824
VSWRin
829
Efficiency ηT (%)
6
10
839
834
844
0
849
Frequency f (MHz)
Pout, ηT, VSWR (in) vs. Frequency
60
20
Pin = 2 mW
VDD = 12.5 V
VAPC = 3.9 V
ηT
4
3
16
Output Power Pout (W)
V.S.W.R. (in)
5
Pout
40
12
30
8
20
2
4
1
0
824
VSWRin
829
834
839
Frequency f (MHz)
4
50
10
844
0
849
Efficiency ηT (%)
6
PF0210
2nd H.D, 3rd H.D vs. Frequency (1)
−20
Pin = 2 mW
VDD = 12.5 V
Pout = 6 W
2nd H.D (dB)
−30
−40
−40
−50
−50
2nd H.D
−60
−70
824
−30
−60
3rd H.D
829
839
834
Frequency f (MHz)
3rd H.D (dB)
−20
844
−70
849
2nd H.D, 3rd H.D vs. Frequency (2)
Pin = 2 mW
VDD = 12.5 V
VAPC = 3.9 V
2nd H.D (dB)
−30
−40
−20
−30
−40
−50
3rd H.D
−50
−60
2nd H.D
−60
−70
824
829
839
834
Frequency f (MHz)
844
3rd H.D (dB)
−20
−70
849
5
PF0210
Pout, ηT vs. Frequency (1)
60
20
Pin = 2 mW
VDD = 12.5 V
VAPC = 3.9 V
ηT
50
Pout
40
12
30
8
20
4
0
824
Efficiency ηT (%)
Output Power Pout (W)
16
10
829
839
834
844
0
849
Frequency f (MHz)
Pout, ηT vs. Frequency (2)
60
ηT
16
Output Power Pout (W)
Pin = 2 mW
VDD = 12.5 V
VAPC = 3.9 V
40
12
30
Pout
8
20
4
10
Tx
0
824
838
Rx
852
866
Frequency f (MHz)
6
50
880
0
894
Efficiency ηT (%)
20
PF0210
VAPC, ηT, VSWR (in) vs. VDD (1)
60
5
f = 824 MHz
Pin = 2 mW
Pout = 6 W
4
3
4
Apc Voltage VAPC (V)
V.S.W.R. (in)
5
VAPC
50
40
3
30
ηT
2
20
2
1
1
0
10.5
VSWRin
11.5
12.5
13.5
Efficiency ηT (%)
6
10
14.5
15.5
0
16.5
Supply Voltage VDD (V)
VAPC, ηT, VSWR (in) vs. VDD (2)
60
5
f = 849 MHz
Pin = 2 mW
Pout = 6 W
4
3
4
Apc Voltage VAPC (V)
V.S.W.R. (in)
5
50
VAPC
40
3
ηT
30
2
20
2
1
1
0
10.5
Efficiency ηT (%)
6
VSWRin
10
11.5
12.5
13.5
14.5
15.5
0
16.5
Supply Voltage VDD (V)
7
PF0210
2nd H.D, 3rd H.D vs. VDD (1)
−20
f = 824 MHz
Pin = 2 mW
Pout = 6 W
2nd H.D (dB)
−30
−40
−30
−40
2nd H.D
−50
−50
−60
3rd H.D (dB)
−20
−60
3rd H.D
−70
10.5
11.5
12.5
13.5
14.5
15.5
−70
16.5
Supply Voltage VDD (V)
2nd H.D, 3rd H.D vs. VDD (2)
−20
f = 849 MHz
Pin = 2 mW
Pout = 6 W
2nd H.D (dB)
−30
−40
−30
−40
−50
−50
2nd H.D
−60
−60
3rd H.D
−70
10.5
11.5
12.5
13.5
14.5
Supply Voltage VDD (V)
8
15.5
−70
16.5
3rd H.D (dB)
−20
PF0210
Pout, ηT vs. VAPC (1)
60
25
f = 824 MHz
Pin = 2 mW
VDD = 12.5 V
50
40
15
30
Pout
10
20
5
Efficiency ηT (%)
Output Power Pout (W)
20
ηT
10
0
0
2
3
2.5
3.5
4
4.5
5
Apc Voltage VAPC (V)
Pout, ηT vs. VAPC (2)
60
25
f = 849 MHz
Pin = 2 mW
VDD = 12.5 V
50
ηT
40
15
30
10
Pout
20
5
Efficiency ηT (%)
Output Power Pout (W)
20
10
0
0
2
2.5
3
3.5
4
4.5
5
Apc Voltage VAPC (V)
9
PF0210
Pout, ηT, VSWR (in) vs. Pin (1)
3
f = 824 MHz
VDD = 12.5 V
VAPC = 3.9 V
12
Output Power Pout (W)
V.S.W.R. (in)
5
4
60
15
2
40
ηT
9
50
30
6
Pout
20
3
Efficiency ηT (%)
6
10
VSWRin
1
0
0
0.2
0.6
0.4
0.8
0
1.0
Input Power Pin (mW)
Pout, ηT, VSWR (in) vs. Pin (2)
3
f = 849 MHz
VDD = 12.5 V
VAPC = 3.9 V
12
Output Power Pout (W)
V.S.W.R. (in)
5
4
60
15
ηT
40
9
30
Pout
6
20
2
3
1
0
VSWRin
0
0.2
0.4
0.6
Input Power Pin (mW)
10
50
10
0.8
0
1.0
Efficiency ηT (%)
6
PF0210
Package Dimensions
60.5 ± 0.5
57.5 ± 0.5
3
13.0 ± 1
49.8 ± 0.5
0.25
2.3
0.6
5.0 +– 0.3
0.5
4
3.3
2
5±1
1
R1.6
6.35 ± 0.5
11.0 ± 0.3
12.7 ± 0.5
Unit: mm
9.2 ± 1
8.0 ± 1
22.0 ± 1
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
RF-B2
—
—
16 g
11
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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